ON MC14040BDG 12-bit binary counter Datasheet

MC14040B
12-Bit Binary Counter
The MC14040B 12−stage binary counter is constructed with MOS
P−Channel and N−Channel enhancement mode devices in a single
monolithic structure. This part is designed with an input wave shaping
circuit and 12 stages of ripple−carry binary counter. The device
advances the count on the negative−going edge of the clock pulse.
Applications include time delay circuits, counter controls, and
frequency−driving circuits.
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Features
•
•
•
•
•
•
•
•
Fully Static Operation
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low−power TTL Loads or One
Low−power Schottky TTL Load Over the Rated Temperature
Range
Common Reset Line
Pin−for−Pin Replacement for CD4040B
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
SOIC−16
D SUFFIX
CASE 751B
VDD
Vin, Vout
Iin, Iout
PD
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
TSSOP−16
DT SUFFIX
CASE 948F
PIN ASSIGNMENT
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
SOEIAJ−16
F SUFFIX
CASE 966
Value
Unit
−0.5 to +18.0
V
−0.5 to VDD + 0.5
V
Q12
1
16
VDD
Q6
2
15
Q11
Q5
3
14
Q10
Q7
4
13
Q8
Q4
5
12
Q9
Q3
6
11
R
Q2
7
10
C
VSS
8
9
MARKING DIAGRAMS
16
16
Input or Output Current
(DC or Transient) per Pin
±10
mA
Power Dissipation, per Package
(Note 1)
500
mW
14040BG
AWLYWW
MC14040B
ALYWG
1
1
SOIC−16
TA
Ambient Temperature Range
−55 to +125
°C
Tstg
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature
(8−Second Soldering)
260
°C
SOEIAJ−16
16
14
040B
ALYW G
G
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: “D/DW” Packages: –7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
Q1
1
TSSOP−16
A
WL, L
YY, Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 11
1
Publication Order Number:
MC14040B/D
MC14040B
TRUTH TABLE
Clock
Reset
Output State
X
0
0
1
No Change
Advance to next state
All Outputs are low
X = Don’t Care
LOGIC DIAGRAM
Q1
Q2
9
CLOCK
C
10
C
R
Q3
6
7
Q
C
Q
C
R
Q
C
Q
C
R
Q10
14
Q
C
Q
C
R
Q11
15
Q
C
Q
C
R
Q12
1
Q
C
Q
C
Q
R
RESET
11
Q4 = PIN 5
Q5 = PIN 3
Q6 = PIN 2
Q7 = PIN 4
Q8 = PIN 13
Q9 = PIN 12
VDD = PIN 16
VSS = PIN 8
ORDERING INFORMATION
Package
Shipping†
MC14040BDG
SOIC−16
(Pb−Free)
48 Units / Rail
NLV14040BDG*
SOIC−16
(Pb−Free)
48 Units / Rail
MC14040BDR2G
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
NLV14040BDR2G*
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
MC14040BDTR2G
TSSOP−16
(Pb−Free)
2500 Units / Tape & Reel
NLV14040BDTR2G*
TSSOP−16
(Pb−Free)
2500 Units / Tape & Reel
MC14040BFELG
SOEIAJ−16
(Pb−Free)
2000 Units / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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2
MC14040B
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
−55_C
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
25_C
VDD
Vdc
Min
Max
Min
Typ
(Note 2)
125_C
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
“0” Level
VIL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
5.0
5.0
10
15
–3.0
–0.64
–1.6
–4.2
−
−
−
−
–2.4
–0.51
–1.3
–3.4
–4.2
–0.88
–2.25
–8.8
−
−
−
−
–1.7
–0.36
–0.9
–2.4
−
−
−
−
IOL
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current
Iin
15
−
±0.1
−
±0.00001
±0.1
−
±1.0
mAdc
Input Capacitance
(Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
−
−
−
5.0
10
20
−
−
−
0.005
0.010
0.015
5.0
10
20
−
−
−
150
300
600
mAdc
IT
5.0
10
15
Vin = 0 or VDD
Input Voltage
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
“1” Level
VIH
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current (Notes 3 & 4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
mAdc
IT = (0.42 mA/kHz) f + IDD
IT = (0.85 mA/kHz) f + IDD
IT = (1.43 mA/kHz) f + IDD
mAdc
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
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3
MC14040B
SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
TTLH, TTHL = (1.5 ns/pF) CL + 25 ns
TTLH, TTHL = (0.75 ns/pF) CL + 12.5 ns
TTLH, TTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time
Clock to Q1
tPHL, tPLH = (1.7 ns/pF) CL + 315 ns
tPHL, tPLH = (0.66 ns/pF) CL + 137 ns
tPHL, tPLH = (0.5 ns/pF) CL + 95 ns
tPLH,
tPHL
VDD
Vdc
Min
Typ
(Note 6)
Max
5.0
10
15
−
−
−
100
50
40
200
100
80
5.0
10
15
−
−
−
260
115
80
520
230
160
5.0
10
15
−
−
−
1625
720
500
3250
1440
1000
Unit
ns
ns
ns
Clock to Q12
tPHL, tPLH = (1.7 ns/pF) CL + 2415 ns
tPHL, tPLH = (0.66 ns/pF) CL + 867 ns
tPHL, tPLH = (0.5 ns/pF) CL + 475 ns
Propagation Delay Time
Reset to Qn
tPHL = (1.7 ns/pF) CL + 485 ns
tPHL = (0.86 ns/pF) CL + 182 ns
tPHL = (0.5 ns/pF) CL + 145 ns
tPHL
Clock Pulse Width
Clock Pulse Frequency
Clock Rise and Fall Time
ns
5.0
10
15
−
−
−
370
155
115
740
310
230
tWH
5.0
10
15
385
150
115
140
55
38
−
−
−
ns
fcl
5.0
10
15
−
−
−
2.1
7.0
10.0
1.5
3.5
4.5
MHz
tTLH, tTHL
5.0
10
15
ns
No Limit
Reset Pulse Width
tWH
5.0
10
15
960
360
270
320
120
80
−
−
−
ns
Reset Removal Time
trem
5.0
10
15
130
50
30
65
25
15
−
−
−
ns
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
VDD
VDD
500 mF
0.01 mF
CERAMIC
ID
PULSE
GENERATOR
C Q1
Q2
Q
R n
C Q1
Q2
Q
R n
CL
CL
VSS
CL
CL
CL
VSS
20 ns
CLOCK
PULSE
GENERATOR
90%
50%
10%
CL
CLOCK
20 ns
20 ns
20 ns
tPLH
VDD
90%
50%
10%
tWH
tPHL
50% DUTY CYCLE
90%
50%
10%
tTLH
Figure 1. Power Dissipation Test Circuit
and Waveform
Figure 2. Switching Time Test Circuit
and Waveforms
Q
VSS
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4
tTHL
MC14040B
1
2
4
8
16
32
64
128
256
512
1024
2048
4096
CLOCK
RESET
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Q10
Q11
Q12
Figure 3. Timing Diagram
APPLICATIONS INFORMATION
TIME−BASE GENERATOR
outputs Q5, Q10, Q11, and Q12 division by 3600 is
accomplished. The MC14012B decodes the counter
outputs, produces a single output pulse, and resets the binary
counter. The resulting output frequency is 1.0 pulse/minute.
A 60 Hz sinewave obtained through a 1.0 Megohm
resistor connected directly to a standard 120 Vac power line
is applied to the clock input of the MC14040B. By selecting
VCC
VCC
1/6 of HC14A
1.0M
MC14040B
Clock
12
≥20pF
120Vac
60Hz
13
Q5
Q10
10
Q11
9
Q12
NOTE:
Ground MUST be isolated
by a transformer or
opto−isolator for safety
reasons.
Figure 4. Time−Base Generator
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5
1/2
14012B
8
1
2
4
5
1/2
14012B
6
1.0 Pulse/Minute
Output
MC14040B
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
B
M
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT*
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14040B
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
T U
M
S
V
S
S
K
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
0.25 (0.010)
8
1
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
H
D
DETAIL E
G
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC14040B
PACKAGE DIMENSIONS
SOEIAJ−16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966
ISSUE A
16
LE
9
Q1
M_
E HE
1
L
8
DETAIL P
Z
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
0.10 (0.004)
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--0.78
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.031
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MC14040B/D