BZX84C2V4 - BZX84C51 350mW SURFACE MOUNT ZENER DIODE Features Mechanical Data Planar Die Construction 350mW Power Dissipation Zener Voltages from 2.4V - 51V Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Case: SOT23 Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Polarity: See Diagram Weight: 0.008 grams (Approximate) SOT23 Top View Device Schematic Ordering Information (Note 5) Part Number (Type Number)-7-F (Type Number)Q-7-F (Type Number)-13-F (Type Number)Q-13-F Compliance Standard Automotive Standard Automotive Case SOT23 SOT23 SOT23 SOT23 Packaging 3,000/Tape & Reel 3,000/Tape & Reel 10,000/Tape & Reel 10,000/Tape & Reel *For (Type Number), please see the Electrical Characteristics Table. Example: 6.2V Zener = BZX84C6V2-7-F. Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3).compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. BZX84C2V4-BZX84C39 products manufactured with Date Code OW (week 42, 2009) and newer are built with Green Molding Compound. BZX84C2V4BZX84C39 products manufactured prior to Date Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. BZX84C43-BZX84C51 products manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. BZX84C43-BZX84C51 products manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 5. For packaging details, go to our website at http://www.diodes.com/products/packages.html. Date Code Key Year 1998 Code J Month Code Jan 1 … … xx = Product Type Marking Code (See Electrical Characteristics Table) YM = Date Code Marking for Shanghai Assembly / Test site Y = Year (ex: Z = 2012) M = Month (ex: 9 = September) 2008 V 2009 W Feb 2 BZX84C2V4 - BZX84C51 Document number: DS18001 Rev. 33 - 2 Mar 3 2010 X 2011 Y Apr 4 2012 Z 2013 A May 5 Kxx 2014 B 2015 C Jun 6 1 of 5 www.diodes.com Jul 7 2016 D YM Kxx YM Marking Information 2017 E Aug 8 xx = Product Type Marking Code (See Electrical Characteristics Table) YM = Date Code Marking for Chengdu Assembly / Test site Y = Year (ex: Z = 2012) M = Month (ex: 9 = September) 2018 F Sep 9 2019 G 2020 H Oct O 2021 I Nov N 2022 J Dec D February 2018 © Diodes Incorporated BZX84C2V4 - BZX84C51 Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Forward Voltage Symbol @ IF = 10mA VF Value 0.9 Unit V Value 300 Unit mW 350 417 mW °C/W 357 °C/W -65 to +150 °C Thermal Characteristics Characteristic Power Dissipation (Note 6) Symbol PD Power Dissipation (Note 7) Thermal Resistance, Junction to Ambient Air (Note 6) PD RθJA RθJA Thermal Resistance, Junction to Ambient Air (Note 7) Operating and Storage Temperature Range Electrical Characteristics Type Number BZX84C2V4 BZX84C2V7 BZX84C3V0 BZX84C3V3 BZX84C3V6 BZX84C3V9 BZX84C4V3 BZX84C4V7 BZX84C5V1 BZX84C5V6 BZX84C6V2 BZX84C6V8 BZX84C7V5 BZX84C8V2 BZX84C9V1 BZX84C10 BZX84C11 BZX84C12 BZX84C13 BZX84C15 BZX84C16 BZX84C18 BZX84C20 BZX84C22 BZX84C24 BZX84C27 BZX84C30 BZX84C33 BZX84C36 BZX84C39 BZX84C43 BZX84C47 BZX84C51 Notes: (@TA = +25°C, unless otherwise specified.) Maximum Zener Impedance f = 1KHz Zener Voltage Range (Note 8) Marking Code ZB ZC ZD ZE ZF ZG ZH Z1 Z2 Z3 Z4 Z5 Z6 Z7 Z8 Z9 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 YA YB YC YD YE YF YG YH TJ, TSTG VZ @ IZT Maximum Reverse Current (Note 8) IZT ZZT @ IZT IR VR Nom (V) Min (V) Max (V) (mA) () () ZZK @ IZK (mA) (µA) (V) 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 2.2 2.5 2.8 3.1 3.4 3.7 4.0 4.4 4.8 5.2 5.8 6.4 7.0 7.7 8.5 9.4 10.4 11.4 12.4 13.8 15.3 16.8 18.8 20.8 22.8 25.1 28.0 31.0 34.0 37.0 40.0 44.0 48.0 2.6 2.9 3.2 3.5 3.8 4.1 4.6 5.0 5.4 6.0 6.6 7.2 7.9 8.7 9.6 10.6 11.6 12.7 14.1 15.6 17.1 19.1 21.2 23.3 25.6 28.9 32.0 35.0 38.0 41.0 46.0 50.0 54.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 100 100 95 95 90 90 90 80 60 40 10 15 15 15 15 20 20 25 30 30 40 45 55 55 70 80 80 80 90 130 150 170 180 600 600 600 600 600 600 600 500 480 400 150 80 80 80 100 150 150 150 170 200 200 225 225 250 250 300 300 325 350 350 375 375 400 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 50 20 10 5.0 5.0 3.0 3.0 3.0 2.0 1.0 3.0 2.0 1.0 0.7 0.5 0.2 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 2.0 4.0 4.0 5.0 5.0 6.0 7.0 8.0 8.0 8.0 10.5 11.2 12.6 14.0 15.4 16.8 18.9 21.0 23.1 25.2 27.3 30.1 32.9 35.7 Temperature Coefficient @ IZT mV/C Min Max -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -2.7 -2.0 0.4 1.2 2.5 3.2 3.8 4.5 5.4 6.0 7.0 9.2 10.4 12.4 14.4 16.4 18.4 21.4 24.4 27.4 30.4 33.4 37.6 42.0 46.6 0 0 0 0 0 0 0 0.2 1.2 2.5 3.7 4.5 5.3 6.2 7.0 8.0 9.0 10.0 11.0 13.0 14.0 16.0 18.0 - 6. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com. 7. Valid provided the terminals are kept at ambient temperature. 8. Short duration pulse test used to minimize self-heating effect. BZX84C2V4 - BZX84C51 Document number: DS18001 Rev. 33 - 2 2 of 5 www.diodes.com February 2018 © Diodes Incorporated 500 50 400 40 IZ, ZENER CURRENT (mA) PD, POWER DISSIPATION (mW) BZX84C2V4 - BZX84C51 300 Note 6 Note 7 200 30 20 10 100 0 100 TA, Ambient Temperature, (°C) Fig. 1 Power Derating Curve 0 30 Tj = 25°C 0 200 0 1 2 3 4 5 6 8 9 10 7 VZ, ZENER VOLTAGE (V) Fig. 2 Typical Zener Breakdown Characteristics 10 C10 TJ = 25°C C47 C43 C51 IZ, ZENER CURRENT (mA) IZ, ZENER CURRENT (mA) C12 C15 20 C18 Test current IZ 2mA C22 10 C27 Test current IZ 5mA C33 C36 8 6 4 Test Current IZ 2mA 2 C39 0 0 0 10 20 30 40 V Z, ZENER VOLTAGE (V) Fig. 3 Typical Zener Breakdown Characteristics 0 20 30 40 50 70 60 VZ, ZENER VOLTAGE (V) Fig. 4 Typical Zener Breakdown Characteristics 10 100 1,000 CT, TOTAL CAPACITANCE (pF) CT, TOTAL CAPACITANCE (pF) TJ = 25°C VR = 1V VR = 2V 100 VR = 1V VR = 2V 10 1 100 10 VZ, NOMINAL ZENER VOLTAGE (V) Fig. 5 Typical Total Capacitance vs. Nominal Zener Voltage BZX84C2V4 - BZX84C51 Document number: DS18001 Rev. 33 - 2 3 of 5 www.diodes.com 10 1 100 VZ, NOMINAL ZENER VOLTAGE (V) Fig. 6 Typical Total Capacitance vs. Nominal Zener Voltage 10 February 2018 © Diodes Incorporated BZX84C2V4 - BZX84C51 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. All 7° H GAUGE PLANE 0.25 J K1 K a M A L C L1 B D G F SOT23 Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.890 1.00 0.975 K1 0.903 1.10 1.025 L 0.45 0.61 0.55 L1 0.25 0.55 0.40 M 0.085 0.150 0.110 a 0° 8° -All Dimensions in mm Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. Y Dimensions C X X1 Y Y1 C Y1 X BZX84C2V4 - BZX84C51 Document number: DS18001 Rev. 33 - 2 Value (in mm) 2.0 0.8 1.35 0.9 2.9 X1 4 of 5 www.diodes.com February 2018 © Diodes Incorporated BZX84C2V4 - BZX84C51 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2018, Diodes Incorporated www.diodes.com BZX84C2V4 - BZX84C51 Document number: DS18001 Rev. 33 - 2 5 of 5 www.diodes.com February 2018 © Diodes Incorporated