ON MBRS410ET3G Surface mount schottky power rectifier Datasheet

MBRS410ET3
Preferred Device
Surface Mount
Schottky Power Rectifier
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
Typical applications are AC−DC and DC−DC converters, reverse
battery protection, and “ORing” of multiple supply voltages and any
other application where performance and size are critical.
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SCHOTTKY BARRIER
RECTIFIERS
4.0 AMPERES, 10 VOLTS
Features
•
•
•
•
•
•
•
•
•
Very Low VF Accompanied by Low IR
1st in the Market Place with a 10 VR Schottky Rectifier
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Designed for Low Leakage
Excellent Ability to Withstand Reverse Avalanche Energy Transients
Guard−Ring for Stress Protection
Pb−Free Package is Available
SMC
CASE 403
PLASTIC
MARKING DIAGRAM
Mechanical Characteristics
AYWW
B4E1G
G
• Case: Epoxy, Molded
• Weight: 217 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
B4E1
= Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
• Lead and Mounting Surface Temperature for Soldering Purposes:
•
•
260°C Max. for 10 Seconds
Polarity: Notch in Plastic Body Indicates Cathode Lead
ESD Ratings:
Machine Model = C
Human Body Model = 3B
ORDERING INFORMATION
MAXIMUM RATINGS
Symbol
Value
Unit
Device
Package
Shipping †
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
10
V
MBRS410ET3
SMC
2500/Tape & Reel
2500/Tape & Reel
Average Rectified Forward Current
(@ TL = 130°C)
IO
4.0
SMC
(Pb−Free)
IFSM
250
A
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
TJ
−65 to +150
°C
Preferred devices are recommended choices for future use
and best overall value.
Rating
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature
MBRS410ET3G
A
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 2
1
Publication Order Number:
MBRS410ET3/D
MBRS410ET3
THERMAL CHARACTERISTICS
Characteristic
Symbol
5 mm x 5 mm
(Note 2)
1 Inch x 1/2 inch
RqJL
12
7.0
RqJA
109
59
VF
TJ = 25°C
TJ = 100°C
0.475
0.500
0.525
0.370
0.395
0.430
TJ = 25°C
TJ = 100°C
50
150
2000
4000
Unit
°C/W
Thermal Resistance,
Junction−to−Lead
Thermal Resistance,
Junction−to−Ambient
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 1)
(IF = 2.0 A)
(IF = 4.0 A)
(IF = 8.0 A)
Maximum Instantaneous Reverse Current (Note 1)
IR
(Rated dc Voltage, VR = 5.0 V)
(Rated dc Voltage, VR = 10 V)
V
mA
1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
2. Mounted with Minimum Recommended Pad Size, PC Board FR4.
100
25°C
VF @ 125°C
IF, MAXIMUM INSTANTANEOUS
FORWARD CURRENT (A)
IF, INSTANTANEOUS FORWARD
CURRENT (A)
100
−40°C
100°C
10
75°C
1
0.1
VF @ 125°C
25°C
100°C
10
75°C
1
0.1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.1
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
0.2
0.3
0.4
0.5
0.6
0.7
VF, MAXIMUM INSTANTANEOUS FORWARD
VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.0E−02
10,000
100°C
1.0E−04
75°C
1.0E−05
25°C
1.0E−06
1.0E−07
25°C
f = 1 MHz
C, CAPACITANCE (pF)
IR, REVERSE CURRENT (A)
IR @ 125°C
1.0E−03
1000
0
2
4
6
8
10
0
2
4
6
8
VR, REVERSE VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
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2
10
MBRS410ET3
IF, AVERAGE FORWARD
CURRENT (A)
8
RATED VOLTAGE
APPLIED
RqJL = 12 °C/W
TJ = 125°C
dc
7
6
5
PFO, AVERAGE POWER DISSIPATION (W)
9
SQUARE WAVE
4
3
2
1
0
100
110
120
130
140
150
160
TL, LEAD TEMPERATURE (°C)
3.5
dc
3
TJ = 125°C
2.5
2
SQUARE WAVE
1.5
1
0.5
0
0
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
Figure 5. Current Derating, Junction−to−Lead
1
2
3
4
5
6
7
8
9
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 6. Forward Power Dissipation
100
D = 0.5
0.2
0.1
10
0.05
0.02
0.01
1
SINGLE PULSE
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
100
1000
t, TIME (S)
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
Figure 7. Thermal Response, Junction−to−Ambient (min pad)
100
D = 0.5
0.2
10
0.1
0.05
0.02
1
0.01
SINGLE PULSE
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
t, TIME (S)
Figure 8. Thermal Response, Junction−to−Ambient (1 inch pad)
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3
MBRS410ET3
PACKAGE DIMENSIONS
SMC
PLASTIC PACKAGE
CASE 403−03
ISSUE E
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4. 403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03.
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
MIN
1.90
0.05
2.92
0.15
5.59
6.60
7.75
0.76
MILLIMETERS
NOM
MAX
2.13
2.41
0.10
0.15
3.00
3.07
0.23
0.30
5.84
6.10
6.86
7.11
7.94
8.13
1.02
1.27
0.51 REF
MIN
0.075
0.002
0.115
0.006
0.220
0.260
0.305
0.030
INCHES
NOM
0.084
0.004
0.118
0.009
0.230
0.270
0.313
0.040
0.020 REF
MAX
0.095
0.006
0.121
0.012
0.240
0.280
0.320
0.050
A
L
L1
c
A1
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
SCALE 4:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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MBRS410ET3/D
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