NICHIA NSSG426C Specifications for nichia chip type green led Datasheet

No. STSE-CC5153A
<Cat.No.051031>
SPECIFICATIONS FOR NICHIA CHIP TYPE GREEN
MODEL : NSSG426CT
NICHIA CORPORATION
-0-
LED
Nichia STSE-CC5153A-1
<Cat.No.060616>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Reverse Voltage
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature
IFP Conditions
:
Symbol
IF
IFP
VR
PD
Topr
Tstg
Tsld
Pulse Width <
= 10msec.
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Reverse Current
IR
Luminous Intensity
Iv
Absolute Maximum Rating
30
100
5
120
-30 ~ + 85
-40 ~ +100
Reflow Soldering : 260°C
Hand Soldering : 350°C
and
Duty <
= 1/10
Condition
IF=20[mA]
VR= 5[V]
IF=20[mA]
Typ.
(3.5)
(560)
(Ta=25°C)
Max.
Unit
4.0
V
50
µA
mcd
Min.
560
390
280
(Ta=25°C)
Max.
Unit
780
mcd
560
mcd
390
mcd
(3) Ranking
Item
Luminous Intensity
Rank T
Rank S
Rank R
Symbol
Iv
Iv
Iv
(Ta=25°C)
Unit
mA
mA
V
mW
°C
°C
for 10sec.
for 3sec.
Condition
IF=20[mA]
IF=20[mA]
IF=20[mA]
½ Luminous Intensity Measurement allowance is ± 10%.
Color Rank
x
y
0.166
0.676
0.136
0.739
(IF=20mA,Ta=25°C)
Rank G0c
0.176 0.220 0.237 0.201
0.750 0.745 0.684 0.686
½ Color Coordinates Measurement allowance is ± 0.01.
½ One delivery will include up to one color rank and three luminous intensity ranks of the products.
The quantity-ratio of the ranks is decided by Nichia.
2.INITIAL
OPTICAL/ELECTRICAL
CHARACTERISTICS
Please refer to figure’s page.
-1-
Nichia STSE-CC5153A
<Cat.No.051031>
3.OUTLINE
DIMENSIONS
AND
MATERIALS
Please refer to figure’s page.
Material as follows ;
Package
:
Package Upper Surface Color :
Encapsulating Resin
:
Resin Color
:
Electrodes
:
Heat-Resistant Polymer
Black
Epoxy Resin (Diffused)
Green (Diffused)
Ag Plating Copper Alloy
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT
NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
-U
- Year
( 4 for 2004, 5 for 2005 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
- Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Intensity
-2-
B for Nov. )
Nichia STSE-CC5153A
<Cat.No.051031>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Standard
Test Method
Test Conditions
Note
Number of
Damaged
2 times
0/100
Resistance to
Soldering Heat
(Reflow Soldering)
JEITA ED-4701
300 301
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Thermal Shock
JEITA ED-4701
300 307
0°C ~ 100°C
15sec. 15sec.
100 cycles
0/100
Temperature Cycle
JEITA ED-4701
100 105
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
100 cycles
0/100
Moisture Resistance Cyclic
JEITA ED-4701
200 203
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
10 cycles
0/100
High Temperature Storage
JEITA ED-4701
200 201
Ta=100°C
1000 hrs.
0/100
Temperature Humidity
Storage
JEITA ED-4701
100 103
Ta=60°C,
1000 hrs.
0/100
Low Temperature Storage
JEITA ED-4701
200 202
Ta=-40°C
1000 hrs.
0/100
Steady State Operating Life
Ta=25°C, IF=30mA
1000 hrs.
0/100
Steady State Operating Life
of High Humidity Heat
60°C, RH=90%, IF=20mA
500 hrs.
0/100
Steady State Operating Life
of Low Temperature
Ta=-30°C, IF=20mA
1000 hrs.
0/100
RH=90%
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Min.
Max.
Item
Symbol Test Conditions
Forward Voltage
VF
IF=20mA
U.S.L.*)
Reverse Current
IR
VR=5V
U.S.L.*)
Luminous Intensity
IV
IF=20mA
L.S.L.**) 0.7
*) U.S.L. : Upper Standard Level
**) L.S.L. : Lower Standard Level
-3-
1.1
2.0
Nichia STSE-CC5153A-2
<Cat.No.061114>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag.
A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less.
The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel).
It is also recommended to return the LEDs to the original moisture proof
bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrodes are silver plated copper alloy. The silver surface may be affected by
environments which contain corrosive substances. Please avoid conditions which may cause the LED
to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering
operations. It is recommended that the User use the LEDs as soon as possible.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
-4-
Nichia STSE-CC5153A-2
<Cat.No. 061114>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Reflow Soldering
Lead Solder
Lead-free Solder
180 ~ 200°C
120 ~ 150°C
120 sec. Max.
120 sec. Max.
240°C Max.
260°C Max.
Hand Soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
10 sec. Max.
10 sec. Max.
refer to
refer to
Temperature - profile 1. Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the following conditions shown to the under figure.
<1 : Lead Solder>
<2 : Lead-free Solder>
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C 60sec.Max.
Above 200°C
1~ 5°C / sec.
240°C Max.
10sec. Max.
1~ 5°C / sec.
Pre-heating
180 ~ 200°C 60sec.Max.
Above 220°C
260°C Max.
10sec. Max.
120sec.Max.
120sec.Max.
1.8
1.0
1.8
2.8
1.0 0.8 1.0
[Recommended soldering pad design]
Use the following conditions shown in the figure.
(Unit : mm)
4.6
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow. It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used. It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
(5) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
-5-
Nichia STSE-CC5153A-2
<Cat.No.061114>
(6) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the leak current remarkably
increases, the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=0.5mA)
(7) Others
· NSSG426C complies with RoHS Directive.
· Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating
when using the LEDs with matrix drive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-6-
Nichia
STSE-CC5153A
<Cat.No.051031>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
G0c
0.7
550
560
0.6
570
500
0.5
580
y
590
0.4
600
610
0.3
620
630
490
0.2
480
0.1
470
460
0
0
0.1
0.2
0.3
0.4
x
½ Color Coordinates Measurement allowance is ± 0.01.
-7-
0.5
0.6
0.7
0.8
10
5
2.5
2.0
1.5
1.0
0.5
0
3.0 3.5 4.0 4.5 5.0
Forward Voltage VF (V)
Ta=25°C
3.0
0
20 40 60 80 100 120
Forward Current IFP (mA)
-8-
Ambient Temperature vs.
Forward Voltage
Ambient Temperature vs.
Relative Luminosity
5.0
2.0
4.6
4.2
IFP=60mA
IFP=20mA
IFP=5mA
3.8
3.4
3.0
2.6
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
IFP=20mA
1.0
0.5
0.2
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Allowable Forward Current IFP (mA)
Relative Luminosity (a.u.)
20
Relative Luminosity (a.u.)
Forward Current IFP (mA)
50
1
2.5
Forward Voltage VF (V)
Ta=25°C
200
Ta=25°C
100
50
30
20
10
1
5 10 20
50 100
Duty Ratio (%)
Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
3.5
200
100
Duty Ratio vs.
Allowable Forward Current
Forward Current vs.
Relative Luminosity
Forward Voltage vs.
Forward Current
40
30
20
10
0
0
20
40
60
80 100
Ambient Temperature Ta (°C)
NICHIA CORPORATION
NSSG426C
Title
CHARACTERISTICS
No.
050922545281
Nichia STSE-CC5153A
<Cat.No.051031>
Model
Forward Current vs.
Chromaticity Coordinate (λD)
20mA
(525nm)
50mA
0.60 (514nm)
y
0.70
1mA(544nm)
100mA(506nm)
0.50
0.40
5mA(536nm)
0
0.10 0.20 0.30 0.40 0.50
x
Forward Current vs.
Dominant Wavelength
Ta=25°C
545
535
525
515
505
495
1
5 10 20
50 100
Forward Current IFP (mA)
Ta=25°C
IF=20mA
1.0
0.8
0.6
0.4
0.2
0
400 450 500 550 600 650 700
Wavelength λ (nm)
Ambient Temperature vs.
Dominant Wavelength
Dominant Wavelength λ D (nm)
Dominant Wavelength λ D (nm)
-9-
555
1.2
Directivity
529
0°
1.0
531
IFP=20mA
Relative Luminosity (a.u.)
Ta=25°C
0.80
Relative Emission Intensity (a.u.)
0.90
Spectrum
527
525
523
521
519
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Ta=25°C
IFP=20mA
X-X
Y-Y
10° 20°
30°
40°
50°
60°
0.5
Ta=25°C
IF=20mA
X-X
Y-Y
0
90°
60°
30°
Radiation Angle
NICHIA CORPORATION
80°
0°
0.5
90°
1.0
NSSG426C
Title
CHARACTERISTICS
No.
050922545291
Nichia STSE-CC5153A
<Cat.No.051031>
Model
70°
3 ± 0.2
(2.6)
NC
Anode
(R 0.8)
(1.2)
(2.6)
3 ± 0.2
A
: Black
Cathode mark
C 0.5
1.8 ± 0.3
(0.8)
(0.4)
-10-
NC
Cathode
ITEM
MATERIALS
PACKAGE
PACKAGE UPPER SURFACE COLOR
ENCAPSULATING RESIN
RESIN COLOR
ELECTRODES
Heat-Resistant Polymer
Black
Epoxy Resin (Diffused)
Green (Diffused)
Ag Plating Copper Alloy
1 ± 0.2
Model
NICHIA CORPORATION
Title
No.
NxSG426C
TAPING DIMENSIONS
050922545301
Unit
mm
15/1
Scale
Allow
Nichia STSE-CC5153A
<Cat.No.051031>
0.75 ± 0.2
0.85 ± 0.3
K
Cathode mark
4±0.1
Reel End of tape
φ
φ 60+1
-0
Label
XXXX LED
TYPE NxSx426CT
LOT XXXXXX-U„
QTY
pcs
3.15±0.1
No LEDs
±0.2
φ 13
2±0.1
1+0.25
-0
11.4±1
9±0.3
φ2
1 ±0.8
3.15±0.1
(2.75)
3.5±0.05
2±0.05
φ 180+0
-3
Reel part
0.25±0.05
8+0.3
- 0.1
4±0.1
φ 1.5+0.1
-0
1.75±0.1
Taping part
LEDs mounting part
No LEDs
-11Top cover
tape
Pull direction
Embossed carrier tape
Reel Lead Min.40mm (No LEDs)
Reel Lead Min.160mm
(No LEDs is more than 40)
Reel Lead Min.400mm
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
Model
NICHIA CORPORATION
Title
No.
NxSx426CT
TAPING DIMENSIONS
050324538351
Unit
mm
Scale
Allow
Nichia STSE-CC5153A
<Cat.No.051031>
2,000pcs/Reel
Nichia STSE-CC5153A
<Cat.No.051031>
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Reel
Label
NICHIA
Seal
XXXX LED
TYPE
LOT
QTY
NxSx426xT
xxxxxx-U„
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture proof foil bag
Moisture
absorbent material
The box is partitioned with the
cardboard.
Label
NICHIA
Nichia
XXXX LED
LED
TYPE
RANK
QTY
NxSx426xT
U„
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag
Cardboard box
Cardboard box S
Cardboard box M
Cardboard box L
Reel/bag
1reel
Quantity/bag (pcs)
2,000 MAX.
Dimensions (mm)
291¯237¯120¯8t
259¯247¯243¯5t
444¯262¯259¯8t
Reel/box
7reel MAX.
15reel MAX.
30reel MAX.
NICHIA CORPORATION
-12-13-
Quantity/box (pcs)
14,000 MAX.
30,000 MAX.
60,000 MAX.
Model
NxSx426xT
Title
PACKING
No.
050922545401
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