HSMC HMPSA18 Npn silicon transistor Datasheet

HI-SINCERITY
Spec. No. : HE6306-B
Issued Date : 1992.09.09
Revised Date : 2000.10.01
Page No. : 1/4
MICROELECTRONICS CORP.
HMPSA18
NPN SILICON TRANSISTOR
Description
The HMPSA18 is designed for low noise stage of audio amplifiers.
Features
• Low Noise : 1.5 dB Max.
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 °C
Junction Temperature ................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................... 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ........................................................................................ 45 V
VCES Collector to Emitter Voltage...................................................................................... 45 V
VEBO Emitter to Base Voltage .......................................................................................... 6.5 V
IC Collector Current ...................................................................................................... 200 mA
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
*VCE(sat)1
*VCE(sat)2
VBE(on)
*hFE1
*hFE2
*hFE3
fT
Cob
Min.
45
45
6.5
300
500
500
100
-
Typ.
0.6
1100
1150
160
1.7
Max.
50
0.2
0.3
0.7
1500
3
Unit
V
V
V
nA
V
V
V
MHz
pF
Test Conditions
IC=100uA, IE=0
IC=10mA, IB=0
IE=10uA, IC=0
VCB=30V, IE=0
IC=10mA, IB=0.5mA
IC=50mA, IB=5mA
VCE=5V, IC=1mA
VCE=5V, IC=100uA
VCE=5V, IC=1mA
VCE=5V, IC=10mA
VCE=5V, IC=1mA, f=100MHz
VCB=5V, f=1MHz, IE=0
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE1
Rank
hFE
A
B
>300
>500
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6306-B
Issued Date : 1992.09.09
Revised Date : 2000.10.01
Page No. : 2/4
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
1000
1
Saturation Voltage (V)
VCE=5V
hFE
100
10
0.1
VCE(sat) @ IC=20IB
0.01
1
0.01
0.1
1
10
100
0.01
1000
0.1
1
10
100
1000
Collector Current (mA)
C ollector Current (mA)
On Voltage & Collector Current
Cutoff Frequency & Collector Current
1000
10
Cutoff Frequency (MHz)
On Voltage (mV)
VCE=5V
1
VBE(ON) @ VCE=5V
100
10
0.1
1
0.01
0.1
1
10
100
1000
1
Collector Current (mA)
10
100
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
Safe Operating Area
10
10000
PT=1m s
PT=100ms
Collector Current-IC (mA)
Capacitance (pF)
PT=1s
Cob
1
1000
100
10
1
0.1
1
10
Reverse-Biased Voltage (V)
100
1
10
100
Forward Voltage-V CE (V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6306-B
Issued Date : 1992.09.09
Revised Date : 2000.10.01
Page No. : 3/4
PD-Ta
700
Power Dissipation-PD(mW)
600
500
400
300
200
100
0
0
20
40
60
80
100
120
140
160
o
Ambient Temperature-Ta( C)
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6306-B
Issued Date : 1992.09.09
Revised Date : 2000.10.01
Page No. : 4/4
MICROELECTRONICS CORP.
TO-92 Dimension
α2
A
Marking :
HSMC Logo
B
1 2
Product Series
Part Number
3
Date Code
Rank
α3
C
Laser Mark
HSMC Logo
Product Series
D
Part Number
H
I
G
Ink Mark
α1
Style : Pin 1.Emitter 2.Base 3.Collector
E
F
3-Lead TO-92 Plastic Package
HSMC Package Code : A
*:Typical
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5°
*2°
*2°
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5°
*2°
*2°
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
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