Renesas ISL9021IIWZ-T 250ma single ldo with low iq, low noise and high psrr ldo Datasheet

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ISL9021A
ISL9021
DATASHEET
250mA Single LDO with Low IQ, Low Noise and High PSRR LDO
The ISL9021 is a single LDO providing high performance
low input voltage, high PSRR. It delivers guaranteed
continuous 250mA load current and is stable with 1µF to
4.7µF of output capacitance (±30%) with an ESR range of
5m to 400m.
Features
The input voltage range for the ISL9021 is between 1.5V to
5.5V and the output voltage comes in many fixed voltage
options with ±1.8% accuracy over temperature, line and load
ranges. Other output voltage within the range of 0.9V to 3.3V
may be available upon request. The ISL9021 has typical
PSRR of 75dB @ 10kHz and 50dB @ 1MHz.
• Output Voltage Range: 0.9V to 3.3V
The reverse current protection feature prevents current from
flowing back to the power source when the output voltage is
pulled higher than the input.
The ISL9021 is offered in tiny 4-bump 1.155mmx0.975mm
WLCSP and 1.6mmx1.6mm 6 Ld µTDFN packages.
FN6867
Rev 2.00
January 14, 2010
• High Performance LDO with 250mA guaranteed
continuous output current
• Input Voltage Range: 1.5V to 5.5V
• High PSRR: 75dB @ 10kHz, 50dB @ 1MHz
• Low Quiescent Current: 35µA
• Dropout Voltage: <150mV @ 250mA
• Stable with 1µF to 4.7µF Output Capacitance (±30%) with
an ESR range of 5m to 400m
• ±1.8% Output Accuracy Over-Temperature/Load/Line
• Soft-start Limits Input Current Surge During Enable
• Current Limit and Overheat Protection
• -40°C to +85°C Operating Temperature Range
Pinouts
ISL9021
(6 LD 1.6x1.6 µTDFN)
TOP VIEW
VIN 1
6
VO
NC 2
5
NC
EN 3
4 GND
• Available in 1.155mmx0.975mm 4-bump WLCSP
Package and 1.6mmx1.6mm 6 Ld µTDFN
• Pb-free (RoHS compliant)
Applications
• PDAs, Cell Phones and Smart Phones
• Portable Instruments, MP3 Players
• Handheld Devices including Medical Handhelds
ISL9021
(4 BALL 1.155x0.975 WLCSP)
TOP VIEW
GND
A2
B2
VOUT
EN
A1
B1
VIN
FN6867 Rev 2.00
January 14, 2010
Page 1 of 10
ISL9021
Ordering Information
PART NUMBER
PART
MARKING
VO Voltage
(Note 2)
TEMP RANGE
(°C)
PACKAGE
Tape & Reel
(Pb-free)
PACKAGE
DWG. #
ISL9021II1Z-T (Notes 1, 3)
0211
1.1
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021II2Z-T (Notes 1, 3)
0212
2.1
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021II3Z-T (Notes 1, 3)
0213
1.3
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021II4Z-T (Notes 1, 3)
0214
1.0
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IIBZ-T (Notes 1, 3)
021B
1.5
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IICZ-T (Notes 1, 3)
021C
1.8
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IIFZ-T (Notes 1, 3)
021F
2.5
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IIGZ-T (Notes 1, 3)
021G
2.7
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IIJZ-T (Notes 1, 3)
021J
2.8
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IIKZ-T (Notes 1, 3)
021K
2.85
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IIMZ-T (Notes 1, 3)
021M
3.0
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IINZ-T (Notes 1, 3)
021N
3.3
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IIPZ-T (Notes 1, 3)
021P
1.85
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IIRZ-T (Notes 1, 3)
021R
2.6
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IISZ-T (Notes 1, 3)
021S
1.6
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IITZ-T (Notes 1, 3)
021T
1.9
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IIWZ-T (Notes 1, 3)
021W
1.2
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IIYZ-T (Notes 1, 3)
021Y
0.9
-40 to +85
4 Ball WLCSP
W2x2.4
ISL9021IRU1Z-T (Notes 1, 4)
S1
1.1
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRU2Z-T (Notes 1, 4)
S9
2.1
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRU3Z-T (Notes 1, 4)
S3
1.3
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRU4Z-T (Notes 1, 4)
S0
1.0
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUBZ-T (Notes 1, 4)
S4
1.5
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUCZ-T (Notes 1, 4)
S6
1.8
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUFZ-T (Notes 1, 4)
T0
2.5
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUGZ-T (Notes 1, 4)
T2
2.7
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUJZ-T (Notes 1, 4)
T3
2.8
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUKZ-T (Notes 1, 4)
T4
2.85
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUMZ-T (Notes 1, 4)
T5
3.0
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUNZ-T (Notes 1, 4)
R8
3.3
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUPZ-T (Notes 1, 4)
S7
1.85
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRURZ-T (Notes 1, 4)
T1
2.6
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUSZ-T (Notes 1, 4)
S5
1.6
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUTZ-T (Notes 1, 4)
S8
1.9
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUWZ-T (Notes 1, 4)
S2
1.2
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
ISL9021IRUYZ-T (Notes 1, 4)
R9
0.9
-40 to +85
6 Ld µTDFN
L6.1.6x1.6
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. For other output voltages, contact Intersil Marketing.
3. These Intersil Pb-free WLCSP and BGA packaged products employ special Pb-free material sets; molding compounds/die attach materials and
SnAgCu - e1 solder ball terminals, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free
WLCSP and BGA packaged products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu
plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products
are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
FN6867 Rev 2.00
January 14, 2010
Page 2 of 10
ISL9021
Absolute Maximum Ratings
Thermal Information
Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6.5V
All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN + 0.3)V
Thermal Resistance (Typical, Note 5)
JA (°C/W)
4 Ball WLCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
135.64
6 Lead µTDFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
140
Junction Temperature Range . . . . . . . . . . . . . . . . .-40°C to +125°C
Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature Range (TA) . . . . . . . . . . . . . . .-40°C to +85°C
Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 to 5.5V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
5. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
Electrical Specifications
PARAMETER
TA = -40°C to +85°C; VIN = (VO + 0.5V) to 5.5V with a minimum VIN of 1.5V; CIN = 1µF; CO = 1µF; Parameters
with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits
established by characterization and are not production tested.
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNIT
5.5
V
1.5
V
DC CHARACTERISTICS
Supply Voltage
VIN Undervoltage Lockout
Threshold
Ground Current
Shutdown Current
VIN
VIN Rising
VUVLO-
VIN Falling
IDD
IDDS
Output Voltage Accuracy
Maximum Output Current
1.5
VUVLO+
Internal Current Limit
ILIM
Dropout Voltage (Notes 6, 7)
VDO
Thermal Shutdown Temperature
TSD
1.3
1.375
V
Output Enabled; IO = 0; VIN = 1.5V to 5.5V
35
50
µA
VIN = 5.5V, EN = Low, IO = 0
0.1
1.0
µA
-0.8
+0.8
%
VIN = VO + 0.5V to 5.5V, IO = 1mA to 150mA, TJ = -40°C to +125°C -1.8
+1.8
VIN = VO + 0.5V to 5.5V, IO = 1mA to 150mA, TJ = +25°C
IMAX
1.425
Continuous
250
mA
260
IO = 250mA; VO > 1.8V
mA
150
250
mV
160
°C
20
°C
VIN = 4.5V, VO = 3.3V @ 1kHz
60
dB
VIN = 4.5V, VO = 3.3V @ 10kHz
75
dB
VIN = 4.5V, VO = 3.3V @ 1MHz
50
dB
8.5*VO
µVRMS
Thermal Shutdown Hysteresis
AC CHARACTERISTICS
Ripple Rejection (Note 6)
Output Noise Voltage (Note 6)
VIN = 4.2V, TA = +25°C, BW = 10Hz to 100kHz, IO = 10mA
DEVICE START-UP CHARACTERISTICS
Device Enable Time
LDO Soft-start Ramp Rate
tEN
tSSR
Time from assertion of the EN pin to when the output voltage
reaches 95% of the VO (nom)
250
600
µs
Slope of linear portion of LDO output voltage ramp during start-up
30
60
µs/V
0.4
V
EN LOGIC CHARACTERISTICS
Input Low Voltage
VIL
Input High Voltage
VIH
Input Leakage Current
IIL, IIH
1.1
V
0.1
µA
NOTES:
6. Limits established by characterization and are not production tested.
7. Dropout voltage is measured as VIN - VO, when VO is 4% lower than the value of VO; when VIN = VO + 0.5V.
FN6867 Rev 2.00
January 14, 2010
Page 3 of 10
ISL9021
Typical Operating Performance
40
T = ROOM TEMP
45
T = +85°C
T = +45°C
QUIESCENT CURRENT (µA)
QUIESCENT CURRENT (µA)
45
35
30
25
T = 0°C
20
15
T = -25°C
T = -40°C
10
5
0
1.5
2.5
3.5
4.5
INPUT VOLTAGE (V)
T = 0°C
20
T = -40°C
T = -25°C
10
4.0
4.5
5.0
INPUT VOLTAGE (V)
5.5
1.5
2.5
3.5
4.5
INPUT VOLTAGE (V)
5.5
+25°C
+85°C
1.80
-40°C
1.75
1.60
0
6.0
50
100
150
Io (mA)
200
250
300
FIGURE 4. LOAD REGULATION vs TEMPERATURE
(VOUT = 1.85V)
2.00
3.5
1.95
3.4
+25°C
+25°C
+85°C
3.3
1.85
1.80
+85°C
Vo (V)
Vo (V)
5
1.65
FIGURE 3. QUIESCENT CURRENT vs INPUT VOLTAGE
(VOUT = 3.3V)
-40°C
1.70
1.65
3.2
-40°C
3.1
3.0
1.60
2.9
1.55
1.50
2.5
T = -40°C
10
1.70
0
1.75
15
T = -25°C
1.85
30
1.90
T = 0°C
20
1.90
40
-10
3.5
25
1.95
T = +85°C
Vo (V)
QUIESCENT CURRENT (µA)
T = +45°C
T = ROOM TEMP
30
FIGURE 2. QUIESCENT CURRENT vs INPUT VOLTAGE
(VOUT = 1.85V)
FIGURE 1. QUIESCENT CURRENT vs INPUT VOLTAGE
(VOUT = 0.9V)
50
35
0
5.5
T = +85°C
T = +45°C
T = ROOM TEMP
40
3.5
4.5
5.5
VIN(V)
FIGURE 5. LINE REGULATION vs TEMPERATURE
(VOUT = 1.85V)
FN6867 Rev 2.00
January 14, 2010
6.5
2.8
0
50
100
150
200
250
300
Io (mA)
FIGURE 6. LOAD REGULATION vs TEMPERATURE
(VOUT = 3.3V)
Page 4 of 10
ISL9021
Typical Operating Performance (Continued)
3.50
1.05
3.45
1.00
3.40
+85°C
3.30
3.25
3.20
-40°C
0.85
0.70
3.05
0.65
4.5
-40°C
0.80
3.10
4.0
+85°C
0.75
3.15
3.00
3.5
+25°C
0.90
Vo (V)
Vo (V)
0.95
+25°C
3.35
5.0
5.5
6.0
0.60
0
50
100
150
200
250
300
Io (mA)
VIN (V)
FIGURE 8. LOAD REGULATION vs TEMPERATURE
(VOUT = 0.9V)
FIGURE 7. LINE REGULATION vs TEMPERATURE
(VOUT = 3.3V)
VIN = 2.7V
1.00
VOUT = 1.85V
0.95
VOUT
+25°C
+85°C
Vo (V)
0.90
0.85
COUT = 1µF
-40°C
0.80
0.75
IOUT
0.70
3.0
3.5
4.0
4.5
5.0
5.5
6.0
IOUT = 1mA TO 250mA
VIN (V)
FIGURE 9. LINE REGULATION vs TEMPERATURE
(VOUT = 0.9V)
VOUT = 1.85V
FIGURE 10. LOAD TRANSIENT RESPONSE
VIN = 2.7V
COUT = 4.7µF
VOUT
IOUT
IOUT = 1mA TO 250mA
FIGURE 11. LOAD TRANSIENT RESPONSE
FN6867 Rev 2.00
January 14, 2010
FIGURE 12. ENABLE FUNCTION (VIN = 3.6V, VOUT = 1.85V,
COUT 1µF)
Page 5 of 10
ISL9021
Typical Operating Performance (Continued)
-20
-30
VIN = 4.5VDC + 50mVAC
COUT = 1µF
PSRR (dB)
-40
IO = 10mA
-50
-60
-70
IO = 0A
-80
-90
100
1k
10k
100k
1M
FREQUENCY (Hz)
FIGURE 13. POWER SUPPLY REJECTION vs FREQUENCY
Pin Descriptions
PIN
NAME
DESCRIPTION
VIN
IC Supply/LDO Input. Connect a 1µF capacitor to GND.
GND
System ground pin.
EN
LDO Enable. When this signal goes high, the LDO is turned on.
VO
LDO Output. Connect a 1µF to 4.7µF capacitor to GND.
E-Pad
For µTDFN package option only. Connect it to the system ground.
Typical Application
ISL9021
VIN (1.5V TO 5.5V)
VIN
VO
EN
GND
VOUT
ON
ENABLE
OFF
C1
C2
C1, C2: 1µF X5R CERAMIC CAPACITOR
FN6867 Rev 2.00
January 14, 2010
Page 6 of 10
ISL9021
Block Diagram
PASS ELEMENT
VIN
VOUT
EN
TEMP
SENSOR
CONTROL
LOGIC
VOLTAGE
AND
REFERENCE
GENERATOR
SHORT-CIRCUIT
PROTECTION
THERMAL PROTECTION
SOFT-START
+
BANDGAP
GND
FN6867 Rev 2.00
January 14, 2010
Page 7 of 10
ISL9021
Functional Description
The ISL9021 is a high performance low-dropout regulator
(LDO) with 250mA sourcing capability. The extra low ground
current makes this part a good choice for handheld product
applications. The device also incorporates overcurrent, thermal
shutdown, reverse current protections, and soft-start features.
Thermal shutdown protects the device against overheating.
Soft-start limits the start-up input current surges. In some
applications, the output voltage may be externally pulled higher
than input, or the input voltage could be connected to ground,
or connected to some voltage lower than the output side. The
ISL9021 features reverse current protection; that can block the
reverse current from output to input.
Enable Control
The ISL9021 has an enable pin. When EN is low, the IC is in
shutdown mode. In this condition, all on-chip circuits are off,
and the device draws minimum current, typically less than
0.1µA(typ). Driving this pin high will turn on the device.
LDO Protections
The ISL9021 offers several protection functions, making it ideal
for use in battery-powered applications.The ISL9021 provides
short-circuit protection by limiting the output current at current limit
of 260mA(min). If the short circuit lasts long enough, the die
temperature increases, and the over-temperature protection
circuit will shut down the output. When the die temperature
reaches about +145°C, thermal protection starts to work with
output being loaded with at least 50mA. Once the die temperature
drops to about +110°C, the LDO will resume operation beginning
with a soft-start.
The ISL9021’s reverse current protection is intended to block
reverse conduction if output voltage is higher than input
voltage.
Input and Output Capacitors
The ISL9021 provides a linear regulator that has low quiescent
current, fast transient response, and overall stable operation
across the recommended operating conditions. A ceramic
capacitor (X5R or X7R) with a capacitance of 1µF to 4.7µF with
an ESR up to 400m is suitable for the ISL9021 to maintain its
output stability. The ground connection of the output capacitor
should be routed directly to the GND pin of the device, and
also placed close to the IC. Similarly for the input capacitor,
usually a 1µF ceramic capacitor (X5R or 7R) is suitable for
most cases, but if a large, fast rising load transient condition is
expected, a higher value input capacitor may be necessary to
achieve satisfactory performance.
Board Layout Recommendations
A good PCB layout is an important step to achieve good
performance. It is recommended to design the board with
separate ground planes for input and output, and connect both
ground planes at the GND pin of the IC. Consideration should
be taken when placing the components and routing the trace to
minimize the ground impedance, and keep the parasitic
inductance low. Usually the input/output capacitors should be
placed as close to the IC as possible with a good ground
connection.
© Copyright Intersil Americas LLC 2009-2010. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6867 Rev 2.00
January 14, 2010
Page 8 of 10
ISL9021
Wafer Level Chip Scale Package
(WLCSP 0.4mm Ball Pitch)
W2x2.4
2x2 ARRAY 4 BALL WAFER LEVEL CHIP SCALE PACKAGE
D
E
PIN 1
TOP VIEW
SYMBOL
MILLIMETERS
A
0.44 Min, 0.495 Nom, 0.55 Max
A1
0.190 ±0.030
A2
0.305 ±0.025
b
0.270 ±0.030
D
1.155 ±0.020
D1
0.400 BASIC
E
0.975 ±0.020
E1
0.400 BASIC
e
0.400 BASIC
SD
0.200 BASIC
SE
0.00 BASIC
NUMBER OF BUMPS: 4
Rev. 2 6/08
A2
A1
A
NOTES:
1. All dimensions are in millimeters.
b
SIDE VIEW
e ( D1 )
2
SE
e ( E1 )
1
B
A
b
SD
BOTTOM VIEW
FN6867 Rev 2.00
January 14, 2010
Page 9 of 10
ISL9021
Package Outline Drawing
L6.1.6x1.6
6 LEAD ULTRA THIN DUAL FLAT NO-LEAD COL PLASTIC PACKAGE (UTDFN COL)
Rev 1, 11/07
2X 1.00
1.60
A
6
PIN 1
INDEX AREA
PIN #1 INDEX AREA
6
B
4X 0.50
1
3
5X 0 . 40 ± 0 . 1
1X 0.5 ±0.1
1.60
(4X)
0.15
4
6
0.10 M C A B
TOP VIEW
4 0.25 +0.05 / -0.07
BOTTOM VIEW
( 6X 0 . 25 )
SEE DETAIL "X"
( 1X 0 .70 )
0 . 55 MAX
0.10 C
C
BASE PLANE
(1.4 )
SIDE VIEW
( 5X 0 . 60 )
C
SEATING PLANE
0.08 C
0 . 2 REF
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
( 4X 0 . 5 )
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
FN6867 Rev 2.00
January 14, 2010
Page 10 of 10
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