NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 Operational Amplifier, Railto-Rail Output, 3 MHz BW The NCx2007x series operational amplifiers provide rail−to−rail output operation, 3 MHz bandwidth, and are available in single, dual, and quad configurations. Rail−to−rail operation enables the user to make optimal use of the entire supply voltage range while taking advantage of 3 MHz bandwidth. The NCx2007x can operate on supply voltages as low as 2.7 V over the temperature range of −40°C to 125°C. At a 2.7 V supply, the high bandwidth provides a slew rate of 2.8 V/ms while only consuming 405 mA of quiescent current per channel. The wide supply range allows the NCx2007x to run on supply voltages as high as 36 V, making it ideal for a broad range of applications. Since this is a CMOS device, high input impedance and low bias currents make it ideal for interfacing to a wide variety of signal sensors. The NCx2007x devices are available in a variety of compact packages. Automotive qualified options are available under the NCV prefix. www.onsemi.com 5 1 TSOP−5 CASE 483 SOT−553 CASE 463B 8 1 Micro8] CASE 846A SOIC−8 CASE 751 Features • • • • • • • • • • Rail−To−Rail Output Wide Supply Range: 2.7 V to 36 V Wide Bandwidth: 3 MHz typical at VS = 2.7 V High Slew Rate: 2.8 V/ms typical at VS = 2.7 V Low Supply Current: 405 mA per channel at VS = 2.7 V Low Input Bias Current: 5 pA typical Wide Temperature Range: −40°C to 125°C Available in a variety of packages NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 14 1 TSSOP−14 CASE 948G TSSOP−8 CASE 948S 14 1 SOIC−14 NB CASE 751A DEVICE MARKING INFORMATION See general marking information in the device marking section on page 2 of this data sheet. Applications • Current Sensing • Signal Conditioning • Automotive ORDERING INFORMATION See detailed ordering and shipping information on page 4 of this data sheet. End Products • Notebook Computers • Portable Instruments • Power Supplies This document contains information on some products that are still under development. ON Semiconductor reserves the right to change or discontinue these products without notice. © Semiconductor Components Industries, LLC, 2016 May, 2016 − Rev. 11 1 Publication Order Number: NCS20071/D NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 MARKING DIAGRAMS Single Channel Configuration NCS20071, NCV20071 5 XXXAYWG G XXMG G 1 TSOP−5 CASE 483 SOT−553 CASE 463B Dual Channel Configuration NCS20072, NCV20072 8 8 K72 YWW AG G NCS20072 ALYW G 0072 AYWG G 1 1 Micro8] CASE 846A SOIC−8 CASE 751 TSSOP−8 CASE 948S Quad Channel Configuration NCS20074, NCV20074 14 14 NCS2 0074 ALYWG G NCS20074G AWLYWW 1 1 TSSOP−14 CASE 948G XXXXX A WL, L Y WW, W G or G SOIC−14 NB CASE 751A = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) www.onsemi.com 2 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 Single Channel Configuration NCS20071, NCV20071 OUT 1 5 IN+ VDD 1 5 VDD 4 OUT + IN+ 3 VSS 2 IN− 3 − − 2 + VSS 4 IN− SOT23−5 (TSOP−5) SOT553−5 Quadruple Channel Configuration NCS20074, NCV20074 Dual Channel Configuration NCS20072, NCV20072 OUT 1 1 IN− 1 2 − IN+ 1 3 + VSS 4 OUT 1 1 14 OUT 4 8 VDD IN− 1 2 − − 13 IN− 4 7 OUT 2 IN+ 1 3 + + 12 IN+ 4 − 6 IN− 2 + 5 IN+ 2 11 VSS VDD 4 IN+ 2 5 + + 10 IN+ 3 IN− 2 6 − − OUT 2 7 Figure 1. Pin Connections www.onsemi.com 3 9 IN− 3 8 OUT 3 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 ORDERING INFORMATION Device Configuration Automotive NCS20071SN2T1G (In Development)** No NCS20071XV53T2G (In Development)** NCV20071SN2T1G* (In Development)** Single Yes NCV20071XV53T2G* (In Development)** NCS20072DMR2G NCS20072DR2G No NCS20072DTBR2G NCV20072DMR2G* Dual NCV20072DR2G* Yes NCV20072DTBR2G* NCS20074DR2G No NCS20074DTBR2G NCV20074DR2G* NCV20074DTBR2G* Quad Yes Marking Package Shipping† TBD TSOP−5 (Pb−Free) 3000 / Tape and Reel TBD SOT553−5 (Pb−Free) 4000 / Tape and Reel TBD TSOP−5 (Pb−Free) 3000 / Tape and Reel TBD SOT553−5 (Pb−Free) 4000 / Tape and Reel 0072 Micro8 (MSOP8) (Pb−Free) 4000 / Tape and Reel NCS20072 SOIC−8 (Pb−Free) 2500 / Tape and Reel K72 TSSOP−8 (Pb−Free) 2500 / Tape and Reel 0072 Micro8 (MSOP8) (Pb−Free) 4000 / Tape and Reel NCS20072 SOIC−8 (Pb−Free) 2500 / Tape and Reel K72 TSSOP−8 (Pb−Free) 2500 / Tape and Reel NCS20074 SOIC−14 (Pb−Free) 2500 / Tape and Reel NCS2 0074 TSSOP−14 (Pb−Free) 2500 / Tape and Reel NCS20074 SOIC−14 (Pb−Free) 2500 / Tape and Reel NCS2 0074 TSSOP−14 (Pb−Free) 2500 / Tape and Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. **Contact local sales office for availability. www.onsemi.com 4 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 ABSOLUTE MAXIMUM RATINGS (Note 1) Rating Symbol Supply Voltage (VDD – VSS) (Note 4) Limit Unit VS 40 V Input Voltage VCM VSS − 0.2 to VDD + 0.2 V Differential Input Voltage (Note 2) VID ±Vs V Maximum Input Current IIN ±10 mA Maximum Output Current (Note 3) IO ±100 mA Continuous Total Power Dissipation (Note 4) PD 200 mW Maximum Junction Temperature TJ 150 °C TSTG −65 to 150 °C Storage Temperature Range Mounting Temperature (Infrared or Convection – 20 sec) Tmount 260 °C ESD Capability (Note 5) HBM MM MM CDM CDM 2000 200 150 2000 (C6) 1000 (C6) V ILU 100 mA MSL Level 1 Human Body Model Machine Model − NCx20071 Machine Model − NCx20072, NCx20074 Charged Device Model − NCx20071/NCx20072 Charged Device Model − NCx20074 Latch−Up Current (Note 6) Moisture Sensitivity Level (Note 7) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. Maximum input current must be limited to ±10 mA. Series connected resistors of at least 500 W on both inputs may be used to limit the maximum input current to ±10 mA. 3. Total power dissipation must be limited to prevent the junction temperature from exceeding the 150°C limit. 4. Continuous short circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of the maximum output current rating over the long term may adversely affect reliability. Shorting output to either VDD or VSS will adversely affect reliability. 5. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per ANSI/ANSI/ESDA/JEDEC JS-001−2010 (AEC−Q100−002) ESD Machine Model tested per JESD22−A115 (AEC−Q100−003) ESD Charged Device Model tested per ANSI/ESD S5.3.1−2009 (AEC−Q100−011) 6. Latch−up Current tested per JEDEC standard: JESD78 (AEC−Q100−004) 7. Moisture Sensitivity Level tested per IPC/JEDEC standard: J−STD−020A THERMAL INFORMATION Parameter Symbol Package Single Layer Board (Note 8) Multi−Layer Board (Note 9) Unit SOT23−5 / TSOP5 SOT553−5 qJA Junction−to−Ambient 178 Micro8 / MSOP8 236 167 SOIC−8 190 131 TSSOP−8 253 194 SOIC−14 142 101 TSSOP−14 179 °C/W 128 mm2 8. Values based on a 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300 copper area 9. Values based on a 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm2 copper area OPERATING RANGES Parameter Symbol Min Max Unit VS 2.7 36 V Operating Supply Voltage (Split Supply) VS ±1.35 ±18 V Differential Input Voltage (Note 10) VID VS V Input Common Mode Voltage Range VCM VSS VDD − 1.35 V TA −40 125 °C Operating Supply Voltage (Single Supply) Ambient Temperature Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 10. Maximum input current must be limited to ±10 mA. See Absolute Maximum Ratings for more information. www.onsemi.com 5 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 ELECTRICAL CHARACTERISTICS AT VS = 2.7 V TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis. Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 11, 12) Parameter Symbol Conditions Min Typ Max Unit 1.3 ±3 mV INPUT CHARACTERISTICS Input Offset Voltage VOS Offset Voltage Drift DVOS/DT +4 TA = 25°C to 125°C 5 Input Bias Current (Note 12) IIB 2 Input Offset Current (Note 12) XTLK 2 DC pA 75 500 IOS NCx20074 Channel Separation 200 1500 NCx20072 mV mV/°C 2 75 pA 200 NCx20072 100 NCx20074 115 dB Differential Input Resistance RID 50 GW Common Mode Input Resistance RIN 5 GW Differential Input Capacitance CID 1.5 pF Common Mode Input Capacitance CCM 3.5 pF Common Mode Rejection Ratio 90 VCM = VSS + 0.2 V to VDD − 1.35 V NCx20072 VCM = VSS to VDD − 1.35 V (Note 13) NCx20074 CMRR 110 dB 69 90 110 dB 69 OUTPUT CHARACTERISTICS 96 Open Loop Voltage Gain Output Current Capability (Note 14) AVOL IO 118 dB 86 Op amp sinking current 70 Op amp sourcing current 50 0.006 mA 0.15 Output Voltage High VOH Voltage output swing from positive rail Output Voltage Low VOL Voltage output swing from negative rail UGBW CL = 25 pF 3 MHz SR CL = 20 pF, RL = 2 kW 2.8 V/ms Phase Margin öm CL = 25 pF 50 ° Gain Margin Am CL = 25 pF 14 dB Settling Time tS 0.22 0.005 V 0.15 0.22 V AC CHARACTERISTICS Unity Gain Bandwidth Slew Rate at Unity Gain VO = 1 Vpp, Gain = 1, CL = 20 pF Settling time to 0.1% 0.6 Settling time to 0.01% 1.2 ms Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 11. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 12. Performance guaranteed over the indicated operating temperature range by design and/or characterization. 13. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM = VSS + 0.2 V to VDD − 1.35 V. 14. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information. www.onsemi.com 6 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 ELECTRICAL CHARACTERISTICS AT VS = 2.7 V TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis. Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 11, 12) Parameter Symbol Conditions Min Typ THD+N VIN = 0.5 Vpp, f = 1 kHz, Av = 1 0.05 Max Unit NOISE CHARACTERISTICS Total Harmonic Distortion plus Noise f = 1 kHz 30 f = 10 kHz 20 in f = 1 kHz 0.25 PSRR No Load IDD Per channel, no load Input Referred Voltage Noise en Input Referred Current Noise % nV/√Hz fA/√Hz SUPPLY CHARACTERISTICS 114 Power Supply Rejection Ratio 135 dB 100 405 Power Supply Quiescent Current 525 mA 625 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 11. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 12. Performance guaranteed over the indicated operating temperature range by design and/or characterization. 13. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM = VSS + 0.2 V to VDD − 1.35 V. 14. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information. ELECTRICAL CHARACTERISTICS AT VS = 5 V TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis. Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 15, 16) Parameter Symbol Conditions Min Typ Max Unit 1.3 ±3 mV +4 mV INPUT CHARACTERISTICS Input Offset Voltage VOS Offset Voltage Drift DVOS/DT TA = 25°C to 125 °C 5 Input Bias Current (Note 16) IIB 2 IOS XTLK 2 DC pA 75 500 NCx20074 Channel Separation 200 1500 NCx20072 Input Offset Current (Note 16) mV/°C 2 75 pA 200 NCx20072 100 NCx20074 115 dB Differential Input Resistance RID 50 GW Common Mode Input Resistance RIN 5 GW Differential Input Capacitance CID 1.5 pF Common Mode Input Capacitance CCM 3.5 pF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 15. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 16. Performance guaranteed over the indicated operating temperature range by design and/or characterization. 17. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM = VSS + 0.2 V to VDD − 1.35 V. 18. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information. www.onsemi.com 7 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 ELECTRICAL CHARACTERISTICS AT VS = 5 V TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis. Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 15, 16) Parameter Symbol Conditions Min Typ 102 125 Max Unit INPUT CHARACTERISTICS Common Mode Rejection Ratio VCM = VSS + 0.2 V to VDD − 1.35 V NCx20072 VCM = VSS to VDD − 1.35 V (Note 17) NCx20074 CMRR dB 80 102 125 dB 80 OUTPUT CHARACTERISTICS Open Loop Voltage Gain Output Current Capability (Note 18) 96 AVOL IO 120 dB 86 Op amp sinking current 50 Op amp sourcing current 60 0.013 Output Voltage High VOH Voltage output swing from positive rail Output Voltage Low VOL Voltage output swing from negative rail mA 0.20 0.25 0.01 V 0.10 0.15 V AC CHARACTERISTICS UGBW CL = 25 pF 3.2 MHz Slew Rate at Unity Gain SR CL = 20 pF, RL = 2 kW 2.7 V/ms Phase Margin öm CL = 25 pF 50 ° Gain Margin Am CL = 25 pF 14 dB Settling Time tS Unity Gain Bandwidth VO = 3 Vpp, Gain = 1, CL = 20 pF Settling time to 0.1% 1.2 Settling time to 0.01% 5.6 ms NOISE CHARACTERISTICS Total Harmonic Distortion plus Noise THD+N VIN = 2.5 Vpp, f = 1 kHz, Av = 1 0.009 f = 1 kHz 30 f = 10 kHz 20 0.25 Input Referred Voltage Noise en Input Referred Current Noise in f = 1 kHz PSRR No Load IDD Per channel, no load % nV/√Hz fA/√Hz SUPPLY CHARACTERISTICS 114 Power Supply Rejection Ratio 135 dB 100 410 Power Supply Quiescent Current 530 630 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 15. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 16. Performance guaranteed over the indicated operating temperature range by design and/or characterization. 17. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM = VSS + 0.2 V to VDD − 1.35 V. 18. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information. www.onsemi.com 8 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 ELECTRICAL CHARACTERISTICS AT VS = 10 V TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis. Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 19, 20) Parameter Symbol Conditions Min Typ Max Unit 1.3 ±3 mV INPUT CHARACTERISTICS Input Offset Voltage VOS Offset Voltage Drift DVOS/DT +4 TA = 25°C to 125°C 5 Input Bias Current (Note 20) IIB 2 Input Offset Current (Note 20) XTLK 2 DC pA 75 500 IOS NCx20074 Channel Separation 200 1500 NCx20072 mV mV/°C 2 75 pA 200 NCx20072 100 NCx20074 115 dB Differential Input Resistance RID 50 GW Common Mode Input Resistance RIN 5 GW Differential Input Capacitance CID 1.5 pF Common Mode Input Capacitance CCM 3.5 pF Common Mode Rejection Ratio 110 VCM = VSS + 0.2 V to VDD − 1.35 V NCx20072 VCM = VSS to VDD − 1.35 V (Note 21) NCx20074 CMRR 130 dB 87 110 130 dB 87 OUTPUT CHARACTERISTICS 98 Open Loop Voltage Gain Output Current Capability (Note 22) AVOL IO 120 dB 88 Op amp sinking current 50 Op amp sourcing current 65 0.023 mA 0.08 Output Voltage High VOH Voltage output swing from positive rail Output Voltage Low VOL Voltage output swing from negative rail UGBW CL = 25 pF 3.2 MHz SR CL = 20 pF, RL = 2 kW 2.2 V/ms Phase Margin öm CL = 25 pF 50 ° Gain Margin Am CL = 25 pF 14 dB Settling Time tS 0.10 0.022 V 0.3 0.35 V AC CHARACTERISTICS Unity Gain Bandwidth Slew Rate at Unity Gain VO = 8.5 Vpp, Gain = 1, CL = 20 pF Settling time to 0.1% 3.4 Settling time to 0.01% 6.8 ms Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 19. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 20. Performance guaranteed over the indicated operating temperature range by design and/or characterization. 21. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM = VSS + 0.2 V to VDD − 1.35 V. 22. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information. www.onsemi.com 9 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 ELECTRICAL CHARACTERISTICS AT VS = 10 V TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis. Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 19, 20) Parameter Symbol Conditions Min Typ THD+N VIN = 7.5 Vpp, f = 1 kHz, Av = 1 0.004 Max Unit NOISE CHARACTERISTICS Total Harmonic Distortion plus Noise f = 1 kHz 30 f = 10 kHz 20 in f = 1 kHz 0.25 PSRR No Load IDD Per channel, no load Input Referred Voltage Noise en Input Referred Current Noise % nV/√Hz fA/√Hz SUPPLY CHARACTERISTICS 114 Power Supply Rejection Ratio 135 dB 100 416 Power Supply Quiescent Current 540 mA 640 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 19. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 20. Performance guaranteed over the indicated operating temperature range by design and/or characterization. 21. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM = VSS + 0.2 V to VDD − 1.35 V. 22. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information. ELECTRICAL CHARACTERISTICS AT VS = 36 V TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis. Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 23, 24) Parameter Symbol Conditions Min Typ Max Unit 1.3 ±3 mV +4 mV INPUT CHARACTERISTICS Input Offset Voltage VOS Offset Voltage Drift DVOS/DT TA = 25°C to 125°C IIB NCx20072 2000 NCx20074 1500 5 Input Bias Current (Note 24) 2 NCx20072 Input Offset Current (Note 24) IOS XTLK 2 DC 200 pA 75 1000 NCx20074 Channel Separation mV/°C 2 75 pA 200 NCx20072 100 NCx20074 115 dB Differential Input Resistance RID 50 GW Common Mode Input Resistance RIN 5 GW Differential Input Capacitance CID 1.5 pF Common Mode Input Capacitance CCM 3.5 pF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 23. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 24. Performance guaranteed over the indicated operating temperature range by design and/or characterization. 25. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM = VSS + 0.2 V to VDD − 1.35 V. 26. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information. www.onsemi.com 10 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 ELECTRICAL CHARACTERISTICS AT VS = 36 V TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis. Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 23, 24) Parameter Symbol Conditions Min Typ 120 145 Max Unit INPUT CHARACTERISTICS VCM = VSS + 0.2 V to VDD − 1.35 V Common Mode Rejection Ratio NCx20072 CMRR 95 120 VCM = VSS to VDD − 1.35 V (Note 25) NCx20074 dB 145 95 OUTPUT CHARACTERISTICS 98 Open Loop Voltage Gain Output Current Capability (Note 26) AVOL IO 120 dB 88 Op amp sinking current 50 Op amp sourcing current 65 0.074 Output Voltage High VOH Voltage output swing from positive rail 0.10 NCx20072 0.15 NCx20074 0.12 0.065 Output Voltage Low mA V 0.3 VOL Voltage output swing from negative rail UGBW CL = 25 pF 3.2 MHz Slew Rate at Unity Gain SR CL = 20 pF, RL = 2 kW 2.4 V/ms Phase Margin öm CL = 25 pF 50 ° Gain Margin Am CL = 25 pF 14 dB Settling Time tS 0.35 V AC CHARACTERISTICS Unity Gain Bandwidth VO = 10 Vpp, Gain = 1, CL = 20 pF Settling time to 0.1% 3.2 Settling time to 0.01% 6.8 ms NOISE CHARACTERISTICS Total Harmonic Distortion plus Noise THD+N VIN = 28.5 Vpp, f = 1 kHz, Av = 1 0.001 f = 1 kHz 30 f = 10 kHz 20 0.25 Input Referred Voltage Noise en Input Referred Current Noise in f = 1 kHz PSRR No Load % nV/√Hz fA/√Hz SUPPLY CHARACTERISTICS 114 Power Supply Rejection Ratio 135 dB 100 465 NCx20072 Power Supply Quiescent Current IDD Per channel, no load 700 465 NCx20074 570 600 mA 700 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 23. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 24. Performance guaranteed over the indicated operating temperature range by design and/or characterization. 25. Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to VCM = VSS + 0.2 V to VDD − 1.35 V. 26. Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more information. www.onsemi.com 11 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 0.7 0.6 SUPPLY CURRENT (mA) T = 125°C T = 85°C 0.5 T = 25°C 0.4 T = −40°C 0.3 0.2 0.6 VS = 36 V 0.5 VS = 2.7 V 0.4 VS = 5 V VS = 10 V 0.3 0.2 0 6 12 18 24 SUPPLY VOLTAGE (V) 30 36 −40 −20 Figure 2. Quiescent Current Per Channel vs. Supply Voltage 20 40 60 80 TEMPERATURE (°C) 5 VCM = mid−supply OFFSET VOLTAGE (mV) OFFSET VOLTAGE (mV) −0.4 T = −40°C T = 85°C T = 25°C T = 125°C −0.8 120 VS = ±18 V 10 units 4 −0.2 −0.6 100 Figure 3. Quiescent Current vs. Temperature 0 −1 3 2 1 0 −1 −2 −3 −4 −5 −18 −1.2 0 6 12 18 24 SUPPLY VOLTAGE (V) 30 36 −14 Figure 4. Offset Voltage vs. Supply Voltage 2.5 −10 −6 −2 2 6 10 COMMON MODE VOLTAGE (V) 14 125 Normal operation VS = ±18 V 10 units −2.5 50 GAIN (dB) 75 −7.5 180 VS = 2.7 V, Gain VS = 36 V, Gain VS = 2.7 V, Phase VS = 36 V, Phase 100 0 −5 18 Figure 5. Input Offset Voltage vs. Common Mode Voltage 5 OFFSET VOLTAGE (mV) 0 −10 GAIN 135 90 45 25 0 0 RL = 10 kW CL = 15 pF −45 −25 PHASE (°) SUPPLY CURRENT (mA) 0.7 −90 PHASE −12.5 −15 15.5 −50 16 16.5 17 17.5 COMMON MODE VOLTAGE (V) 18 18.5 −75 10 Figure 6. Input Offset Voltage vs. Common Mode Voltage −135 100 1k 10k 100k 1M FREQUENCY (Hz) 10M −180 100M Figure 7. Gain and Phase vs. Frequency www.onsemi.com 12 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 60 1E+1 VS = 5 V RL = 10 kW TA = 25°C 1E+0 40 THD+N (%) PHASE MARGIN (°) 50 VS = 36 V FIN = 1 kHz AV = 1 30 1E−1 1E−2 20 1E−3 10 0 1E−4 0 100 200 300 CAPACITIVE LOAD (pF) 400 500 0 Figure 8. Phase Margin vs. Capacitive Load 1E+1 275 AV = 1 VS = 2.7 V VS = 5 V VS = 10 V 1E−3 30 36 VS = 2.7 V VS = 5 V VS = 10 V VS = 36 V 250 VOLTAGE NOISE (nV/√Hz) THD+N (%) 1E−2 12 18 24 OUTPUT VOLTAGE (Vpp) Figure 9. THD+N vs. Output Voltage 1E+0 1E−1 6 VS = 36 V 225 200 175 150 125 100 75 50 25 1E−4 10 100 1k 0 10 100 1k 10k 100k FREQUENCY (Hz) FREQUENCY (Hz) Figure 10. THD+N vs. Frequency Figure 11. Input Voltage Noise vs. Frequency 140 5 VS = 2.7 V VS = 5 V VS = 10 V VS = 36 V 4 VS = 2.7 V, VDD VS = 5 V, VSS VS = 10 V, VDD VS = 36 V VSS 120 100 3 PSRR (dB) CURRENT NOISE (fA/√Hz) 10k 2 1 60 40 0 −1 10 80 20 0 100 1k 10k 100k 10 100 1k 10k 100k FREQUENCY (Hz) FREQUENCY (Hz) Figure 12. Input Current Noise vs. Frequency Figure 13. PSRR vs. Frequency www.onsemi.com 13 1M NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 120 1.4 100 OUTPUT VOLTAGE RELATIVE TO VDD (V) VS = 2.7 V VS = 5 V VS = 10 V VS = 36 V CMRR (dB) 80 60 40 20 RL = 10 kW TA = 25°C 0 10 1k 10k 100k 0.6 0.4 0.2 VS = 36 V 1M 0 2 4 6 8 10 12 14 16 18 OUTPUT CURRENT (mA) Figure 14. CMRR vs. Frequency Figure 15. High Level Output vs. Output Current 18.1 Input Output 20 VS = 36 V AV = +1 RL = 10 kW 18.05 VOLTAGE (V) OUTPUT VOLTAGE RELATIVE TO VSS (V) 0.8 FREQUENCY (Hz) T = −40°C T = 25°C T = 85°C T = 125°C 0.8 1 0 100 1 T = −40°C T = 25°C T = 85°C T = 125°C 1.2 0.6 0.4 18 17.95 0.2 VS = 36 V 0 0 2 4 6 8 10 12 14 16 18 17.9 −20 20 0 20 40 OUTPUT CURRENT (mA) TIME (ms) Figure 16. Low Level Output vs. Output Current Figure 17. Non−inverting Small Signal Transient Response 18.075 60 25 Input Output 18.025 VOLTAGE (V) VOLTAGE (V) 18.05 18 VS = 36 V AV = +1 RL = 10 kW 17.975 20 15 VS = 36 V AV = +1 RL = 10 kW 17.95 17.925 −20 0 20 40 60 10 −20 Input Output 0 20 40 TIME (ms) TIME (ms) Figure 18. Inverting Small Signal Transient Response Figure 19. Non−inverting Large Signal Transient Response www.onsemi.com 14 60 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 24 1200 VS = 36 V 22 CURRENT (pA) 20 VOLTAGE (V) 1000 VS = 36 V AV = −1 RL = 10 kW 18 16 14 12 10 −20 IIB+ IIB− IOS 800 600 400 200 0 Input Output 0 20 40 −200 −25 60 0 25 50 75 100 125 TIME (ms) TEMPERATURE (°C) Figure 20. Inverting Large Signal Transient Response Figure 21. Input Bias and Offset Current vs. Temperature 50 30 20 10 2 mV/div CURRENT (pA) 0.1 Hz to 10 Hz noise VS = ±18 V, VCM = VS/2 RL = 10 kW, CL = 100 pF AV = −1, VIN = 0 V VS = 36 V IIB+ IIB− IOS 40 0 −10 −20 −30 −40 −50 0 6 12 18 30 24 36 0 4 5 6 7 8 TIME (s) Figure 23. 0.1 Hz to 10 Hz Noise 500 RL = 10 kW CL = 25 pF 400 −60 −80 −100 VS = 2.7 V VS = 5 V VS = 10 V VS = 36 V −120 −140 100 1k 10k 100k 9 10 VS = 2.7 V VS = 5 V VS = 10 V VS = 36 V 450 IMPEDANCE (W) CHANNEL SEPARATION (dB) 3 COMMON MODE VOLTAGE (V) −40 −160 10 2 Figure 22. Input Bias Current vs. Common Mode Voltage 0 −20 1 350 300 250 200 150 100 50 0 1M 10 100 1k 10k 100k FREQUENCY (Hz) FREQUENCY (Hz) Figure 24. Channel Separation vs. Frequency Figure 25. Open Loop Output Impedance www.onsemi.com 15 1M NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 1000 VS = 36 V 10 V step AV = −1 8 D FROM FINAL VALUE (mV) OFFSET VOLTAGE (mV) 500 10 VS = 36 V 5 Units VCM = mid−supply 0 −500 −1000 −1500 −2000 6 4 2 12−bit Setting 0 ±1/2LSB = ±0.024% −2 −4 −6 −8 −2500 −50 −25 25 0 50 75 125 100 −10 0 15 20 25 30 35 40 Figure 26. Offset Voltage vs. Temperature Figure 27. Large Signal Settling Time SR+ SR− VS = 36 V 4 SLEW RATE (V/ms) 10 TIME (ms) 5 3 2 1 0 −40 5 TEMPERATURE (°C) −20 0 20 40 60 80 100 120 TEMPERATURE (°C) Figure 28. Slew Rate vs. Temperature www.onsemi.com 16 45 50 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 PACKAGE DIMENSIONS SOT−553, 5 LEAD CASE 463B ISSUE C D −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 1 2 E −Y− 3 b e HE c 5 PL 0.08 (0.003) DIM A b c D E e L HE M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.65 1.20 1.25 0.50 BSC 0.10 0.20 0.30 1.55 1.60 1.65 MIN 0.50 0.17 0.08 1.55 1.15 RECOMMENDED SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 17 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.008 0.004 0.061 0.063 MIN 0.020 0.007 0.003 0.061 0.045 MAX 0.024 0.011 0.007 0.065 0.049 0.012 0.065 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 PACKAGE DIMENSIONS TSOP−5 CASE 483−02 ISSUE K NOTE 5 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X 0.20 C A B 0.10 T M 2X 0.20 T B 5 1 4 2 S 3 K B DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H SIDE VIEW C SEATING PLANE END VIEW MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 18 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 PACKAGE DIMENSIONS Micro8t CASE 846A−02 ISSUE J D HE PIN 1 ID NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. E b 8 PL 0.08 (0.003) −T− DIM A A1 b c D E e L HE e M T B S A S SEATING PLANE A 0.038 (0.0015) A1 MILLIMETERS NOM MAX −− 1.10 0.08 0.15 0.33 0.40 0.18 0.23 3.00 3.10 3.00 3.10 0.65 BSC 0.40 0.55 0.70 4.75 4.90 5.05 MIN −− 0.05 0.25 0.13 2.90 2.90 L c RECOMMENDED SOLDERING FOOTPRINT* 8X 8X 0.48 0.80 5.25 0.65 PITCH DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 19 INCHES NOM −− 0.003 0.013 0.007 0.118 0.118 0.026 BSC 0.021 0.016 0.187 0.193 MIN −− 0.002 0.010 0.005 0.114 0.114 MAX 0.043 0.006 0.016 0.009 0.122 0.122 0.028 0.199 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. −X− A 8 5 S B 0.25 (0.010) M Y M 1 4 K −Y− G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H M D 0.25 (0.010) M Z Y S X J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 20 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 PACKAGE DIMENSIONS TSSOP−8 CASE 948S ISSUE C 8x 0.20 (0.008) T U K REF 0.10 (0.004) S 2X L/2 8 B −U− 1 PIN 1 IDENT S T U 5 L 0.20 (0.008) T U M S V ÉÉÉÉ ÇÇÇ ÉÉÉÉ ÇÇÇ ÉÉÉÉ ÇÇÇ J J1 4 K1 K A −V− SECTION N−N −W− C 0.076 (0.003) D −T− SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S DETAIL E G 0.25 (0.010) N M N F DETAIL E www.onsemi.com 21 DIM A B C D F G J J1 K K1 L M MILLIMETERS MIN MAX 2.90 3.10 4.30 4.50 --1.10 0.05 0.15 0.50 0.70 0.65 BSC 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.114 0.122 0.169 0.177 --0.043 0.002 0.006 0.020 0.028 0.026 BSC 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 PACKAGE DIMENSIONS TSSOP−14 CASE 948G ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A −V− ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 J J1 DIM A B C D F G H J J1 K K1 L M SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 22 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 PACKAGE DIMENSIONS SOIC−14 NB CASE 751A−03 ISSUE L D A B 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 8 A3 E H L 1 0.25 M DETAIL A 7 B 13X M DIM A A1 A3 b D E e H h L M b 0.25 M C A S B S 0.10 X 45 _ M A1 e DETAIL A h A C SEATING PLANE MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.19 0.25 0.35 0.49 8.55 8.75 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ INCHES MIN MAX 0.054 0.068 0.004 0.010 0.008 0.010 0.014 0.019 0.337 0.344 0.150 0.157 0.050 BSC 0.228 0.244 0.010 0.019 0.016 0.049 0_ 7_ SOLDERING FOOTPRINT* 6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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