LMV331 SINGLE, LMV393 DUAL LMV339 QUAD SLCS136N – AUGUST 1999 – REVISED APRIL 2011 www.ti.com GENERAL-PURPOSE LOW-VOLTAGE COMPARATORS FEATURES 1 The LMV393 and LMV339 devices are low-voltage (2.7 V to 5.5 V) versions of the dual and quad comparators, LM393 and LM339, which operate from 5 V to 30 V. The LMV331 is the single-comparator version. The LMV331, LMV339, and LMV393 are the most cost-effective solutions for applications where low-voltage operation, low power, space saving, and price are the primary specifications in circuit design for portable consumer products. These devices offer specifications that meet or exceed the familiar LM339 and LM393 devices at a fraction of the supply current. 1 14 2 13 3 12 4 11 5 10 6 9 7 8 3OUT 4OUT GND 4IN+ 4IN– 3IN+ 3IN– LMV339 . . . RUC PACKAGE (TOP VIEW) 1OUT 1 VCC+ 3OUT DESCRIPTION/ ORDERING INFORMATION 2OUT 1OUT VCC+ 1IN– 1IN+ 2IN– 2IN+ 14 13 12 4OUT 2 11 GND 1IN– 3 10 4IN+ 1IN+ 4 9 4IN– 2IN– 5 8 3IN+ 6 7 3IN– • • LMV339 . . . D OR PW PACKAGE (TOP VIEW) 2OUT • 2.7-V and 5-V Performance Low Supply Current – LMV331 . . . 130 μA Typ – LMV393 . . . 210 μA Typ – LMV339 . . . 410 μA Typ Input Common-Mode Voltage Range Includes Ground Low Output Saturation Voltage 200 mV Typical Open-Collector Output for Maximum Flexibility 2IN+ • • LMV393 . . . D, DDU, DGK OR PW PACKAGE (TOP VIEW) 1OUT 1IN– 1IN+ GND 1 8 2 7 3 6 4 5 VCC+ 2OUT 2IN– 2IN+ LMV331 . . . DBV OR DCK PACKAGE (TOP VIEW) 1IN+ 1 GND 2 1IN– 3 5 VCC+ 4 OUT 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2011, Texas Instruments Incorporated LMV331 SINGLE, LMV393 DUAL LMV339 QUAD SLCS136N – AUGUST 1999 – REVISED APRIL 2011 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA SC-70 – DCK Single SOT23-5 – DBV MSOP/VSSOP – DGK SOIC – D –40°C to 85°C Dual TSSOP – PW VSSOP – DDU SOIC – D Quad TSSOP – PW µQFN – RUC (1) (2) (3) TOP-SIDE MARKING (3) ORDERABLE PART NUMBER Reel of 3000 LMV331IDCKR Reel of 250 LMV331IDCKT Reel of 3000 LMV331IDBVR Reel of 250 LMV331IDBVT Reel of 2500 LMV338IDGKR Tube of 75 LMV393ID Reel of 2500 LMV393IDR Tube of 90 LMV393IPW Reel of 2000 LMV393IPWR Reel of 3000 LMV393IDDUR Tube of 50 LMV339ID Reel of 2500 LMV339IDR Tube of 150 LMV339IPW Reel of 2000 LMV339IPWR Reel of 3000 LMV339IRUCR R2_ R1I_ R9_ MV393I MV393I RABR LM339I MV339I RT For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK/DGK: The actual top-side marking has one additional character that designates the wafer fab/assembly site. SYMBOL (EACH COMPARATOR) – IN– OUT + IN+ LMV324 SIMPLIFIED SCHEMATIC VCC+ Q6 Q7 M OUT IN+ Q1Q2 Q3Q4Q5 IN− R1R2R3 GND 2 Copyright © 1999–2011, Texas Instruments Incorporated LMV331 SINGLE, LMV393 DUAL LMV339 QUAD SLCS136N – AUGUST 1999 – REVISED APRIL 2011 www.ti.com Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN (2) VCC Supply voltage VID Differential input voltage (3) VI Input voltage range (either input) Duration of output short circuit (one amplifier) to ground (4) 0 At or below TA = 25°C, VCC ≤ 5.5 V D package Package thermal impedance (5) (6) Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) (5) (6) V V 5.5 V 8 pin 97 14 pin 86 206 252 DDU package TBD RUC package TBD DGK package TJ 5.5 ±5.5 DCK package PW package UNIT Unlimited DBV package θJA MAX °C/W 172 8 pin 149 14 pin 113 –65 150 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND. Differential voltages are at IN+ with respect to IN–. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions VCC Supply voltage (single-supply operation) VOUT Output voltage TA Operating free-air temperature Copyright © 1999–2011, Texas Instruments Incorporated I temperature MIN MAX 2.7 5.5 V VCC+ + 0.3 V 85 °C –40 UNIT 3 LMV331 SINGLE, LMV393 DUAL LMV339 QUAD SLCS136N – AUGUST 1999 – REVISED APRIL 2011 www.ti.com Electrical Characteristics VCC+ = 2.7 V, GND = 0 V, at specified free-air temperature (unless otherwise noted) PARAMETER VIO Input offset voltage αVIO Average temperature coefficient of input offset voltage IIB Input bias current IIO Input offset current IO Output current (sinking) TEST CONDITIONS TA MIN 25°C Saturation voltage ICC Supply current 7 5 25°C 15 5 –40°C to 85°C VO ≤ 1.5 V 5 mV 250 nA 50 150 25°C UNIT μV/°C 400 25°C VSAT 1.7 –40°C to 85°C Output Leakage Current Common-mode input voltage range MAX –40°C to 85°C 25°C VICR TYP 23 nA mA 0.003 –40°C to 85°C 1 25°C –0.1 to 2 IO ≤ 1.5 mA 25°C 200 LMV331 25°C 40 100 LMV393 (both comparators) 25°C 70 140 LMV339 (all four comparators) 25°C 140 200 µA V mV μA Switching Characteristics TA = 25°C, VCC+ = 2.7 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted) PARAMETER TEST CONDITIONS TYP tPHL Propagation delay high to low level output switching Input overdrive = 10 mV 1000 Input overdrive = 100 mV 350 tPLH Propagation delay low to high level output switching Input overdrive = 10 mV 500 Input overdrive = 100 mV 400 4 UNIT ns ns Copyright © 1999–2011, Texas Instruments Incorporated LMV331 SINGLE, LMV393 DUAL LMV339 QUAD SLCS136N – AUGUST 1999 – REVISED APRIL 2011 www.ti.com Electrical Characteristics VCC+ = 5 V, GND = 0 V, at specified free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS TA MIN 25°C VIO Input offset voltage αVIO Average temperature coefficient of input offset voltage IIB Input bias current –40°C to 85°C IIO Input offset current –40°C to 85°C IO Output current (sinking) 1.7 7 9 25°C 5 25°C 25 VO ≤ 1.5 V 25°C 2 Output Leakage Current Common-mode input voltage range 25°C AVD Large-signal differential voltage gain 25°C VSAT Saturation voltage 25°C IO ≤ 4 mA –40°C to 85°C LMV331 –40°C to 85°C LMV393 (both comparators) –40°C to 85°C LMV339 (all four comparators) –40°C to 85°C 25°C 25°C 25°C nA 50 84 nA mA 0.003 –40°C to 85°C VICR mV 250 150 10 UNIT μV/°C 400 25°C Supply current MAX –40°C to 85°C 25°C ICC TYP 1 –0.1 to 4.2 20 V 50 200 V/mV 400 700 60 µA mV 120 150 100 200 250 170 μA 300 350 Switching Characteristics TA = 25°C, VCC+ = 5 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted) PARAMETER TEST CONDITIONS TYP tPHL Propagation delay high to low level output switching Input overdrive = 10 mV Input overdrive = 100 mV 200 tPLH Propagation delay low to high level output switching Input overdrive = 10 mV 450 Input overdrive = 100 mV 300 Copyright © 1999–2011, Texas Instruments Incorporated 600 UNIT ns ns 5 LMV331 SINGLE, LMV393 DUAL LMV339 QUAD SLCS136N – AUGUST 1999 – REVISED APRIL 2011 www.ti.com REVISION HISTORY Changes from Revision M (November 2005) to Revision N Page • Changed document format from Quicksilver to DocZone. .................................................................................................... 1 • Added RUC package pin out and RUC package ordering information. ............................................................................... 1 6 Copyright © 1999–2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 13-May-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp LMV331IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV331IDCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IDE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IDRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 13-May-2011 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp LMV339IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV339IRUCR ACTIVE QFN RUC 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDDUR ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDDURE4 ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDDURG4 ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 13-May-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp LMV393IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 13-May-2011 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LMV331, LMV393 : • Automotive: LMV331-Q1, LMV393-Q1 NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 20-Aug-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LMV331IDBVR SOT-23 DBV 5 3000 180.0 9.2 LMV331IDBVR SOT-23 DBV 5 3000 178.0 LMV331IDBVT SOT-23 DBV 5 250 178.0 LMV331IDCKR SC70 DCK 5 3000 LMV331IDCKR SC70 DCK 5 LMV331IDCKT SC70 DCK LMV331IDCKT SC70 DCK LMV339IDR SOIC W Pin1 (mm) Quadrant 3.17 3.23 1.37 4.0 8.0 Q3 9.0 3.23 3.17 1.37 4.0 8.0 Q3 9.0 3.23 3.17 1.37 4.0 8.0 Q3 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 5 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LMV339IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LMV339IRUCR QFN RUC 14 3000 180.0 8.4 2.3 2.3 0.55 4.0 8.0 Q2 LMV393IDDUR VSSOP DDU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 LMV393IDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV393IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LMV393IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Aug-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV331IDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0 LMV331IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 LMV331IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 LMV331IDCKR SC70 DCK 5 3000 180.0 180.0 18.0 LMV331IDCKR SC70 DCK 5 3000 205.0 200.0 33.0 LMV331IDCKT SC70 DCK 5 250 180.0 180.0 18.0 LMV331IDCKT SC70 DCK 5 250 205.0 200.0 33.0 LMV339IDR SOIC D 14 2500 346.0 346.0 33.0 LMV339IPWR TSSOP PW 14 2000 346.0 346.0 29.0 LMV339IRUCR QFN RUC 14 3000 202.0 201.0 28.0 LMV393IDDUR VSSOP DDU 8 3000 202.0 201.0 28.0 LMV393IDGKR MSOP DGK 8 2500 358.0 335.0 35.0 LMV393IDR SOIC D 8 2500 340.5 338.1 20.6 LMV393IPWR TSSOP PW 8 2000 346.0 346.0 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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