LF411 JFET-INPUT OPERATIONAL AMPLIFIER SLOS011C – MARCH 1987 – REVISED OCTOBER 1997 D D D D D D D D OR P PACKAGE (TOP VIEW) Low Input Bias Current, 50 pA Typ Low Input Noise Current, 0.01 pA/√Hz Typ Low Supply Current, 2 mA Typ High Input impedance, 1012 Ω Typ Low Total Harmonic Distortion Low 1/f Noise Corner, 50 Hz Typ Package Options Include Plastic Small-Outline (D) and Standard (P) DIPs BAL1 IN – IN + VCC – 1 8 2 7 3 6 4 5 NC VCC + OUT BAL2 NC – No internal connection description This device is a low-cost, high-speed, JFET-input operational amplifier with very low input offset voltage and a maximum input offset voltage drift. It requires low supply current, yet maintains a large gain-bandwidth product and a fast slew rate. In addition, the matched high-voltage JFET input provides very low input bias and offset currents. The LF411 can be used in applications such as high-speed integrators, digital-to-analog converters, sample-and-hold circuits, and many other circuits. The LF411C is characterized for operation from 0°C to 70°C. The LF411I is characterized for operation from –40°C to 85°C. symbol IN – IN + BAL1 BAL2 2 – 3 6 OUT + 1 5 AVAILABLE OPTIONS TA VIOmax AT 25°C 0°C to 70°C –40°C to 85°C PACKAGE SMALL OUTLINE (D) PLASTIC DIP (P) 2 mV LF411CD LF411CP 2 mV LF411ID LF411IP The D packages are available taped and reeled. Add the suffix R to the device type (i.e., LF411CDR). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 1997, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 LF411 JFET-INPUT OPERATIONAL AMPLIFIER SLOS011C – MARCH 1987 – REVISED OCTOBER 1997 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC + . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V Supply voltage, VCC – . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 18 V Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 30 V Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 15 V Duration of output short circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197°C/W P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C NOTES: 1. Unless otherwise specified, the absolute maximum negative input voltage is equal to the negative power supply voltage. 2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero. recommended operating conditions C SUFFIX I SUFFIX MIN MIN MAX MAX UNIT Supply voltage, VCC + 3.5 18 3.5 18 V Supply voltage, VCC – – 3.5 – 18 – 3.5 – 18 V 0 70 – 40 –85 °C Operating free-air temperature, TA electrical characteristics over operating free-air temperature range, VCC ± = ±15 V (unless otherwise specified) PARAMETER TA TEST CONDITIONS VIO Input offset voltage VIC = 0, RS = 10 kΩ αVIO Average temperature coefficient of input offset voltage VIC = 0, RS = 10 kΩ IIO Inp t offset current Input c rrent‡ VIC = 0 IIB Inp t bias current Input c rrent‡ VIC = 0 LF411C LF411I 25°C 25°C 25°C 25°C 70°C 85°C 25°C 25°C 70°C 85°C MIN TYP MAX 0.8 2 10 20† µV/°C 25 100 pA 2 nA 200 pA 4 nA 50 UNIT mV ± 11 –11.5 to 14.5 V ± 12 ± 13.5 V VICR Common-mode input voltage range VOM Maximum peak output-voltage swing RL = 10 kΩ AVD Large-signal g g differential voltage VO = ± 10 V V, ri Input resistance TJ = 25°C CMR R Common-mode rejection ratio RS ≤ 10 kΩ 70 100 dB kSVR Supply-voltage rejection ratio See Note 3 70 100 dB RL = 2 kΩ 25°C 25°C 25 200 0°C to 70°C –40°C to 85°C 15 200 1012 V/mV Ω ICC Supply current 2 3.4 mA † At least 90% of the devices meet this limit for αVIO. ‡ Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive. Pulse techniques must be used that will maintain the junction temperatures as close to the ambient temperature as possible. NOTE 3: Supply-voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 LF411 JFET-INPUT OPERATIONAL AMPLIFIER SLOS011C – MARCH 1987 – REVISED OCTOBER 1997 operating characteristics, VCC± = ±15 V, TA = 25°C PARAMETER TEST CONDITIONS SR Slew rate B1 Vn Unity-gain bandwidth Equivalent input noise voltage f = 1 kHz, In Equivalent input noise current f = 1 kHz MIN TYP 8 13 2.7 POST OFFICE BOX 655303 RS = 20 Ω • DALLAS, TEXAS 75265 MAX UNIT V/µs 3 MHz 18 nV/√Hz 0.01 pA/√Hz 3 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LF411CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF411C LF411CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF411C LF411CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF411C LF411CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF411C LF411CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LF411CP LF411CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LF411CP LF411ID OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 85 LF411IDR OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 85 LF411IP OBSOLETE PDIP P 8 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device LF411CDR Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 6.4 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LF411CDR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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