Microchip DSC400-0304Q0001KE2T Configurable four output, low jitter crystal-lessâ ¢ clock generator Datasheet

DSC400
Configurable Four Output, Low Jitter Crystal-less™ Clock Generator
Features
General Description
• Low RMS Phase Jitter: <1 ps (typ.)
• High Stability: ±25 ppm, ±50 ppm
• Wide Temperature Range:
- Industrial –40°C to +85°C
- Ext. Commercial –20°C to +70°C
• High Supply Noise Rejection: –50 dBc
• Four Format-Configurable Outputs:
- LVPECL, LVDS, HCSL, LVCMOS
• Available Pin-Selectable Frequency Table
- 1 Pin per Bank for 2 Frequency Sets
• Wide Frequency Range:
- 2.3 MHz – 460 MHz
• 20-Pin QFN Footprint (5.0 mm x 3.2 mm)
• Excellent Shock and Vibration Immunity
• High Reliability
- 20x better MTF than quartz-based devices
• Wide Supply Range of 2.25V to 3.6V
• Lead Free and RoHS-Compliant
• AEC-Q100 Automotive Qualified
The DSC400 is a four output crystal-less™ clock
generator. It utilizes proven PureSilicon™ MEMS
technology to provide excellent jitter and stability while
incorporating additional device functionality.
The nominal frequencies of the outputs can be identical
or independently derived from common PLLs.
Each output may be configured independently to
support a single-ended LVCMOS interface or a
differential interface. Differential options include
LVPECL, LVDS, or HCSL.
The DSC400 provides two independent select lines for
choosing between two sets of pre-configured
frequencies per bank. It also has two OE pins to allow
for enabling and disabling outputs.
The DSC400 is packaged in a 20-pin QFN (5 mm x
3.2 mm) and is available in extended commercial and
industrial temperature grades.
Block Diagram
CONTROL
CIRCUITRY
Applications
• Communications and Networks
• Ethernet
- 1G, 10GBASE-T/KR/LR/SR, and FCoE
• Storage Area Networks
- SATA, SAS, Fibre Channel
• Passive Optical Networks
- EPON, 10G-EPON, GPON, 10G-PON
• HD/SD/SDI Video and Surveillance
• Automotive
• Media and Video
• Embedded and Industrial
 2016 Microchip Technology Inc.
CLK0+
CLK0BANK 1
MEMS
PLL
PLL
OE1
OE2
OUTPUT
CONTROL
AND
DIVIDERS
CLK3+
CLK3-
CLK1+
CLK1-
BANK 2
FSB1
FSB2
CLK2+
CLK2-
DS20005612A-page 1
DSC400
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage .......................................................................................................................................–0.3V to VDD+0.3V
ESD Protection (HBM) ...............................................................................................................................................4 kV
ESD Protection (MM) ................................................................................................................................................400V
ESD Protection (CDM) ............................................................................................................................................1.5 kV
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameters
Supply Voltage (Note 1)
Core Supply Current (Note 2)
Frequency Stability
Sym.
Min.
Typ.
Max.
Units
VDD
2.25
—
3.6
V
IDDCORE
—
40
44
mA
OE(1:2) = 0. All outputs
disabled.
ppm
All temperature and VDD
ranges.
ppm
One year at +25°C
∆f
—
—
±25
—
—
±50
Conditions
—
Aging - First Year
∆fY1
—
—
±5
Aging - After First Year
∆fY2+
—
—
<±1
Start-up Time (Note 3)
tSU
—
—
5
ms
Input Logic Levels
VIH
0.75 x VDD
—
—
V
VIL
—
—
0.25 x VDD
Output Disable Time (Note 4)
tDA
—
—
5
ns
OE(1:2) transition
from 1 to 0
Output Enable Time (Note 4)
tEN
—
—
20
ns
OE(1:2) transition
from 0 to 1
Pull-Up Resistor
RPU
—
40
—
kΩ
All input pins have an
internal pull-up
Note 1:
2:
3:
4:
ppm/yr Year two and beyond at
+25°C
T = +25°C
Input logic high
Input logic low
VDD pins should be filtered with a 0.1 µF capacitor connected between VDD and VSS.
The addition of IDDCORE and IDDIO provides the total current consumption of the device.
tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled.
See the Output Waveform section for more information.
DS20005612A-page 2
 2016 Microchip Technology Inc.
DSC400
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
TA
–20
—
+70
°C
Ordering Option E
Temperature Ranges
Operating Temperature Range (T)
TA
–40
—
+85
°C
Ordering Option I
Junction Temperature
TJ
—
—
+150
°C
—
Storage Temperature Range
TS
–40
—
+150
°C
—
Soldering Temperature
—
—
—
+260
°C
40 sec. max.
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
 2016 Microchip Technology Inc.
DS20005612A-page 3
DSC400
CLK3+
CLK3-
CLK2+
CLK2-
20
19
18
17
16
15
OE1
1
14
VSS
NC
2
13
VSS
VSS
3
12
NC
VSS
4
11
OE2
5
6
7
8
9
10
CLK0-
CLK0+
CLK1-
CLK1+
VDD2
FSB2
FIGURE 2-1:
VDD1
PIN DESCRIPTIONS
FSB1
2.0
Pin Configuration, 20-Pin QFN (5.0 mm x 3.2 mm)
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
Pin Type
1
OE1
I
2
NC
N/A
Description
Output Enable for Bank1 (CLK0 and CLK3); Active-High. See
Table 3-1.
Leave unconnected or connect to ground.
3
VSS
PWR
Ground.
4
VSS
PWR
Ground.
5
CLK0–
O
Complement output of differential pair 0 (off when in LVCMOS format).
6
CLK0+
O
True output of differential pair 0 or LVCMOS output 0.
7
CLK1–
O
Complement output of differential pair 1 (off when in LVCMOS format).
8
CLK1+
O
True output of differential pair 1 or LVCMOS output 1.
9
VDD2
PWR
10
FSB2
I
Input for selecting pre-configured frequencies on Bank2 (CLK1 and
CLK2).
11
OE2
I
Output Enable for Bank2 (CLK1 and CLK2); Active-High. See
Table 3-1.
12
NC
N/A
Power Supply for Bank2 (CLK1 and CLK2).
Leave unconnected or connect to ground.
13
VSS
PWR
Ground.
14
VSS
PWR
Ground.
15
CLK2–
O
Complement output of differential pair 2 (off when in LVCMOS format).
16
CLK2+
O
True output of differential pair 2 or LVCMOS output 2.
17
CLK3–
O
Complement output of differential pair 3 (off when in LVCMOS format).
18
CLK3+
O
19
VDD1
PWR
20
FSB1
I
DS20005612A-page 4
True output of differential pair 3 or LVCMOS output 3.
Power Supply for Bank1 (CLK0 and CLK3).
Input for selecting pre-configured frequencies on Bank1 (CLK0 and
CLK3).
 2016 Microchip Technology Inc.
DSC400
3.0
OPERATIONAL DESCRIPTION
The DSC400 is a crystal-less™ clock generator. Unlike
older clock generators in the industry, it does not
require an external crystal to operate; it relies on the
integrated MEMS resonator that interfaces with internal
PLLs. This technology enhances performance and
reliability by allowing tighter frequency stability over a
far wider temperature range. In addition, the higher
resistance to shock and vibration decreases the aging
rate to allow for much improved product life in the
system.
3.1
chosen from 2.3 MHz to 460 MHz for differential
outputs and from 2.3 MHz to 170 MHz on LVCMOS
outputs.
3.3
Power
VDD1 and VDD2 supply the power to banks 1 and 2
respectively. Each VDD may each have a different
supply voltage from the other as long as it is within the
2.25V to 3.6V range. Each VDD pin should have a
0.1 µF capacitor to filter high-frequency noise. VSS is
common to the entire device.
Inputs
There are four input signals in the device. Each has an
internal (40 kΩ) pull-up to default the selection to a high
(1). Inputs can be controlled through hardware
strapping method with a resistor to ground to assert the
input low (0). Inputs may also be controlled by other
components’ GPIOs
In case more than one frequency set is desired, FSB1
and FSB2 are used to independently select one of two
sets per bank. FSB1 selects the pre-configured set on
Bank1 (CLK0 and CLK3) and FSB2 selects the
pre-configured set on Bank2 (CLK1 and CLK2), as
shown in Table 1-1 in the Product Identification System
section.
If there is a requirement to disable outputs, the inputs
OE1 and OE2 are used in conjunction to disable the
banks of outputs. Outputs are disabled in tri-state (Hi-Z)
mode. See Table 3-1 for more information.
TABLE 3-1:
OUTPUT ENABLE
SELECTION TABLE
OE1
OE2
Bank 1
(CLK0 & CLK3)
Bank 2
(CLK1 & CLK2)
0
0
Hi-Z
Hi-Z
0
1
Hi-Z
Running
1
0
Running
Hi-Z
1
1
Running
Running
3.2
Outputs
The four outputs are grouped into two banks. Each
bank is supplied by an independent VDD to allow for
optimized noise isolation between the two banks. Each
bank provides two synchronous outputs generated by
a common PLL:
• Bank1 is composed of outputs CLK0 and CLK3.
• Bank2 is composed of outputs CLK1 and CLK2.
Each output may be pre-configured independently to
be one of the following formats: LVCMOS, LVDS,
LVPECL or HCSL. In case the output is configured to
be single-ended LVCMOS, the frequency is generated
on the true output (CLKx+) and the complement output
(CLKx–) is shut off in a low state. Frequencies can be
 2016 Microchip Technology Inc.
DS20005612A-page 5
DSC400
4.0
TERMINATION SCHEMES
4.1
LVPECL
VDD
130 Ω
130 Ω
100 Ω
82 Ω
FIGURE 4-1:
TABLE 4-1:
Parameter
82 Ω
Typical LVPECL Termination Scheme.
LVPECL OUTPUTS (Note 1)
Symbol
Min.
Typ.
Max.
Units
Output Logic
Levels
VOH
VDD – 1.08
—
—
V
VOL
—
—
VDD – 1.55
Peak-to-Peak
Output Swing
—
—
800
—
mV
Single-Ended
Output
Transition Time
(Note 2)
tR
—
250
—
ps
Rise Time. 20% to 80%; RL = 50Ω to
VDD–2V
tF
—
250
—
Frequency
Condition
Output Logic High, RL = 50Ω to VDD–2V
Output Logic Low, RL = 50Ω to VDD–2V
Fall Time. 20% to 80%; RL = 50Ω to
VDD–2V
f0
2.3
—
460
MHz
Output Duty
Cycle
SYM
48
—
52
%
IO Supply
Current (Note 3)
IDDIO
—
35
38
mA
Period Jitter
(Note 4)
JPER
—
2.5
—
psRMS CLK(0:3) = 156.25 MHz
Integrated
Phase Noise
JPH
—
0.25
—
psRMS 200 kHz to 20 MHz @ 156.25 MHz
—
0.38
—
100 kHz to 20 MHz @ 156.25 MHz
Single Frequency
Differential
Per Output at 125 MHz
—
1.7
2
12 kHz to 20 MHz @ 156.25 MHz
Note 1: LVPECL applicable to extended commercial temperature only.
2: See the Output Waveform section for more information.
3: The addition of IDDCORE and IDDIO provides the total current consumption of the device.
4: Period jitter includes crosstalk from adjacent output.
DS20005612A-page 6
 2016 Microchip Technology Inc.
DSC400
4.2
LVDS
100 Ω
100 Ω
Load (receiver IC)
FIGURE 4-2:
Typical LVDS Termination Scheme.
If the 100Ω clamping resistor does not exist inside the receiving device, it should be added externally on the PCB and
placed as close as possible to the receiver.
TABLE 4-2:
Parameter
LVDS OUTPUTS
Symbol
Min.
Typ.
Max.
Units
Output Offset
Voltage
VOS
1.125
—
1.4
V
Delta Offset
Voltage
∆VOS
—
—
50
mV
—
VPP
—
350
—
mV
Single-Ended
Output
Transition Time
(Note 1)
tR
—
200
—
ps
Rise Time, 20% to 80%, RL= 50Ω,
CL= 2 pF
tF
—
200
—
Frequency
f0
2.3
—
460
MHz
Output Duty
Cycle
SYM
48
—
52
%
IO Supply
Current (Note 2)
IDDIO
—
9
12
mA
Period Jitter
JPER
—
2.5
—
psRMS —
Integrated
Phase Noise
JPH
—
0.28
—
psRMS 200 kHz to 20 MHz @ 156.25 MHz
—
0.4
—
100 kHz to 20 MHz @ 156.25 MHz
Peak-to-Peak
Output Swing
Condition
R = 100Ω Differential
Fall Time, 20% to 80%, RL= 50Ω,
CL= 2 pF
—
1.7
2.0
Note 1: See the Output Waveform section for more information.
Single Frequency
Differential
Per Output at 125 MHz.
12 kHz to 20 MHz @156.25 MHz
2: The addition of IDDCORE and IDDIO provides the total current consumption of the device.
 2016 Microchip Technology Inc.
DS20005612A-page 7
DSC400
4.3
HCSL
RS
100 Ω
RS
FIGURE 4-3:
50 Ω
50 Ω
Typical HCSL Termination Scheme.
RS is a series resistor implemented to match the trace impedance. Depending on the board layout, the value may range
from 0Ω to 30Ω.
TABLE 4-3:
Parameter
HCSL OUTPUTS
Symbol
Min.
Typ.
Max.
Units
Output Logic
Levels
VOH
0.725
—
—
V
VOL
—
—
0.1
Peak-to-Peak
Output Swing
—
—
750
—
mV
Single-Ended
Output
Transition Time
(Note 1)
tR
200
—
400
ps
Rise Time, 20% to 80%, RL= 50Ω,
CL= 2 pF
tF
200
—
400
Frequency
Condition
Output Logic High, RL = 50Ω
Output Logic Low, RL = 50Ω
Fall Time, 20% to 80%, RL= 50Ω,
CL= 2 pF
f0
2.3
—
460
MHz
Output Duty
Cycle
SYM
48
—
52
%
IO Supply
Current (Note 2)
IDDIO
—
20
22
mA
Period Jitter
JPER
—
2.5
—
psRMS —
Integrated
Phase Noise
JPH
—
0.25
—
psRMS 200 kHz to 20 MHz @ 156.25 MHz
—
0.37
—
100 kHz to 20 MHz @ 156.25 MHz
—
1.7
2.0
Note 1: See the Output Waveform section for more information.
Single Frequency
Differential
Per Output at 125 MHz.
12 kHz to 20 MHz @156.25 MHz
2: The addition of IDDCORE and IDDIO provides the total current consumption of the device.
DS20005612A-page 8
 2016 Microchip Technology Inc.
DSC400
4.4
LVCMOS
50 Ω
RS
FIGURE 4-4:
Typical LVCMOS Termination Scheme.
RS is a series resistor implemented to match the trace impedance to that of the clock output. Depending on the board
layout, the value may range from 0Ω to 27Ω.
TABLE 4-4:
Parameter
LVCMOS OUTPUTS
Symbol
Min.
Typ.
Max.
Units
VOH
0.9 x VDD
—
—
V
Output Logic High, I = ±6 mA
VOL
—
—
0.1 x VDD
Output
Transition Time
(Note 1)
tR
—
1.1
2.0
ns
Rise Time, 20% to 80%, CL= 15 pF
tF
—
1.3
2.0
Frequency
f0
2.3
—
170
—
—
100
Output Logic
Levels
Condition
Output Logic Low, I = ±6 mA
Fall Time, 20% to 80%, CL= 15 pF
MHz
All Temperature Ranges, Except
Automotive
Automotive Temperature Range
Output Duty
Cycle
SYM
44
—
55
%
IO Supply
Current (Note 2)
IDDIO
—
11
14
mA
Period Jitter
JPER
—
3
—
psRMS CLK(0:3) = 125 MHz
Integrated
Phase Noise
JPH
—
0.3
—
psRMS 200 kHz to 20 MHz @ 125 MHz
—
0.38
—
100 kHz to 20 MHz @ 125 MHz
—
1.7
2.0
Note 1: See the Output Waveform section for more information.
—
Per Output at 125 MHz, CL = 15 pF
12 kHz to 20 MHz @125 MHz
2: The addition of IDDCORE and IDDIO provides the total current consumption of the device.
 2016 Microchip Technology Inc.
DS20005612A-page 9
DSC400
5.0
OUTPUT WAVEFORM
tR
Clk
Clk
tF
80%
50%
20%
tEN
1/f0
tDA
OE
VIH
VIL
FIGURE 5-1:
Differential Output (LVDS, LVPECL, HCSL).
tR
tF
VOH
Clk
VOL
tEN
1/f0
tDA
OE
VIH
VIL
FIGURE 5-2:
DS20005612A-page 10
LVCMOS Output.
 2016 Microchip Technology Inc.
DSC400
6.0
CONNECTION DIAGRAM
The connection diagram below includes recommended capacitors to be placed on each VDD for noise filtering.
VDD
Clock 3 Output
0.1μF
Clock 2 Output
CLK2‒
CLK2+
CLK3‒
OE1
CLK3+
FSB1
Output Enable 1
VDD1
Frequency Select 1
VSS
Frequency Select 2
FSB2
OE2
VDD2
VSS
CLK1+
NC
CLK1‒
VSS
CLK0+
VSS
CLK0‒
NC
VDD
0.1μF
Output Enable 2
Clock 1 Output
Clock 0 Output
FIGURE 6-1:
DSC400 Connection Diagram.
 2016 Microchip Technology Inc.
DS20005612A-page 11
DSC400
7.0
SOLDER REFLOW PROFILE
Temperature
8 minutes max.
3°
C
m / se
ax c
.
260°C
20-40
seconds
217°C
/
6°C
200°C
3°
C/
se
cm
ax
.
25°C
60-180
seconds
Preheat
60-150
seconds
Reflow
x.
ma
sec
150°C
Cooldown
Time
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
3°C/sec. max.
Preheat Time 150°C to 200°C
60-180 sec.
Time Maintained above 217°C
60-150 sec.
Peak Temperature
Time within 5°C of Actual Peak
255°C to 260°C
20-40 sec.
Ramp-Down Rate
6°C/sec. max.
Time 25°C to Peak Temperature
8 minutes max.
DS20005612A-page 12
 2016 Microchip Technology Inc.
DSC400
8.0
PACKAGE MARKING INFORMATION
20-Lead QFN 5.0 mm x 3.2 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
 2016 Microchip Technology Inc.
DS20005612A-page 13
DSC400
NOTES:
DS20005612A-page 14
 2016 Microchip Technology Inc.
DSC400
APPENDIX A:
REVISION HISTORY
Revision A (September 2016)
• Converted Micrel data sheet DSC400 to Microchip DS20005612A.
• Minor text changes throughout.
 2016 Microchip Technology Inc.
DS20005612A-page 15
DSC400
NOTES:
DS20005612A-page 16
 2016 Microchip Technology Inc.
DSC400
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Device
X
X
PART NO.
X
X
Qxxxx
X
X
DSC400:
Device:
Configurable Four Output, Low Jitter
Crystal-less Clock Generator
X
Examples:
a)
DSC400-2143QxxxxKE1T:
Configurable Four Output, Low Jitter Crystal-less
Clock Generator; LVPECL CLK3; LVCMOS CLK2;
HCSL CLK1; LVDS CLK0; Frequency Code; 20-Pin
QFN; –20°C to +70°C Temp. Range; ±50 ppm Stability; Tape & Reel
CLK3 Output
Format:
0
1
2
3
4
=
=
=
=
=
OFF
LVCMOS
LVPECL
LVDS
HCSL
CLK2 Output
Format:
1
2
3
4
=
=
=
=
LVCMOS
LVPECL
LVDS
HCSL
CLK1 Output
Format:
0
1
2
3
4
=
=
=
=
=
OFF
LVCMOS
LVPECL
LVDS
HCSL
CLK0 Output
Format:
1
2
3
4
=
=
=
=
LVCMOS
LVPECL
LVDS
HCSL
Frequency Code:
Qxxxx =
This code is assigned by the factory. See the
table in this section for more information.
Package:
K
=
20-Pin QFN
Temperature
Range:
E
I
=
=
–20°C to +70°C
–40°C to +85°C
Stability:
1
2
=
=
±50 ppm
±25 ppm
Packing:
T
=
Tape & Reel
1.0
X
CLK3 CLK2 CLK1 CLK0 Freq. Package Temp. Stability Packing
Output Output Output Output Code
Range
Format Format Format Format
b)
DSC400-4132QxxxxKI2T:
Configurable Four Output, Low Jitter Crystal-less
Clock Generator; HCSL CLK3; LVCMOS CLK2;
LVDS CLK1; LVPECL CLK0; Frequency Code; 20Pin QFN; –40°C to +85°C Temp. Range; ±25 ppm
Stability; Tape & Reel
c)
DSC400-0202QxxxxKE2T:
Configurable Four Output, Low Jitter Crystal-less
Clock Generator; OFF CLK3; LVPECL CLK2; OFF
CLK1; LVPECL CLK0; Frequency Code; 20-Pin QFN;
–20°C to +70°C Temp. Range; ±25 ppm Stability;
Tape & Reel
d)
DSC400-1111QxxxxKI1T:
Configurable Four Output, Low Jitter Crystal-less
Clock Generator; LVCMOS CLK3 through CLK0;
Frequency Code; 20-Pin QFN; –40°C to +85°C Temp.
Range; ±50 ppm Stability; Tape & Reel
FACTORY CONFIGURATION CODE ASSIGNMENT OF QXXXX
The DSC400 is meant for customers to define their own frequency requirements at the four available outputs. The Qxxxx
number identifies these specific customer requirements and is assigned by the factory.
TABLE 1-1:
EXAMPLE OF HOW FSB1 & FSB2 ARE APPLIED & THE QXXXX ASSIGNMENT
Outputs
Bank1
 2016 Microchip Technology Inc.
Qxxxx Number
1 (default)
0
CLK0
125 MHz
150 MHz
CLK3
50 MHz
Outputs
Bank2
FSB1
25 MHz
Q0001
FSB2
1 (default)
0
CLK1
156.25 MHz
100 MHz
CLK2
156.25 MHz
100 MHz
DS20005612A-page 17
DSC400
NOTES:
DS20005612A-page 18
 2016 Microchip Technology Inc.
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•
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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2016 Microchip Technology Inc.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0985-4
DS20005612A-page 19
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06/23/16
DS20005612A-page 20
 2016 Microchip Technology Inc.
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