CD74AC251, CD74ACT251 Data sheet acquired from Harris Semiconductor SCHS246 8-Input Multiplexer, Three-State August 1998 Features Description • Buffered Inputs The CD74AC251 and CD74ACT251 8-input multiplexers that utilize the Harris Advanced CMOS Logic technology. This multiplexer features both true (Y) and complement (Y) outputs as well as an Output Enable (OE) input. The OE must be at a LOW logic level to enable this device. When the OE input is HIGH, both outputs are in the high-impedance state. When enabled, address information on the data select inputs determines which data input is routed to the Y and Y outputs. • Typical Propagation Delay - 6ns at VCC = 5V, TA = 25oC, CL = 50pF • Exceeds 2kV ESD Protection MIL-STD-883, Method 3015 • SCR-Latchup-Resistant CMOS Process and Circuit Design Ordering Information • Speed of Bipolar FAST™/AS/S with Significantly Reduced Power Consumption PART NUMBER • Balanced Propagation Delays • AC Types Feature 1.5V to 5.5V Operation and Balanced Noise Immunity at 30% of the Supply • ±24mA Output Drive Current - Fanout to 15 FAST™ ICs - Drives 50Ω Transmission Lines Pinout TEMP. RANGE (oC) PKG. NO. PACKAGE CD74AC251E 0 to 70oC, -40 to 85, 16 Ld PDIP -55 to 125 E16.3 CD74ACT251E 0 to 70oC, -40 to 85, 16 Ld PDIP -55 to 125 E16.3 CD74AC251M 0 to 70oC, -40 to 85, 16 Ld SOIC -55 to 125 M16.15 CD74ACT251M 0 to 70oC, -40 to 85, 16 Ld SOIC -55 to 125 M16.15 NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. CD74AC251, CD74ACT251 (PDIP, SOIC) TOP VIEW I3 1 16 VCC I2 2 15 I4 I1 3 14 I5 I0 4 13 I6 Y 5 12 I7 Y 6 11 S0 OE 7 10 S1 GND 8 9 S2 2. Wafer and die for this part number is available which meets all electrical specifications. Please contact your local sales office or Harris customer service for ordering information. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. FAST™ is a Trademark of Fairchild Semiconductor. Copyright © Harris Corporation 1998 1 File Number 1981.1 CD74AC251, CD74ACT251 Functional Diagram THREE-STATE DISABLE OE I0 I1 I2 CHANNEL INPUTS I3 I4 I5 I6 7 4 3 2 1 15 14 5 13 Y 12 OUTPUTS 6 I7 Y 11 S0 DATA SELECT 10 S1 9 S2 TRUTH TABLE INPUTS OUTPUTS SELECT S2 S1 S0 OUTPUT ENABLE OE Y Y X X X H Z Z L L L L I0 I0 L L H L I1 I1 L H L L I2 I2 L H H L I3 I3 H L L L I4 I4 H L H L I5 I5 H H L L I6 I6 H H H L I7 I7 H = High logic level, L = Low logic level, Z = High impedance (off), X = Irrelevant, I0, I1...I7 = The level of the respective input 2 CD74AC251, CD74ACT251 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 6V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC VCC or Ground Current, ICC or IGND (Note 3) . . . . . . . . .±100mA Thermal Resistance (Typical, Note 5) θJA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ___ SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ___ Maximum Junction Temperature (Plastic Package) . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC (Note 4) AC Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Slew Rate, dt/dv AC Types, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (Max) AC Types, 3.6V to 5.5V . . . . . . . . . . . . . . . . . . . . . . . . 20ns (Max) ACT Types, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . 10ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 3. For up to 4 outputs per device, add ±25mA for each additional output. 4. Unless otherwise specified, all voltages are referenced to ground. 5. θJA is measured with the component mounted on an evaluation PC board in free air. DC Electrical Specifications TEST CONDITIONS PARAMETER -40oC TO 85oC 25oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) MIN MAX MIN MAX MIN MAX UNITS VIH - - 1.5 1.2 - 1.2 - 1.2 - V 3 2.1 - 2.1 - 2.1 - V 5.5 3.85 - 3.85 - 3.85 - V 1.5 - 0.3 - 0.3 - 0.3 V 3 - 0.9 - 0.9 - 0.9 V 5.5 - 1.65 - 1.65 - 1.65 V 1.5 1.4 - 1.4 - 1.4 - V AC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage VIL VOH - VIH or VIL - -0.05 -0.05 3 2.9 - 2.9 - 2.9 - V -0.05 4.5 4.4 - 4.4 - 4.4 - V -4 3 2.58 - 2.48 - 2.4 - V -24 4.5 3.94 - 3.8 - 3.7 - V -75 (Note 6, 7) 5.5 - - 3.85 - - - V -50 (Note 6, 7) 5.5 - - - - 3.85 - V 3 CD74AC251, CD74ACT251 DC Electrical Specifications (Continued) TEST CONDITIONS PARAMETER Low Level Output Voltage -40oC TO 85oC 25oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) MIN MAX MIN MAX MIN MAX UNITS VOL VIH or VIL 0.05 1.5 - 0.1 - 0.1 - 0.1 V 0.05 3 - 0.1 - 0.1 - 0.1 V 0.05 4.5 - 0.1 - 0.1 - 0.1 V 12 3 - 0.36 - 0.44 - 0.5 V 24 4.5 - 0.36 - 0.44 - 0.5 V 75 (Note 6, 7) 5.5 - - - 1.65 - - V 50 (Note 6, 7) 5.5 - - - - - 1.65 V Input Leakage Current II VCC or GND - 5.5 - ±0.1 - ±1 - ±1 µA Three-State Leakage Current IOZ VIH or VIL VO = VCC or GND - 5.5 - ±0.5 - ±5 - ±10 µA Quiescent Supply Current MSI ICC VCC or GND 0 5.5 - 8 - 80 - 160 µA High Level Input Voltage VIH - - 4.5 to 5.5 2 - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - 0.8 - 0.8 - 0.8 V High Level Output Voltage VOH VIH or VIL -0.05 4.5 4.4 - 4.4 - 4.4 - V -24 4.5 3.94 - 3.8 - 3.7 - V -75 (Note 6, 7) 5.5 - - 3.85 - - - V -50 (Note 6, 7) 5.5 - - - - 3.85 - V 0.05 4.5 - 0.1 - 0.1 - 0.1 V 24 4.5 - 0.36 - 0.44 - 0.5 V 75 (Note 6, 7) 5.5 - - - 1.65 - - V 50 (Note 6, 7) 5.5 - - - - - 1.65 V ACT TYPES Low Level Output Voltage VOL VIH or VIL II VCC or GND - 5.5 - ±0.1 - ±1 - ±1 µA Three-State or Leakage Current IOZ VIH or VIL VO = VCC or GND - 5.5 - ±0.5 - ±5 - ±10 µA Quiescent Supply Current MSI ICC VCC or GND 0 5.5 - 8 - 80 - 160 µA ∆ICC VCC -2.1 - 4.5 to 5.5 - 2.4 - 2.8 - 3 mA Input Leakage Current Additional Supply Current per Input Pin TTL Inputs High 1 Unit Load NOTES: 6. Test one output at a time for a 1-second maximum duration. Measurement is made by forcing current and measuring voltage to minimize power dissipation. 7. Test verifies a minimum 50Ω transmission-line-drive capability at 85oC, 75Ω at 125oC. 4 CD74AC251, CD74ACT251 ACT Input Load Table INPUT UNIT LOAD S0, S1, S3 1 OE 1 I0 - I 7 1 NOTE: Unit load is ∆ICC limit specified in DC Electrical Specifications Table, e.g., 2.4mA max at 25oC. Switching Specifications Input tr, tf = 3ns, CL = 50pF (Worst Case) -40oC TO 85oC PARAMETER -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN TYP MAX UNITS tPLH, tPHL 1.5 - - 153 - - 169 ns 3.3 (Note 9) 4.9 - 17.2 4.7 - 18.9 ns 5 (Note 10) 3.5 - 12.3 3.4 - 13.5 ns 1.5 - - 169 - - 186 ns 3.3 5.4 - 19 5.2 - 20.9 ns 5 3.8 - 13.5 3.7 - 14.9 ns 1.5 - - 207 - - 228 ns 3.3 6.6 - 23.2 6.4 - 25.5 ns 5 4.7 - 16.5 4.6 - 18.2 ns 1.5 - - 223 - - 245 ns 3.3 7.1 - 24.9 6.9 - 27.4 ns 5 5.1 - 17.8 4.9 - 19.6 ns 1.5 - - 155 - - 169 ns 3.3 5.2 - 18.7 5.1 - 20.3 ns 5 3.5 - 12.3 3.4 - 13.5 ns AC TYPES Propagation Delay, Data to Y Output Propagation Delay, Data to Y Output Propagation Delay, Select to Y Output Propagation Delay, Select to Y Output Propagation Delay, Output Enable and Output Disable to Output tPLH, tPHL tPLH, tPHL tPLH, tPHL tPZH, tPZL, tPHZ, tPLZ Three-State Output Capacitance CO - - - 15 - - 15 pF Input Capacitance CI - - - 10 - - 10 pF CPD (Note 11) - - 120 - - 120 - pF Propagation Delay, Data to Y Output tPLH, tPHL 5 (Note 10) 3.5 - 12.3 3.4 - 13.5 ns Propagation Delay, Data to Y Output tPLH, tPHL 5 3.8 - 13.5 3.7 - 14.9 ns Propagation Delay, Select to Y Output tPLH, tPHL 5 4.7 - 16.5 4.6 - 18.2 ns Propagation Delay, Select to Y Output tPLH, tPHL 5 5.1 - 17.8 4.9 - 19.6 ns Propagation Delay, Output Enable and Output Disable to Output tPZH, tPZL, tPHZ, tPLZ 5 3.5 - 12.3 3.4 - 13.5 ns Power Dissipation Capacitance ACT TYPES 5 CD74AC251, CD74ACT251 Switching Specifications Input tr, tf = 3ns, CL = 50pF (Worst Case) (Continued) -40oC TO 85oC PARAMETER SYMBOL -55oC TO 125oC VCC (V) MIN TYP MAX MIN TYP MAX UNITS Three-State Output Capacitance CO Input Capacitance CI - - - 10 - - 10 pF CPD (Note 11) - - 45 - - 45 - pF Power Dissipation Capacitance NOTES: 8. Limits tested 100%. 9. 3.3V Min is at 3.6V, Max is at 3V. 10. 5V Min is at 5.5V, Max is at 4.5V. 11. CPD is used to determine the dynamic power consumption per device. PD = VCC2 fi (CPD + CL) where fi = input frequency, CL = output load capacitance, VCC = supply voltage. tr = 3ns tf = 3ns INPUT LEVEL 90% OUTPUT DISABLE VS 10% GND tPZL tPLZ VS 0.2VCC OUTPUT: LOW TO OFF TO LOW tPHZ tPZH VOH (≠ VCC) 0.8 VCC VS OUTPUT: HIGH TO OFF TO HIGH OUTPUTS ENABLED OTHER INPUTS (TIED HIGH OR LOW) OUTPUTS DISABLED OUTPUT DISABLE OUTPUTS ENABLED GND (tPHZ, tPZH) OPEN (tPHL, tPLH) 2 VCC (tPLZ, tPZL) (OPEN DRAIN) 500Ω† RL DUT WITH THREESTATE OUTPUT VOL (≠ GND) OUT 500Ω† RL CL 50pF †FOR AC SERIES ONLY: WHEN VCC = 1.5V, RL = 1kΩ FIGURE 1. THREE-STATE PROPAGATION DELAY WAVEFORMS AND TEST CIRCUIT tr = 3ns 90% IN V S 10% tf = 3ns INPUT LEVEL VS INVERTING OUTPUT Y tPHL tPLH NON-INVERTING OUTPUT Y VS tPLH tPHL FIGURE 2. PROPAGATION DELAY TIMES 6 CD74AC251, CD74ACT251 OUTPUT RL (NOTE) 500Ω DUT OUTPUT LOAD CL 50pF NOTE: For AC Series Only: When VCC = 1.5V, RL = 1kΩ. CD74AC CD74ACT VCC 3V Input Switching Voltage, VS 0.5 VCC 1.5V Output Switching Voltage, VS 0.5 VCC 0.5 VCC Input Level FIGURE 3. PROPAGATION DELAY TIMES 7 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD74AC251M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC251M CD74AC251M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC251M CD74AC251M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC251M CD74AC251M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC251M CD74AC251MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC251M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74AC251M96 Package Package Pins Type Drawing SOIC D 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 10.3 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74AC251M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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