Pressure Freescale Semiconductor MPXHZ6130A Rev 1, 05/2010 Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXHZ6130A Series 15 to 130 kPa (2.2 to 18.9 psi) 0.2 to 4.8 V Output Application Examples The MPXHZ6130A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensor's packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. The small form factor and high reliability of on-chip integration make the Freescale Semiconductor, Inc. pressure sensor a logical and economical choice for the system designer. The MPXHZ6130A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. • Aviation Altimeters • Industrial Controls • Engine Control/Manifold Absolute Pressure (MAP) • Weather Stations and Weather Reporting Devices Features • • • • • • 1.5% Maximum Error Over 0° to 85°C Resistant to High Humidity and Common Automotive Media Improved Accuracy at High Temperature Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from -40° to +125°C Durable Thermoplastic (PPS) Surface Mount Package ORDERING INFORMATION Package Case Device Name Options No. Super Small Outline Package (MPXHZ6130A Series) MPXHZ6130A6U Rail 1317 MPXHZ6130AC6U Rail 1317A None # of Ports Single Dual Gauge Pressure Type Differential Absolute • • • • SUPER SMALL OUTLINE PACKAGES MPXHZ6130A6U CASE 1317 © Freescale Semiconductor, Inc., 2006-2010. All rights reserved. MPXHZ6130AC6U CASE 1317A Device Marking MPXHZ6130A MPXHZ6130A Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Characteristic Symbol Min Typ Max Unit Pressure Range POP 15 — 130 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 6.0 10 mAdc Minimum Pressure Offset(2) @ VS = 5.0 Volts (0 to 85°C) Voff 0.132 0.200 0.268 Vdc Full Scale Output(3) @ VS = 5.0 Volts (0 to 85°C) VFSO 4.632 4.700 4.768 Vdc Full Scale Span(4) @ VS = 5.0 Volts (0 to 85°C) VFSS 4.365 4.500 4.635 Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %VFSS V/P — 39.2 — mV/kPa Response Time(6) tR — 1.0 — ms Warm-Up Time(7) — — 20 — ms Offset Stability(8) — — ±0.25 — %VFSS Sensitivity 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: TcSpan: TcOffset: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. Output deviation over the temperature range of 0° to 85°C, relative to 25°C. Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. MPXHZ6130A 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Units Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg -40° to +125° °C Operating Temperature TA -40° to +125° °C Output Source Current @ Full Scale Output(2) I o+ 0.5 mAdc Output Sink Current @ Minimum Pressure Offset(2) Io - -0.5 mAdc 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from VOUT to Gnd or VOUT to VS in the application circuit. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND 3 Gain Stage #2 and Ground Reference Shift Circuitry 4 VOUT Pins 1, 5, 6, 7, and 8 are NO CONNECTS Figure 1. Fully Integrated Pressure Sensor Schematic MPXHZ6130A Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be Fluoro Silicone Gel Die Coat +5.0 V Stainless Steel Cap Die Wire Bond transmitted to the sensor diaphragm. The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory for more information regarding media compatibility in your specific application. P1 Thermoplastic Case Lead Frame VS Pin 2 MPXHZ6130A 100 nF to ADC Vout Pin 4 47 pF GND Pin 3 51 K Die Bond Absolute Element Sealed Vacuum Reference Figure 2. Cross Sectional Diagram SSOP (not to scale) Figure 3. Typical Application Circuit (Output Source Current Operation) Output (Volts) 5.0 Transfer Function: 4.5 Vout =Vs x (0.007826 xP(kPa) - 0.07739) 4.0 +/- (PE x TM x Vs x 0.007826) MAX 3.5 PE = +/- 1.725kPa 3.0 TM = 1 @ 0 to 85°C Vs = 5.0Vdc 2.5 MIN 2.0 TYP 1.5 1.0 140 130 120 110 100 90 80 70 60 50 40 30 20 0 10 0.5 Pressure (ref: to sealed vacuum) in kPa Figure 4. Output vs. Absolute Pressure MPXHZ6130A 4 Sensors Freescale Semiconductor Pressure Transfer Function (MPXHZ6130A) Nominal Transfer Value: Vout = VS x (0.007826 x P(kPa) - 0.07739) ± (Pressure Error x Temp. factor x 0.007826 x VS) VS = 5.0 ± 0.25 Vdc Temperature Error Band MPXHZ6130A Series 4.0 Break Points Temp 3.0 Temperature Error Factor Multiplier - 40 0 to 85 125 2.0 3 1 1.75 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in Cº NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 20 40 60 80 100 120 Pressure (in kPa) -1.0 -2.0 Pressure 15 to 130 (kPa) Error (Max) ±1.725 (kPa) -3.0 MPXHZ6130A Sensors Freescale Semiconductor 5 Pressure MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a 0.050 1.27 TYP solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 5. SSOP Footprint (Case 1317 and 1317A) MPXHZ6130A 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXHZ6130A Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXHZ6130A 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXHZ6130A Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXHZ6130A 10 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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