Intersil ISL32273EFVZ Quad, â±16.5kv esd protected, 3.0v to 5.5v, rs-485/rs-422 receiver Datasheet

ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E,
ISL32277E
These Intersil devices are ±16.5kV IEC61000-4-2 ESD
protected, 3.0V to 5.5V powered, QUAD receivers for
balanced communication using the RS-485 and RS-422
standards. Each receiver has low input currents
(±200μA), so it presents a 1/4 unit load to the RS-485
bus, and allows up to 128 receivers on the bus.
The ISL32173E, ISL32175E, ISL32177E are high data
rate receivers that operate at data rates up to 80Mbps.
Their 8ns maximum propagation delay skew (tolerance)
guarantees excellent part-to-part matching. The
ISL32273E, ISL32275E, ISL32277E are reduced supply
current versions that operate at data rates up to 20Mbps.
Receiver outputs are tri-statable, and incorporate a hot
plug feature to keep them disabled during power up and
down. Versions are available with a common EN/EN (‘173
pinout), a two channel EN12/EN34 (‘175 pinout), or a
versatile individual channel enable (see Table 1)
A 26% smaller footprint is available with the ISL32177E
and ISL32277E QFN packages, and these two devices
also feature a logic supply pin (VL). The VL supply sets
the switching points of the enable inputs, and the
receiver outputs’ VOH, to levels compatible with a lower
supply voltage in mixed voltage systems. Individual
channel and group enable pins increase the ISL32177E
and ISL32277E’s flexibility.
1
11.52
11.40
11.28
11.15
11.03
10.91
10.78
10.66
10.54
10.41
10.29
10.17
10.04
9.92
9.80
9.67
FREQUENCY
November 19, 2009
FN7529.0
• Wide Supply Range. . . . . . . . . . . . . 3.0V to 5.5V
• Wide Common Mode Range . . . . . . . -7V to +12V
• Low Part-to-Part Propagation Delay
Tolerance . . . . . . . . . . . . . . . . . . . ±4ns (max)
• Specified for +125°C Operation
• Fail-Safe Open Rx Inputs
• 1/4 Unit Load Allows 128 Devices on the Bus
• Available in Industry Standard Pinouts (‘173/’175)
and a 4x4 QFN (ISL32X77E) with Added Features
• Logic Supply Pin (VL) Eases Operation in Mixed
Supply Systems (ISL32X77E)
• High Data Rates . . . . . . . . . up to 80M or 20Mbps
• Low Shutdown Supply Current . . . . . . . . . . 60μA
• Tri-statable Rx Outputs
• 5V Tolerant Logic Inputs When VCC = 3.3V
Applications*(see page 19)
•
•
•
•
Telecom Equipment
Motor Controllers/Encoders
Programmable Logic Controllers
Industrial/Process Control Networks
ISL3217XE Data Rate and VL
Performance
VCC = 3.3V, +25°C
# of DEVICES = 270
RECEIVER PROPAGATION DELAY (ns)
• IEC61000 ESD Protection (RS-485 Inputs) ±16.5kV
- Class 3 ESD on all Other Pins . . . . . .>8kV HBM
RECEIVER OUTPUT (V) RECEIVER INPUT (V)
ISL32177E Part-to-Part Prop
Delay Variability
Features
80Mbps
1
0
-1
3.0
2.5
2.0
VCC = 3.3V
A-B
VL = 2.5V
VL = 1.8V
1.5
1.0
0.5
VL = 1.6V
0
-0.5
TIME (4ns/DIV)
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
QUAD, ±16.5kV ESD Protected, 3.0V to 5.5V,
RS-485/RS-422 Receivers
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
DATA
VL
RATE
HOT
SUPPLY
FUNCTION (Mbps) PLUG?
PIN?
Rx ENABLE
TYPE
MAX. TOTAL
SUPPLY
CURRENT
(mA)
LOW POWER
SHUTDOWN?
PIN
COUNT
ISL32173E
4 Rx
80
YES
NO
EN, EN
15
YES
16
ISL32175E
4 Rx
80
YES
NO
EN12, EN34
15
YES
16
ISL32177E
4 Rx
80
YES
YES
INDIVIDUAL AND GROUP
ENABLES
15
YES
24
ISL32273E
4 Rx
20
YES
NO
EN, EN
5.5
YES
16
ISL32275E
4 Rx
20
YES
NO
EN12, EN34
5.5
YES
16
ISL32277E
4 Rx
20
YES
YES
INDIVIDUAL AND GROUP
ENABLES
5.5
YES
24
Pin Configurations
ISL32173E, ISL32273E
(16 LD N-SOIC, 16 LD TSSOP)
TOP VIEWS
R
RO1 3
RO1 3
12 EN
R
R
GND 8
16 VCC
R
R
15 B4
14 A4
EN12 4
13 RO4
RO2 5
12 EN34
11 RO3
A2 6
10 A3
B2 7
9 B3
GND 8
11 RO3
R
R
10 A3
9 B3
2
VCC
VL
B4
A4
24
23
22
21
20
19
18 RO4
1
3
EN
4
NC
5
RO2
6
16 EN3
PAD
(GND)
15 EN
R
14 NC
R
13 RO3
7
8
9
10
11
12
A3
EN2
17 EN4
B3
2
R
GND
EN1
R
SHDNEN
RO1
B1
ISL32177E, ISL32277E
(24 LD QFN)
TOP VIEW
B2
B2 7
A1 2
14 A4
13 RO4
EN 4
RO2 5
A2 6
15 B4
A1
A1 2
B1 1
16 VCC
R
A2
B1 1
ISL32175E, ISL32275E
(16 LD N-SOIC, 16 LD TSSOP)
TOP VIEWS
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Pin Descriptions
ISL32173E,
ISL32175E,
ISL32177E,
ISL32273E
ISL32275E
ISL32277E
PIN NUMBER PIN NUMBER PIN NUMBER
PIN
FUNCTION
4, 12
-
4, 15
EN, EN
Group driver output enables, that are internally pulled high to
VCC. All receiver outputs are enabled by driving EN high OR EN
low, and the outputs are all high impedance when EN is low AND
EN is high (i.e., if using only the active high EN, connect EN to
VCC or VL through a 1kΩ resistor; if using only the active low EN,
connect EN directly to GND). If the group enable function isn’t
required, connect EN to VCC (or VL) through a 1kΩ or greater
resistor, or connect EN directly to GND. (ISL32X73E and
ISL32X77E only)
-
4, 12
-
EN12, EN34
Paired driver output enables, that are internally pulled high to
VCC. Driving EN12 (EN34) high enables the channel 1 and 2
(3 and 4) RO outputs. Driving EN12 (EN34) low disables the
channel 1 and 2 (3 and 4) outputs. If the enable function isn’t
required, connect EN12 and EN34 to VCC (or VL) through a 1kΩ
or greater resistor. (ISL32X75E only).
-
-
2, 3,
16, 17
EN1, EN2,
EN3, EN4
Individual receiver output enables that are internally pulled high
to VCC. Forcing ENX high (along with EN high OR EN low) enables
the channel X output (ROX). Driving ENX low disables the
channel X output, regardless of the states of EN and EN. If the
individual channel enable function isn’t required, connect ENX to
VCC (or VL) through a 1kΩ or greater resistor. (ISL32X77E only)
-
-
9
SHDNEN
3, 5,
11, 13
3, 5,
11, 13
1, 6,
13, 18
RO1, RO2,
RO3, RO4
Channel X receiver output: If A - B ≥ 200mV, RO is high;
If A - B ≤ -200mV, RO is low. RO = High if A and B are unconnected
(floating).
8
8
10, PD
GND
Ground connection. This is also the potential of the QFN thermal
pad.
2, 6,
10, 14
2, 6,
10, 14
24, 7,
12, 19
A1, A2,
A3, A4
±16.5kV IEC61000-4-2 ESD Protected RS-485/422 level,
channel X noninverting receiver input.
1, 7,
9, 15
1, 7,
9, 15
23, 8,
11, 20
B1, B2,
B3, B4
±16.5kV IEC61000-4-2 ESD Protected RS-485/422 level,
channel X inverting receiver input.
16
16
22
VCC
System power supply input (3.0V to 5.5V). On devices with a VL
pin, power up VCC first.
-
-
21
VL
Logic power supply input (1.4V to VCC) that powers all the
TTL/CMOS inputs and outputs (logic pins). VL sets the VIH and
VIL levels of the enable and SHDNEN pins, and sets the VOH level
of the RO pins. Connect the VL pin to the lower voltage power
supply of a logic device (e.g., UART or μcontroller) interfacing
with the ISL32X77E logic pins. Power up this supply after VCC,
and keep VL ≤ VCC. To minimize input current and SHDN supply
current, logic pins that are strapped high externally (preferably
through a 1kΩ resistor) should connect to VCC, but they may also
connect to VL. (ISL32X77E only)
-
-
5, 14
NC
No Connection.
3
Low power SHDN mode enable that is internally pulled high to
VCC. A high level allows the ISL32X77E to enter a low power
mode when all channels are disabled. A low level prevents the
device from entering the low power mode. (ISL32X77E only)
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
ISL32173EIBZ
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
16 Ld SOIC
PKG.
DWG. #
ISL32173 EIBZ
-40 to +85
M16.15
ISL32173EFBZ
ISL32173 EFBZ
-40 to +125
16 Ld SOIC
M16.15
ISL32173EIVZ
32173 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
ISL32173EFVZ
32173 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32175EIBZ
ISL32175 EIBZ
-40 to +85
16 Ld SOIC
M16.15
ISL32175EFBZ
ISL32175 EFBZ
-40 to +125
16 Ld SOIC
M16.15
ISL32175EIVZ
32175 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
ISL32175EFVZ
32175 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32177EIRZ
321 77EIRZ
-40 to +85
24 Ld QFN
L24.4x4C
ISL32177EFRZ
321 77EFRZ
-40 to +125
24 Ld QFN
L24.4x4C
ISL32273EIBZ
ISL32273 EIBZ
-40 to +85
16 Ld SOIC
M16.15
ISL32273EFBZ
ISL32273 EFBZ
-40 to +125
16 Ld SOIC
M16.15
ISL32273EIVZ
32273 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
ISL32273EFVZ
32273 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32275EIBZ
ISL32275 EIBZ
-40 to +85
16 Ld SOIC
M16.15
ISL32275EFBZ
ISL32275 EFBZ
-40 to +125
16 Ld SOIC
M16.15
ISL32275EIVZ
32275 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
ISL32275EFVZ
32275 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32277EIRZ
322 77EIRZ
-40 to +85
24 Ld QFN
L24.4x4C
ISL32277EFRZ
322 77EFRZ
-40 to +125
24 Ld QFN
L24.4x4C
NOTES:
1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL32173E,ISL32175E,ISL32177E,ISL32273E,
ISL32275E, ISL32277E. For more information on MSL please see techbrief TB363.
RECEIVER ENABLE (ISL32173E, ISL32273E)
Truth Tables
INPUTS
RECEIVER OUTPUT (ROX ENABLED, ALL VERSIONS)
INPUTS (A-B)
OUTPUT (RO)
≥0.2V
1
≤-0.2V
0
Inputs Open (Floating)
1
4
OUTPUTS
EN
EN
ROX
X
0
ENABLED
1
X
ENABLED
0
1
DISABLED*
NOTE: *Low Power SHDN Mode When Disabled
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Truth Tables
RECEIVER ENABLE (ISL32177E, ISL32277E)
(Continued)
INPUTS
RECEIVER ENABLE (ISL32175E, ISL32275E)
INPUTS
ENX
OUTPUTS
OUTPUTS
EN EN SHDNEN ROX
COMMENTS
EN12
EN34
RO1
RO2
RO3
RO4
0
X
X
0
Z
Chan X output disabled
0
0
Z*
Z*
Z*
Z*
EN1-4 = 0
X
X
1
Z*
All outputs disabled
0
1
Z
Z
EN
EN
X
0
1
0
Z
All outputs disabled
1
0
EN
EN
Z
Z
X
0
1
1
Z*
All outputs disabled
1
1
EN
EN
EN
EN
1
X
0
X
EN
1
1
X
X
EN
Individual ENX controls
chan
NOTE: *Low Power SHDN Mode When All Outputs Disabled;
Z = Tri-state
NOTE: * Low Power SHDN Mode; Z = Tri-state
Typical Operating Circuits (1 of 4 Channels Shown)
NETWORK USING GROUP ENABLES
+3.3V TO 5V
+3.3V TO 5V
+
0.1μF
16
VCC
+
0.1μF
16
VCC
ISL32X73E
3 RO
≥1kΩ
R
ISL32X72E
A
2
B
1
12 EN
RT
2 Y
3 Z
D
DI 1
EN 4
EN 12
GND
EN
8
GND
4
8
NETWORK USING PAIRED ENABLES
+3.3V TO 5V
+3.3V TO 5V
+
0.1μF
16
VCC
ISL32X75E
3 RO1
A1 2
R
B1 1
4 EN12
GND
8
5
RT
+
0.1μF
16
VCC
ISL32X74E
EN12 4
2 Y1
3 Z1
D
DI1 1
GND
8
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Typical Operating Circuits (1 of 4 Channels Shown) (Continued)
NETWORK WITH VL PIN FOR INTERFACING TO LOWER VOLTAGE LOGIC DEVICES
+1.8V +3.3V TO 5V
22
21
VCC
LOGIC
DEVICE
(μP, ASIC,
UART)
≥1kΩ
VCC
9
SHDNEN
15
ISL32X77E EN
4
EN
A1 24
1 RO1 R
B1 23
2 EN1
VL
+3.3V TO 5V +2.5V
+
0.1μF
RT
GND
10
USING INDIVIDUAL
CHANNEL ENABLES AND
CONFIGURED FOR LOWEST
SHDN SUPPLY CURRENT
NOTE: POWER UP VCC BEFORE VL
6
+
≥1kΩ
0.1μF
21
20
V
VL
CC
22
SHDNEN
14 EN ISL32179E
2, 3, 15, 16 EN1-EN4
24 Y
1 Z
D
DI
EN
GND
VCC
LOGIC
DEVICE
(μP, ASIC,
UART)
23
4
9
USING ACTIVE
HIGH GROUP ENABLE
AND CONFIGURED FOR
LOWEST SHDN SUPPLY
CURRENT
NOTE: POWER UP VCC BEFORE VL
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Absolute Maximum Ratings
Thermal Information
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
VL to GND (Note 4) . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Input Voltages
EN (All varieties) . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
A, B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V
Output Voltages
RO (Note 5). . . . . . . . . . . . . . . . . -0.5V to (VCC + 0.3V)
RO (Note 4). . . . . . . . . . . . . . . . . . . -0.5V to (VL + 0.3V)
Short Circuit Duration
RO (One output at a time) . . . . . . . . . . . . . . . Indefinite
ESD Rating . . . . . . . . . See “Electrical Specifications” Table
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
16 Ld SOIC Package (Notes 6, 9). .
78
30
16 Ld TSSOP Package (Notes 6, 9)
104
25
24 Ld QFN Package (Notes 7, 8) . .
42
5
Maximum Junction Temperature (Plastic Package) . . +150°C
Maximum Storage Temperature Range . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Supply Voltages
VCC . . . . . . . . . . . . . . . . . . . . . . .
VL (Note 4) . . . . . . . . . . . . . . . . . .
Temperature Range
ISL32X7XEI . . . . . . . . . . . . . . . . .
ISL32X7XEF . . . . . . . . . . . . . . . . .
Bus Pin Common Mode Voltage Range
RO Output Current . . . . . . . . . . . . . .
RO Load Capacitance . . . . . . . . . . . .
. . . . . . . . 3V to 5.5V
. . . . . . . 1.6V to VCC
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
. .-40°C to +85°C
. -40°C to +125°C
. . . -7V to +12V
. . -9mA to +9mA
. . . . . . . . . ≤6pF
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. ISL32177E and ISL32277E only.
5. Excluding the ISL32177E and ISL32277E.
6. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
7. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379 for details.
8. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
9. For θJC, the “case temp” location is taken at the package top center.
Electrical Specifications
PARAMETER
SYMBOL
Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL32177E and ISL32277E only); Typicals are at
the worst case of VCC = 3.3V or VCC = 5V, TA = +25°C; Unless Otherwise Specified. Boldface
limits apply over the operating temperature range. (Notes 10, 14)
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 13)
TYP
MAX
(Note 13)
UNITS
DC CHARACTERISTICS
Input High Voltage
(Logic Pins,
Note 17)
Input Low Voltage
(Logic Pins,
Note 17)
VIH1
VL = VCC if ISL32177E or
ISL32277E
VIH2
VCC ≤3.6V
Full
2
-
-
V
VCC ≤ 5.5V
Full
2.2
-
-
V
VIH3
2.7V ≤ VL < 3.0V (ISL32177E and
ISL32277E Only)
Full
2
-
-
V
VIH4
2.3V ≤ VL < 2.7V (ISL32177E and
ISL32277E Only)
Full
1.6
-
-
V
VIH5
1.6V ≤ VL < 2.3V (ISL32177E and
ISL32277E Only)
Full
0.72*VL
-
-
V
VIH6
1.4V ≤ VL < 1.6V (ISL32177E and
ISL32277E Only)
25
-
0.4*VL
-
V
VIL1
VL = VCC if ISL32177E and ISL32277E
Full
-
-
0.8
V
VIL2
VL ≥ 2.7V (ISL32177E and ISL32277E Only)
Full
-
-
0.6
V
VIL3
2.3V ≤ VL < 2.7V (ISL32177E and
ISL32277E Only)
Full
-
-
0.6
V
VIL4
1.6V ≤ VL < 2.3V (ISL32177E and
ISL32277E Only)
Full
-
-
0.22*VL
V
VIL5
1.4V ≤ VL < 1.6V (ISL32177E and
ISL32277E Only)
25
0.35*
VL
-
V
7
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Electrical Specifications
PARAMETER
Logic Input
Current
Receiver
Differential
Threshold Voltage
Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL32177E and ISL32277E only); Typicals are at
the worst case of VCC = 3.3V or VCC = 5V, TA = +25°C; Unless Otherwise Specified. Boldface
limits apply over the operating temperature range. (Notes 10, 14) (Continued)
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 13)
TYP
MAX
(Note 13)
UNITS
Full
-15
-
15
μA
IIN1
EN, EN, ENX, SHDNEN = 0V or VCC
IIN2
EN12, EN34 = 0V or VCC (ISL32X75E Only)
Full
-30
-
30
μA
VTH
-7V ≤ VCM ≤ 12V
Full
-200
-
200
mV
25
-
30
-
mV
VIN = 12V
Full
-
-
0.2
mA
VIN = -7V
Full
-0.2
-
-
mA
Receiver Input
Hysteresis
ΔVTH
VCM = 0V
Input Current
(A, B)
IIN3
VCC = 0V or 5.5V
Receiver Input
Resistance
RIN
-7V ≤ VCM ≤ 12V
Full
48
-
-
kΩ
Receiver Output
Leakage Current
IOZ
EN = 0V, 0 ≤ VO ≤ VCC (0 to VL if ISL32177E
or ISL32277E)
Full
-10
-
10
μA
Receiver ShortCircuit Current,
VO = High or Low
IOS
EN = 1, 0V ≤ VO ≤ VCC (0
to VL if ISL32177E or
ISL32277E)
20Mbps
Versions
Full
-
-
±100
mA
80Mbps
Versions
Full
-
-
±155
mA
IO = -8mA, VID = 200mV VCC ≥ 4.5V
(VL = VCC if ISL32177E or
ISL32277E)
Full
VCC - 1
-
-
V
IO = -6mA, VID = 200mV VCC ≥ 3.0V
(VL = VCC if ISL32177E or
ISL32277E)
Full
2.4
-
-
V
VOH2
IO = -2mA, VL ≥ 2.3V
Full
VL - 0.3
-
-
V
VOH3
IO = -1.5mA, VL = 1.8V
Full
VL - 0.3
-
-
V
VOH4
IO = -200μA, VL ≥ 1.4V
Full
VL - 0.2
-
-
V
VOL1
IO = 8mA, VID = -200mV, VL = VCC if
ISL32177E, ISL32277E
Full
-
-
0.4
V
VOL2
IO = 5mA, VL ≥ 1.8V
ISL32177E and
ISL32277E Only
Full
-
-
0.4
V
VOL3
IO = 2mA, VL ≥ 1.4V
ISL32177E and
ISL32277E Only
Full
-
-
0.4
V
80ICC
EN = 1, or EN = 0 (ISL32173E and
ISL32177E), or EN12 = EN34 = 1
(ISL32175E), or EN1 = EN2 = EN3 = EN4 = 1
(ISL32177E)
Full
-
-
15
mA
EN12 = 1 and EN34 = 0, or vice versa
(ISL32175E only), or if only two channels
are enabled on the ISL32177E
Full
-
-
8.5
mA
SHDNEN = 0, EN1 = EN2 = EN3 = EN4 = 0
or EN = 0 and EN = 1 (ISL32177E only)
Full
-
-
2.5
mA
Receiver Output
High Voltage
Receiver Output
Low Voltage
VOH1
ISL32177E and
ISL32277E Only
SUPPLY CURRENT
No-Load Supply
Current,
80Mbps Versions
80ICC1/2
80ICCD
8
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Electrical Specifications
PARAMETER
Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL32177E and ISL32277E only); Typicals are at
the worst case of VCC = 3.3V or VCC = 5V, TA = +25°C; Unless Otherwise Specified. Boldface
limits apply over the operating temperature range. (Notes 10, 14) (Continued)
TEMP
(°C)
MIN
(Note 13)
TYP
MAX
(Note 13)
UNITS
EN = 1, or EN = 0 (ISL32273E and
ISL32277E), or EN12 = EN34 = 1
(ISL32275E), or EN1 = EN2 = EN3 = EN4 = 1
(ISL32277E)
Full
-
-
5.5
mA
EN12 = 1 and EN34 = 0, or vice versa
(ISL32275E only), or if only two channels
are enabled on the ISL32277E
Full
-
-
3.5
mA
20ICCD
SHDNEN = 0, EN1 = EN2 = EN3 = EN4 = 0
or EN = 0 and EN = 1 (ISL32277E only)
Full
-
-
1.2
mA
ISHDN
All outputs disabled (Note 18) (all except
ISL32X75E)
Full
-
-
15
μA
All outputs disabled (Note 19) (all except
ISL32X73E)
Full
-
-
60
μA
IEC61000-4-2, From Bus
Pins to GND
Air Gap
25
-
±16.5
-
kV
Contact
25
-
±8
-
kV
SYMBOL
TEST CONDITIONS
20ICC
No-Load Supply
Current,
20Mbps Versions
20ICC1/2
Shutdown Supply
Current
ESD PERFORMANCE
RS-485 Pins (A, B)
All Pins
Human Body Model, From Bus Pins to GND
25
-
±15
-
kV
HBM
25
-
±8
-
kV
Machine Model
25
-
500
-
V
RECEIVER SWITCHING CHARACTERISTICS (ISL32273E, ISL32275E, ISL32277E, 20Mbps)
Maximum Data
Rate
Receiver Input to
Output Delay
Receiver Skew
| tPLH - tPHL |
VID = ±1.5V, CL=15pF
fMAX
Full
20
-
-
Mbps
Full
-
37
55
ns
(Figure 1)
Full
-
2.7
6
ns
tPLH, tPHL (Figure 1)
tSKD
Prop Delay Skew
Chan-to-Chan
tSKC-C
(Figure 1), (Note 11)
Full
-
3
8
ns
Prop Delay Skew
Part-to-Part
tSKP-P
(Figure 1), (Note 12)
Full
-
4
20
ns
Receiver Enable to
Output High
tZH
RL = 1kΩ, CL = 15pF, SW = GND (Figure 2),
(Notes 15, 21)
Full
-
150
190
ns
Receiver Enable to
Output Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 2),
(Notes 15, 21)
Full
-
155
190
ns
Receiver Disable
from Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND (Figure 2)
Full
-
19
30
ns
Receiver Disable
from Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 2)
Full
-
19
30
ns
Receiver Enable
from Shutdown to
Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 2),
(Notes 16, 20)
Full
-
-
850
ns
Receiver Enable
from Shutdown to
Output Low
tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 2),
(Notes 16, 20)
Full
-
-
850
ns
RECEIVER SWITCHING CHARACTERISTICS (ISL32173E, ISL32175E, ISL32177E, 80Mbps)
Maximum Data
Rate
fMAX
VID = ±1.5V, CL≤ 15pF
VCC≤ 3.6V
Full
80
-
-
Mbps
VCC > 3.6V
Full
20
-
-
Mbps
Full
80
-
-
Mbps
VID = ±1.5V, CL≤ 6pF, 3.6V ≤ VCC ≤ 5.5V
9
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Electrical Specifications
PARAMETER
Receiver Input to
Output Delay
Receiver Skew
| tPLH - tPHL |
Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL32177E and ISL32277E only); Typicals are at
the worst case of VCC = 3.3V or VCC = 5V, TA = +25°C; Unless Otherwise Specified. Boldface
limits apply over the operating temperature range. (Notes 10, 14) (Continued)
TEMP
(°C)
MIN
(Note 13)
TYP
MAX
(Note 13)
UNITS
Full
7
11
16
ns
(Figure 1)
Full
-
0.4
2
ns
SYMBOL
TEST CONDITIONS
tPLH, tPHL (Figure 1)
tSKD
Prop Delay Skew
Chan-to-Chan
tSKC-C
(Figure 1), (Note 11)
Full
-
0.7
4
ns
Prop Delay Skew
Part-to-Part
tSKP-P
(Figure 1), (Note 12)
Full
-
1.2
8
ns
Receiver Enable to
Output High
tZH
RL = 1kΩ, CL = 15pF, SW = GND (Figure 2),
(Notes 15, 21)
Full
-
57
75
ns
Receiver Enable to
Output Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 2),
(Notes 15, 21)
Full
-
59
75
ns
Receiver Disable
from Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND (Figure 2)
Full
-
18
30
ns
Receiver Disable
from Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 2)
Full
-
19
30
ns
Receiver Enable
from Shutdown to
Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 2),
(Notes 16, 20)
Full
-
-
850
ns
Receiver Enable
from Shutdown to
Output Low
tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 2),
(Notes 16, 20)
Full
-
-
850
ns
NOTES:
10. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device
ground unless otherwise specified.
11. Channel-to-channel skew is the magnitude of the worst case delta between any two propagation delays of any two outputs
on the same IC, at the same test conditions.
12. tSKP-P is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test
conditions (VCC, temperature, etc.).
13. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established
by characterization and are not production tested.
14. EN = 0 indicates that the output(s) under test are disabled via the appropriate logic pin settings. EN = 1 indicates that the
logic pins are set to enable the output(s) under test.
15. For ISL32177E and ISL32277E, keep SHDNEN low to avoid entering SHDN. For ISL32175E and ISL32275E ensure that at least
one channel remains enabled to prevent SHDN.
16. For ISL32177E and ISL32277E, keep SHDNEN high to enter SHDN when all drivers are disabled.
17. Logic Pins are the enable variants and SHDNEN.
18. EN low and EN high on the ISL32X73E. SHDNEN, EN, EN1-EN4 all high and EN low on the ISL32X77E.
19. EN12 and EN34 low on ISL32X75E. SHDNEN high, with EN1-EN4 low plus EN and EN high on the ISL32X77E.
20. Shutdown is entered by simultaneously disabling all four outputs for at least 600ns.
21. Does not apply to the ISL32173E nor the ISL32273E; only the EN from SHDN parameters apply to these two parts.
10
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Test Circuits and Waveforms
3V
EN
+1.5V
B
RO
R
A
A
15pF
1.5V
1.5V
0V
tPLH
tPHL
VCC OR VL
SIGNAL
GENERATOR
50%
RO
50%
0V
FIGURE 1B. MEASUREMENT POINTS
FIGURE 1A. TEST CIRCUIT
FIGURE 1. RECEIVER PROPAGATION DELAY
EN
GND
B
A
R
VCC
OR VL
1kΩ
RO
SW
SIGNAL
GENERATOR
A
+1.5V
-1.5V
+1.5V
-1.5V
+1.5V
-1.5V
1.5V
1.5V
GND
15pF
PARAMETER
tHZ
tLZ
tZH (Notes 15, 21)
tZL (Notes 15, 21)
tZH(SHDN) (Notes 16, 20)
tZL(SHDN) (Notes 16, 20)
3V OR VL
EN
0V
tZH, tZH(SHDN)
SW
GND
VCC
GND
VCC
GND
VCC
FIGURE 2A. TEST CIRCUIT
RO
tHZ
OUTPUT HIGH
LOWER OF
1.5V OR VL/2
tZL, tZL(SHDN)
tLZ
LOWER OF
1.5V OR VL/2
RO
OUTPUT LOW
V
VOH - 0.5V OH
0V
VCC OR VL
VOL + 0.5VV
OL
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. RECEIVER ENABLE AND DISABLE TIMES
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a
point-to-multipoint (multidrop) standard, which allows
only one driver and up to 10 (assuming one unit load
devices) receivers on each bus. RS-485 is a true
multipoint standard, which allows up to 32 one unit load
devices (any combination of drivers and receivers) on
each bus.
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the
driver outputs and receiver inputs withstand signals that
range from +12V to -7V. RS-422 and RS-485 are
intended for runs as long as 4000’, so the wide CMR is
necessary to handle ground potential differences, as well
as voltages induced in the cable by external fields.
Receiver Features
These devices utilize differential receivers for maximum
noise immunity and common mode rejection. Input
sensitivity is better than ±200mV, as required by the
RS-422 and RS-485 specifications.
Receiver input resistance of 48kΩ surpasses the RS-422
specification of 4kΩ and is four times the RS-485 “Unit
11
Load (UL)” requirement of 12kΩ minimum. Thus, these
products are known as “one-quarter UL” receivers and
there can be up to 128 of these devices on a network
while still complying with the RS-485 loading
specification.
Receiver inputs function with common mode voltages as
great as +9V/-7V outside the power supplies (i.e., +12V
and -7V with VCC = 3.0V), making them ideal for long
networks where induced voltages, and ground potential
differences are realistic concerns.
All the receivers include a “fail-safe open” function that
guarantees a high level receiver output if the receiver
inputs are unconnected (floating).
All receivers easily support a 20Mbps data rate, and the
ISL32173E, ISL32175E, and ISL32177E support data
rates up to 80Mbps. All receiver outputs are tri-statable,
with the enable scheme varying by part type (see next
section).
Receiver Enable Functions
All product types include functionality to allow disabling
of the Rx outputs. The ISL32X73E types feature group
(all four Rx) enable functions that are active high (EN) or
active low (EN). Receivers enable when EN = 1, or when
EN = 0, and they disable only when EN = 0 and EN = 1.
ISL32X75E versions use active high paired enable
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
functions (EN12 and EN34) that enable (when high) or
disable (when low) the corresponding pairs of Rx. All four
of these enable pins have internal pull-up resistors to
VCC, but unused enable pins that need to be high (e.g.,
EN when using the EN input for enable control, or EN12
and EN34 when using always enabled receivers) should
always be connected externally to VCC. If VCC transients
might exceed 7V, then inserting a series resistor between
the input(s) and VCC limits the current that flows if the
input’s ESD protection starts conducting.
1 OF 4 CHANNELS
ENX
VCC
VCC
EN
CHX EN
EN
The ISL32177E and ISL32277E include a VL pin that
powers the logic inputs (enables, SHDNEN) and the RO
outputs. These pins interface with “logic” devices such as
UARTs, ASICs, and μcontrollers, and today most of these
devices use power supplies significantly lower than 3.3V.
Thus, a 5V or 3.3V RO output level from an ISL32X77E
IC might seriously overdrive and damage the logic device
input (Figure 4). Similarly, the logic device’s low VOH
might not exceed the VIH of the ISL32X77E’s 3.3V or 5V
powered enable input. Connecting the ISL32X77E’s VL
pin to the power supply of the logic device - as shown in
Figure 4 - limits the ISL32X77E’s VOH to VL, and reduces
its logic input switching points to values compatible with
the logic device’s output levels. Tailoring the logic pin
input switching points and RO output levels to the supply
voltage of the UART, ASIC, or μcontroller eliminates the
need for a level shifter/translator between the two ICs.
VCC = +2V
VCC = +3.3V
VCC
FIGURE 3. ISL32X77E ENABLE LOGIC
The ISL32177E and ISL32277E have the most flexible
enable scheme. Their six enable pins allow for group,
paired, or individual channel enable control. Figure 3
details the ISL32X77E’s internal enable logic. To utilize a
group enable function, connect all the ENX pins high, and
handle the EN and EN pins as described in the previous
paragraph. For paired enables, connect EN and EN high
(for the lowest current in SHDN mode, if SHDN is used)
and tie EN1 and EN2 together, and EN3 and EN4
together. For individual channel enables, again connect
EN and EN high, and drive the appropriate ENX (active
high) for the particular channel. All six enable pins
incorporate pull-up resistors to VCC, but unused enable
pins of any type should be externally connected high,
rather than being left floating. Connecting to VCC is the
best choice, but VL may be utilized as long as SHDN
power isn’t a primary concern (for each VL connected
input, ICC increases by (VCC - VL)/600kΩ). If VCC or VL
transients might exceed 7V, then inserting a series
resistor between the input(s) and the supply limits the
current that will flow if the input’s ESD protection starts
conducting.
Wide Supply Range
RO
EN
VOH = 3.3V
RXD
VIH ≥ 2V
VOH ≤ 2V
GND
ISL32X7XE
RXEN
GND
UART/PROCESSOR
VCC = +3.3V TO 5V
VCC = +2V
VL
RO
EN
GND
ISL32X77E
ESD
DIODE
VOH = 2V
RXD
VIH = 0.9V
VOH ≤ 2V
ESD
DIODE
RXEN
GND
UART/PROCESSOR
FIGURE 4. USING VL PIN TO ADJUST LOGIC LEVELS
The ISL32X7XE design operates with a wide range of
supply voltages from 3.0V to 5.5V, and the receivers
meet the RS-485 specs for that full supply voltage range.
5.5V TOLERANT LOGIC PINS
Logic input pins (enables, SHDNEN) contain no ESD nor
parasitic diodes to VCC (nor to VL), so they withstand
input voltages exceeding 5.5V regardless of the VCC and
VL voltages (see Figure 6).
Logic Supply (VL Pin, ISL32177E and
ISL32277E)
VL can be anywhere from VCC down to 1.4V, but the data
rate drops off dramatically below VL = 1.6V. Table 2
indicates typical VIH and VIL values (applicable to both
speed grades) for various VL settings, and also lists the
ISL32177E’s typical data rate versus VL. The ISL32277E
typically runs at 20Mbps for VL ≥ 1.6V, and drops to
10Mbps to 15Mbps at VL=1.4V. Prop delays, skews, and
transition times increase at lower VL, as shown in Figures
17 through 29.
Note: Power up VCC before powering up the VL supply.
12
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
VL
(V)
VIH
(V)
VIL
(V)
ISL32177E
DATA RATE
(Mbps)
1.4
0.55
0.5
25
1.6
0.6
0.55
50
configuration (power applied) rather than testing each
pin-to-pin combination. The lower current limiting
resistor coupled with the larger charge storage capacitor
yields a test that is much more severe than the HBM test.
The extra ESD protection built into this device’s RS-485
pins allows the design of equipment meeting level 4
criteria without the need for additional board level
protection on the RS-485 port.
1.8
0.8
0.7
65
AIR-GAP DISCHARGE TEST METHOD
2.3
1
0.9
70
2.7
1.1
1
75
3.3
1.3
1.2
80
For this test method, a charged probe tip moves toward
the IC pin until the voltage arcs to it. The current
waveform delivered to the IC pin depends on approach
speed, humidity, temperature, etc., so it is difficult to
obtain repeatable results. The A and B RS-485 pins
withstand ±16.5kV air-gap discharges.
TABLE 2. TYPICAL VIH, VIL AND DATA RATE vs. VL FOR
VCC = 3.3V OR 5V
Neglecting the RO IOH currents, the quiescent VL supply
current (IL) is typically less than 1μA for enable input
voltages at ground or VL, as shown in Figure 6. Enable
pin pull-up resistors connect to VCC, so the current due
to a low enable input adds to ICC rather than to IL.
Hot Plug Function
When a piece of equipment powers up, there is a period
of time where the processor or ASIC driving the RS-485
control lines (EN, EN, ENX) is unable to ensure that the
RS-485 Rx outputs are kept disabled. If the equipment is
connected to the bus, a receiver activating prematurely
during power up may generate RO transitions that could
cause interrupts. To avoid this scenario, this family
incorporates a “Hot Plug” function. During power up,
circuitry monitoring VCC ensures that the Rx outputs
remain disabled for a period of time, regardless of the
state of the enables. This gives the processor/ASIC a
chance to stabilize and drive the RS-485 control lines to
the proper states.
ESD Protection
All pins on these devices include class 3 (>8kV) Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (receiver inputs) incorporate advanced
structures allowing them to survive ESD events in excess
of ±15kV HBM, and ±16.5kV IEC 61000-4-2. The
RS-485 pins are particularly vulnerable to ESD damage
because they typically connect to an exposed port on the
exterior of the finished product. Simply touching the port
pins, or connecting a cable, can cause an ESD event that
might destroy unprotected ICs. These new ESD
structures protect the device whether or not it is powered
up, and without degrading the RS-485 common mode
range of -7V to +12V. This built-in ESD protection
eliminates the need for board level protection structures
(e.g., transient suppression diodes), and the associated,
undesirable capacitive load they present.
IEC 61000-4-2 Testing
The IEC 61000 test method applies to finished
equipment, rather than to an individual IC. Therefore,
the pins most likely to suffer an ESD event are those that
are exposed to the outside world (the RS-485 pins in this
case), and the IC is tested in its typical application
13
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. These Quad receivers survive ±8kV contact
discharges on the RS-485 pins.
Data Rate, Cables, and Terminations
RS-485 and RS-422 are intended for network lengths up
to 4000’, but the maximum system data rate decreases
as the transmission length increases. Networks operating
at 80Mbps are limited to lengths much less than 100’
(30m), while a 20Mbps version can operate at full data
rates with lengths up to 200’ (60m).
Any of these ICs may be used at slower data rates over
longer cables, but there are some limitations for the
80Mbps versions. The 80Mbps Rx is optimized for high
speed operation, so its output may glitch if the Rx input
differential transition times are too slow. Keeping the
transition times below 500ns, which equates to a Tx
driving a 1000’ (305m) CAT 5 cable, yields excellent
performance over the full operating temperature range.
Twisted pair is the cable of choice for RS-485 and RS-422
networks. Twisted pair cables tend to pick up noise and
other electromagnetically induced voltages as common
mode signals, which are effectively rejected by the
differential receivers in these ICs.
When using these receivers, proper termination is
imperative to minimize reflections. Short networks using
slew rate limited transmitters need not be terminated,
but terminations are recommended unless power
dissipation is an overriding concern.
In point-to-point, or point-to-multipoint (single driver on
a bus with multiple receivers) networks, the main cable
should be terminated in its characteristic impedance
(typically 120Ω) at the end farthest from the driver. In
multi-receiver applications, stubs connecting receivers to
the main cable should be kept as short as possible.
Multipoint (multi-driver) systems require that the main
cable be terminated in its characteristic impedance at
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
both ends. Stubs connecting a transmitter or receiver to
the main cable should be kept as short as possible.
Low Power Shutdown Mode
These BiCMOS receivers all use a fraction of the power
required by their bipolar counterparts, but they also
include a shutdown (SHDN) feature that reduces the
already low quiescent ICC to a microamp trickle. These
devices enter shutdown only when all four receivers
disable (see “Truth Tables” on page 4) for at least 600ns.
The ISL32X73E types enter SHDN whenever EN is low
and EN is high. ISL32X75E types enter SHDN only if both
EN12 and EN34 are low. Note that the ISL32X75E enable
times increase significantly when enabling from the
SHDN condition.
14
The ISL32X77E enter the low power SHDN mode if
SHDNEN is high, and if all four Rx are disabled for at
least 600ns. This is accomplished by driving EN low and
EN high, or by driving all four ENX inputs low. Enable
times increase if the IC was in SHDN, so if enable time is
more important than SHDN supply current, tying the
SHDNEN pin low defeats the low power SHDN feature. In
this mode, the supply current drops to 1mA to 2mA when
all four Rx are disabled, but the enable time of any Rx
remains below 200ns.
Remember that all enable pins have pull-up resistors on
them, so each pin that is low during SHDN adds up to
15μA to the SHDN supply current. The SHDN supply
current entries in the “Electrical Specifications” table on
page 9 include the resistor currents of the pins indicated
to be in the low state.
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Typical Performance Curves
11
10
180
VCC = VL = 5V
ISL3217XE
9
CL= 15pF, VCC = VL = 3.3V or 5V, TA = +25°C; Unless Otherwise
Specified. VL Notes Apply To The ISL32177E And ISL32277E Only.
140
VCC = VL = 3.3V
7
6
5
VCC = VL = 3.3V
2
-40
-15
100
VOL, +25°C
VOL, +85°C
80
VOL, +125°C
VOH, +85°C
60
VOH, +125°C
40
20
0
1
2
3
4
5
25
VOL, +25°C
VOL, +85°C
30
VOH, +25°C
VOL, +125°C
20
VOH, +125°C
15
VOH, +85°C
10
5
0
0
0.5
1.0
1.5
2.0
2.5
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 9. ISL32177E RECEIVER OUTPUT CURRENT
vs RECEIVER OUTPUT VOLTAGE
15
2
3
4
EN VOLTAGE (V)
5
6
7
VOL, +25°C
VOL, +85°C
VOH, +25°C
50
VOL, +125°C
40
VOH, +85°C
30
VOH, +125°C
20
10
0
VCC = 5V OR 3.3V, VL = 3.3V
0
0.5
1.0
1.5
2.0
2.5
3.0 3.3
FIGURE 8. ISL3217XE RECEIVER OUTPUT CURRENT
vs RECEIVER OUTPUT VOLTAGE
RECEIVER OUTPUT CURRENT (mA)
RECEIVER OUTPUT CURRENT (mA)
35
1
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 7. ISL3217XE RECEIVER OUTPUT CURRENT
vs RECEIVER OUTPUT VOLTAGE
VCC = 5V OR 3.3V, VL = 2.5V
VL = 2.5V
60
RECEIVER OUTPUT VOLTAGE (V)
40
VL = 3.3V
FIGURE 6. VL SUPPLY CURRENT vs ENABLE PIN
VOLTAGE (ISL32X77E ONLY)
RECEIVER OUTPUT CURRENT (mA)
VCC = VL = 5V
VOH, +25°C
0
0
110 125
FIGURE 5. SUPPLY CURRENT vs TEMPERATURE
120
VL ≤ 2V
20
EN = VCC, EN = 0V
10
35
60
85
TEMPERATURE (°C)
80
40
ISL3227XE
3
100
60
VCC = VL = 5V
4
RECEIVER OUTPUT CURRENT (mA)
VL = 5V (VCC = 5V ONLY)
120
IL (μA)
ICC (mA)
8
0
VCC = 5V OR 3.3V
DATA FOR ANY 1 ENABLE PIN
160
18
VCC = 5V OR 3.3V, VL = 1.8V
16
VOL, +25°C
VOL, +85°C
14
VOL, +125°C
12
10
VOH, +25°C
8
6
VOH, +85°C
VOH, +125°C
4
2
0
0
0.5
1.0
1.5
1.8
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 10. ISL32177E RECEIVER OUTPUT CURRENT
vs RECEIVER OUTPUT VOLTAGE
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Typical Performance Curves
70
VCC = 5V or 3.3V, VL = 1.5V
9
VOL, +85°C
8
VOL, +25°C
VOL, +125°C
7
6
5
3
VOH, -40°C
2
VOH, +25°C
1
0
VOH, +85°C
VOH, +125°C
4
0
0.2
0.4
0.6
0.8
1.0
1.2
RECEIVER OUTPUT CURRENT (mA)
RECEIVER OUTPUT CURRENT (mA)
10
CL= 15pF, VCC = VL = 3.3V or 5V, TA = +25°C; Unless Otherwise
Specified. VL Notes Apply To The ISL32177E And ISL32277E Only.
60
VOL, +125°C
40
VOH, +85°C
30
VOH, +125°C
20
10
0
VOL, +25°C
VOL, +85°C
VOL, +125°C
VOH, +25°C
20
VOH, +85°C
VOH, +125°C
15
10
5
0
VCC = 5V OR 3.3V, VL = 3.3V
0
0.5
1.0
1.5
2.0
2.5
3.0 3.3
25
VOL, +25°C
VOL, +85°C
8
VOL, +125°C
6
VOH, +25°C
4
VOH, +85°C
VOH, +125°C
2
0
0
0.5
1.0
1.5
1.8
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 15. ISL32277E RECEIVER OUTPUT CURRENT
vs RECEIVER OUTPUT VOLTAGE
16
5
VOL, +25°C
20
VOL, +85°C
VOL, +125°C
15
VOH, +25°C
10
VOH, +85°C
VOH, +125°C
5
0
0
0.5
1.0
1.5
2.0
2.5
FIGURE 14. ISL32277E RECEIVER OUTPUT CURRENT
vs RECEIVER OUTPUT VOLTAGE
6
RECEIVER OUTPUT CURRENT (mA)
RECEIVER OUTPUT CURRENT (mA)
VCC = 5V OR 3.3V, VL = 1.8V
4
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 13. ISL3227XE RECEIVER OUTPUT CURRENT
vs RECEIVER OUTPUT VOLTAGE
10
3
VCC = 5V OR 3.3V, VL = 2.5V
RECEIVER OUTPUT VOLTAGE (V)
11
2
FIGURE 12. ISL3227XE RECEIVER OUTPUT CURRENT
vs RECEIVER OUTPUT VOLTAGE
RECEIVER OUTPUT CURRENT (mA)
RECEIVER OUTPUT CURRENT (mA)
40
25
1
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 11. ISL32177E RECEIVER OUTPUT CURRENT
vs RECEIVER OUTPUT VOLTAGE
30
VOL, +85°C
VOH, +25°C
RECEIVER OUTPUT VOLTAGE (V)
35
VOL, +25°C
50
0
1.41.5
VCC = VL = 5V
VCC = 5V or 3.3V, VL = 1.5V
VOL, +85°C
5
VOL, +25°C
VOL, +125°C
4
3
VOH, +125°C
2
1
VOH, +85°C
VOH, -40°C
VOH, +25°C
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4 1.5
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 16. ISL32277E RECEIVER OUTPUT CURRENT
vs RECEIVER OUTPUT VOLTAGE
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Typical Performance Curves
3.5
VCC = 5V
|tPLH - tPHL|
VL = 1.5V
16
2.5
14
VL = 1.8V
12
VL = 3.3V
10
10
1.5
VL = 1.8V
35
VL = 2.5V
0.5
VL = 5V
-15
2.0
1.0
VL = 2.5V
8
-40
VL = 3.3V
VL = 5V
60
85
0
-40
110 125
-15
10
FIGURE 17. ISL3217XE RECEIVER PROPAGATION
DELAY vs TEMPERATURE
16
14
VL = 1.8V
VL = 1.5V
2.0
1.5
VL = 1.8V
1.0
VL = 3.3V
10
VL = 3.3V
0.5
-15
10
35
60
85
0
-40
110 125
VL = 2.5V
-15
TEMPERATURE (°C)
52
8
SKEW (ns)
VL = 1.5V
44
38
VL = 1.8V
VL = 3.3V
34
-40
VL = 5V
-15
10
110 125
VCC = 5V
VL = 1.5V
5
4
VL = 1.8V
3
2.5V ≤ VL ≤ VCC
2
VL = 2.5V
36
85
6
46
40
60
|tPLH - tPHL|
7
50
42
35
FIGURE 20. ISL3217XE RECEIVER SKEW vs
TEMPERATURE
VCC = 5V
48
10
TEMPERATURE (°C)
FIGURE 19. ISL3217XE RECEIVER PROPAGATION
DELAY vs TEMPERATURE
54
110 125
VCC = 3.3V
2.5
VL = 2.5V
85
|tPLH - tPHL|
VL = 1.5V
SKEW (ns)
PROPAGATION DELAY (ns)
3.0
18
12
60
FIGURE 18. ISL3217XE RECEIVER SKEW vs
TEMPERATURE
VCC = 3.3V
8
-40
PROPAGATION DELAY (ns)
35
TEMPERATURE (°C)
TEMPERATURE (°C)
20
VCC = 5V
VL = 1.5V
3.0
18
SKEW (ns)
PROPAGATION DELAY (ns)
20
CL= 15pF, VCC = VL = 3.3V or 5V, TA = +25°C; Unless Otherwise
Specified. VL Notes Apply To The ISL32177E And ISL32277E Only.
35
60
1
85
110 125
TEMPERATURE (°C)
FIGURE 21. ISL3227XE RECEIVER PROPAGATION
DELAY vs TEMPERATURE
17
0
-40
-15
10
35
60
85
110 125
TEMPERATURE (°C)
FIGURE 22. ISL3227XE RECEIVER SKEW vs
TEMPERATURE
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Typical Performance Curves
7
VCC = 3.3V
VL = 1.5V
5
VL = 1.5V
47
42
37
VCC = 3.3V
|tPLH - tPHL|
6
52
SKEW (ns)
PROPAGATION DELAY (ns)
57
CL= 15pF, VCC = VL = 3.3V or 5V, TA = +25°C; Unless Otherwise
Specified. VL Notes Apply To The ISL32177E And ISL32277E Only.
VL = 1.8V
VL = 1.8V
3
VL = 2.5V
VL = 3.3V
2
VL = 3.3V
VL = 2.5V
32
-40
4
1
-15
10
35
60
85
0
-40
110 125
-15
TEMPERATURE (°C)
10
35
60
85
FIGURE 23. ISL3227XE RECEIVER PROPAGATION
DELAY vs TEMPERATURE
FIGURE 24. ISL3227XE RECEIVER SKEW vs
TEMPERATURE
RECEIVER OUTPUT (V) RECEIVER INPUT (V)
RECEIVER OUTPUT (V) RECEIVER INPUT (V)
80Mbps
1
0
-1
A-B
VCC = 5V, CL = 6pF
5
4
3
2
1
0
VCC = 3.3V, CL = 15pF
20Mbps
1
0
-1
A-B
VCC = 5V
5
4
3
VCC = 3.3V
2
1
0
TIME (20ns/DIV)
TIME (4ns/DIV)
FIGURE 26. ISL3227XE RECEIVER WAVEFORMS
80Mbps
CL = 6pF
0
-1
A-B
4
3
2
1
VCC = 5V
VL = 3.3V
VL = 2.5V
VL = 1.8V
VL = 1.6V
0
TIME (4ns/DIV)
FIGURE 27. ISL32177E RECEIVER WAVEFORMS
18
RECEIVER OUTPUT (V) RECEIVER INPUT (V)
RECEIVER OUTPUT (V) RECEIVER INPUT (V)
FIGURE 25. ISL3217XE RECEIVER WAVEFORMS
1
110 125
TEMPERATURE (°C)
80Mbps
1
0
-1
2.5
2.0
VCC = 3.3V
A-B
VL = 2.5V
VL = 1.8V
1.5
1.0
0.5
VL = 1.6V
0
TIME (4ns/DIV)
FIGURE 28. ISL32177E RECEIVER WAVEFORMS
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
RECEIVER OUTPUT (V) RECEIVER INPUT (V)
Typical Performance Curves
20Mbps
CL= 15pF, VCC = VL = 3.3V or 5V, TA = +25°C; Unless Otherwise
Specified. VL Notes Apply To The ISL32177E And ISL32277E Only.
VCC = 5V OR 3.3V
1
0
-1
Die Characteristics
A-B
SUBSTRATE AND QFN THERMAL PAD
POTENTIAL (POWERED UP):
GND
2.5
2.0
VL = 2.5V
VL = 1.8V
1.5
PROCESS:
VL = 1.6V
Si Gate BiCMOS
1.0
0.5
0
VL = 1.4V
TIME (20ns/DIV)
FIGURE 29. ISL32277E RECEIVER WAVEFORMS
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
DATE
REVISION
11/19/09
FN7529.0
CHANGE
Initial release.
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The
Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,
handheld products, and notebooks. Intersil's product families address power management and analog signal
processing functions. Go to www.intersil.com/products for a complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device
information page on intersil.com: ISL32173E,ISL32175E,ISL32177E,ISL32273E, ISL32275E, ISL32277E
To report errors or suggestions for this datasheet, please
go to www.intersil.com/askourstaff
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19
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Small Outline Plastic Packages (SOIC)
M16.15 (JEDEC MS-012-AC ISSUE C)
N
INDEX
AREA
H
0.25(0.010) M
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
B M
INCHES
E
-B1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
α
B S
0.050 BSC
20
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
MILLIMETERS
α
16
0°
16
8°
0°
7
8°
Rev. 1 6/05
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Package Outline Drawing
L24.4x4C
24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 10/06
4X 2.5
4.00
A
20X 0.50
B
19
PIN 1
INDEX AREA
PIN #1 CORNER
(C 0 . 25)
24
1
4.00
18
2 . 50 ± 0 . 15
13
0.15
(4X)
12
7
0.10 M C A B
. 07
24X 0 . 23 +- 0
0 . 05 4
24X 0 . 4 ± 0 . 1
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
C
0 . 90 ± 0 . 1
BASE PLANE
( 3 . 8 TYP )
SEATING PLANE
0.08 C
SIDE VIEW
(
2 . 50 )
( 20X 0 . 5 )
C
0 . 2 REF
5
( 24X 0 . 25 )
0 . 00 MIN.
0 . 05 MAX.
( 24X 0 . 6 )
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
21
FN7529.0
November 19, 2009
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Thin Shrink Small Outline Package Family (TSSOP)
MDP0044
0.25 M C A B
D
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
A
(N/2)+1
N
MILLIMETERS
SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE
PIN #1 I.D.
E
E1
1
(N/2)
B
TOP VIEW
0.05
e
C
0.20 C B A
2X
N/2 LEAD TIPS
SEATING
PLANE
0.10 M C A B
b
0.10 C
N LEADS
SIDE VIEW
SEE DETAIL “X”
c
H
A
1.20
1.20
1.20
1.20
1.20
Max
A1
0.10
0.10
0.10
0.10
0.10
±0.05
A2
0.90
0.90
0.90
0.90
0.90
±0.05
b
0.25
0.25
0.25
0.25
0.25
+0.05/-0.06
c
0.15
0.15
0.15
0.15
0.15
+0.05/-0.06
D
5.00
5.00
6.50
7.80
9.70
±0.10
E
6.40
6.40
6.40
6.40
6.40
Basic
E1
4.40
4.40
4.40
4.40
4.40
±0.10
e
0.65
0.65
0.65
0.65
0.65
Basic
L
0.60
0.60
0.60
0.60
0.60
±0.15
L1
1.00
1.00
1.00
1.00
1.00
Reference
Rev. F 2/07
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
END VIEW
L1
A A2
GAUGE
PLANE
0.25
L
A1
0° - 8°
DETAIL X
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in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
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22
FN7529.0
November 19, 2009