MOTOROLA MC74LCX125SD Low-voltage cmos quad buffer Datasheet

SEMICONDUCTOR TECHNICAL DATA
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The MC74LCX125 is a high performance, non–inverting quad buffer
operating from a 2.7 to 3.6V supply. High impedance TTL compatible
inputs significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance. A VI
specification of 5.5V allows MC74LCX125 inputs to be safely driven from
5V devices. The MC74LCX125 is suitable for memory address driving
and all TTL level bus oriented transceiver applications.
Current drive capability is 24mA at the outputs. The Output Enable
(OEn) inputs, when HIGH, disable the outputs by placing them in a HIGH
Z condition.
•
•
•
•
•
•
•
•
LOW–VOLTAGE CMOS
QUAD BUFFER
Designed for 2.7 to 3.6V VCC Operation
D SUFFIX
PLASTIC SOIC
CASE 751A–03
14
5V Tolerant — Interface Capability With 5V TTL Logic
1
Supports Live Insertion and Withdrawal
IOFF Specification Guarantees High Impedance When VCC = 0V
LVTTL Compatible
M SUFFIX
PLASTIC SOIC EIAJ
CASE 965–01
14
LVCMOS Compatible
1
24mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current in All Three Logic States (10µA)
Substantially Reduces System Power Requirements
• Latchup Performance Exceeds 500mA
1
SD SUFFIX
PLASTIC SSOP
CASE 940A–03
1
DT SUFFIX
PLASTIC TSSOP
CASE 948G–01
14
• ESD Performance: Human Body Model >2000V; Machine Model >200V
Pinout: 14–Lead (Top View)
VCC
14
14
OE3
D3
O3
OE2
D2
O2
13
12
11
10
9
8
PIN NAMES
1
2
3
4
5
6
7
OE0
D0
O0
OE1
D1
O1
GND
Pins
Function
OEn
Dn
On
Output Enable Inputs
Data Inputs
3–State Outputs
FUNCTION TABLE
LOGIC DIAGRAM
OE0
D0
OE1
D1
1
2
OE2
3
O0
4
5
D2
OE3
6
O1
D3
INPUTS
10
9
8
O2
13
12
11
O3
OEn
Dn
On
L
L
H
L
H
X
L
H
Z
H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level and Transitions Are
Acceptable, for ICC reasons, DO NOT FLOAT Inputs
11/96
 Motorola, Inc. 1996
1
OUTPUTS
REV 1
MC74LCX125
ABSOLUTE MAXIMUM RATINGS*
Symbol
Parameter
VCC
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
Value
Condition
Unit
–0.5 to +7.0
V
–0.5 ≤ VI ≤ +7.0
V
–0.5 ≤ VO ≤ +7.0
Output in 3–State
V
–0.5 ≤ VO ≤ VCC + 0.5
Note 1.
V
IIK
DC Input Diode Current
–50
VI < GND
mA
IOK
DC Output Diode Current
–50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
–65 to +150
°C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.
1. Output in HIGH or LOW State. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Typ
Max
Unit
2.0
1.5
3.3
3.3
3.6
3.6
V
0
5.5
V
0
0
VCC
5.5
V
HIGH Level Output Current, VCC = 3.0V – 3.6V
–24
mA
IOL
LOW Level Output Current, VCC = 3.0V – 3.6V
24
mA
IOH
HIGH Level Output Current, VCC = 2.7V – 3.0V
–12
mA
IOL
LOW Level Output Current, VCC = 2.7V – 3.0V
TA
Operating Free–Air Temperature
∆t/∆V
Input Transition Rise or Fall Rate, VIN from 0.8V to 2.0V,
VCC = 3.0V
VCC
Supply Voltage
VI
Input Voltage
VO
Output Voltage
IOH
Operating
Data Retention Only
(HIGH or LOW State)
(3–State)
12
mA
–40
+85
°C
0
10
ns/V
DC ELECTRICAL CHARACTERISTICS
TA = –40°C to +85°C
Symbol
Characteristic
VIH
HIGH Level Input Voltage (Note 2.)
VIL
LOW Level Input Voltage (Note 2.)
VOH
HIGH Level Output Voltage
VOL
LOW Level Output Voltage
Condition
Min
2.7V ≤ VCC ≤ 3.6V
2.0
2.7V ≤ VCC ≤ 3.6V
Max
V
0.8
2.7V ≤ VCC ≤ 3.6V; IOH = –100µA
VCC – 0.2
VCC = 2.7V; IOH = –12mA
2.2
VCC = 3.0V; IOH = –18mA
2.4
VCC = 3.0V; IOH = –24mA
2.2
Unit
V
V
2.7V ≤ VCC ≤ 3.6V; IOL = 100µA
0.2
VCC = 2.7V; IOL= 12mA
0.4
VCC = 3.0V; IOL = 16mA
0.4
VCC = 3.0V; IOL = 24mA
0.55
V
2. These values of VI are used to test DC electrical characteristics only.
MOTOROLA
2
LCX DATA
BR1339 — REV 3
MC74LCX125
DC ELECTRICAL CHARACTERISTICS (continued)
TA = –40°C to +85°C
Symbol
Characteristic
Condition
Min
Max
Unit
II
Input Leakage Current
2.7V ≤ VCC ≤ 3.6V; 0V ≤ VI ≤ 5.5V
±5.0
µA
IOZ
3–State Output Current
2.7 ≤ VCC ≤ 3.6V; 0V ≤ VO ≤ 5.5V;
VI = VIH or V IL
±5.0
µA
IOFF
Power–Off Leakage Current
VCC = 0V; VI or VO = 5.5V
10
µA
ICC
Quiescent Supply Current
2.7 ≤ VCC ≤ 3.6V; VI = GND or VCC
10
µA
2.7 ≤ VCC ≤ 3.6V; 3.6 ≤ VI or VO ≤ 5.5V
±10
µA
2.7 ≤ VCC ≤ 3.6V; VIH = VCC – 0.6V
500
µA
∆ICC
Increase in ICC per Input
AC CHARACTERISTICS (tR = tF = 2.5ns; CL = 50pF; RL = 500Ω)
Limits
TA = –40°C to +85°C
VCC = 3.0V to 3.6V
Symbol
Parameter
VCC = 2.7V
Waveform
Min
Max
Max
Unit
tPLH
tPHL
Propagation Delay
Input to Output
1
1.5
1.5
6.0
6.0
6.5
6.5
ns
tPZH
tPZL
Output Enable Time to
High and Low Level
2
1.5
1.5
7.0
7.0
8.0
8.0
ns
tPHZ
tPLZ
Output Disable Time From
High and Low Level
2
1.5
1.5
6.0
6.0
7.0
7.0
ns
tOSHL
tOSLH
Output–to–Output Skew
(Note 3.)
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C
Symbol
Characteristic
Condition
Min
Typ
Max
Unit
VOLP
Dynamic LOW Peak Voltage (Note 4.)
VCC = 3.3V, CL = 50pF, VIH = 3.3V, VIL = 0V
0.8
V
VOLV
Dynamic LOW Valley Voltage (Note 4.)
VCC = 3.3V, CL = 50pF, VIH = 3.3V, VIL = 0V
0.8
V
4. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Unit
CIN
Input Capacitance
VCC = 3.3V, VI = 0V or VCC
7
pF
COUT
Output Capacitance
VCC = 3.3V, VI = 0V or VCC
8
pF
CPD
Power Dissipation Capacitance
10MHz, VCC = 3.3V, VI = 0V or VCC
25
pF
LCX DATA
BR1339 — REV 3
3
MOTOROLA
MC74LCX125
2.7V
Dn
1.5V
1.5V
0V
tPLH
tPHL
VOH
1.5V
On
1.5V
VOL
WAVEFORM 1 – PROPAGATION DELAYS
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns
2.7V
1.5V
OEn
0V
tPZH
tPHZ
VCC
VOH – 0.3V
1.5V
On
≈ 0V
tPZL
tPLZ
≈ 3.0V
1.5V
On
VOL + 0.3V
GND
WAVEFORM 2 – OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns
Figure 1. AC Waveforms
VCC
PULSE
GENERATOR
R1
DUT
CL
RT
TEST
6V
OPEN
GND
RL
SWITCH
tPLH, tPHL
Open
tPZL, tPLZ
6V
Open Collector/Drain tPLH and tPHL
6V
tPZH, tPHZ
GND
CL = 50pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 500Ω or equivalent
RT = ZOUT of pulse generator (typically 50Ω)
Figure 2. Test Circuit
MOTOROLA
4
LCX DATA
BR1339 — REV 3
MC74LCX125
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A
–
14
8
–B
–
1
P7
PL
0.25 (0.010)
7
G
D
0.25 (0.010)
M
T
F
B
A
S
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
14 PL
M
R X 45°
C
SEATING
PLANE
B
M
S
MILLIMETERS
MIN
MAX
8.75
8.55
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC
0.25
0.19
0.25
0.10
7°
0°
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7°
0°
0.228 0.244
0.010 0.019
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
14
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
8
Q1
E HE
M_
L
7
1
DETAIL P
Z
D
e
VIEW P
A
c
b
0.13 (0.005)
LCX DATA
BR1339 — REV 3
A1
M
0.10 (0.004)
5
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--1.42
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.056
MOTOROLA
MC74LCX125
OUTLINE DIMENSIONS
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940A–03
ISSUE B
14X
K REF
0.12 (0.005)
T U
M
S
V
S
NOTES:
6 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
7 CONTROLLING DIMENSION: MILLIMETER.
8 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
9 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
0.25 (0.010)
N
14
L/2
8
M
N
B
L
F
PIN 1
IDENT
1
7
DETAIL E
–U–
A
–V–
0.20 (0.008)
M
T U
ÉÉÉÉ
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
K
J
S
J1
K1
SECTION N–N
0.076 (0.003)
–T–
–W–
C
SEATING
PLANE
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
D
G
DETAIL E
H
MILLIMETERS
MIN
MAX
6.07
6.33
5.20
5.38
1.73
1.99
0.05
0.21
0.63
0.95
0.65 BSC
1.08
1.22
0.09
0.20
0.09
0.16
0.25
0.38
0.25
0.33
7.65
7.90
0_
8_
INCHES
MIN
MAX
0.238
0.249
0.205
0.212
0.068
0.078
0.002
0.008
0.024
0.037
0.026 BSC
0.042
0.048
0.003
0.008
0.003
0.006
0.010
0.015
0.010
0.013
0.301
0.311
0_
8_
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
–U–
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
A
–V–
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
SECTION N–N
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
MOTOROLA
D
G
H
DETAIL E
6
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
LCX DATA
BR1339 — REV 3
MC74LCX125
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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Opportunity/Affirmative Action Employer.
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◊
LCX DATA
BR1339 — REV 3
7
MC74LCX125/D
MOTOROLA
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