FXMHD103 — HDMI Voltage Translator Description Features CEC, DDC, and HPD Level Shifting without a Direction Pin Host Port Voltage Supply (VCCA): 1.6V – 3.6V Supports DDC (I2C) Clock Stretching Back Drive Protection Operating Temperature Range: -40°C to 85°C HDMI Port Voltage Supply (VCCC): 4.8V – 5.3V Long HDMI Cable Support with Integrated DDC (I2C) Edge Rate Accelerators Pin Out Tailored for PCB Trace Routing to HDMI Type D Connectors Non-Preferential Power-Up/Down Sequencing between VCCA and VCCC ESD Protection: - 8kV HBM (per JESD22-A114) - 2kV CDM (per JESD22-C101) There are three non-inverting bi-directional voltage translation circuits for the DDC serial data (SDA)/clock (SCL) lines and CEC lines. Each line has a common power rail (VCCA) on the host side from 1.6V to 3.6V. On the HDMI connector side, the SCL_C and SDA_C pins each have an internal 1.75KΩ pull-up connected to the HDMI 5V rail, VCCC. The SCL and SDA pins exceed the HDMI specification for driving up to 800pF loads. The CEC_C pin has an internal 27KΩ pull-up to an internal 3.3V supply (VREG). The HPD_C path is uni-directional. The direction is from the HDMI connector port to the host port. HPD_H references VCCA, and HPD_C references VCCC. HPD_C offers hysteresis to avoid false detection due to bouncing while inserting the HDMI plug. The FXMHD103 device can be powered down if the OE pin is LOW. If OE is HIGH, the HPD path is enabled. If an HDMI sink asserts the HPD_C pin HIGH, the DDC and CEC paths are enabled. OE references VCCA. Applications The FXMHD103 is a reduced-pin-count, low-power, High-Definition Multimedia Interface (HDMI), voltage translator for the Data Display Channel (DDC), Consumer Electronic Control (CEC), and Hot Plug Detect (HPD) control lines. Smart Phones Back drive protection is provided on pins facing the HDMI connector. Multimedia Phones Digital Camcorders Digital Still Cameras Portable Game Consoles Notebooks MP3 Players PC and Consumer Electronics Ordering Information Part Number Top Mark Operating Temperature Range FXMHD103UMX BZ -40°C to 85°C © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 Package 12-Terminal, Quad µMLP, 1.8mm x 1.8mm Package Packing Method 5000 Units on Tape and Reel www.fairchildsemi.com FXMHD103 — HDMI Voltage Translator July 2012 Host Port: HDMI Port: VBAT Regulated 5.0V (55mA) PMIC VCCA (1.6V – 3.6V) FXMHD103 HDMI Translator Regulated 5.0V (55mA) TVS Qty: 1 Host VCC Ref erence 1.6V – 3.6V HDMI Connect or Type C/D 3.3V VREG HDMI Host Controller DDC (I2C) Translation DDC/CEC/HPD HPD Translation CEC Translation DDC/CEC/HPD TVS Qty: 4 Enable Translation VREF Control TMDS TVS Qty: 8 Figure 1. System Block Diagram Figure 2. Application Drawing Note: 1. The external TVS devices depicted in the Application Drawing (Figure 2) provide system-level IEC61000-4-2, Level 4 ESD protection to the mobile device system at the HDMI connector. The FXMHD103 provides devicelevel ESD protection defined in the ESD section of the Absolute Maximum Ratings table. © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 www.fairchildsemi.com 2 FXMHD103 — HDMI Voltage Translator Block Diagrams FXMHD103 — HDMI Voltage Translator Block Diagrams (Continued) Figure 3. Circuit Block Diagram Table 1. Truth Table (VCCA & VCCC Valid) OE HPD_C OE Internal VREG HPD_H SCL_C SDA_C CEC_C LOW Don’t Care LOW Disabled 3-State 3-State 3-State 3-State HIGH LOW LOW Disabled Enabled 3-State 3-State 3-State(2) HIGH HIGH HIGH Enabled Enabled Enabled Enabled Enabled (2) (2) Note: 2. SCL_C and SDA_C internally pulled up to VCCC. CEC_C is 0V because VREG is disabled. This is required for HDMI compliance testing. The VOUTDIS parameter captures this requirement. © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 www.fairchildsemi.com 3 FXMHD103 — HDMI Voltage Translator CEC_H VCCA HPD_H HPD_C Pin Configuration 12 11 10 9 1 SCL_H 4 5 VCCC CEC_C 7 SCL_C 6 SDA_C 3 GND 2 OE SDA_H 8 Figure 4. Pin Assignments (Top View) Pin Definitions Pin # Signal Name 1 SCL_H Host-side (DDC) SCL bi-directional I2C pin; referenced to VCCA. 2 SDA_H Host-side (DDC) SDA bi-directional I2C pin; referenced to VCCA. 3 OE 4 GND 5 VCCC HDMI port supply: 5V VCC reference for HPD_C, SCL_C, SDA_C, and VREG input. 6 SDA_C Connector-side (DDC) SDA bi-directional I2C pin; referenced to VCCC. 7 SCL_C Connector-side (DDC) SCL bi-directional I C pin; referenced to VCCC. 8 CEC_C Connector-side (CEC) bi-directional pin; referenced to internal 3.3V voltage regulator (VREG). RPU decoupled from “3.3V Internal” if OE=LOW. 9 HPD_C Connector-side HPD, input for the “hot plug” detect. 10 HPD_H Host-side HPD; output for the hot plug detect. This pin references VCCA and indicates to the HDMI controller (HDMI source) when there is an HDMI sink connected to the FXMHD103. 11 VCCA 12 CEC_H © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 Description Output enable: LOW=DDC, CEC, & HPD paths disabled; HIGH=DDC, CEC, & HPD paths enabled. Device GND 2 Host-side power supply, 1.6V – 3.6V. Host-side CEC, bi-directional pin; referenced to VCCA. RPU decoupled from VCCA if OE=LOW. www.fairchildsemi.com 4 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter VCC Supply Voltage Range VIN(3) Input Voltage Range VO(3) Output Voltage Condition Min. Max. Unit VCCA, VCCC -0.5 6.5 V SCL_H, SDA_H, CEC_H, OE -0.5 6.5 SCL_C, SDA_C, CEC_C, HPD_C -0.5 6.5 SCL_H, SDA_H, CEC_H, HPD_H -0.5 6.5 SCL_C, SDA_C, CEC_C -0.5 6.5 V V IIK Input Clamp Current VIN < 0V IOK Output Clamp Current VO < 0V TJ Junction Temperature -40 Storage Temperature Range -65 +150 °C TSTG ESD Electrostatic Discharge Capability -50 mA -50 mA +150 °C Human Body Model, JESD22-A114-B All Pins 8 Charged Device Model, JESD22-C101 All Pins 2 Air Gap 16 Contact 9 IEC 61000-4-2 kV Note: 3. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Unless otherwise noted, values are across the recommended operating free-air temperature range. Symbol Parameter Condition VCCA Supply Voltage VCCA VCCC Supply Voltage VCCC Host Port VIN Input Voltages Min. Max. Unit 1.6 3.6 V V 4.8 5.3 SCL_H, SDA_H, CEC_H 0 VCCA OE 0 VCCA SCL_C, SDA_C V 0 VCCC Connector Port CEC_C 0 3.3V (Internal) HPD_C 0 VCCC TA Ambient Temperature -40 +85 °C TJ Junction Temperature -40 +125 °C © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 www.fairchildsemi.com 5 FXMHD103 — HDMI Voltage Translator Absolute Maximum Ratings Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with fourlayer 2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ (maximum) at a given ambient temperature. Symbol Parameter ΘJA Junction-to-Ambient Thermal Resistance Typ. Unit 320 °C/W Max. Unit DC Electrical Characteristics (ICC) Unless otherwise specified, TA=-40 to 85°C. Symbol Parameter Condition Min. Typ. ICCPD1 Power Down 1 VCCA=0V, or VCCC=0V, All Other Pins=Don’t Care 1 μA ICCPD2 Power Down 2 OE=LOW, VCCA and VCCC Valid, All Other Pins=Don’t Care 1 µA ICCHPD Active HPD Only OE=HIGH, VCCA and VCCC Valid, SCL_H, SDA_H and CEC_H=HIGH, HPD_C=0V 1.5 µA VCCA and VCCC Valid, SCL_H, SDA_H and CEC_H=HIGH, HPD_C=VCCC, OE=HIGH 5 µA VCCA and VCCC Valid, SCL_H, SDA_H and CEC_H=HIGH, HPD_C=VCCC, OE=HIGH 5 µA ICCA Active HDMI Link ICCC Back Drive Current Unless otherwise specified, TA=-40 to 85°C. Symbol Parameter Condition VCCA VCCC Typ. Max. Unit IbackCEC Current Through CEC_C CEC_C=0V - 5V 0V 0V 0.1 1.8 µA IbackDDC Current Through SDA_C and SCL_C SDA_C and SCL_C=0V – 5V 0V 0V 0.1 5.0 µA IbackVCCC Current Through VCCC VCCC=0V – 5V 0V NA 0.1 5.0 µA IbackHPD Current Through HPD_C HPD_C=0V – 5V 0V 0V 0.1 5.0 µA © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 www.fairchildsemi.com 6 FXMHD103 — HDMI Voltage Translator Thermal Properties Unless otherwise specified, TA=-40 to 85°C. Symbol Parameter Condition Host Side VIH Min. 1.6V to 3.6V VCCA 0.4 1.6V to 3.6V VCCC 0.4 High Level input Voltage Connector Side VIL VCCA Low Level Input Voltage Typ. Max. V Host Side <2V 0.2 x VCCA Host Side >2V 0.4 Connector Side Unit 1.6V to 3.6V V 0.4 Host Side: IOH=-10µA 1.6V to 3.6V VCCA x 0.8 Connector Side: IOH=-10µA 1.6V to 3.6V VCCC 0.3 VOL1 IOL=3mA, VIL=0V; Both Directions 1.6V to 3.6V 0.05 V VOL2 IOL=3mA, VIL=0.25V; Both Directions 1.6V to 3.6V 0.30 V IOL=3mA, VIL=0.3V; Both Directions 1.6V to 3.6V 0.35 V VOL4 IOL=3mA, VIL=0.4V; Both Directions 1.6V to 3.6V 0.45 V VOL5 IOL=3mA, VIL=0.6V C H Direction Only 1.6V to 3.6V 0.65 V VOH VOL3 RPU High Level Output Voltage Low Level Output Voltage Internal Pull-up Transient Boosted Pull-up IPULLUPAC Current (Edge Rate Accelerator) SCL_H, Internal Pull-up Connected to SDA_H, VCCA Rail 10.00 SCL_C, Internal Pull-up Connected to SDA_C, VCCC 1.75 SCL_C, Internal Pull-up Connected to SDA_C, VCCC 15 kΩ mA Host Port VCCA=0V, VI or VO=0 to 3.6V 0V ±5 Connector Port VCCC=0V, VI or VO=0 to 5.3V 0V to 3.6V ±5 Connector Port VO=VCCO or GND 1.6V to 3.6V ±5 Host Port VI=VCCI or GND 1.6V to 3.6V ±5 IOFF IOZ V © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 µA µA www.fairchildsemi.com 7 FXMHD103 — HDMI Voltage Translator Voltage Level Shifter: SCL, SDA Lines (Host/Connector Ports) Unless otherwise specified, TA=-40 to 85°C. Symbol VIH VIL Parameter Condition High Level input Voltage Low Level Input Voltage VCCA Min. Host Side 1.6V to 3.6V VCCA 0.4 Host Side <2V 0.2 x VCCA Host Side >2V 0.4 1.6V to 3.6V 0.6 Connector Side VOH High Level Output Voltage Host Side, IOH=-10µA 1.6V – 3.6V VCCA x 0.8 VOH High Level Output Voltage Connector Side, IOH=-10µA 1.6V – 3.6V 2.75 IOL=3mA, VIL=0V VOL1 VOL2 VOL3 VOL4 Low Level Output Voltage Host & Connector Sides VOL5 VOUTDIS RPU Output Voltage when Disabled Internal Pull-up Max. Unit VCCA V V V 3.10 V 1.6V to 3.6V 0.05 V IOL=3mA, VIL=0.25V 1.6V to 3.6V 0.30 V IOL=3mA, VIL=0.3V 1.6V to 3.6V 0.35 V IOL=3mA, VIL=0.4V 1.6V to 3.6V 0.45 V IOL=3mA, VIL=0.6V 1.6V to 3.6V 0.65 V CEC_C: HPD_C=LOW, OE=HIGH, VCCC=4.8V – 5.3V 1.6V to 3.6V 0.3 V CEC_H, Internal Pull-up Connected to VCCA Rail 10 CEC_C, Internal Pull-up Connected to Internal 3.3V Rail 27 kΩ H Port VCCA=0V, VI or VO=0 to 3.6V 0V ±5.0 C Port VCCC=0V, VI or VO=0 to 5.3V 0V to 3.6V ±1.8 C Port VO=VCCO or GND 1.6V to 3.6V ±5.0 H Port VI=VCCI or GND 1.6V to 3.6V ±5.0 IOFF IOZ Typ. µA µA Voltage Level Shifter: HPD Lines (Host/Connector Ports) TA=-40 to 85°C unless otherwise specified. Symbol Parameter Condition VCCA Min. 2 VIH High Level Input Voltage 1.6V to 3.6V VIL Low Level Input Voltage 1.6V to 3.6V VOH High Level Output Voltage IOH=-3mA 1.6V to 3.6V VOL Low Level Output Voltage IOL=3mA 1.6V to 3.6V VHYS HPD_C (VT+ - VT-) RPD Internal Pull-Down HPD_C, Internal Pull-down Connected to Ground, VCCA and VCCC Powered up IOFF Host Port VO=VCCO or GND IOZ Host Port VI=VCCI or GND © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 1.6V to 3.6V Typ. Max. Unit V 0.8 0.7 x VCCA V V 0.3 V 200 mV 100 KΩ 0V ±5 µA 3.6V ±5 µA www.fairchildsemi.com 8 FXMHD103 — HDMI Voltage Translator Voltage Level Shifter: CEC Lines (Host/Connector Ports) Unless otherwise specified, TA=-40 to 85°C. Typical values TA= 25°C. Voltage Level Shifter: SCL, SDA Lines (Host and Connector Ports); VCCA=1.8V Symbol Parameter Propagation Delay tPLH tr fMAX Condition Min. H to C tPHL tf Pins C to H H to C H Port C Port Fall time C Port H Port Rise Time H Port C Port Rise Time C Port Maximum Switching Frequency Max. Unit 100 5 DDC Channels Enabled ns 25 C to H H Port Fall Time Typ. 5 2 DDC Channels Enabled 70% -30% 2 DDC Channels Enabled 30% -70% DDC Channels Enabled ns 80 ns 50 400 kHZ Voltage Level Shifter: CEC Line (Host and Connector Ports); VCCA=1.8V Symbol Parameter tPHL Propagation Delay tPLH tf tr Pins Condition Min. Typ. H to C 100 C to H 5 H to C CEC Channels Enabled H Port C Port Fall time C Port H Port Rise Time H Port C Port Rise Time C Port ns 5 CEC Channels Enabled 90% - 10% CEC Channels Enabled 10% - 90% Unit ns 25 C to H H Port Fall Time Max. 10 50000 200 50000 5 400 ns 0.2 250 µs Typ. Max. ns Voltage Level Shifter: HPD Line (Host and Connector Ports); VCCA=1.8V Symbol tPHL tPLH Parameter Propagation Delay Pins C to H C to H Condition Min. 10 HPD Channel Enabled Unit ns 5 tf H Port Fall Time H Port HPD Channel Enabled 90% - 10% 1 ns tr H Port Rise Time H Port HPD Channel Enabled 10% - 90% 3 ns I/O Capacitance TA= 25°C unless otherwise specified. Symbol CI CIO Parameter Condition VCCA & VCCC Min. Typ. Max. Unit Control Inputs 0V 2 pF DDC & CEC on Host Port 0V 5 pF DDC on Connector Port LCR: Vbias=2.5V; AC Input=3.5Vpp; f=100kHZ 0V 10 16.5 pF CEC on Connector Port LCR: Vbias=1.65V; AC Input=2.5Vpp; f=100kHZ 0V 10 16.5 pF Note: 4. AC Characteristics are guaranteed by Design and Characterization, not production tested. © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 www.fairchildsemi.com 9 FXMHD103 — HDMI Voltage Translator AC Electrical Characteristics(4) VCCI VCCO DUT IN OUT Input CL 1MΩ Figure 5. Device Under Test Setup Table 2. Symbol CL AC Load Parameter Condition VCCA Min. Typ. Max. Bus Load Capacitance (Connector-Side) CEC 1.6V to 3.6V 1300 Bus Load Capacitance (Connector-Side) DDC & HPD 1.6V to 3.6V 800 Bus Load Capacitance (Host-Side) All Pins 1.6V to 3.6V 15 Unit pF Notes: 5. RT termination resistance should be equal to ZOUT of the pulse generator. 6. CL includes probe and jig capacitance. 7. All input pulses supplied by generators have the following characteristics: PRR < 10MHz, ZO=50Ω, slew rate > 1V/ns. 8. The outputs are measured one at a time, with one transition per measurement. 9. tPLH and tPHL are the same as tPD. © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 www.fairchildsemi.com 10 FXMHD103 — HDMI Voltage Translator AC Parameter Measurement Information(5,6,7,8,9) DATA IN VCCI Vmi tpxx GND Vmo DATA OUT VCCO VCCA Vmi DATA OUT Figure 8. VOL 3-STATE Output Low Enable Time Symbol VCC Vmi VCCI / 2 Vx VOL VY Figure 7. GND tPLZ GND tPZL Waveform for Inverting and Non-Inverting Functions OUTPUT CONTROL VCCA Vmi tpxx DATA OUT Figure 6. OUTPUT CONTROL Vmo VCCO / 2 VX 0.5 x VCCO VY 0.1 x VCCO 3-STATE Output High Enable Time Figure 9. Active Output Rise Time Figure 10. Active Output Fall Time VCCO DATA OUTPUT Vmo Vmo GND tperiod DATA IN VCCI / 2 VCCI / 2 tskew VCCI VCCO DATA OUTPUT GND F-toggle rate, f = 1 / tperiod tskew Vmo Vmo GND tskew = (tpHLmax – tpHLmin) or (tpLHmax – tpLHmin) Figure 11. F-Toggle Rate Figure 12. Output Skew Time Notes: 10. Input tR=tF=2.0ns, 10% to 90% at VIN=1.65V to 1.95V; Input tR=tF=2.0ns, 10% to 90% at VIN=2.3 to 2.7V; Input tR=tF=2.5ns, 10% to 90%, at VIN=3.0V to 3.6V only; Input tR=tF=2.5ns, 10% to 90%, at VIN=4.5V to 5.5 only. 11. VCCI=VCCA for control pin OE or Vmi=(VCCA / 2). 12. DDC Rise Times 30% - 70%, CEC & HPD Rise Times 10% - 90% 13. DDC Fall Times 30% - 70%, CEC & HPD Fall Times 10% - 90% 14. VCCI is the VCC associated with the input side. VCCO is the VCC associated with the output side. © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 www.fairchildsemi.com 11 FXMHD103 — HDMI Voltage Translator Timing Diagrams(10,11,12,13,14) Power Down Backdrive Protection The FXMHD103 can be powered down if either VCCA or VCCC equals 0V, or if OE is LOW. Backdrive-current protection is available on all FXMHD103 signals interfacing with the HDMI connector, including VCCC, SCL_C, SDA_C, CEC_C, and HPD_C. If the FXMHD103 is powered down, VCCA=0V or VCCC=0V and the HDMI sink forces 0V – 5V onto any of the HDMI connector-facing pins (VCCC, SCL_C, SDA_C, CEC_C & HPD_C). The maximum current flow from the FXMHD103 is only 5µA, with the exception of 1.8µA (maximum) on CEC_C. “Hot Plug” Detect Operation After VCCA and VCCC have powered up to valid levels, and OE enabled (HIGH) the HPD path is enabled. The internal 3.3V voltage regulator and the CEC & DDC blocks are disabled due to the internal weak pull-down resistor (100kΩ to GND) on HPD_C. When the HDMI sink recognizes a valid 5V signal on the HDMI connector, to inform the HDMI source there is a valid HDMI sink connected to the HDMI connector; the sink typically ties the HPD_C signal to the HDMI 5V supply through a 1KΩ resistor. A HIGH on HPD_C, in turn, enables the internal voltage regulator, as well as the DDC & CEC paths. The HDMI link is active between the HDMI source and the HDMI sink. DDC Channel Description The HDMI specification implements the Video Electronics Standards Association (VESA) Display Data Channel (DDC) for communication between a single HDMI source and a single HDMI sink. The DDC is used by the HDMI source to read the HDMI sink’s Enhanced Extended Display Identification Data (E-EDID) to discover the sink’s configuration or capabilities. DDC must meet the I2C specification, version 2.1, for Standard Mode devices. Because the HDMI application is meant for high-definition Transition-Minimized Differential Signaling (TMDS) video transport across a cable, the HDMI specification requires the DDC signals (SCL & SDA) be able to drive a minimum capacitance of 800pF (source 50pF + cable assembly 700pF + sink 50pF). The I2C specification requires a minimum of 400pF capacitance. When HPD_C is LOW, the respective resistor pullups (RPUs) on the host and connector sides of the DDC paths remain coupled to their respective voltage references. Likewise, when HPD_C is LOW, the RPUs on the host and connector sides of the CEC path remain coupled to their respective voltage references. Since HPD_C disables VREG and VREG is the CEC_C voltage reference, CEC_C is held to 0V by a weak (50nA) current source when HPD_C is LOW. This is captured by the VOUTDIS parameter. Figure 13. © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 DDC Channel Block Diagram, 1 of 2 Channels (SDA & SCL) www.fairchildsemi.com 12 FXMHD103 — HDMI Voltage Translator Application Information The FXMHD103 DDC channel is designed for highperformance I2C level shifting. Figure 13 shows that each bi-directional channel contains an Npassgate and two dynamic drivers. This hybrid architecture is highly 2 beneficial in an I C application with large capacitive loads and where auto-direction is necessary. For example, during the following I2C protocol events the bus direction needs to change from “Source-to-Sink” to “Sink-to-Source” without the occurrence of an edge: Clock Stretching Slave’s ACK Bit (9th bit=0) following a Master’s Write Bit (8th bit=0) Clock Synchronization and Multi Master Arbitration 2 If there is an I C translator between the source and sink 2 in these examples, the I C translator must change direction when both A and C ports are LOW. The Npassgate can accomplish this efficiently because, when both A and C ports are LOW, the Npassgate acts as a low resistive short between the (A and C) ports. Driving a Capacitive Load The FXMHD103 dynamic drivers have enough current sourcing capability to drive an 800pF capacitive bus. The Figure 14 scope shot is of an FXMHD103 driving a lumped load of 600pF. Notice the (30% - 70%) rise time is only 112ns (RPU=5KΩ). This is well below the maximum rise time of 1000ns in Standard Mode (100KHz) or 300ns in Fast Mode (400KHz). VOL vs. VIL & IOL The I2C specification mandates a maximum VIL (IOL of 2 3mA) of VCC x 0.3 for an I C receiver and a maximum 2 VOL of 0.4V for an I C transmitter. If there is an HDMI 2 source on the A port of an I C translator with a VCC of 2 1.8V and an HDMI sink on the I C translator C port with a VCC of 5.0V, the maximum VIL of the source is (1.6V x 0.3) 480mV. Meanwhile, the sink could transmit a valid logic LOW of 0.4V to the source. 80mV is not very much margin between the maximum transmitted VOL of 400mV (HDMI sink) to the maximum received VIL of 480mV (HDMI source). This appears to be an oversight in the I2C specification, but there is an explanation. The 2 I C specification assumes transmitters and receivers share the same VCC. The I2C specification does call out separate VOL requirements vs. VCC conditions where VOL1=0.4V when VCC is > 2.0V and VOL3=0.2 x VCC, when VCC is < 2.0V. When there is VCC alignment between I2C transmitters and receivers, the I2C specification provides adequate VIL vs. VOL margins. However, when you have a transmitter operating at 5V and a receiver operating at 1.6V through a translator or level shifter, the VOL vs. VIL margin gets very tight, as in the above example. Therefore, the voltage drop across 2 the I C translator must be as low as possible. Due to the I2C open-drain topology, I2C drivers are not push/pull devices. Logic LOWs are “pulled down” (Isink), while logic HIGHs are “let go” (3-state). For example, when the source lets go of SCL (SCL always comes from the source), the rise time of SCL is largely determined by the RC time constant, where R=RPU and C=the bus capacitance. If the FXMHD103 is attached to the source [on the A port] and there is a source on the C port, the Npassgate acts as a low-resistive short between both ports until either of the port’s VCC/2 thresholds is reached. After the RC time constant has reached the VCC/2 threshold of either port, the port’s edge detector triggers both dynamic drivers to drive their respective ports in the LOW-to-HIGH (LH) direction, accelerating the rising edge. The resulting rise time resembles the scope shot in Figure 14. Effectively, two distinct slew rates appear in rise time. The first slew rate (slower) is the RC time constant of the bus. The second slew rate (much faster) is the dynamic driver accelerating the edge. In general, if the I2C translator’s channel resistance is too high, the voltage drop across the translator could present a VIL to a receiver greater than the receiver’s maximum VIL. To complicate matters, the I2C specification states that 6mA of IOL is recommended for bus capacitances approaching 400pF in Fast Mode. 2 More IOL increases the voltage drop across the I C translator. The I2C application benefits when I2C translators exhibit low VOL performance. Table 3 depicts the FXMHD103 targeted VOL performance vs. VIL/IOL when the direction is from C side to A side, VCCC=5.0V and VCCA=1.6V. Figure 14. Rise Time Driving 600pF Load © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 www.fairchildsemi.com 13 FXMHD103 — HDMI Voltage Translator If both the A and C ports of the translator are HIGH, a high-impedance path exists between the A and C ports because both the Npassgates are turned off. If a source or sink device decides to pull SCL or SDA LOW, that device’s driver pulls down (Isink) SCL or SDA until the edge reaches the A or C port VCC/2 threshold. When either the A or C port threshold is reached, the port’s edge detector triggers both dynamic drivers to drive their respective ports in the HIGH-to-LOW (HL) direction, accelerating the falling edge. Edge Rate Accelerators DDC Voltage Drop (VOL vs. VIL/IOL): Port C Port A Direction, VCCA=1.6V VIL (mV) IOL (mA) VOL Max. (mV) Voltage Drop Max. (mV) Calculated Max. RON (Ω) 0 6 50 50 8.33 250 6 300 50 8.33 300 6 350 50 8.33 400 6 450 50 8.33 600 6 650 50 8.33 PCB Layout Recommendation Figure 15. PCB Routing Example (Molex HDMI Type-D Connector) © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 www.fairchildsemi.com 14 FXMHD103 — HDMI Voltage Translator Table 3. FXMHD103 — HDMI Voltage Translator Physical Dimensions 1.80 0.10 C A (11X) 2.10 B 0.563 0.588 2X 1 1.80 0.40 2.10 PIN#1 IDENT TOP VIEW 0.55 MAX. 0.10 C 0.10 C (12X) 0.20 2X RECOMMENDED LAND PATTERN 0.152 0.45 0.35 0.08 C 0.05 0.00 0.10 SEATING C PLANE SIDE VIEW 0.10 0.10 DETAIL A SCALE : 2X NOTES: 0.35 (11X) 0.45 3 6 0.40 DETAIL A A. PACKAGE DOES NOT FULLY CONFORM TO JEDEC STANDARD. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 1 PIN#1 IDENT 12 9 BOTTOM VIEW 0.25 0.15 (12X) 0.10 C A B 0.05 C D. LAND PATTERN RECOMMENDATION IS BASED ON FSC DESIGN ONLY. E. DRAWING FILENAME: MKT-UMLP12Arev4. PACKAGE EDGE LEAD OPTION 1 SCALE : 2X LEAD OPTION 2 SCALE : 2X Figure 16. 12-Lead, UMLP, Quad JEDEC MO-252, 1.8mm x 1.8mm, 0.4mm Pitch Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 www.fairchildsemi.com 15 FXMHD103 — HDMI Voltage Translator © 2012 Fairchild Semiconductor Corporation FXMHD103 • Rev. 1.0.2 www.fairchildsemi.com 16