BZX584B4V7 ~ BZX584B20 Taiwan Semiconductor Small Signal Product 2% Zener Voltage Tolerance SMD Zener Diode FEATURES - Wide zener voltage range selection: 4.7V to 20V - Surface Mount Device type - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code SOD-523F MECHANICAL DATA - Case: SOD-523F small outline plastic package - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed: 260°C/10s - Polarity: Indicated by cathode band - Weight: 1.3mg ± 20 % MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER Power Dissipation Forward Voltage Thermal Resistance (Junction to Ambient) IF = 10 mA (Note 1) Junction Temperature Junction and Storage Temperature Range SYMBOL VALUE UNIT PD VF RθJA 150 0.9 833 mW V TJ 150 o TSTG - 55 to + 150 o o C/W C C Note1: Valid provided that electrodes are kept at ambient temperature Zener I vs. V Characteristics VBR : Voltage at IZK IZK : Test current for voltage VBR ZZK : Dynamic impedance at IZK IZT : Test current for voltage VZ VZ : Voltage at current I ZZT : Dynamic impedance at IZT IZM : Maximum steady state current : Voltage at IZM VZM Document Number: DS_S1403006 Version: A14 BZX584B4V7 ~ BZX584B20 Taiwan Semiconductor Small Signal Product Electrical Characteristics (Ratings at TA=25oC ambient temperature unless otherwise specified) Maximum Zener Voltage Range Part Number Zener Impedance Maximum Typical Reverse Temperature Currrent Coefficent Marking VZ @ IZT (V) IZT ZZT @ IZK ZZK @ I R @ VR VR (mA) IZT (Ω) (mA) IZK (Ω) (µA) (V) Tc @ IZT o (mV/ C) BZX584B4V7 2Z1 Min 4.61 Nom 4.7 Max 4.79 5 80 1 500 3 2.0 Min -3.5 Max 0.2 BZX584B5V1 2Z2 5.00 5.1 5.20 5 60 1 480 2 2.0 -2.7 1.2 BZX584B5V6 2Z3 5.49 5.6 5.71 5 40 1 400 1 2.0 -2.0 2.5 BZX584B6V2 2Z4 6.08 6.2 6.32 5 10 1 150 3 4.0 0.4 3.7 BZX584B6V8 2Z5 6.66 6.8 6.94 5 15 1 80 2 4.0 1.2 4.5 BZX584B7V5 2Z6 7.35 7.5 7.65 5 15 1 80 1 5.0 2.5 5.3 BZX584B8V2 2Z7 8.04 8.2 8.36 5 15 1 80 0.7 5.0 3.2 6.2 BZX584B9V1 2Z8 8.92 9.1 9.28 5 15 1 100 0.5 6.0 3.8 7.0 BZX584B10 2Z9 9.80 10 10.20 5 20 1 150 0.2 7.0 4.5 8.0 BZX584B11 2Y1 10.78 11 11.22 5 20 1 150 0.1 8.0 5.4 9.0 BZX584B12 2Y2 11.76 12 12.24 5 25 1 150 0.1 8.0 6.0 10.0 BZX584B13 2Y3 12.74 13 13.26 5 30 1 170 0.1 8.0 7.0 11.0 BZX584B15 2Y4 14.70 15 15.30 5 30 1 200 0.1 10.5 9.2 13.0 BZX584B16 2Y5 15.68 16 16.32 5 40 1 200 0.1 11.2 10.4 14.0 BZX584B18 2Y6 17.64 18 18.36 5 45 1 225 0.1 12.6 12.4 16.0 BZX584B20 2Y7 19.60 20 20.40 5 55 1 225 0.1 14.0 14.4 18.0 Document Number: DS_S1403006 Version: A14 BZX584B4V7 ~ BZX584B20 Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) Fig. 2 Reverse Current vs Reverse Voltage Fig. 2 Reverse Current vs Reverse Voltage Fig.1 Typical Forward Characteristics 100 100 90 90 80 80 70 70 60 60 50 50 40 40 30 30 20 20 10 10 0 0 10 Reverse ReverseCurrent Current(mA) (mA) Forward Current (mA) 100 Ta=100°C Ta=25°C 1 0.1 200 300 400 500 600 700 800 900 1000 Ta=25°C Ta=25°C Ta=100°C Ta=100°C 0 0 2 2 4 4 Forward Voltage (mV) 8 10 12 14 16 18 20 8 10 12 14 16 18 20 Reverse Voltage (V) Reverse Volatge (V) Fig. 4 Typical Capacitance Characteristics Fig. 3 Admissible Power Dissipation Curve 50 Capacitance Between Terminals (pF) 200 Power Dissipation (mW) 6 6 150 100 50 0 0 25 50 75 100 Ambient Temperature (°C) Document Number: DS_S1403006 125 150 40 30 20 10 0 0 2 4 6 8 Reverse Voltage (V) 10 12 14 Version: A14 BZX584B4V7 ~ BZX584B20 Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. MANUFACTURE CODE BZX584Bxxx (Note1) PACKING CODE (Note 2) RS GREEN COMPOUND G PACKAGE PACKING SOD-523F 3K / 7" Reel Note 1: "xxx" is Device Code from "4V7" through "20". Note 2: Manufacture special control, if empty means no special control requirement. EXAMPLE PREFERRED P/N PART NO. BZX584B4V7 RSG BZX584B4V7 MANUFACTURE BZX584B4V7-M0 RSG BZX584B4V7 Document Number: DS_S1403006 CODE M0 PACKING CODE GREEN COMPOUND CODE DESCRIPTION RS G Green compound RS G Green compound Version: A14 BZX584B4V7 ~ BZX584B20 Taiwan Semiconductor Small Signal Product PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) Min Max Min Max A 0.70 0.90 0.028 0.035 B 1.50 1.70 0.059 0.067 C 0.25 0.40 0.010 0.016 D 1.10 1.30 0.043 0.051 E 0.50 0.77 0.020 0.030 F 0.07 0.20 0.003 0.008 SUGGESTED PAD LAYOUT DIM. Unit (inch) Typ. Typ. 0.60 0.024 X1 2.30 0.091 Y 0.80 0.031 X Document Number: DS_S1403006 Unit (mm) Version: A14 BZX584B4V7 ~ BZX584B20 Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1403006 Version: A14