TECHNICAL DATA IN74ACT163 Presettable Counters High-Speed Silicon-Gate CMOS The IN74ACT163A is identical in pinout to the LS/ALS163 HC/HCT163. The IN74ACT163 may be used as a level converter for interfacing TTL or NMOS outputs to High Speed Cmos Inputs. The IN74ACT163A is programmable 4-bit synchronous counter that feature parallel Load, synchronous Reset, a Carry Output for cascading and count-enable controls. The IN74ACT163A is binary counter with synchronous Reset. • TTL/NMOS Compatible Input Levels • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 4.5 to 5.5 V • Low Input Current: 1.0 µA ; 0.1 mA @25°C • Ouptuts Source/Sink 24mA ORDERING INFORMATION IN74ACT163N Plastic IN74ACT163D SOIC TA = -40° to 85° C for all packages LOGIC DIAGRAM PIN ASSIGNMENT PIN 16 =VCC PIN 8 = GND FUNCTION TABLE Inputs Outputs Reset Load Enable P Enable T L X X H L H Clock Q0 Q1 Q2 Q3 Function X L L L L Reset to “0” X X P0 P1 P2 P3 Preset Data H X L No change No count H H L X No change No count H H H H Count up Count X X X X No change No count X=don’t care P0,P1,P2,P3 = logic level of Data inputs Ripple Carry Out = Enable T • Q0 • Q1 • Q2 • Q3 Rev. 00 IN74ACT163 MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC Supply Current, VCC and GND Pins ±50 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW -65 to +150 °C 260 °C VOUT IIN Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TJ Junction Temperature (PDIP) TA Operating Temperature, All Package Types IOH Output Current - High IOL Output Current - Low tr, tf * Parameter Input Rise and Fall Time (except Schmitt Inputs) * Min Max Unit 4.5 5.5 V 0 VCC V 140 °C +85 °C -24 mA 24 mA 10 8.0 ns/V -40 VCC =4.5 V VCC =5.5 V 0 0 VIN from 0.8 V to 2.0 V This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IN74ACT163 DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions Guaranteed Limits V 25 °C -40°C to 85°C Unit VIH Minimum HighLevel Input Voltage VOUT=0.1 V or VCC-0.1 V 4.5 5.5 2.0 2.0 2.0 2.0 V VIL Maximum Low Level Input Voltage VOUT=0.1 V or VCC-0.1 V 4.5 5.5 0.8 0.8 0.8 0.8 V VOH Minimum HighLevel Output Voltage IOUT ≤ -50 µA 4.5 5.5 4.4 5.4 4.4 5.4 V 4.5 5.5 3.86 4.86 3.76 4.76 4.5 5.5 0.1 0.1 0.1 0.1 VIN= VIH or VIL IOL=24 mA IOL=24 mA 4.5 5.5 0.36 0.36 0.44 0.44 ±0.1 ±1.0 µA * VIN=VIH or VIL IOH=-24 mA IOH=-24 mA VOL Maximum LowLevel Output Voltage IOUT ≤ 50 µA V * IIN Maximum Input Leakage Current VIN=VCC or GND 5.5 ∆ICCT Additional Max. ICC/Input VIN=VCC - 2.1 V 5.5 1.5 mA IOLD +Minimum Dynamic Output Current VOLD=1.65 V Max 5.5 75 mA IOHD +Minimum Dynamic Output Current VOHD=3.85 V Min 5.5 -75 mA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND 5.5 80 µA 8.0 * All outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time. Rev. 00 IN74ACT163 AC ELECTRICAL CHARACTERISTICS (VCC=5V±10% CL=50pF,Input tr=tf=3.0 ns) Guaranteed Limits Symbol 25 °C Parameter Min -40°C to 85°C Max Min Unit Max fmax Maximum Clock Frequency (Figure 1) 120 105 tPLH Propagation Delay Clock to Q (Figure 1) 1.5 10.0 1.5 11.0 ns tPHL Propagation Delay Clock to Q (Figure 1) 1.5 11.0 1.5 12.0 ns tPLH Propagation Delay, Clock to Ripple Cary Out (Figure 1) 2.5 11.5 2.0 13.5 ns tPHL Propagation Delay, Clock to Ripple Cary Out (Figure 1) 3.0 13.5 2.0 15.0 ns tPLH Propagation Delay, Enable T to Ripple Carry Out (Figure 2) 2.0 9.0 1.5 10.5 ns tPHL Propagation Delay, Enable T to Ripple Carry Out (Figure 2) 2.0 10.0 2.0 11.0 ns CIN Maximum Input Capacitance 4.5 MHz 4.5 pF Typical @25°C,VCC=5.0 V CPD Power Dissipation Capacitance 45 pF TIMING REQUIREMENTS (VCC=5.0V±10%, CL=50pF, Input tr=tf=3.0 ns) Guaranteed Limit Symbol Parameter +25° C -40° C to +85° C Unit tsu Minimum Setup Time, Preset Data Inputs to Clock (Figure 4) 10.0 12.0 ns th Minimum Hold Time, Clock to Preset Data Inputs (Figure 4) 0.5 0.5 ns tsu Minimum Setup Time, Reset to Clock (Figure 3) 10.0 11.5 ns th Minimum Hold Time, Clock to Reset (Figure 3) -0.5 -0.5 ns tsu Minimum Setup Time, Load to Clock (Figure 5) 8.5 10.5 ns th Minimum Hold Time, Clock to Load or Preset Data Inputs (Figure 5) -0.5 0 ns tsu Minimum Setup Time, Enable T or Enable P to Clock (Figure 5) 5.5 6.5 ns th Minimum Hold Time, Clock to Enable T or Enable P (Figure 5) 0 0.5 ns tw Minimum Pulse Width, (Load) (Figure 3) 3.5 3.5 ns tw Minimum Pulse Width, (Count) (Figure 3) 3.5 3.5 ns Rev. 00 IN74ACT163 Figure 1. Switching Waveform Figure 2. Switching Waveform Figure 3. Switching Waveform Figure 4. Switching Waveform Figure 5. Switching Waveform Rev. 00 IN74ACT163 Sequence illustrated in waveforms: 1. Reset outputs to zero. 2. Preset to binary twelve. 3. Count to thirteen, fourteen, fifteen, zero, one, and two. 4. Inhibit. Figure 8. Timing Diagram Rev. 00 IN74ACT163 EXPANDED LOGIC DIAGRAM Rev. 00 IN74ACT163 N SUFFIX PLASTIC DIP (MS - 001BB) A Dimension, mm 9 16 Symbol MIN MAX A 18.67 19.69 B 6.1 7.11 B 1 8 5.33 C F L C D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 -T- SEATING PLANE N G K M H D J 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 012AC) Dimension, mm A 16 9 H B 1 G P 8 R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 9.8 10 B 3.8 4 C 1.35 1.75 D 0.33 0.51 F 0.4 1.27 G 1.27 H 5.72 J 0° 8° K 0.1 0.25 M 0.19 0.25 P 5.8 6.2 R 0.25 0.5 Rev. 00