Material Content Data Sheet Sales Product Name BSO150N03MD G MA# MA000468352 Package PG-DSO-8-40 Issued 29. August 2013 Weight* 82.45 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 1.061 1.29 0.010 0.01 0.039 0.05 476 0.785 0.95 9523 31.880 38.67 39.68 386656 396774 0.262 0.32 0.32 3173 3173 0.235 0.28 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.29 12874 12874 119 2850 7.284 8.83 39.474 47.87 56.98 478748 569938 0.814 0.99 0.99 9870 9870 0.063 0.08 0.08 762 762 0.082 0.10 0.463 0.56 88340 991 0.66 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5618 6609 1000000