OKI ML7074-001 Voip codec Datasheet

OKI Semiconductor
ML7074-001 GA
FEDL7074-001DIGEST-01
Issue Date: Oct. 15, 2002
VoIP CODEC
GENERAL DESCRIPTION
The ML7074-001GA is a speech CODEC for VoIP. This LSI allows selection of G.729.A, G.726, or G.711
standard as a speech CODEC. The LSI is optimum for adding VoIP functions to TAs, routers, etc., since it has the
functions of an echo canceller for 32 msec delay, DTMF detection, tone detection, tone generation, etc.
FEATURES
• Single 3.3 V power supply operation (DVDD0, 1, 2, AVDD: 3.0 to 3.6 V)
• Speech CODEC:
Selectable among G.729.A (8 kbps), G726 (32 kbps), G.711 (64 kbps) µ-law, and A-law
Mutual conversion function between G.729.A (8 kbps) and G.726 (32 kbps).
• Echo canceller for 32 ms delay
• DTMF detect function
• Tone detect function: 2 systems (1650 Hz, 2100 Hz: Detect frequency can be changed.)
• Tone generate function
• FSK generate function
• Dial pulse detect function
• Dial pulse transmit function
• Internal 1-channel 16-bit timer
• Built-in FIFO buffers (640 bytes) for transferring transmit and receive data
Frame/DMA (slave) interface selectable.
• Master clock frequency: 4.096 MHz (crystal oscillation or external input)
• Hardware or software power down operation possible.
• Analog input/output type:
Two built-in input amplifiers, 10 kΩ driving
Two built-in output amplifiers, 10 kΩ driving
• Package:
64-pin plastic QFP (QFP64-P-1414-0.80-BK)
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CLKSEL
BCLK
SYNC
Serial I/F
P/S
VREF
PCMO
AMP3
AMP2
S/P
10kΩ
10kΩ
AMP1
10kΩ
AMP0
PCMI
AVREF
VFRO1
VFRO0
AIN1N
GSX1
AIN0P
LPF
BPF
G.726
G.711
Encode
r
G.726
G.711
Decoder
Codec
D/A
A/D
Linear PCM
Codec
STGAIN
Rout
Sin
OSC
PLL
XI
10kΩ
XO
LPAD
ATTs
CKGN
ATTr
AFF
+
GPAD
MCK
SYNC(8kHz)
Center
Clip
Echo Canceller
TXGAIN
Power
FSK_GEN
Rin
TONE_GEN
(TONEA/B)
Sout
RXGAIN
DPDET
DPGEN
TIMER
DP_DET
DTMF_DET
DTMF_CODE[3:0]
TONE0_DET
TONE1_DET
DP_DET
CR16-B0(GPI0)
CR17-B0(GPO0)
G.729.A
G.711
G.726
Decoder
G.729.A
G.729.A
G.711
G.726
Encoder
G.729.A
INT
Control
Register
Frame/DMA
Controller
RX
Buffer1
RX
Buffer0
TX
Buffer1
TX
Buffer0
Bus Control Unit
DTMF_DET
DTMF_CODE[3:0]
DTMF_REC
Speech Codec
TONE1_DET
TONE_DET1
TST0
TST1
TST2
TST3
GSX0
DVDD1
DVDD0
DGND0
DGND1
DVDD2
DGND2
AGND
AVDD
TONE0_DET
GPI0
GPI1
GPO0
GPO1
AIN0N
PDNB
TONE_DET0
16b
8b
INTB
D0-D15
CSB
RDB
WRB
FR0B
FR1B
ACK0B
ACK1B
A0-A7
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
BLOCK DIAGRAM
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ML7074-001 GA
33 DVDD1
34 A0
35 A1
36 A2
37 A3
38 A4
39 A5
40 A6
41 A7
42 PDNB
43 CLKSEL
44 DGND1
45 GPI0
46 GPI1
47 GPO0
48 GPO1
PIN ASSIGNMENT (TOP VIEW)
AVDD 49
32 D15
AIN0P 50
31 D14
AIN0N 51
30 D13
GSX0 52
29 D12
GSX1 53
28 D11
AIN1N 54
27 D10
AVREF 55
26 D9
VFRO0 56
25 D8
ML7074-001
VFRO1 57
24 D7
DGND0 16
WRB 15
RDB 14
CSB 13
INTB 12
9
ACK1B
FR1B 11
8
ACK0B
FR0B 10
7
17 D0
DVDD0
TST2 64
6
18 D1
SYNC
TST3 63
5
19 D2
BCLK
DVDD2 62
4
20 D3
PCMI
XO 61
3
21 D4
PCMO
XI 60
2
22 D5
TST0
DGND2 59
1
23 D6
TST1
AGND 58
64-pin plastic QFP
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PIN DESCRIPTIONS
Pin
No.
1
2
3
4
Symbol
I/O PDNB = “0”
TST1
TST0
PCMO
PCMI
I
I
O
I
BCLK
I/O
“0”
“0”
“Hi-z”
I
I
5
“L”
I
6
SYNC
I/O
“L”
7
8
9
DVDD0
ACK0B
ACK1B

I
I

I
I
10
FR0B
(DMARQ0B)
O
”H”
11
FR1B
(DMARQ1B)
O
“H”
12
INTB
O
“H”
13
14
15
16
17
18
19
20
21
22
23
24
CSB
RDB
WRB
DGND0
D0
D1
D2
D3
D4
D5
D6
D7
I
I
I

I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
I
I
I
I
25
D8
I/O
I
Description
Test control input 1: Normally input “0”.
Test control input 0: Normally input “0”.
PCM data output
PCM data input
CLKSEL = ”0”
PCM shift clock input
CLKSEL = ”1”
PCM shift clock output
CLKSEL = ”0”
PCM sync signal 8 kHz input
CLKSEL = ”1”
PCM sync signal 8 kHz output
Digital power supply
Transmit buffer DMA access acknowledge signal input
Receive buffer DMA access acknowledge signal input
FR0B: (CR11-B7 = ”0”)
Transmit buffer frame signal output
DMARQ0B: (CR11-B7 = ”1”)
Transmit buffer DMA access request signal output
FR1B: (CR11-B7 = ”0”)
Receive buffer frame signal output
DMARQ1B: (CR11-B7 = ”1”)
Receive buffer DMA access request signal output
Interrupt request output
“L” level is output for about 1.0 µsec when an interrupt is generated.
Chip select control input
Read control input
Write control input
Digital ground (0.0 V)
Data input/output
Data input/output
Data input/output
Data input/output
Data input/output
Data input/output
Data input/output
Data input/output
Data input/output
Fix to input state when using in 8-bit bus access (CR11-B5 = “1”).
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26
D9
I/O
I
27
D10
I/O
I
28
D11
I/O
I
29
D12
I/O
I
30
D13
I/O
I
31
D14
I/O
I
32
D15
I/O
I
33
34
35
36
37
38
39
40
41
DVDD1
A0
A1
A2
A3
A4
A5
A6
A7

I
I
I
I
I
I
I
I

I
I
I
I
I
I
I
I
42
PDNB
I
“0”
43
CLKSEL
I
I
44
DGND1


45
GPI0
I
I
46
GPI1
I
I
47
GPO0
O
“L”
48
GPO1
O
“L”
49
50
51
52
53
54
55
AVDD
AIN0P
AIN0N
GSX0
GSX1
AIN1N
AVREF

I
I
O
O
I
O

I
I
“Hi-z”
“Hi-z”
I
“L”
Data input/output
Fix to input state when using in 8-bit bus access (CR11-B5 = “1”).
Data input/output
Fix to input state when using in 8-bit bus access (CR11-B5 = “1”).
Data input/output
Fix to input state when using in 8-bit bus access (CR11-B5 = “1”).
Data input/output
Fix to input state when using in 8-bit bus access (CR11-B5 = “1”).
Data input/output
Fix to input state when using in 8-bit bus access (CR11-B5 = “1”).
Data input/output
Fix to input state when using in 8-bit bus access (CR11-B5 = “1”).
Data input/output
Fix to input state when using in 8-bit bus access (CR11-B5 = “1”).
Digital power supply
Address input
Address input
Address input
Address input
Address input
Address input
Address input
Address input
Power down input
“0”: Power down reset
“1”: Normal operation
SYNC and BCLK I/O control input
“0”: SYNC and BCLK become inputs
“1”: SYNC and BCLK become outputs
Digital ground (0.0 V)
General-purpose input pin 0 (5 V tolerant input)
/Secondary function: Dial pulse detect input pin
General-purpose input pin 1 (5 V tolerant input)
General-purpose output pin 0 (5 V tolerant output, can be pulled up
externally)
/Secondary function: Dial pulse transmit pin
General-purpose output pin 1 (5 V tolerant output, can be pulled up
externally)
Analog power supply
AMP0 non-inverted input
AMP0 inverted input
AMP0 output (10 kΩ driving)
AMP1 output (10 kΩ driving)
AMP1 inverted input
Analog signal ground (1.4 V)
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56
57
58
59
60
61
62
63
64
VFRO0
VFRO1
AGND
DGND2
XI
XO
DVDD2
TST3
TST2
ML7074-001 GA
O
O


I
O

I
I
“Hi-z”
“Hi-z”
I
“H”
“0”
“0”
AMP2 Output (10 kΩ driving)
AMP3 Output (10 kΩ driving)
Analog ground (0.0 V)
Digital ground (0.0 V)
4.096 MHz crystal oscillator I/F, 4.096 MHz clock input
4.096 MHz crystal oscillator I/F
Digital power supply
Test control input 3: Normally input “0”.
Test control input 2: Normally input “0”.
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ABSOLUTE MAXIMUM RATINGS
Parameter
Analog power supply
voltage
Digital power supply voltage
Analog input voltage
Digital input voltage
Storage temperature range
Symbol
Conditions
Rating
Unit
VDA

−0.3 to 5.0
V
VDD
VAIN
VDIN1
VDIN2
Tstg

Analog pins
Normal digital pins
5 V tolerant pins

−0.3 to 5.0
−0.3 to VDD + 0.3
−0.3 to VDD + 0.3
−0.3 to 6.0
−55 to +150
V
V
V
V
°C
RECOMMENDED OPERATING CONDITIONS
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Analog power supply voltage
VDA
3.0
3.3
3.6

Digital power supply voltage
VDD
3.0
3.3
3.6

Operating temperature range
Ta
60

−20

VDD+
VIH1
Digital input pins
2.0

0.3
Digital high level input voltage
VIH2
GPI0 and GPI1 pins
2.0
5.5

Digital low level input voltage
VIL
Digital pins
0.8
−0.3

Digital input rise time
tIR
Digital pins
2
20

Digital input fall time
tIF
Digital pins
2
20

Digital output load capacitance
CDL
Digital pins
50


Capacitance of bypass capacitor
Cvref Between AVREF and AGND 2.2+0.1
4.7+0.1

for AVREF
Master clock frequency
Fmck
MCK
−0.01% 4.096 +0.01%
PCM shift clock frequency
Fbclk
BCLK (at input)
64
2048

PCM sync signal frequency
Fsync
SYNC (at input)
8.0


Clock duty ratio
DRCLK
MCK, BCLK (at input)
40
50
60
BCLK to SYNC
tBS
100


(at input)
PCM sync timing
SYNC to BCLK
tSB
100


(at input)
PCM sync signal width
tWS
SYNC (at input)
1BCLK
100

Unit
V
V
°C
V
V
V
ns
ns
pF
µF
MHz
kHz
kHz
%
ns
ns
µs
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ELECTRICAL CHARACTERISTICS
DC Characteristics
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Standby state
ISS
5.0
20.0

(PDNB = ”0”, VDD = 3.3 V, Ta = 25°C)
Operating state 1
In the PCM/IF mode
(SC_EN = “1”, PCMIF_EN = “1”,
IDD1
45.0
55.0

AFE_EN = “1”, TRANS_EN = “1”)
Connect a 4.096 MHz crystal oscillator
Power supply current
between XI and XO.
Operating state 2
When operating the whole system
(SC_EN = “1”, PCMIF_EN = “0”,
IDD2
50.0
65.0

TRANS_EN = “0”, AFE_EN = “0”)
Connect a 4.096 MHz crystal oscillator
between XI and XO.
Digital input pin
IIH
Vin = DVDD
0.01
1.0

input leakage current
IIL
Vin = DGND
−1.0
−0.01

Digital I/O pin
IOZH
Vout = DVDD
0.01
1.0

output leakage current
IOZL
Vout = DGND
−1.0
−0.01

Digital output pins, I/O pins
High level output
IOH = 4.0 mA
VOH
2.2


voltage
IOH = 1.0 mA (XO pin)
Digital output pins, I/O pins
Low level output
VOL
IOL = −4.0 mA
0.4


voltage
IOL = −1.0 mA (XO pin)
Input capacitance *1
CIN
Input pins
8
12

Unit
µA
mA
mA
µA
µA
µA
µA
V
V
pF
Note: *1 Guaranteed design value
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ML7074-001 GA
Analog Interface
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Input resistance *1
RIN
AIN0N, AIN0P, AIN1N
10


MΩ
Output load resistance
RL
GSX0, GSX1, VFRO0, VFRO1
10


kΩ
Output load capacitance
CL
Analog output pins
50
pF


Offset voltage
VOF
VFRO0, VFRO1
40
mV
−40

GSX0, GSX1, VFRO0, VFRO1
Output voltage level *2
VO
1.3
Vpp


RL = 10 kΩ
Notes:
*1 Guaranteed design value
*2 −7.7 dBm (600Ω) = 0 dBm0, +3.17 dBm0 = 1.3 Vpp
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AC Characteristics
CODEC (Speech CODEC in G.711 (µ-law) Mode)
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Conditions
Parameter
Symbol
Min.
Typ.
Max.
Unit
Frequency (Hz)
Level (dBm0)
0 to 60
25
dB
LT1


300 to 3000
0.20
dB
LT2
−0.15

1020
Reference value
LT3
Transmit frequency

0
characteristics
3300
0.80
dB
LT4
−0.15

3400
0
0.80
dB
LT5

3968.75
13
dB
LT6


0 to 3000
0.20
dB
LR2
−0.15

1020
Reference value
LR3

Receive frequency
3300
0.80
dB
0
LR4
−0.15

characteristics
3400
0
0.80
dB
LR5

3968.75
13
dB
LR6


3
35
dBp
SDT1


0
35
dBp
SDT2


Transmit signal to noise
35
dBp
1020
SDT3
−30


ratio [*1]
28
dBp
SDT4
−40


23
dBp
SDT5
−45


3
35
dBp
SDR1


0
35
dBp
SDR2


Receive signal to noise
35
dBp
1020
SDR3
−30


ratio [*1]
28
dBp
SDR4
−40


23
dBp
SDR5
−45


3
0.2
dB
GTT1
−0.2

Reference value
GTT2
−10

Transmit inter-level
0.2
dB
1020
GTT3
−40
−0.2

loss error
0.6
dB
GTT4
−50
−0.6

1.2
dB
GTT5
−55
−1.2

3
0.2
dB
GTR1
−0.2

Reference value
GTR2
−10

Receive inter-level loss
0.2
dB
1020
GTR3
−40
−0.2

error
0.6
dB
GTR4
−50
−0.6

1.2
dB
GTR5
−55
−1.2

Analog input =
NIDLT
dBm0p



−68
Idle channel noise
AVREF
[*1]
PCMI = ”1”
dBm0p
NIDLR



−72
Transmit absolute level
AVT
1020
0
0.285 0.320 0.359
Vrms
[*2]
Receive absolute level
AVR
1020
0
0.285 0.320 0.359
Vrms
[*2]
Noise frequency
30
dB
PSRRT



Power supply noise
range: 0 to 50 kHz
reject ratio
PSRRR
30
dB



Noise level: 50mVpp
Notes: *1 Using P-message filter
*2 0.320 Vrms = 0 dBm0 = −7.7 dBm (600Ω)
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Gain Setting (Speech CODEC in G.711 (µ-law) Mode)
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Transmit and receive
GAC
1.0
dB

−1.0

gain setting accuracy
Tone Output (Speech CODEC in G.711 (µ-law) Mode)
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Frequency deviation
Relative to set frequency
1.5
%
fDFT
−1.5

Output level
Relative to set gain
2.0
dB
oLEV
−2.0

DTMF Detector, Other Detectors (Speech CODEC in G.711 (µ-law) Mode)
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Detect level accuracy
dLAC
Relative to set detect level
2.5
dB
−2.5

Echo Canceller
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
In the analog I/F mode
35
In the PCM I/F (16-bit linear) mode
Echo attenuation
eRES
dB


In the PCM I/F (G.711) mode
30
Erasable echo delay time
tECT
32
ms



Measurement method
Echo Canceller
ATT
Sin
Sout
Rout
Rin
Level Meter
E.R.L
(echo return loss)
Delay
Echo delay time
LPF
5 kHz
White noise generator
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PDNB, XO, AVREF Timings
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Power down signal pulse
tPDNB
PDNB pin
1


µs
width
Oscillation start-up time
txtal
100
ms


2+α
AVREF = 1.4 (90%)
AVREF rise time
tAVREF
600
ms


C5 = 4.7 µF, C6 = 0.1 µF
(See Fig. 9.)
Initialization mode start-up
tINIT
1
s



time
* α is a value that depends on the oscillation stabilizing time when using a crystal oscillator.
VDD
DVDD,
AVDD
0V
VDD
PDNB
0V
tPDNB
VDD
XO
0V
txtal
About
1.4 V
AVREF
0V
tAVREF
CR5-B7
(READY)
"1"
Initialization mode
"0"
tINIT
Fig. 1 PDNB, XO, and AVREF timings
12/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
PCM I/F Mode
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Bit clock frequency
fBCLK
CDL = 20pF(at output)
64
+0.1%
kHz
−0.1%
Bit clock duty ratio
dBCLK
CDL = 20pF(at output)
45
50
55
%
CDL = 20pF(at output)
8
+0.1%
kHz
Sync signal frequency
fSYNC
−0.1%
CDL = 20pF(at output)
dSYNC1
12.4
12.5
12.6
%
At 64 kHz output
Sync signal duty ratio
CDL = 20pF(at output)
dSYNC2
6.24
6.25
6.26
%
At 128 kHz output
BCLK to SYNC
tBS
100
ns


Transmit/receive signal sync
(at output)
timing
SYNC to BCLK
tSB
100
ns


(at output)
Input setup time
tDS
100
—
ns


Input hold time
tDH
100
—
ns


tSDX
100
ns


Digital output delay time
PCMO pin
tXD1
100
ns


Pull-up, pull-down resistors
tXD2
100
ns


RDL = 1 kΩ, CDL = 50 pF
Digital output hold time
tXD3
100
ns


BCLK
0
1
tBS
2
3
4
5
6
7
8
-
16
tSB
tWS
SYNC
tDS
tDH
MSB
PCMI
LSB
LSB
LSB
G.726
G.711
16-bit
linear
Fig. 2 PCM I/F mode input timing (long frame)
BCLK
0
1
tBS
2
3
4
5
6
7
8
9
-
17
tSB
tWS
SYNC
tDS
PCMI
tDH
MSB
LSB
LSB
LSB
G.726
G.711
16-bit
linear
Fig. 3 PCM I/F mode input timing (short frame)
13/31
FEDL7074-001DIGEST-01
OKI Semiconductor
BCLK
0
ML7074-001 GA
1
tBS
2
3
4
5
6
7
8
9
-
17
tSB
tWS
SYNC
tSDX
PCMO
tXD2
tXD1
Hi-z
MSB
tXD3
LSB
G.726
tXD3
LSB
LSB
G.711
16-bit
linear
Fig. 4 PCM I/F mode output timing (long frame)
BCLK
0
1
tBS
2
3
4
5
6
7
8
9
10
-
18
tSB
tWS
SYNC
tXD1
tXD2
tXD3
tXD3
Hi-z
PCMO
MSB
LSB
LSB
LSB
G.726
G.711
16-bit
linear
Fig. 5 PCM I/F mode output timing (short frame)
14/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
Control Register Interface
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Address setup time
tAS
10
ns


Address hold time
tAH
10
ns


Write data setup time
tWDS
10
ns


Write data hold time
tWDH
10
ns


CSB setup time
tCS
10
ns


CSB hold time
tCH
10
ns
CL = 50 pF


WRB pulse width
tWW
10
ns


Read data output delay time
tRDD
20
ns


Read data output hold time
tRDH
3
ns


RDB pulse width
tRW
25
ns


CSB disable time
tCD
10
ns


A7-A0
Input
A2
A1
tAS
tAH
D7-D0
I/O
tAS
tAH
D1
Input
D2
Output
tWDS
tWDH
tCS
tCH
tRDD
tRDH
CSB
Input
tCD
tCS
tCH
WRB
Input
tRW
tWW
RDB
Input
Write timing
Read timing
Fig. 6 Control register interface
15/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
Transmit and Receive Buffer Interface (in Frame Mode)
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
FR1B setup time
tF1S
3
ns


FR1B output delay time
tF1D
20
ns


Address setup time
tAS
10
ns


Address hold time
tAH
10
ns


Write data setup time
tWDS
10
ns


Write data hold time
tWDH
10
ns


CSB setup time
tCS
10
ns


CSB hold time
tCH
10
ns
CL = 50 pF


WRB pulse width
tWW
10
ns


FR0B setup time
tF0S
3
ns


FR0B output delay time
tF0D
20
ns


Read data output delay time
tRDD
30
ns


Read data output hold time
tRDH
3
ns


RDB pulse width
tRW
35
ns


CSB disable time
tCD
10
ns


FR0B
Output
tF0S
tF0D
FR1B
Output
tF1S
tF1D
A7-A0
Input
A2
A1
tAS
tAH
tAS
tAH
D2
Output
D1
Input
D15-D0
I/O
tWDS
tWDH
tCS
tCH
tRDD
tRDH
CSB
Input
WRB
Input
tCD
tCS
tCH
tWW
tRW
Write timing
Read timing
RDB
Input
Fig. 7 Transmit and receive buffer interface (in frame mode)
16/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
Transmit and Receive Buffer Interface (in DMA Mode)
(Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V,
Ta = −20 to +60°C)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
DMARQ1B setup time
tDR1S
3
ns


tDR1RD
25
ns


DMARQ1B output delay time
tDR1FD
25
ns


Address setup time
tAS
10
ns


Address hold time
tAH
10
ns


Write data setup time
tWDS
10
ns


Write data hold time
tWDH
10
ns


ACK setup time
tAKS
10
ns


ACK hold time
tAKH
10
ns
CL = 50 pF


WRB pulse width
tWW
10
ns


DMARQ0B setup time
tDR0S
3
ns


tDR0RD
20
ns


DMARQ0B output delay time
tDR0FD
25
ns


Read data output delay time
tRDD
30
ns


Read data output hold time
tRDH
3
ns


RDB pulse width
tRW
35
ns


ACKB disable time
tAD
10
ns


DMARQ0B
Output
tDR0S
tDR0FD
tDR0RD
DMARQ1B
Output
tDR1S
tDR1FD
tDR1RD
A7-A0
Input
A2
A1
tAS
D15-D0
I/O
tAH
tAS
tAH
D1
Input
tWDS
D2
Output
tWDH
tRDD
tRDH
ACK0B
Input
tAKS
tAKH
ACK1B
Input
WRB
Input
tAKS
tAKH
tWW
tAD
tRW
RDB
Input
Write timing
Read timing
Fig. 8 Transmit and receive buffer interface (in DMA mode)
17/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
PIN FUNCTION DESCRIPTIONS
AIN0N, AIN0P, GSX0, AIN1N, GSX1
These are the analog transmit input and transmit level adjust pins. Each of AIN0N and AIN1N is connected to each
of the inverting input pins of the built-in transmit amplifiers AMP0 and AMP1, and AIN0P is connected to the
non-inverting input pin of AMP0. In addition, GSX0 and GSX1 are connected to the output pins of AMP0 and
AMP1, respectively. The selection between AMP0 and AMP1 is made by CR10-B0. See Fig. 9 for the method of
making level adjustment. During the power down mode (when PDNB = “0” or CR0-B7 = “1”), the outputs of
GSX0 and GSX1 go to the high impedance state. If AMP0 is not used in the specific application of this LSI, short
GSX0 with AIN0N and connect AIN0P with AVREF. When AMP1 is not used, short GSX1 with AIN1N.
Notice:
It is recommended to select the amplifier to be used before the conversation starts, since a small amount of noise
will be generated if the amplifier selection is changed while conversation is in progress.
VFRO0, VFRO1
These are analog receive output pins and are connected to the output pins of the built-in receive amplifiers AMP2
and AMP3, respectively. The output signals of VFRO0 and VFRO1 can be selected using CR10-B1 and CR10-B2,
respectively. When selected (“1”), the received signal will be output, and when deselected (“0”), the AVREF
signal (about 1.4 V) will be output. In the power down mode, these pins will be in the high impedance state. It is
recommended to use these output signals via DC coupling capacitors.
Notice:
It is recommended to select the amplifier to be used before the conversation starts, since a small amount of noise is
generated if the output selection is changed while the conversation is in progress.
At the time of resetting or releasing from the reset state, it is recommended to select the AVREF as outputs of
VFRO0 and VFRO1.
GSX0
R2
C1
Gain = R2/R1 <=
63(+36dB)
R1 : Variable
R2 : Max 500k
R1
10kΩ
AIN0N
AIN0P
AMP0
CR10-B0
A/D
GSX1
Gain = R4/R3 <=63(+36dB)
R1 : Variable
R2 : Max 500k
R4
C2
R3
10κΩ
AIN1N
AMP1
Out : Max 1.3Vp-p
C3 VFRO0
CR10-B1
10kΩ
D/A
AMP2
Out : Max 1.3Vp-p
C4
VFRO1
10kΩ
CR10-B2
AMP3
AVREF
C5 +
2.2 to 4.7µF
VREF
C6 0.1µF
Fig. 9 Analog interface
18/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
AVREF
This is the output pin for the analog signal ground potential. The output potential at this pin will be about 1.4 V.
Connect a 2.2 to 4.7 µF (aluminum electrolytic type) capacitor and a 0.1 µF (ceramic type) capacitor in parallel
between this pin and the GND pin as bypass capacitors. The output at the AVREF pin goes to 0.0 V in the power
down mode. The voltage starts rising after the power down mode is released (PDNB = “1” and also CR0-B7 = “0”).
The rise time is about 0.6 sec.
XI, XO
These are the pins for either connecting the crystal oscillator for the master clock or for inputting an external master
clock signal.
The oscillations of the master clock oscillator will be stopped during a power down due to the PDNB signal or
during a software power down due to CR0-B7 (SPDN). The oscillations start when the power down condition is
released, and the internal clock supply of the LSI will be started after counting up the oscillation stabilization
period (of about 16 ms). Examples of crystal oscillator connection and external master clock input are shown in
Fig. 10.
CR0-B7
(SPDN)
To internal
circuits
PDNB
XI
XO
R
X'tal
C1
C2
CR0-B7
(SPDN)
To internal
circuits
PDNB
XI
XO
Open
4.096 MHz
X'tal(4.096 MHz)
C1
C2
R
Daishinku Co., Ltd.
AT-49
5pF
10pF
1MΩ
Fig. 10 Examples of oscillator circuit and clock input
PDNB
This is the power down control input pin. The power down mode is entered when this pin goes to “0”. In addition,
this pin also has the function of resetting the LSI. In order to prevent wrong operation of the LSI, carry out the
initial power-down reset after switching on the power using this PDNB pin. Also, keep the PDNB pin at “0” level
for 1 µs or more to initiate the power down state.
Further, it is possible to carry out a power down reset of the LSI when the power is being supplied by performing
control of CR0-B7 (SPDN) in the sequence “0” → “1” → “0”.
The READY signal (CR5-B7) goes to “1” about 1.0 second after the power down mode is released thereby entering
the mode of setting various functions (initialization mode). See Fig. 1 for the timings of PDNB and AVREF, XO,
and the initialization mode.
Notice: At the time of switching on the power, start from the power down mode using PDNB.
DVDD0, DVDD1, DVDD2, AVDD
These are power supply pins. DVDD0, 1, 2 are the power supply pins for the digital circuits while AVDD is the
power supply pin for the analog circuits of the LSI. Connect these pins together in the neighborhood of the LSI and
connect as bypass capacitors a 10 µF electrolytic capacitor and a 0.1 µF ceramic capacitor in parallel between the
DGND and AGND pins.
DGND0, DGND1, DGND2, AGND
These are ground pins. GDND0, 1, 2 are the ground pins for the digital circuits and AGND is the ground pin for the
analog circuits of the LSI. Connect these pins together in the neighborhood of the LSI.
19/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
TST0, TST1, TST2, TST3
These are input pins for testing purposes only. Keep the inputs to these pins at the “0” level during normal use
conditions.
INTB
This is the interrupt request output pin. An “L” level is output for a duration of about 1.0 µsec at this pin when
there is a change in state of an interrupt cause.
This output will be maintained at the “H” level when there is no change in state of any of the interrupt causes. The
actual interrupt cause generating the interrupt can be verified by reading CR3 and CR4. The different interrupt
causes are described below.
• Underflow error (CR3-B0)
An interrupt is generated when an internal read from the receive buffer occurs before the writing into the receive
buffer from the MCU has been completed.
An interrupt is generated when a normal writing is made in the receive buffer by the MCU and the underflow
error is released.
• Overrun error (CR3-B1)
An interrupt is generated when an internal write of the next data into the transmit buffer occurs before the
transmit buffer data read out from the MCU has been completed.
An interrupt is generated when a normal read out is made from the transmit buffer by the MCU and the overrun
error is released.
• When a dial pulse is detected (CR4-B6).
• When a DTMF signal is detected (CR4-B4).
• When DTMF_CODEC0, 1, 2, 3 are detected (CR4-B0, B1, B2, B3).
An interrupt is generated when a DTMF signal is detected.
An interrupt is generated when there is a change from the DTMF signal detected state to the no-detected state.
An interrupt is generated when there is a change in the detected code (CR4-B0, B1, B2, B3) in the condition in
which a DTMF signal is being detected.
• When TONE0 is detected (CR3-B3).
An interrupt is generated when a 1650 Hz tone signal is detected.
An interrupt is generated when there is a change to the non-detection condition in the tone signal detection
condition.
• When TONE1 is detected (CR3-B4).
An interrupt is generated when a 2100 Hz tone signal is detected.
An interrupt is generated when there is a change to the non-detection condition in the tone signal detection
condition.
• When FGEN_RQ is generated (CR3-B6).
An interrupt is generated when the FSK generator makes a request for the next data to be transmitted.
An interrupt is generated when there is a change from the condition in which the FSK generator is requesting for
transmission data to the condition in which there is no request for internal fetch of the data to be transmitted next.
• When DSP_ERR is detected (CR3-B7).
An interrupt is generated when any error occurs in the DSP inside the LSI.
20/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
A0 to A7
These are the address input pins for use during an access of the frame, DMA, or control registers. The different
addresses will be the following.
Transmit buffer (TX Buffer)
A7 to A0 = 10xxxxxxb (the lower 6 bits are not valid)
Receive buffer (RX Buffer)
A7 to A0 = 01xxxxxxb (the lower 6 bits are not valid)
Control register (CR)
A7 to A0 = 00xxxxxxb
D0 to D15
These are the data input/output pins for use during an access of the frame, DMA, or control registers. Connect
pull-up resistors to these pins since they are I/O pins. When the 8-bit bus access method is selected by CR11-B5,
only D0 to D7 become valid. Since the higher 8 bits D8 to D15 will always be in the input state when the 8-bit bus
access method is selected (CR11-B5 = “1”), tie them to “0” or “1” inputs.
CSB
This is the chip select input pin for use during a frame or control register access.
RDB
This is the read enable input pin for use during a frame, DMA, or control register access.
WRB
This is the write enable input pin for use during a frame, DMA, or control register access.
21/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
FR0B (DMARQ0B)
• FR0B (In frame mode, CR11-B7 = “0”)
This is the transmit frame output pin which outputs the signal when the transmit buffer is full during frame
access. This pin outputs an “L” level when the transmit buffer becomes full, and maintains that “L” level output
until a specific number of words are read out from the MCU.
• DMARQ0B (In DMA mode, CR11-B7 = “1”)
This is the DMA request output pin which outputs the signal when the transmit buffer is full during DMA access.
This output becomes “L” when the transmit buffer becomes full, and returns to the “H” level automatically on
the falling edge of the read enable signal (RDB = “1” → “0”) when there is an acknowledgement signal (ACK0B
= “0”) from the MCU. This relationship is repeated until a specific number of words are read out from the MCU.
FR1B (DMARQ1B)
• FR1B (In frame mode, CR11-B7 = “0”)
This is the receive frame output pin which outputs the signal when the receive buffer is empty during frame
access. This pin outputs an “L” level when the receive buffer becomes empty, and maintains that “L” level
output until a specific number of words are written from the MCU.
• DMARQ1B (In DMA mode, CR11-B7 = “1”)
This is the DMA request output pin which outputs the signal when the receive buffer is empty during DMA
access. This output becomes “L” when the receive buffer becomes empty, and returns to the “H” level
automatically on the falling edge of the write enable signal (WRB = “1” → “0”) when there is an
acknowledgement signal (ACK1B = “0”) from the MCU. This relationship is repeated until a specific number of
words are written from the MCU.
ACK0B
This is the DMA acknowledgement input pin for the DMARQ0B signal during DMA access of the transmit buffer
and becomes valid in the DMA mode (CR11-B7 = “1”).
Tie this pin to “1” when using this LSI in the frame access mode (CR11-B7 = “0”).
ACK1B
This is the DMA acknowledgement input pin for the DMARQ1B signal during DMA access of the receive buffer
and becomes valid in the DMA mode (CR11-B7 = “1”).
Tie this pin to “1” when using this LSI in the frame access mode (CR11-B7 = “0”).
GPI0, GPI1
These are general-purpose input pins. The state (“1” or “0”) of each of these GPI0 and GPI1 pins can be read out
respectively from CR16-B0 and CR16-B1. Further, GPI0 becomes the input pin for the dial pulse detector
(DPDET) in the secondary functions.
GPO0, GPO1
These are general-purpose output pins. The values set in CR17-B0 and CR17-B1 are output at these pins GPO0
and GPO1, respectively. Further, GPO0 becomes the output pin for the dial pulse generator (DPGEN) in the
secondary functions.
22/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
CLKSEL
This is the input/output control input pin of SYNC and BCLK. The pin becomes input at “0” level and output at
“1” level.
SYNC
This is the 8 kHz sync signal input/output pin of PCM signals. When CLKSEL is “0”, input continuously an 8 kHz
clock synchronous with BCLK. Further, when CLKSEL is “1”, this pin outputs an 8 kHz clock synchronous with
BCLK. Long frame synchronization is used when CR0-B1 (LONG/SHORT) is “0” and short frame
synchronization is used when it is “1”.
BCLK
This is the shift clock input/output pin for the PCM signal. When CLKSEL is “0”, it is necessary to input to this pin
a clock signal that is synchronous with SYNC. Input a 64 to 2048 kHz clock when the G.711 mode or the G.726
mode has been selected, and input a 128 to 2048 kHz clock when the 16-bit linear mode has been selected. When
CLKSEL is “1”, this pin outputs a clock that is synchronous with SYNC. This pin outputs a 64 kHz clock when the
G.711 mode or the G.726 mode has been selected, and outputs an 128 kHz clock when the 16-bit linear mode or
G.729.A mode has been selected.
Note: The input/output control and frequencies of the above SYNC and BLCK signals will be as shown in Table 1
below.
Table 1 Input/output control of SYNC and BCLK
CLKSEL
SYNC
“0”
Input
(8 kHz)
“1”
Output
(8 kHz)
BCLK
Remarks
Input a continuous clock after starting the power
supply.
Input
Input a 64 to 2048 kHz clock when G.711 or G.726 is
(64 kHz to 2048 kHz) selected.
Input a 128 to 2048 kHz clock when 16-bit linear
mode is selected.
An “L” level is output during the power down mode.
A 64 kHz clock is output when G.711 or G.726 is
Output
selected.
(64 kHz or 128 kHz)
A 128 kHz clock is output when G.729.A or 16-bit
linear mode is selected.
PCMO
This is the PCM signal output pin for the transmitting section. The PCM signal is output in synchronization with
the rising edges of SYNC and BCLK. The PCMO outputs the data only during the valid data segment in the
selected coding format and goes to the high impedance state during all other segments. The basic timing chart of
the PCM I/F mode is shown in Fig. 11. The PCMO output will be in the high impedance state when the mutual
conversion function is not used (CR11-B0 = “0”) or when the PCM I/F mode is not used (CR12-B0 = “0”).
PCMI
This is the PCM signal input pin for the receiving section. The data is entered starting from the MSB by shift on the
falling edge of BCLK.
The basic timing chart of the PCM I/F mode is shown in Fig. 11.
Fix input with “0” or “1” when the mutual conversion function is not used (CR11-B0 = “0”) or when the PCM I/F
mode (CR12-B0 = “0”) is not used.
23/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
16-Bit linear
Long frame synchronization mode (CR0-B1 = "0")
SYNC
(IN/OUT)
Hi-z
Hi-z
:
PCMO
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
PCMI
:
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
BCLK
(IN/OUT)
16-Bit linear
Short frame synchronization mode (CR0-B1 = "1")
SYNC
(IN/OUT)
Hi-z
Hi-z
:
PCMO
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
PCMI
:
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
BCLK
(IN/OUT)
G.711 (µ-law, A-law)
Long frame synchronization mode (CR0-B1 = "0")
SYNC
(IN/OUT)
PCMO
Hi-z
D7
D6
D5
D4
D3
D2
D1
D0
Hi-z
D7
D6
D5
D4
D3
D2
D1
D0
PCMI
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
BCLK
(IN/OUT)
Hi-z
G.711 (µ-law, A-law)
Short frame synchronization mode (CR0-B1 = "1")
SYNC
(IN/OUT)
PCMO
Hi-z
D7
D6
D5
D4
D3
D2
D1
D0
Hi-z
D7
D6
D5
D4
D3
D2
D1
D0
PCMI
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
BCLK
(IN/OUT)
Hi-z
G.726 (32 kbps)
Long frame synchronization mode (CR0-B1 = "0")
SYNC
(IN/OUT)
PCMO
Hi-z
D3
D2
D1
D0
Hi-z
D3
D2
D1
D0
PCMI
D3
D2
D1
D0
D3
D2
D1
D0
BCLK
(IN/OUT)
Hi-z
G.726 (32 kbps)
Short frame synchronization mode (CR0-B1 = "1")
SYNC
(IN/OUT)
PCMO
Hi-z
D3
D2
D1
D0
Hi-z
D3
D2
D1
D0
PCMI
D3
D2
D1
D0
D3
D2
D1
D0
BCLK
(IN/OUT)
Hi-z
Fig. 11 PCM I/F mode timing diagram
24/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
example of Configuration
Analog I/F mode
GSX0
TONE_DET0
TONE0_DET
TONE_DET1
TONE1_DET
DTMF_REC
DTMF_DET
DTMF_CODE[3:0]
Speech Codec
10kΩ
Linear PCM Codec
AIN0N
Echo Canceller
AMP0
AIN0P
A/D
Bus Control Unit
Encoder
G.729.A
TXGAIN
BPF
Sin
GSX1
LPAD
+
-
10kΩ
G.726
Sout
ATTs
Center
Clip
GPAD
G.711
TX
Buffer0
TX
Buffer1
AIN1N
G.729.A
AMP1
TONE_GEN
(TONEA/B)
STGAIN
AFF
Decoder
G.729.A
10kΩ
D/A
VFRO0
Rout
LPF
Rin
ATTr
RXGAIN
G.726
AMP2
G.711
RX
Buffer0
RX
Buffer1
10kΩ
VFRO1
8b
G.729.A
FSK_GEN
A0-A7
AMP3
16b
Codec
AVREF
VREF
Frame/DMA
Controller
Decoder
G.711
S/P
TIMER
G.726
CR17-B0(GPO0)
DPGEN
Encoder
P/S
PLL
CKGN
CR16-B0(GPI0)
MCK
SYNC(8kHz)
DPDET
G.726
SYNC
OSC
BCLK
Power
DP_DET
DTMF_DET
DTMF_CODE[3:0]
TONE0_DET
TONE1_DET
DP_DET
Control
Register
INT
INTB
TST0
TST1
TST2
TST3
PDNB
Function stopped
Cannot be used
DVDD1
DVDD0
DGND0
DGND1
DVDD2
DGND2
AGND
AVDD
Serial I/F
XI
CLKSEL
G.711
XO
PCMO
GPI0
GPI1
GPO0
GPO1
PCMI
D0-D15
CSB
RDB
WRB
FR0B
FR1B
ACK0B
ACK1B
Example of settings in the initialization mode
⋅ CR15 = 40
⋅ CR11 = 00h (Frame/10 ms/16B/Speech CODEC = G.729.A)
⋅ Various settings
⋅ CR0 = 09h (OPE_STAT = “1”)
25/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
PCM I/F Mode
GSX0
TONE_DET0
TONE0_DET
TONE_DET1
TONE1_DET
DTMF_REC
DTMF_DET
DTMF_CODE[3:0]
Speech Codec
10kΩ
Linear PCM Codec
AIN0N
Echo Canceller
AMP0
AIN0P
A/D
Bus Control Unit
Encoder
G.729.A
TXGAIN
BPF
Sin
GSX1
LPAD
+
-
10kΩ
G.726
Sout
ATTs
Center
Clip
GPAD
G.711
TX
Buffer0
TX
Buffer1
AIN1N
G.729.A
TONE_GEN
(TONEA/B)
STGAIN
AMP1
AFF
Decoder
G.729.A
10kΩ
D/A
VFRO0
Rout
LPF
ATTr
Rin
RXGAIN
G.726
AMP2
G.711
RX
Buffer0
RX
Buffer1
10kΩ
VFRO1
8b
G.729.A
FSK_GEN
A0-A7
AMP3
16b
Codec
AVREF
VRE
F
Frame/DMA
Controller
Decoder
G.711
S/P
TIMER
G.726
CR17-B0(GPO0)
DPGEN
Encoder
P/S
CKGN
CR16-B0(GPI0)
MCK
SYNC(8kHz)
DPDET
G.726
SYNC
OSC
BCLK
Power
DP_DET
DTMF_DET
DTMF_CODE[3:0]
TONE0_DET
TONE1_DET
DP_DET
Control
Register
INT
INTB
TST0
TST1
TST2
TST3
PDNB
Function stopped
Cannot be used
DVDD1
DVDD0
DGND0
DGND1
DVDD2
DGND2
AGND
AVDD
Serial I/F
XI
CLKSEL
PLL
XO
PCMO
G.711
GPI0
GPI1
GPO0
GPO1
PCMI
D0-D15
CSB
RDB
WRB
FR0B
FR1B
ACK0B
ACK1B
Examples of settings in the initialization mode
⋅ CR15 = 40
⋅ CR10 = 00h (VFRO1 = AVREF/VFRO0 = AVREF)
⋅ CR11 = 00h (Frame/10 ms/16B/PCMIF = 16-bit linear)
⋅ CR12 = 01h (Speech CODEC = G.729.A/PCMIF_EN = “1”)
⋅ Various settings
⋅ CR0 = 29h (AFE_EN = Power down/LONG/OPE_STAT = “1”)
26/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
G.729.A ↔ G.726 Mutual Conversion
GSX0
TONE_DET0
TONE0_DET
TONE_DET1
TONE1_DET
DTMF_REC
DTMF_DET
DTMF_CODE[3:0]
Speech Codec
10kΩ
Linear PCM Codec
AIN0N
Echo Canceller
AMP0
AIN0P
A/D
Bus Control Unit
Encoder
G.729.A
TXGAIN
BPF
Sin
GSX1
LPAD
+
-
10kΩ
G.726
Sout
ATTs
Center
Clip
GPAD
G.711
TX
Buffer0
TX
Buffer1
AIN1N
G.729.A
AMP1
TONE_GEN
(TONEA/B)
STGAIN
AFF
Decoder
G.729.A
10kΩ
D/A
VFRO0
Rout
LPF
ATTr
Rin
RXGAIN
G.726
AMP2
G.711
RX
Buffer0
RX
Buffer1
10kΩ
VFRO1
8b
G.729.A
FSK_GEN
A0-A7
AMP3
16b
Codec
AVREF
VREF
Frame/DMA
Controller
Decoder
G.711
S/P
TIMER
G.726
CR17-B0(GPO0)
DPGEN
Encoder
P/S
CKGN
CR16-B0(GPI0)
MCK
SYNC(8kHz)
DPDET
G.726
SYNC
OSC
BCLK
Power
DP_DET
DTMF_DET
DTMF_CODE[3:0]
TONE0_DET
TONE1_DET
DP_DET
Control
Register
INT
INTB
TST0
TST1
TST2
TST3
PDNB
Function stopped
Cannot be used
DVDD1
DVDD0
DGND0
DGND1
DVDD2
DGND2
AGND
AVDD
Serial I/F
XI
CLKSEL
PLL
XO
PCMO
G.711
GPI0
GPI1
GPO0
GPO1
PCMI
D0-D15
CSB
RDB
WRB
FR0B
FR1B
ACK0B
ACK1B
Examples of settings in the initialization mode
⋅ CR15 = 40
⋅ CR11 = 05h (Frame/10 ms/16B/G.726/TRANS_EN= “1”)
⋅ CR10 = 00h (VFRO1 = AVREF/VFRO0 = AVREF)
⋅ Various settings
⋅ CR0 = 29h (AFE_EN = Power down/LONG/OPE_STAT = “1”)
27/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
EXAMPLE OF APPLICATION CIRCUIT
1.4V
50
51
52
Analog
input
53
54
55
56
Analog
output
57
Generalpurpose
input pins
45
46
47
48
Generalpurpose
output pins
AIN0N
GSX0
GSX1
AIN1N
AVREF
VFRO0
VFRO1
GPI0
GPI1
GPO0
GPO1
+3.3V
PCM
I/F
open
open
open
Power down control
4.096 MHz
crystal
oscillator
A7
A6
A5
A4
A3
A2
A1
A0
AIN0P
ML7074-001
43
4
3
5
6
42
60
61
CLKSEL
PCMI
PCMO
BCLK
SYNC
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
41
40
39
38
37
36
35
34
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
MCU
I/F
+3.3V
ACK0B
ACK1B
PDNB
FR0B
FR1B
INTB
XI
XO
CSB
RDB
WRB
8
9
10
11
12
13
14
15
+3.3V
7
33
62
49
16
44
59
58
DVDD0
DVDD1
DVDD2
AVDD
DGND0
DGND1
DGND2
AGND
TST3
TST2
TST1
TST0
63
64
1
2
Conditions:
- When using analog
interface
- Frame mode
- SYNC and BCLK are
output (CLKSEL="1")
28/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
PACKAGE DIMENSIONS
(Unit: mm)
QFP64-P-1414-0.80-BK
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (J5µm)
0.87 TYP.
6/Feb. 23, 2001
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
29/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
REVISION HISTORY
Document
No.
FEDL7074-001-01
Date
Oct. 15, 2002
Page
Previous
Current
Edition
Edition
–
–
Description
Final edition 1
30/31
FEDL7074-001DIGEST-01
OKI Semiconductor
ML7074-001 GA
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action and performance of the product. When planning to use the product, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in connection with the use of the product and/or the information and drawings contained herein.
No responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.
6.
The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not authorized for use in any system or application that requires special
or enhanced quality and reliability characteristics nor in any system or application where the failure of such
system or application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7.
Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2002 Oki Electric Industry Co., Ltd.
31/31
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