Datasheet Voltage Detector IC Series Standard CMOS Voltage Detector IC BD48xxx series BD49xxx series ●Key Specifications Detection voltage: ●General Description ROHM’s BD48xxx and BD49xxx series are highly accurate, low-current Voltage Detector IC series. The family includes BD48xxx devices with N-channel open drain output and BD49xxx devices with CMOS output. The devices are available for specific detection voltages ranging from 2.3V to 6.0V in increments of 0.1V. 2.3V to 6.0V (Typ.), 0.1V steps High accuracy detection voltage: ±1.0% Ultra-low current consumption: 0.9µA (Typ.) Operating temperature range: ●Features High accuracy detection Ultra-low current consumption Two output types (Nch open drain and CMOS output) Wide Operating temperature range Very small and low height package Package SSOP5 is similar to SOT-23-5 (JEDEC) Package SSOP3 is similar to SOT-23-3 (JEDEC) -40°C to +105°C ●Package SSOP5: 2.90mm x 2.80mm x 1.25mm SSOP3: 2.92mm x 2.80mm x 1.25mm VSOF5: 1.60 mm x 1.60mm x 0.60mm ●Applications Circuits using microcontrollers or logic circuits that require a reset. ●Typical Application Circuit VDD1 VDD2 VDD1 RL BD48xxx RST RST BD49xxx Micro controller CL CL ( Capacitor for noise filtering ） ( Capacitor for noise filtering） GND (Open Drain Output type） BD48xxx series Micro controller GND (CMOS Output type） BD49xxx series ○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays .www.rohm.com TSZ02201-0R7R0G300030-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 1/15 TSZ22111・14・001 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series ●Connection Diagram N.C. SSOP5 N.C. VSOF5 VDD 5 Marking Lot. No Marking VOUT VOUT VDD GND TOP VIEW GND 4 1 2 3 SUB N.C Lot. No TOP VIEW ●Pin Descriptions SSOP5 VSOF5 PIN No. Symbol Function PIN No. Symbol Function 1 VOUT Reset Output 1 VOUT Reset Output 2 VDD Power Supply Voltage 2 SUB Substrate* 3 GND GND N.C. Unconnected Terminal N.C. GND Unconnected Terminal 4 3 4 5 N.C. Unconnected Terminal 5 VDD Power Supply Voltage GND *Connect the substrate to GND. SSOP3(1pin GND) SSOP3(3pin GND) VDD GND 3 3 2 Marking Marking Lot. No 2 1 VOUT GND Lot. No 2 1 VOUT VDD TOP VIEW TOP VIEW ●Pin Descriptions PIN No. SSOP3-1 Symbol Function PIN No. GND 1 1 GND 2 VOUT Reset Output 3 VDD Power Supply Voltage SSOP3-2 Symbol Function VOUT Reset Output 2 VDD Power Supply Voltage 3 GND GND Ordering Information B Part Number D x x Output Type 48 : Open Drain 49 : CMOS x Package1 x x x - Reset Voltage Value Package2 23 : 2.3V 0.1V step 60 : 6.0V Package1 E K L Blank Blank Package2 G G G FVE G Package name SSOP5 SSOP3(1pin GND) SSOP3(3pin GND) VSOF5 SSOP5 T R Packaging and forming specification Embossed tape and reel TR :The pin number 1is the upper right :SSOP5 :VSOF5 TL :The pin number 1is the upper left :SSOP3-1 :SSOP3-2 Note: When ordering new SSOP5, select “E” for Package 1 and “G” for Package 2. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/15 TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series SSOP5 5 4 1 2 0.2Min. +0.2 1.6 −0.1 2.8±0.2 <Tape and Reel information> +6 ° 4° −4° 2.9±0.2 3 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.13 −0.03 +0.05 0.42 −0.04 0.05±0.05 1.1±0.05 1.25Max. ) 0.95 0.1 Direction of feed Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. VSOF5 4 (MAX 1.28 include BURR) 1.2 ± 0.05 5 1.6 ± 0.05 0.2MAX 1.6±0.05 1.0±0.05 1 3 2 0.6MAX 0.13±0.05 0.22±0.05 0.5 (Unit : mm) SSOP3 2.92±0.1 4°±4° L 0.45±0.15 1.6±0.1 2.8±0.15 3 1 2 1.1±0.05 1.25MAX 0.15±0.05 ＸＸＸ ＸＸＸ 0.95 ＸＸＸ ＸＸＸ ＸＸＸ ＸＸＸ ＸＸＸ ＸＸＸ ＸＸＸ ＸＸＸ 0.4±0.1 1.9±0.1 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/15 TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series ●Lineup Table 1. Lineup for VSOF5 and SSOP5 Package VSOF5 or SSOP5 Package Type Output Type Detection Voltage 6.0V 5.9V 5.8V 5.7V 5.6V 5.5V 5.4V 5.3V 5.2V 5.1V 5.0V 4.9V 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V Open Drain SSOP5 CMOS Open Drain CMOS Marking Part Number Marking Part Number Marking Part Number Marking Part Number EW EV EU ET ES ER EQ EP EN EM EL EK EJ EH EG EF EE ED EC EB EA DV DU DT DS DR DQ DP DN DM DL DK DJ DH DG DF DE DD BD4860 BD4859 BD4858 BD4857 BD4856 BD4855 BD4854 BD4853 BD4852 BD4851 BD4850 BD4849 BD4848 BD4847 BD4846 BD4845 BD4844 BD4843 BD4842 BD4841 BD4840 BD4839 BD4838 BD4837 BD4836 BD4835 BD4834 BD4833 BD4832 BD4831 BD4830 BD4829 BD4828 BD4827 BD4826 BD4825 BD4824 BD4823 GW GV GU GT GS GR GQ GP GN GM GL GK GJ GH GG GF GE GD GC GB GA FV FU FT FS FR FQ FP FN FM FL FK FJ FH FG FF FE FD BD4960 BD4959 BD4958 BD4957 BD4956 BD4955 BD4954 BD4953 BD4952 BD4951 BD4950 BD4949 BD4948 BD4947 BD4946 BD4945 BD4944 BD4943 BD4942 BD4941 BD4940 BD4939 BD4938 BD4937 BD4936 BD4935 BD4934 BD4933 BD4932 BD4931 BD4930 BD4929 BD4928 BD4927 BD4926 BD4925 BD4924 BD4923 Cm Ck Ch Cg Cf Ce Cd Cc Cb Ca By Br Bp Bn Bm Bk Bh Bg Bf Be Bd Bc Bb Ba Ay Ar Ap An Am Ak Ah Ag Af Ae Ad Ac Ab Aa BD48E60 BD48E59 BD48E58 BD48E57 BD48E56 BD48E55 BD48E54 BD48E53 BD48E52 BD48E51 BD48E50 BD48E49 BD48E48 BD48E47 BD48E46 BD48E45 BD48E44 BD48E43 BD48E42 BD48E41 BD48E40 BD48E39 BD48E38 BD48E37 BD48E36 BD48E35 BD48E34 BD48E33 BD48E32 BD48E31 BD48E30 BD48E29 BD48E28 BD48E27 BD48E26 BD48E25 BD48E24 BD48E23 Ff Fe Fd Fc Fb Fa Ey Er Ep En Em Ek Eh Eg Ef Ee Ed Ec Eb Ea Dy Dr Dp Dn Dm Dk Dh Dg Df De Dd Dc Db Da Cy Cr Cp Cn BD49E60 BD49E59 BD49E58 BD49E57 BD49E56 BD49E55 BD49E54 BD49E53 BD49E52 BD49E51 BD49E50 BD49E49 BD49E48 BD49E47 BD49E46 BD49E45 BD49E44 BD49E43 BD49E42 BD49E41 BD49E40 BD49E39 BD49E38 BD49E37 BD49E36 BD49E35 BD49E34 BD49E33 BD49E32 BD49E31 BD49E30 BD49E29 BD49E28 BD49E27 BD49E26 BD49E25 BD49E24 BD49E23 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/15 TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series ●Lineup - continued Table 2. Lineup for SSOF3(1pin GND) and SSOP3(3pin GND) Package SSOP3(1pin GND) Package Type Output Type Open Drain SSOP3(3pin GND) CMOS Open Drain CMOS Detection Voltage Marking Part Number Marking Part Number Marking Part Number Marking Part Number 6.0V 5.9V 5.8V 5.7V 5.6V 5.5V 5.4V 5.3V 5.2V 5.1V 5.0V 4.9V 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V Cm Ck Ch Cg Cf Ce Cd Cc Cb Ca By Br Bp Bn Bm Bk Bh Bg Bf Be Bd Bc Bb Ba Ay Ar Ap An Am Ak Ah Ag Af Ae Ad Ac Ab Aa BD48K60 BD48K59 BD48K58 BD48K57 BD48K56 BD48K55 BD48K54 BD48K53 BD48K52 BD48K51 BD48K50 BD48K49 BD48K48 BD48K47 BD48K46 BD48K45 BD48K44 BD48K43 BD48K42 BD48K41 BD48K40 BD48K39 BD48K38 BD48K37 BD48K36 BD48K35 BD48K34 BD48K33 BD48K32 BD48K31 BD48K30 BD48K29 BD48K28 BD48K27 BD48K26 BD48K25 BD48K24 BD48K23 Ff Fe Fd Fc Fb Fa Ey Er Ep En Em Ek Eh Eg Ef Ee Ed Ec Eb Ea Dy Dr Dp Dn Dm Dk Dh Dg Df De Dd Dc Db Da Cy Cr Cp Cn BD49K60 BD49K59 BD49K58 BD49K57 BD49K56 BD49K55 BD49K54 BD49K53 BD49K52 BD49K51 BD49K50 BD49K49 BD49K48 BD49K47 BD49K46 BD49K45 BD49K44 BD49K43 BD49K42 BD49K41 BD49K40 BD49K39 BD49K38 BD49K37 BD49K36 BD49K35 BD49K34 BD49K33 BD49K32 BD49K31 BD49K30 BD49K29 BD49K28 BD49K27 BD49K26 BD49K25 BD49K24 BD49K23 Kb Ka Hy Hr Hp Hn Hm Hk Hh Hg Hf He Hd Hc Hb Ha Gy Gr Gp Gn Gm Gk Gh Gg Gf Ge Gd Gc Gb Ga Fy Fr Fp Fn Fm Fk Fh Fg BD48L60 BD48L59 BD48L58 BD48L57 BD48L56 BD48L55 BD48L54 BD48L53 BD48L52 BD48L51 BD48L50 BD48L49 BD48L48 BD48L47 BD48L46 BD48L45 BD48L44 BD48L43 BD48L42 BD48L41 BD48L40 BD48L39 BD48L38 BD48L37 BD48L36 BD48L35 BD48L34 BD48L33 BD48L32 BD48L31 BD48L30 BD48L29 BD48L28 BD48L27 BD48L26 BD48L25 BD48L24 BD48L23 Np Nn Nm Nk Nh Ng Nf Ne Nd Nc Nb Na My Mr Mp Mn Mm Mk Mh Mg Mf Me Md Mc Mb Ma Ky Kr Kp Kn Km Kk Kh Kg Kf Ke Kd Kc BD49L60 BD49L59 BD49L58 BD49L57 BD49L56 BD49L55 BD49L54 BD49L53 BD49L52 BD49L51 BD49L50 BD49L49 BD49L48 BD49L47 BD49L46 BD49L45 BD49L44 BD49L43 BD49L42 BD49L41 BD49L40 BD49L39 BD49L38 BD49L37 BD49L36 BD49L35 BD49L34 BD49L33 BD49L32 BD49L31 BD49L30 BD49L29 BD49L28 BD49L27 BD49L26 BD49L25 BD49L24 BD49L23 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/15 TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series ●Absolute Maximum Ratings Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output Output Current *1*4 SSOP5 Power *2*4 SSOP3 Dissipation *3*4 VSOF5 Operating Temperature Ambient Storage Temperature *1 *2 *3 *4 Symbol VDD-GND VOUT Io Limits -0.3 to +10 GND-0.3 to +10 GND-0.3 to VDD+0.3 70 540 Unit V 700 210 -40 to +105 -55 to +125 mW Pd Topr Tstg V mA °C °C Reduced by 5.4mW/°C when used over 25°C. Reduced by 7.0mW/°C when used over 25°C. Reduced by 2.1mW/°C when used over 25°C. When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board). ●Electrical Characteristics (Unless Otherwise Specified, Ta=-40 to 105°C) Parameter Symbol Condition VDET=2.5V Ta=+25°C Ta=-40°C to 85°C Min. VDET(T) ×0.99 2.475 2.418 VDET=3.0V Ta=85°C to 105°C Ta=+25°C Ta=-40°C to 85°C 2.5 - Max. VDET(T) ×1.01 2.525 2.584 2.404 2.970 2.901 3.0 - 2.597 3.030 3.100 VDET=3.3V Ta=85°C to 105°C Ta=+25°C Ta=-40°C to 85°C 2.885 3.267 3.191 3.3 - 3.117 3.333 3.410 VDET=4.2V Ta=85°C to 105°C Ta=+25°C Ta=-40°C to 85°C 3.173 4.158 4.061 4.2 - 3.428 4.242 4.341 VDET=4.8V Ta=85°C to 105°C Ta=+25°C Ta=-40°C to 85°C 4.039 4.752 4.641 4.8 - 4.364 4.848 4.961 4.616 - 4.987 - - 100 0.95 1.20 0.51 0.56 0.60 0.66 0.75 0.80 0.85 0.90 - 1.53 1.68 1.80 1.98 2.25 2.40 2.55 2.70 - RL=470kΩ, VDD=H L Detection Voltage VDET Ta=85°C to 105°C CL=100pF RＬ=100kΩ Output Delay Time “L H” tPLH Vout=GND 50% VDET=2.3-3.1V VDET=3.2-4.2V *1 Circuit Current when ON ICC1 VDD=VDET-0.2V VDET=4.3-5.2V VDET=5.3-6.0V VDET=2.3-3.1V VDET=3.2-4.2V *1 Circuit Current when OFF ICC2 VDD=VDET+2.0V VDET=4.3-5.2V VDET=5.3-6.0V VOL≤0.4V, Ta=25 to 105°C, RL=470kΩ Operating Voltage Range VOPL VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ VDET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. CL: Capacitor to be connected between VOUT and GND. Design Guarantee. (Outgoing inspection is not done on all products.) *1 Guaranteed at Ta=25°C. *2 tPLH:VDD=(VDET typ.-0.5V) (VDET typ.+0.5V) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Limit Typ. 6/15 *1 VDET(T) Unit V *2 µs µA µA V TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series ●Electrical Characteristics (Unless Otherwise Specified, Ta=-40 to 105°C) - continued Parameter Symbol ‘Low’Output Voltage (Nch) VOL ‘High’Output Voltage (Pch) (BD49Exxx Series) VOH VDD=1.5V, ISINK = 0.4 mA, VDET=2.3-6.0V VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V) VDD=6.0V, ISOURCE=0.9 mA,VDET(4.3V to 5.2V) VDD=8.0V, ISOURCE=1.1 mA,VDET(5.3V to 6.0V) Leak Current when OFF Ileak VDD=VDS=10V (BD48xxx Series) Detection Voltage Ta=-40°C to 105°C VDET/∆T Temperature coefficient (Designed Guarantee) Hysteresis Voltage ∆VDET VDD=L H L, RL=470kΩ VDET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. CL: Capacitor to be connected between VOUT and GND. Design Guarantee. (Outgoing inspection is not done on all products.) *1 Guaranteed at Ta=25°C. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Limit Condition 7/15 *1 Unit Min. VDD-0.5 VDD-0.5 VDD-0.5 Typ. - Max. 0.5 0.5 - - - 0.1 µA - ±100 ±360 ppm/°C VDET×0.03 VDET×0.05 VDET×0.08 V V V TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series ●Block Diagrams VDD VOUT Vref GND Fig.1 BD48xxx series VDD VOUT Vref GND Fig.2 BD49xxx series www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/15 TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series ●Typical Performance Curves "LOW" OUTPUT CURRENT ： IOL [mA] 2.0 CIRCUIT CURRENT ： IDD[µA] 【BD48x42】 】 【BD4842G/FVE 【BD49x42】 1.5 1.0 0.5 0.0 0 1 2 3 4 5 6 7 8 9 10 20 BD4842G/FVE BD48x42】 】 【【 【BD49x42】 15 10 VDD =2.4V 5 VDD =1.2V 0 0.0 1.0 1.5 2.0 2.5 DRAIN-SOURCE VOLTAGE ： VDS[V] VDD SUPPLY VOLTAGE ：VDD[V] Fig.3 Circuit Current Fig.4 “Low” Output Current 45 9 BD4942G/FVE 【【 BD49x42】 】 40 OUTPUT VOLTAGE： VOUT [V] "HIGH" OUTPUT CURRENT ： IOH[mA] 0.5 35 30 25 20 VDD=8.0V 15 VDD=6.0V 10 5 VDD=4.8V 0 1 2 3 4 5 6 【BD49x42】 7 6 5 4 3 Ta=25℃ 2 1 0 0 BD4842G/FVE BD48x42】 】 【【 8 Ta=25℃ 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 DRAIN-SOURCE VOLTAGE ： VDS[V] VDD SUPPLY VOLTAGE ：VDD [V] Fig.5 “High” Output Current Fig.6 I/O Characteristics www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/15 TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series 1.0 【BD49x42】 0.8 【 BD48x42 】】 】 BD48x42x 【 【BD4842G/FVE 5.4 【 】 】】 BD48x42x 【BD48x42 【BD4842G/FVE DETECTION VOLTAGE: VDET[V] OUTPUT VOLTAGE : VOUT [V] ●Typical Performance Curves – continued 0.6 0.4 0.2 【BD49x42】 5.0 Low to High(VDET+∆VDET） 4.6 4.2 3.8 High to Low(VDET） 3.4 0.0 0 0.5 1 1.5 2 3.0 2.5 ～ ～ -40 1.5 BD48x42x 【【 【BD4842G/FVE BD48x42】】 】 【BD49x42】 1.0 0.5 0 20 40 60 40 80 Ta[℃] Fig.8 Detection Voltage Release Voltage CIRCUIT CURRENT WHEN OFF ： I DD2[μA] CIRCUIT CURRENT WHEN ON ： IDD1[μA] Fig.7 Operating Limit Voltage 0.0 -40 -20 0 TEMPERATURE : SUPPLY VOLTAGE : [V] 80 100 1.5 BD48x42x BD4842G/FVE 【【【 BD48x42】】 】 【BD49x42】 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] Fig.9 Circuit Current when ON Fig.10 Circuit Current when OFF www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/15 TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series ●Typical Performance Curves – continued MINIMUM OPERATION VOLTAGE ： VOPL[V] 1.5 【BD4842G/FVE 【 BD48x42x 】 】 【BD48x42】 【BD49x42】 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 TEMPERATURE ： Ta[℃] Fig.11 Operating Limit Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/15 TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series ●Application Information Explanation of Operation For both the open drain type (Fig.12) and the CMOS output type (Fig.13), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the appropriate threshold voltage, the VOUT terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical Characteristics for information on hysteresis. Because the BD48xxx series uses an open drain output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD R1 R1 RL Vref Vref Q2 VOUT VOUT R2 R2 Q1 Q1 R3 R3 GND GND Fig.12 (BD48xxx series Internal Block Diagram) Fig.13 (BD49xxx series Internal Block Diagram) Reference Data Examples of Leading (tPLH) and Falling (tPHL) Output Part Number BD48x45 tPLH (µs) 39.5 tPHL (µs) 87.8 BD49x45 32.4 VDD=4.3V 5.1V 52.4 VDD=5.1V 4.3V *These data are for reference only. The figures will vary with the application, so please check actual operating conditions before use. Timing Waveform Example: the following shows the relationship between the input voltages VDD and the output voltage VOUT when the input power supply voltage VDD swept up and down (the circuits are those in Fig.12 and 13). 1 VDD VDET+ΔVDET VDET ⑤ VOPL 0V VOUT VOH tPHL tPLH tPLH tPHL VOL ① ② ③ ④ Fig.14 Timing Waveform www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 When the power supply is turned on, the output is unstable from after over the operating limit voltage (VOPL) until tPHL. Therefore it is possible that the reset signal is not outputted when the rise time of VDD is faster than tPHL. 2 When V DD is greater than VOPL but less than the reset release voltage (VDET + ∆VDET), the output voltages will switch to Low. 3 If V DD exceeds the reset release voltage (VDET + ∆VDET), then VOUT switches from L to H. 4 If V DD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, VOUT switches to L (with a delay of tPHL). 5 The potential difference between the detection voltage and the release voltage is known as the hysteresis width (∆VDET). The system is designed such that the output does not toggle with power supply fluctuations within this hysteresis width, preventing malfunctions due to noise. 12/15 TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series ●Circuit Applications 1) Examples of a common power supply detection reset circuit. VDD2 VDD1 RL BD48xxx RST Micro controller Application examples of BD48xxx series (Open Drain output type) and BD49xxx series (CMOS output type) are shown on the left. CASE1: Power supply of the microcontroller (VDD2) differs from the power supply of the reset detection IC (VDD1). Use an open drain output type (BD48xxx) device with a load resistance RL attached as shown in figure 15. CL ( capacitor is for noise filtering ） GND CASE2: Power supply of the microcontroller (VDD1) is same as the power supply of the reset detection IC (VDD1). Use a CMOS output type (BD49xxx) device or an open drain device with a pull up resistor between output and VDD1. Fig.15 Open Drain Output Type VDD1 Micro RST controller BD49xxx CL When a capacitance CL for noise filtering is connected to the VOUT pin (the reset signal input terminal of the microcontroller), please take into account the rise and fall waveform of the output voltage (VOUT). ( capacitor is for filtering） The Electrical characteristics were measured using RL= 470kΩ and CL = 100pF. GND Fig.16 CMOS Output Type 2) The following is an example of a circuit application in which an OR connection between two types of detection voltage resets the microcontroller. VDD1 VDD2 VDD3 RL BD48xxx BD48xxx Microcontroller RST GND Fig.17 To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain output type (BD48xxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller (VDD3) as shown in Fig. 17. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/15 TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series 3) Examples of the power supply with resistor dividers In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause malfunction in the systems operation such as output oscillations, etc. V1 R2 I1 VDD BD48xxx BD49xxx R1 CIN VOUT CL GND Fig.18 When an in-rush current (I1) flows into the circuit (Refer to Fig. 18) at the time when output switches from “Low” to “High”, a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low” condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to oscillation. IDD Through Current 0 VDD VDET Fig.19 Current Consumption vs. Power Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/15 TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 BD48xxx series Datasheet BD49xxx series ●Operational Notes 1) Absolute maximum ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. 2) Ground Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) Recommended operating conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 4) Bypass Capacitor for Noise Rejection To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND. Be careful when using extremely big capacitor as transient response will be affected. 5) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 6) Operation under strong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 7) The VDD line impedance might cause oscillation because of the detection current. 8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD) condition. 10) External parameters The recommended parameter range for RL is 10kΩ to 1MΩ. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 11) Power on reset operation Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual operation. 12) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 13) Rush current When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. 14) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the pull up resistor should be less than 1/10 of the assumed leak resistance. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/15 TSZ02201-0R7R0G300030-1-2 22.May.2013.Rev.008 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001