Kingbright APTC2012SURC 2.0 x1.25mm smd chip led lamp Datasheet

2.0x1.25mm SMD CHIP LED LAMP
APTC2012SURC
HYPER RED
Features
Description
!2.0mmx1.25mm SMT LED,0.75mm THICKNESS.
The Hyper Red source color devices are made
!LOW
with DH
POWER CONSUMPTION.
! WIDE
VIEWING ANGLE.
InGaAlP on GaAs substrate Light
Emitting Diode.
!IDEAL FOR BACKLIGHT AND INDICATOR.
! VARIOUS
COLORS AND LENS TYPES AVAILABLE.
!PACKAGE
: 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
SPEC NO: DSAD0952
APPROVED : J. Lu
REV NO: V.1
CHECKED :Allen Liu
DATE: MAR/22/2003
DRAWN:S.J.HOU
PAGE: 1 OF 4
Selection Guide
Par t No .
Dic e
APTC2012SURC
Iv (m c d )
@ 20 m A
L en s Ty p e
HYPER RED (InGaAlP)
WATER CLEAR
V i ew i n g
An g l e
Min .
Ty p .
2θ1/2
70
180
12 0 °
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T)=25°°C
Sy m b o l
Par am et er
D ev i c e
λpeak
Peak Wavelength
Hyper Red
λD
Dominate Wavelength
∆λ1/2
Ty p .
Max .
Un it s
Tes t Co n d it io n s
640
nm
I F =20mA
Hyper Red
6 28
nm
I F =20mA
Spectral Line Half-width
Hyper Red
27
nm
I F =20mA
C
Capacitance
Hyper Red
45
pF
VF=0V;f=1MHz
VF
Forward Voltage
Hyper Red
1.9
2.5
V
I F =20mA
IR
Reverse Current
Hyper Red
10
uA
V R = 5V
Absolute Maximum Ratings at T)=25°°C
P ar am e t e r
H y p e r R ed
Un it s
Power dissipation
170
mW
DC Forward Current
30
mA
Peak Forward Current [1]
185
mA
Reverse Voltage
5
V
Operating/Storage Temperature
-40°C To +85°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: DSAD0952
APPROVED : J. Lu
REV NO: V.1
CHECKED :Allen Liu
DATE: MAR/22/2003
DRAWN:S.J.HOU
PAGE: 2 OF 4
Hyper Red
SPEC NO: DSAD0952
APPROVED : J. Lu
APTC2012SURC
REV NO: V.1
CHECKED :Allen Liu
DATE: MAR/22/2003
DRAWN:S.J.HOU
PAGE: 3 OF 4
APTC2012SURC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAD0952
APPROVED : J. Lu
REV NO: V.1
CHECKED :Allen Liu
DATE: MAR/22/2003
DRAWN:S.J.HOU
PAGE: 4 OF 4
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