LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DURL COLOR LED LAMPS Pb Lead-Free Parts LHRF9UG3392/R1-PF DATA SHEET DOC. NO : QW0905-LHRF9UG3392/R1-PFA REV. : A DATE : 22 - Apr. - 2015 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/9 PART NO. LHRF9UG3392/R1-PF Package Dimensions 5.0 5.9 7.6 8.6 10.5± 0.5 1.5 MAX 9UG □0.5 TYP 1 18.0MIN 1 2 3 2.0MIN 2.0MIN 2.54TYP HRF 2 3 1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE RED 2.54TYP Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF9UG3392/R1-PF Page 2/9 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT HRF 9UG Forward Current IF 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 60 mA Power Dissipation PD 75 75 mW ESD 2000 V Reverse Current @5V Ir 10 μA Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Electrostatic Discharge( * ) Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted AlGaInP Lens Red Forward Luminous Viewing Dominant Spectral voltage intensity angle wave halfwidth @20mA(V) @20mA(mcd) length 2θ 1/2 △λ nm λDnm (deg) Min. Max. Min. Typ. 630 20 1.5 2.4 28 50 76 574 20 1.7 2.6 12 21 76 White Diffused LHRF9UG3392/R1-PF AlGaInP Green Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/9 PART NO. LHRF9UG3392/R1-PF Brightness Code For Standard LED Lamps HRF CHIP Group Luminous Intensity(mcd) at 20 mA Min. Max. A8 28 38 A9 38 50 A10 50 65 A11 65 90 A12 90 120 A13 120 160 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/9 PART NO. LHRF9UG3392/R1-PF Brightness Code For Standard LED Lamps 9UG CHIP Group Luminous Intensity(mcd) at 20 mA Min. Max. A5 12 15 A6 15 21 A7 21 28 A8 28 38 A9 38 50 A10 50 65 Color Code 9UG CHIP Group Dominant Wave length(nm) at 20 mA Min. Max. 7 8 568 570 570 572 9 572 574 10 574 576 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF9UG3392/R1-PF Page 5/9 Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 3.0 2.5 2.0 1.5 1.0 0.5 0 1.0 1.5 2.0 2.5 3.0 1.0 10 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 3.0 Relative Intensity@20mA Normalize@25 ℃ 1.2 Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 100 Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 100 1.0 0.5 0 550 600 650 Wavelength (nm) 700 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/9 PART NO. LHRF9UG3392/R1-PF Typical Electro-Optical Characteristics Curve 9UG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0 1.0 2.0 3.0 4.0 5.0 1.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0 500 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity @20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity @20mA Normalize @25℃ Forward Voltage@20mA Normaliz @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF9UG3392/R1-PF Page 7/9 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 ° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 2° /sec max 0 Preheat 50 100 60 Seconds Max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/9 PART NO. LHRF9UG3392/R1-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 Page 9/9 PACKING SPECIFICATION 1. 500PCS / BAG 2. 8 BAG / INNER BOX SIZE : L X W X H 33.5cm X 19cm X 7.5cm L W H 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58.5cm X 34cm X 34cm L W C/NO: MADE IN CHINA . NO M IT E Y : Q'T ,: W : N, , W G, S PC s kg s kg H