Apr. 2010 DDR2 SDRAM Memory Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved. -1- Apr. 2010 Product Guide DDR2 SDRAM Memory 1. DDR2 SDRAM MEMORY ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 K 4 T X X X X X X X - X X X X SAMSUNG Memory Speed DRAM Temp & Power DRAM Type Package Type Revision Density Bit Organization Interface (VDD, VDDQ) # of Internal Banks 1. SAMSUNG Memory : K 8. Revision M A B C D E F G H I Q R 2. DRAM : 4 3. DRAM Type T : DDR2 SDRAM 4. Density 56 : 256Mb 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 9. Package Type Z J H M T B 5. Bit Organization 04 06 07 08 16 26 27 : 1st Gen. : 2nd Gen. : 3rd Gen. : 4th Gen. : 5th Gen. : 6th Gen. : 7th Gen. : 8th Gen. : 9th Gen. : 10th Gen. : 17th Gen. : 18th Gen. :x4 : x 4 Stack : x 8 Stack :x8 : x16 : x 4 Stack (JEDEC Standard) : x 8 Stack (JEDEC Standard) : : : : : : FBGA (Lead-free) FBGA DDP (Lead-free) FBGA (Lead-free & Halogen-free) FBGA DDP (Lead-free & Halogen-free) FBGA DSP (Lead-free & Halogen-free, Thin) FBGA (Lead-free & Halogen-free, Flip Chip) 10. Temp & Power C : Commercial Temp.( 0°C ~ 95°C) & Normal Power L : Commercial Temp.( 0°C ~ 95°C) & Low Power Y : Commercial Temp.( 0°C ~ 95°C) & Low Voltage 6. # of Internal Banks 3 : 4 Banks 4 : 8 Banks 7. Interface ( VDD, VDDQ) Q : SSTL_18 (1.8V, 1.8V) 11. Speed CC : DDR2-400 D5 : DDR2-533 E6 : DDR2-667 F7 : DDR2-800 E7 : DDR2-800 -2- (200MHz @ CL=3, tRCD=3, tRP=3) (266MHz @ CL=4, tRCD=4, tRP=4) (333MHz @ CL=5, tRCD=5, tRP=5) (400MHz @ CL=6, tRCD=6, tRP=6) (400MHz @ CL=5, tRCD=5, tRP=5) Apr. 2010 Product Guide DDR2 SDRAM Memory 2. DDR2 SDRAM Component Product Guide 2.1 SDRAM Density 512Mb I-die 1Gb Q-die 1Gb E-die 1Gb F-die 2Gb A-die Banks 4Banks 8Banks 8Banks 8Banks 8Banks Part Number Package & Power, Temp. (-C/-L) & Speed Org. K4T51043QI HCE7/F7/E6 128M x 4 K4T51083QI HCE7/F7/E6 64M x 8 K4T51163QI HCF8/E7/F7/E6 32M x 16 K4T1G044QQ HC(L)E7/F7/E6 256M x 4 K4T1G084QQ HC(L)E7/F7/E6 128M x 8 K4T1G164QQ HC(L)E7/F7/E6 64M x 16 K4T1G044QE HC(L)E7/F7/E6 256M x 4 K4T1G084QE HC(L)E7/F7/E6 128M x 8 K4T1G164QE HC(L)E7/F7/E6 K4T1G044QF BCE7/F7/E6 256M x 4 K4T1G084QF BCE7/F7/E6 128M x 8 K4T1G164QF BCE7/F7/E6 K4T2G044QA HC(L)F7/E6 512M x 4 K4T2G084QA HC(L)F7/E6 256M x 8 64M x 16 64M x 16 -3- PKG 60 ball FBGA Avail. Now 84 ball FBGA 60 ball FBGA Now 84 ball FBGA 60 ball FBGA Now 84 ball FBGA Now 60 ball FBGA Jun. ’10 84 ball FBGA May. ’10 68 ball FBGA Now Apr. 2010 Product Guide DDR2 SDRAM Memory 3. DDR2 SDRAM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 13 M X X X T X X X X X X X - X X X X Memory Module AMB Vendor DIMM Type Data bits DRAM Component Type Speed Temp & Power PCB Revision Depth # of Banks in Comp. & Interface Package Bit Organization Component Revision 1. Memory Module : M 8. Component Revision M B D F I R 2. DIMM Type 3 : DIMM 4 : SODIMM 3. Data Bits 78 : 91 : 92 : 93 : 95 : 70 : x64 x72 x72 x72 x72 x64 240pin Unbuffered DIMM 240pin ECC unbuffered DIMM 240pin VLP Registered DIMM 240pin Registered DIMM 240pin Fully Buffered DIMM 200pin Unbuffered SODIMM Z J Q H M E B T : DDR2 SDRAM 32 : 32M 64 : 64M 28 : 128M 56 : 256M 51 : 512M 1G : 1G 33 65 29 57 52 1K : 32M (for 128Mb/512Mb) : 64M (for 128Mb/512Mb) : 128M (for 128Mb/512Mb) : 256M (for 512Mb/2Gb) : 512M (for 512Mb/2Gb) : 1G (for 2Gb) 6. # of Banks in comp. & Interface 5 : 6 : 4Banks & SSTL-1.8V 8Banks & SSTL-1.8V 7. Bit Organization 0 3 4 6 7 8 9 : : : : : : : x4 x8 x16 x 4 Stack (JEDEC Standard) x 8 Stack (JEDEC Standard) x 4 Stack x 8 Stack 1st Gen. 3rd Gen. 5th Gen. 7th Gen. 10th Gen. 18th Gen. A C E G Q : : : : : 2nd Gen. 4th Gen. 6th Gen. 8th Gen. 17th Gen. 9. Package 4. DRAM Component Type 5. Depth : : : : : : : : : : : : : FBGA(Lead-free) FBGA DDP (Lead-free) FBGA QDP (Lead-free) FBGA (Lead-free & Halogen-free) FBGA DDP (Lead-free & Halogen-free) FBGA QDP (Lead-free & Halogen-free) FBGA (Lead-free & Halogen-free, Flip Chip) 10. PCB Revision 0 : Mother PCB 2 : 2nd Rev. 4 : 4th Rev. 1 3 A S : : : : 1st Rev. 3rd Rev. Parity DIMM Reduced PCB 11. Temp & Power C : Commercial Temp.( 0°C ~ 95°C) & Normal Power L : Commercial Temp.( 0°C ~ 95°C) & Low Power Y : Commercial Temp.( 0°C ~ 95°C) & Low Voltage 12. Speed CC : DDR2-400 D5 : DDR2-533 E6 : DDR2-667 F7 : DDR2-800 E7 : DDR2-800 (200MHz @ CL=3, tRCD=3, tRP=3) (266MHz @ CL=4, tRCD=4, tRP=4) (333MHz @ CL=5, tRCD=5, tRP=5) (400MHz @ CL=6, tRCD=6, tRP=6) (400MHz @ CL=5, tRCD=5, tRP=5) 13. AMB Vendor For FBDIMM : Intel 5 6, 8 : IDT 3, 4 : Montage NOTE : PC2-6400(DDR2-800), PC2-5300(DDR2-667) PC2-4200(DDR2-533), PC2-3200(DDR2-400) -4- Apr. 2010 Product Guide DDR2 SDRAM Memory 4. DDR2 SDRAM Module Product Guide 240Pin DDR2 Unbuffered DIMM Org. Density 64Mx 64 512MB 128Mx 64 1GB 128Mx 72 256Mx 64 2GB 256Mx 72 512Mx 64 512Mx 72 4GB Part Number Speed Composition Comp. Version M378T6464QZ(H)3 CE7/F7/E6 64M x 16 * 4pcs 1Gb Q-die M378T6464EHS CE7/F7/E6 64M x 16 * 4pcs 1Gb E-die 1Gb Q-die 128M x 8 * 8pcs 1Gb E-die M378T2863QZ(H)S CE7/F7/E6 M378T2863EHS CE7/F7/E6 M378T2863FBS CE7/F7/E6 1Gb F-die M391T2863QZ(H)3 CE7/F7/E6 1Gb Q-die M391T2863EH3 CE7/F7/E6 1Gb E-die 128M x 8 * 9pcs M391T2863FB3 CE7/F7/E6 1Gb F-die M378T5663QZ(H)3 CE7/F7/E6 1Gb Q-die M378T5663EH3 CE7/F7/E6 1Gb E-die 128M x 8 * 16pcs M378T5663FB3 CE7/F7/E6 1Gb F-die M391T5663QZ(H)3 CE7/F7/E6 1Gb Q-die M391T5663EH3 CE7/F7/E6 1Gb E-die M391T5663FB3 CE7/F7/E6 1Gb F-die 128M x 8 * 18pcs M378T5263AZ(H)3 CF7/E6 256M x 8 * 16pcs 2Gb A-die M391T5263AZ(H)3 CF7/E6 256M x 8 * 18pcs 2Gb A-die -5- Internal Banks 8 8 Rank PKG Height Avail. 1 84 ball FBGA 30mm Now 1 Now 1 60 ball FBGA 8 30mm Jun. ’10 Now 1 Jun. ’10 Now 8 2 60 ball FBGA 30mm Jun. ’10 Now Jun. ’10 8 2 68 ball FBGA 30mm Now Apr. 2010 Product Guide DDR2 SDRAM Memory 200Pin DDR2 SODIMM Org. Density 64Mx 64 512MB 128Mx 64 256Mx 64 512Mx 64 1GB 2GB 4GB Part Number Speed M470T6464QZ(H)3 C(L)E7/F7/E6 M470T6464EHS C(L)E7/F7/E6 M470T6554IH3 CE6 M470T2864QZ(H)3 C(L)E7/F7/E6 M470T2864EH3 C(L)E7/F7/E6 M470T2863EH3 C(L)E7/F7/E6 M470T2863FB3 CE7/F7/E6 M470T5663QZ(H)3 C(L)E7/F7/E6 M470T5663EH3 C(L)E7/F7/E6 M470T5663FB3 CE7/F7/E6 M470T5267AZ(H)3 C(L)F7/E6 Composition 64M x 16 * 4pcs 32M x 16 * 8pcs 64M x 16 * 8pcs 128M x 8 128M x 8 st.512M x 8 * 8pcs * 16pcs * -6- 8pcs Comp. Version 1Gb Q-die 1Gb E-die 512Mb I-die 1Gb Q-die 1Gb E-die 1Gb F-die 1Gb Q-die 1Gb E-die 1Gb F-die 2Gb A-die Internal Banks Rank PKG Height Avail. 8 1 84 ball FBGA 30mm Now 4 2 2 84 ball FBGA 1 60 ball FBGA 8 8 30mm 2 60 ball FBGA Now May. ’10 30mm Now May. ’10 8 2 83 ball FBGA 30mm Now Apr. 2010 Product Guide DDR2 SDRAM Memory 240Pin DDR2 Registered DIMM Org. Density Part Number M393T2863QZ(H)3 CD5/CC 128Mx 72 1GB M393T2863QZ(H)A CE7/F7/E6 256Mx 72 512Mx 72 1Gx 72 2GB 4GB Speed M393T2863FB3 CE7/F7/E6 M393T5663QZ3 CD5/CC M393T5663QZ(H)A CE7/F7/E6 M393T5660QZ3 CD5/CC M393T5660QZ(H)A CE7/F7/E6 M393T5660FB3 CE7/F7/E6 M393T5160QZ3 CD5/CC M393T5160QZ(H)A CE7/F7/E6 M393T5160FB3 CE7/F7/E6 Comp. Version Composition 128M x 8 * 9pcs Internal Banks Rank PKG Height 60 ball FBGA 30mm 1Gb Q-die 8 1 1Gb F-die 8 1 1Gb Q-die 1Gb F-die 1Gb Q-die 1Gb F-die 128M x 8 * 18pcs CF7/E6 512M x 4 * 18pcs 2Gb A-die M393T1G60QJ(M)A CE6/D5 DDP 512M x 4 * 36pcs 1Gb Q-die 8GB 60 ball FBGA 8 st.1G x 4 * 18pcs -7- 30mm Now Jun. ’10 2 8 2Gb A-die 60 ball FBGA 1 68 ball FBGA 4 63 ball FBGA 2 83 ball FBGA 8 CF7/E6 Jun. ’10 1 M393T5260AZ(H)A M393T1K66AZ(H)A Now 2 256M x 4 * 18pcs 256M x 4 * 36pcs Avail. Now 30mm Jun. ’10 Now 30mm Now Apr. 2010 Product Guide DDR2 SDRAM Memory 240Pin DDR2 VLP Registered DIMM Org. Density Part Number Speed 64Mx 72 512MB M392T6553GZA CF7/E6 128Mx 72 1GB 256Mx 72 2GB M392T2863QZ(H)A CF7/E6 M392T2863FBA CE7/F7/E6 M392T5660QZ(H)A CF7/E6 M392T5660FBA CE7/F7/E6 M392T5663QZ(H)A CF7/E6 M392T5663FBA CE7/F7/E6 Comp. Version Composition 64M x 8 * 9pcs 512Mb G-die 128M x 8 * 9pcs 256M x 4 * 18pcs 128M x 8 * 18pcs 1Gb Q-die 1Gb F-die 1Gb Q-die 1Gb F-die 1Gb Q-die 1Gb F-die Internal Banks Rank PKG Height Avail. 4 1 60 ball FBGA 18.3mm Now 8 1 60 ball FBGA 18.3mm Now 1 60 ball FBGA 8 Now Jun. ’10 18.3mm 2 Jun. ’10 Now Jun. ’10 512Mx 72 4GB M392T5160QJ(M)A CF7/E6 DDP 512M x 4 * 18pcs 1Gb Q-die 8 2 63 ball FBGA 18.3mm Now 1Gx 72 8GB M392T1G60QQ(E)A CE6/D5 QDP 1G x 4 * 18pcs 1Gb Q-die 8 4 65 ball FBGA 18.3mm Now -8- Apr. 2010 Product Guide DDR2 SDRAM Memory 240Pin DDR2 Fully Buffered DIMM(1.8V) Org. Density Part Number 64Mx 72 512MB M395T6553GZ4 M395T2863QZ(H)4 128Mx 72 1GB M395T2863FB4 Speed CE7/F7/E6 6 : IDT C1 CE6 5 : Intel D1 CE7/F7/E6 6 : IDT C1 CE7/F7/E6 8: IDT L4 CE6 5 : Intel D1 CE7/F7/E6 CE7/F7/E6 M395T5663QZ(H)4 256Mx 72 2GB CE7/F7/E6 CE6 M395T5663FB4 CE7/F7/E6 CE7/F7/E6 M395T5160QZ(H)4 CE6 CE6 512Mx 72 4GB M395T5160FB4 CE7/F7/E6 M395T5163QZ(H)4 CE7/F7/E6 M395T5163FB4 M395T5263AZ(H)4 M395T1G60QJ(M)4 1Gx 72 8GB M395T1K66AZ(H)4 AMB CE7/F7/E6 Composition 64M x 8 * 9pcs 128M x 8 * 9pcs 6 : IDT C1 8: IDT L4 Comp. Internal Version Banks 512Mb G-die 1Gb Q-die 1Gb F-die 1Gb Q-die Rank 4 1 8 1 PKG 60 ball FBGA 60 ball FBGA Height Avail. 30.35mm Now Now 30.35mm Jun. ’10 6 : IDT C1 8: IDT L4 5 : Intel D1 3: Montage D3 128M x 8 * 18pcs 6 : IDT C1 8: IDT L4 8 1Gb F-die 1Gb Q-die 2 60 ball FBGA Now 30.35mm Jun. ’10 6 : IDT C1 8: IDT L4 5 : Intel D1 3: Montage D3 8: IDT L4 8: IDT L4 128M x 8 * 36pcs 6 : IDT C1 CF7/E6 8: IDT L4 CE6/F7 8: IDT L4 CF7/E6/D5 6 : IDT C1 CF7/E6 8: IDT L4 1Gb F-die 1Gb Q-die FBGA 8 256M x 8 * 18pcs 2Gb A-die 2 DDP 512M x 4 * 36pcs 1Gb Q-die 4 8 -9- 2Gb A-die Jun. ’10 Now F-die st.1G x 4 * 18pcs 30.35mm 4 1Gb 8: IDT L4 CF7/E6 2 60 ball 6 : IDT C1 6 : IDT C1 Now 256M x 4 * 36pcs 2 Jun. ’10 68 ball Now FBGA 63 ball FBGA 83 ball FBGA 30.35mm Now Apr. 2010 Product Guide DDR2 SDRAM Memory 240Pin DDR2 Fully Buffered DIMM(1.55V) Comp. Internal Banks Density Part Number Speed AMB 128Mx 72 1GB M395T2863QZ(H)4 YE6 8: IDT L4 64M x 8 * 18pcs 1Gb Q-die 8 1 256Mx 72 2GB M395T5663QZ(H)4 YE6 8: IDT L4 128M x 8 * 18pcs 1Gb Q-die 8 2 1Gb Q-die 512Mx 72 1Gx 72 4GB 8GB Composition Version Org. M395T5160QZ(H)4 YE6 8: IDT L4 256M x 4 * 36pcs M395T5163QZ(H)4 YE6 8: IDT L4 128M x 8 * 36pcs YE6 8: IDT L4 256M x 8 * 18pcs 2Gb A-die M395T1K66AZ(H)4 YE6 8: IDT L4 st.1G x 4 * 18pcs 2Gb A-die - 10 - 2 8 M395T5263AZ(H)4 Rank 4 2 8 2 PKG 60 ball FBGA 60 ball FBGA Height Avail. 30.35mm Now 30.35mm Now 30.35mm Now 30.35mm Now 60 ball FBGA 68 ball FBGA 83 ball FBGA Apr. 2010 Product Guide DDR2 SDRAM Memory 5. Package Dimension 0.10MAX 60Ball FBGA for 1Gb Q-die (x4/x8) # A1 INDEX MARK 9.00 ± 0.10 A 0.80 x 8 = 6. 40 0.80 9 8 1.60 7 6 5 4 B 3 2 9.00 ± 0.10 #A1 1 A B C H 0.50±0.05 0.80 G 11.00 ± 0.10 F 11.00 ± 0.10 E 0.80 x 10 = 8.00 D 1.60 J K L 0.35±0.05 (0.95) (1.90) 1.10±0.10 Bottom Top 0.10MAX 84Ball FBGA for 1Gb Q-die (x16) # A1 INDEX MARK 9.00 ± 0.10 A 0.80 x 8 = 6. 40 0.80 9 8 7 9.00 ± 0.10 1.60 6 5 4 B 3 2 #A1 1 A B C D 0.50±0.05 0.80 J K 13.00 ± 0.10 H 13.00 ± 0.10 F G 0.80 x 14 = 11.20 E L M 1.60 N P R (0.95) 0.35±0.05 (1.90) Bottom Top - 11 - 1.10±0.10 Apr. 2010 Product Guide DDR2 SDRAM Memory 7.50 ± 0.10 A 0.80 x 8 = 6. 40 # A1 INDEX MARK 3.20 (Datum A) 0.80 9 8 7 0.10MAX 60Ball FBGA for 1Gb E-die (x4/x8) 1.60 6 5 4 B 3 2 7.50 ± 0.10 #A1 1 A B E 0.80 H J 4.00 F G 9.50 ± 0.10 D 9.50 ± 0.10 C 0.80 x 10 = 8.00 0.80 (Datum B) K L (0.95) 0.35±0.05 MOLDING AREA 1.10±0.10 (1.90) 60-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) Bottom 0.2 M A B Top 7.50 ± 0.10 A 0.80 x 8 = 6. 40 # A1 INDEX MARK 3.20 0.80 9 (Datum A) 8 7 0.10MAX 84Ball FBGA for 1Gb E-die (x16) 1.60 6 5 4 B 3 2 7.50 ± 0.10 #A1 1 A B C D G H 0.80 J K 4.00 L 12.50 ± 0.10 F 12.50 ± 0.10 E 0.80 x 14 = 11.20 0.80 (Datum B) M N P R (0.95) 84-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0.35±0.05 MOLDING AREA (1.90) 1.10±0.10 0.2 M A B Bottom Top - 12 - Apr. 2010 Product Guide DDR2 SDRAM Memory 7.50 ± 0.10 A 0.80 x 8 = 6. 40 # A1 INDEX MARK 3.20 (Datum A) 0.80 9 8 7 0.10MAX 60Ball FBGA for 1Gb F-die (x4/x8) 1.60 6 5 4 B 3 2 7.50 ± 0.10 #A1 1 A E F H 4.00 0.80 G J 9.50 ± 0.10 D 9.50 ± 0.10 C 0.80 x 10 = 8.00 0.80 B (Datum B) K L 0.37±0.05 (0.30) MOLDING AREA 1.10±0.10 60-∅0.48 Solder ball (Post reflow 0.50 ± 0.05) (0.60) Bottom 0.2 M A B Top 7.50 ± 0.10 A 0.80 x 8 = 6. 40 # A1 INDEX MARK 3.20 0.80 9 (Datum A) 8 7 0.10MAX 84Ball FBGA for 1Gb F-die (x16) 1.60 6 5 4 B 3 2 7.50 ± 0.10 #A1 1 A B C D H 0.80 J K 5.60 L 12.50 ± 0.10 F G 12.50 ± 0.10 E 0.80 x 14 = 11.20 0.80 (Datum B) M N P R 0.37±0.05 (0.30) MOLDING AREA 84-∅0.48 Solder ball (Post reflow 0.50 ± 0.05) 0.2 M A B 1.10±0.10 (0.60) Bottom Top - 13 - Apr. 2010 Product Guide DDR2 SDRAM Memory 68Ball FBGA for 2Gb A-die (x4/x8) 11.00 ± 0.10 #A1 0.80 x 8 = 6.40 3.20 11.00 ± 0.10 # A1 INDEX MARK 1.60 0.80 9 8 7 6 5 4 3 2 1 0.10MAX (Datum A) A B C (Datum B) D 7.20 E F L 0.80 M N 18.00 ± 0.10 J K 18.00 ± 0.10 8.00 H 0.80 x 18 = 14.40 G P R T U V W (0.95) 68-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0.2 M A B (1.90) 0.35 ± 0.05 1.10 ± 0.10 MOLDING AREA Bottom Top - 14 -