MBR560MFS, NRVB560MFS SWITCHMODE Power Rectifiers These state−of−the−art devices have the following features: Features • Low Power Loss / High Efficiency • New Package Provides Capability of Inspection and Probe After • • • • • • Board Mounting Guardring for Stress Protection Low Forward Voltage Drop 175°C Operating Junction Temperature NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable Wettable Flanks Option available These are Pb−Free Devices http://onsemi.com SCHOTTKY BARRIER RECTIFIERS 5 AMPERES 60 VOLTS 5,6 1,2,3 MARKING DIAGRAM Mechanical Characteristics: • • • • • • Case: Epoxy, Molded Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in. Lead Finish: 100% Matte Sn (Tin) Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL 1 Requirements The Heat Generated must be less than the Thermal Conductivity from Junction−to−Ambient: dPD/dTJ < 1/RJA MAXIMUM RATINGS Rating Symbol Value VRRM VRWM VR V 60 Average Rectified Forward Current (Rated VR, TC = 160°C) IF(AV) 5.0 A Peak Repetitive Forward Current, (Rated VR, Square Wave, 20 kHz, TC = 165°C) IFRM 10 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 100 A Storage Temperature Range Tstg −65 to +175 °C Operating Junction Temperature TJ −55 to +175 °C Unclamped Inductive Switching Energy (10 mH Inductor, Non−repetitive) EAS 10 mJ 3B ESD Rating (Machine Model) M4 A 1 SO−8 FLAT LEAD CASE 488AA STYLE 2 B560 A Y W ZZ A C B560 AYWZZ C Not Used = Specific Device Code = Assembly Location = Year = Work Week = Lot Traceability Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage ESD Rating (Human Body Model) A ORDERING INFORMATION Device Package Shipping† MBR560MFST1G SO−8 FL (Pb−Free) 1500 / Tape & Reel MBR560MFST3G SO−8 FL (Pb−Free) 5000 / Tape & Reel NRVB560MFST1G SO−8 FL (Pb−Free) 1500 / Tape & Reel NRVB560MFST3G SO−8 FL (Pb−Free) 5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2013 November, 2013 − Rev. 1 1 Publication Order Number: MBR560MFS/D MBR560MFS, NRVB560MFS THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Case, Steady State (Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board) Symbol Typ Max Unit RθJC − 2.4 °C/W 0.60 0.65 0.72 0.78 1.5 0.015 2.5 0.150 ELECTRICAL CHARACTERISTICS Instantaneous Forward Voltage (Note 1) (iF = 5 Amps, TJ = 100°C) (iF = 5 Amps, TJ = 25°C) vF Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 100°C) (Rated dc Voltage, TJ = 25°C) iR 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. http://onsemi.com 2 V mA MBR560MFS, NRVB560MFS TYPICAL CHARACTERISTICS 10 iF, INSTANTANEOUS FORWARD CURRENT (A) TA = 175°C TA = 150°C 1 TA = 100°C TA = 25°C TA = −40°C 0.1 0.2 0.3 0.4 0.5 0.6 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 Figure 2. Maximum Instantaneous Forward Characteristics 0.8 1.E+00 TA = 175°C TA = 150°C 1.E−03 1.E−01 TA = 175°C 1.E−02 TA = 150°C 1.E−03 TA = 100°C 1.E−04 TA = 100°C 1.E−04 1.E−05 1.E−05 TA = 25°C 1.E−06 TA = 25°C 1.E−06 1.E−07 1.E−08 1.E−07 TA = −40°C 0 10 20 30 40 50 TA = −40°C 1.E−08 60 1.E−09 0 10 20 30 40 50 VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V) Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics 1000 C, JUNCTION CAPACITANCE (pF) TA = −40°C Figure 1. Typical Instantaneous Forward Characteristics 1.E−02 TJ = 25°C 100 0 TA = 25°C VF, INSTANTANEOUS FORWARD VOLTAGE (V) 1.E−01 10 TA = 100°C VF, INSTANTANEOUS FORWARD VOLTAGE (V) 1.E+00 1.E−09 1.E−10 TA = 150°C 0.1 0.7 TA = 175°C 1 IR, INSTANTANEOUS REVERSE CURRENT (A) 0 IR, INSTANTANEOUS REVERSE CURRENT (A) 0.1 IF(AV), AVERAGE FORWARD CURRENT (A) iF, INSTANTANEOUS FORWARD CURRENT (A) 10 10 20 30 40 50 60 10 9 RqJC = 2.4°C/W 8 DC 7 6 Square Wave 5 4 3 2 1 0 60 80 100 120 140 160 VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (°C) Figure 5. Typical Junction Capacitance Figure 6. Current Derating TO−220AB http://onsemi.com 3 60 MBR560MFS, NRVB560MFS TYPICAL CHARACTERISTICS PF(AV), AVERAGE FORWARD POWER DISSIPATION (W) 8 IPK/IAV = 20 7 IPK/IAV = 10 TJ = 175°C 6 5 IPK/IAV = 5 4 3 Square Wave 2 DC 1 0 0 1 2 3 4 IF(AV), AVERAGE FORWARD CURRENT (A) Figure 7. Forward Power Dissipation 100 50% Duty Cycle R(t) (°C/W) 20% 10 10% 5% 2% 1 Assumes 25°C ambient and soldered to a 600 mm2 − oz copper pad on PCB 1% 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 PULSE TIME (sec) Figure 8. Thermal Characteristics http://onsemi.com 4 1 10 100 1000 MBR560MFS, NRVB560MFS PACKAGE DIMENSIONS DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE G 2X 0.20 C D 2 A B D1 2X 0.20 C 3 q E 2 2 DIM A A1 b c D D1 D2 E E1 E2 e G K L L1 M q 4X E1 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. c A1 4 TOP VIEW C 3X e 0.10 C SEATING PLANE DETAIL A A STYLE 2: PIN 1. ANODE 2. ANODE 3. ANODE 4. NO CONNECT 5. CATHODE 0.10 C SIDE VIEW 8X DETAIL A SOLDERING FOOTPRINT* b 0.10 C A B 0.05 c 3X 0.750 4 K 0.965 1.330 E2 L1 M 2X 0.905 2X 0.495 4.530 3.200 G 4X 1.000 e/2 1 PIN 5 (EXPOSED PAD) 4X 1.270 L MILLIMETERS MIN NOM MAX 0.90 1.00 1.10 0.00 −−− 0.05 0.33 0.41 0.51 0.23 0.28 0.33 5.15 BSC 4.50 4.90 5.10 3.50 −−− 4.22 6.15 BSC 5.50 5.80 6.10 3.45 −−− 4.30 1.27 BSC 0.51 0.61 0.71 1.20 1.35 1.50 0.51 0.61 0.71 0.05 0.17 0.20 3.00 3.40 3.80 0_ −−− 12 _ 0.475 D2 BOTTOM VIEW 2X 1.530 4.560 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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