2.0X1.25mm SMD CHIP LED LAMP APTK2012MBC BLUE Features Description !2.0mmX1.25mm SMT LED, 0.75mm THICKNESS. The Blue source color devices are made with GaN !LOW on SiC Light Emitting Diode. POWER CONSUMPTION. ! WIDE ! IDEAL VIEWING ANGLE. Static electricity and surge damage the LEDS. It is FOR BACKLIGHT AND INDICATOR. recommended to use a wrist band or anti- ! VARIOUS COLORS AND LENS TYPES AVAILABLE. electrostatic glove when handling the LEDs. !PACKAGE : 2000PCS / REEL. All devices, equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1125 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/23/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e APTK2012MBC Iv (m c d ) @ 20 m A L en s Ty p e BLUE (GaN) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 4 14 100° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Blue λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 430 nm I F =2 0 mA Blue 466 nm I F =2 0 mA Spectral Line Half-width Blue 60 nm I F =2 0 mA C Capacitance Blue 100 pF V F= 0 V ; f = 1 M H z VF Forward Voltage Blue 3.8 4.5 V I F =2 0 mA IR Reverse Current Blue 10 uA V R = 5V Absolute Maximum Ratings at T)=25°°C P ar am e t e r B lu e Un it s Power dissipation 105 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating / Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAD1125 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/23/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 Blue APTK2012MBC SPEC NO: DSAD1125 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/23/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APTK2012MBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1125 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/23/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4