bq294502, bq294504, bq294512, bq294515 bq294522, bq294524, bq294532, bq294562 bq294572, bq294582, bq294592 www.ti.com SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012 Overvoltage Protection for 2-Series and 3-Series Cell Li-Ion Batteries Check for Samples: bq294502, bq294504, bq294512, bq294515, bq294522, bq294524, bq294532, bq294562, bq294572, bq294582, bq294592 FEATURES • 1 • • • • 2-Series and 3-Series Cell Monitor for Secondary Protection Fixed Programmable Delay Timer Fixed OVP Threshold: – bq294502 = 4.35 V with 4-s Delay Timer – bq294504 = 4.35 V with 6.5-s Delay Timer – bq294512 = 4.40 V with 4-s Delay Timer – bq294515 = 4.425 V with 4-s Delay Timer – bq294522 = 4.45 V with 4-s Delay Timer – bq294524 = 4.45 V with 6.5-s Delay Timer – bq294532 = 4.50 V with 4-s Delay Timer – bq294562 = 4.25 V with 4-s Delay Timer – bq294572 = 4.00 V with 4-s Delay Timer – bq294582 = 4.225 V with 4-s Delay Timer – bq294584 = 4.225 V with 6.5-s Delay Timer – bq294592 = 4.30 V with 4-s Delay Timer High-Accuracy Overvoltage Protection: ± 10 mV • • Low Power Consumption ICC ≈ 1 µA (VCELL(ALL) < VPROTECT) Low leakage current per cell input < 100 nA Small package footprint – 6-pin SON APPLICATIONS • 2nd-Level Protection in Li-Ion Battery Packs in: – Tablets – Slates – Power Tools – Notebook Computers – Portable Equipment and Instrumentation DESCRIPTION The bq2945xy family of products is a secondary level voltage monitor and protector for Li-Ion battery pack systems. Each cell is monitored independently for an overvoltage condition. Based on the configuration, an output is triggered after a fixed delay if any one of the two or three cells has an overvoltage condition. This output will be triggered into a high state after an overvoltage condition has satisfied the specified delay timer. DRV Package (Top View) V3 1 V2 2 VSS 3 6 OUT 5 VDD 4 V1 PWR PAD 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2012, Texas Instruments Incorporated bq294502, bq294504, bq294512, bq294515 bq294522, bq294524, bq294532, bq294562 bq294572, bq294582, bq294592 SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION (1) TA OVP (V) DELAY TIME (S) TAPE AND REEL (LARGE) TAPE AND REEL (SMALL) bq294502 4.35 4.0 bq294502DRVR bq294502DRVT bq294504 4.35 6.5 bq294504DRVR bq294504DRVT bq294512 4.40 4.0 bq294512DRVR bq294512DRVT bq294515 4.425 4.0 bq294515DRVR bq294515DRVT bq294522 4.45 4.0 bq294522DRVR bq294522DRVT 4.45 6.5 bq294524DRVR bq294524DRVT 4.50 4.0 bq294532DRVR bq294532DRVT 4.25 4.0 bq294562DRVR bq294562DRVT bq294572 4.00 4.0 bq294572DRVR bq294572DRVT bq294582 4.225 4.0 bq294582DRVR bq294582DRVT bq294584 (2) 4.225 6.5 bq294584DRVR bq294584DRVT bq294592 4.30 4.0 bq294592DRVR bq294592DRVT PART NUMBER –40°C to 110°C bq294524 bq294532 PACKAGE SON-6 PACKAGE DESIGNATOR DRV bq294562 (1) (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder on ti.com (www.ti.com). Product Preview only THERMAL INFORMATION bq2945xy THERMAL METRIC (1) SON UNITS 6 PINS θJA Junction-to-ambient thermal resistance 186.4 θJC(top) Junction-to-case(top) thermal resistance 90.4 θJB Junction-to-board thermal resistance 110.7 ψJT Junction-to-top characterization parameter 96.7 ψJB Junction-to-board characterization parameter 90 θJC(bottom) Junction-to-case(bottom) thermal resistance n/a (1) 2 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562 bq294572 bq294582 bq294592 bq294502, bq294504, bq294512, bq294515 bq294522, bq294524, bq294532, bq294562 bq294572, bq294582, bq294592 www.ti.com SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012 PIN FUNCTIONS bq2945xy Pin Name Type I/O 1 V3 IA Sense input for positive voltage of the third cell from the bottom of the stack Description 2 V2 IA Sense input for positive voltage of the second cell from the bottom of the stack 3 VSS P Electrically connected to IC ground and negative terminal of the lowest cell in the stack 4 V1 IA Sense input for positive voltage of the lowest cell in the stack 5 VDD P Power supply 6 OUT OA Output drive for external N-Channel FET Thermal Pad PWRPAD — VSS pin to be connected to the PWRPAD on the printed circuit board for proper operation PIN DETAILS Description Cell Voltage (V) (V3 –V2, V2 – V1, V1–VSS) The voltage sensing for each cell is done independently using a multiplexer. The method of overvoltage detection is comparing the voltage to an overvoltage protection voltage VOV. Once the voltage exceeds the programmed fixed value, the delay timer circuit is activated. This delay (tDELAY) is fixed for either a 4-s or 6.5-s delay. When these conditions are satisfied, the OUT terminal is transitioned to a high level. This output (OUT) is released to a low condition if all of the cell inputs (Vx) are below the OVP threshold minus the Vhys. VOV VOV –V HYS t DELAY OUT (V) Figure 1. Timing for Overvoltage Sensing Sense Positive Input for Vx This is an input to sense each single battery cell voltage. A series resistor and a capacitor across the cell for each input is required for noise filtering and stable voltage monitoring. Output Drive, OUT The gate of an external N-Channel MOSFET is connected to this terminal. This output transitions to a high level when an overvoltage condition is detected and after the programmed delay timer. The out will reset to a low level if the cell voltage falls below the VOV threshold before the fixed delay timer expires. Supply Input, VDD This terminal is the unregulated input power source for the IC. A series resistor is connected to limit the current, and a capacitor is connected to ground for noise filtering. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562 bq294572 bq294582 bq294592 3 bq294502, bq294504, bq294512, bq294515 bq294522, bq294524, bq294532, bq294562 bq294572, bq294582, bq294592 SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012 www.ti.com Thermal Pad, PWRPAD For correct operation, the power pad (PWRPAD) is connected to the VSS terminal on the printed circuit board. FUNCTIONAL BLOCK DIAGRAM PACK+ R VD CVD VDD RIN V3 CIN V2 RIN CIN V1 RIN Multiplexer Switch Network REG INT_EN VOV Delay Timer OUT OSC CIN VSS PWRPAD PACK– ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range (unless otherwise noted) (1) PARAMETER CONDITION VALUE/UNIT Supply voltage range Input voltage range VDD–VSS –0.3 to 30 V V1–VSS or V2–VSS or V3–VSS –0.3 to 30 V V3–V2 or V2–V1 –0.3 to 8 V Output voltage range OUT–VSS Continuous total power dissipation, PTOT –0.3 to 30 V See package dissipation rating. Functional temperature –65 to 110°C Storage temperature range, TSTG –65 to 150°C Lead temperature (soldering, 10 s), TSOLDER (1) 300°C Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum–rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range (unless otherwise noted) PARAMETER Supply voltage, VDD (1) Input voltage range V3–V2 or V2–V1 or V1–VSS Operating ambient temperature range, TA (1) 4 MIN NOM MAX UNIT 3 25 V 0 5 V –40 110 °C See APPLICATION SCHEMATIC. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562 bq294572 bq294582 bq294592 bq294502, bq294504, bq294512, bq294515 bq294522, bq294524, bq294532, bq294562 bq294572, bq294582, bq294592 www.ti.com SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012 DC CHARACTERISTICS Typical values stated where TA = 25°C and VDD = 10.8 V, MIN/MAX values stated where TA = –40°C to 110°C and VDD = 3 V to 15 V (unless otherwise noted). Symbol Parameter Condition Min Typ Max Unit Voltage Protection Threshold VCx 1.0 bq294502, fixed delay 4 s 4.35 V 1.1 bq294504, fixed delay 6.5 s 4.35 V 1.2 bq294512, fixed delay 4 s 4.40 V 1.3 bq294515, fixed delay 4 s 4.425 V bq294522, fixed delay 4 s 4.45 V bq294524, fixed delay 6.5 s 4.45 V bq294532, fixed delay 4 s 4.50 V 1.7 bq294562, fixed delay 4 s 4.25 V 1.8 bq294572, fixed delay 4 s 4.00 V 1.9 bq294582, fixed delay 4 s 4.225 V 4.225 V 4.30 V 1.4 1.5 1.6 VOV V(PROTECT) – Overvoltage Detection 1.10 bq294584, fixed delay 6.5 s 1.11 bq294592, fixed delay 4 s 1.12 VHYS Overvoltage Detection Hysteresis 1.13 VOA OV Detection Accuracy TA = 25°C 1.14 VOA –DRIFT OV Detection Accuracy due to Temperature TA = -40°C TA = 0°C TA = 60°C TA = 110°C (1) 250 300 400 mV –10 10 mV -40 -20 -24 -54 44 20 24 54 mV mV mV mV Supply and Leakage Current 1.15 ICC Supply Current (V3–V2) = (V2–V1) = (V1–VSS) = 4.0 V (See Figure 11 for reference) 1 µA (V3–V2) = (V2–V1) = (V1–VSS) = 2.8 V with TA = –40°C to 60°C 1.25 Measured at V3, V2, and V1 = 4.0 V (V2–V1) = (V1–VSS) = 4.0 V TA = 0°C to 60°C (See Figure 11 for reference.) –0.1 1.17 (V3–V2) or (V2–V1) or (V1–VSS) > VOV VDD = 7.2 V, IOH = 100 µA, TA = –40°C to 110°C 6 1.18 Two of the three cells are short circuit and only one cell is powered (V3–V2) or (V2–V1) or (V1–VSS) > VOV VDD = Vx (Cell voltage), IOH = 100 µA, TA = –40°C to 110°C 1.16 IIN Input Current at Vx Pins 2 0.1 µA Output Drive OUT VOUT Output Drive Voltage VDD – 0.2 (V3–V2), (V2–V1), and (V1–VSS) < VOV, IOL = 100 µA, TA = 25°C TA = –40°C to 110°C 1.19 OUT Short Circuit Current OUT = 0 V (V3–V2) or (V2–V1) or (V1–VSS) > VOV tR Output Rise Time CL = 1 nF, VOH(OUT) = 0 V to 5 V ZO Output Impedance 1.20 IOUT(Short) 1.21 1.22 V 250 (2) V 400 mV 4.5 mA 5 µs 2 5 kΩ Fixed Delay Timer 1.23 (1) (2) tDELAY Fault Detection Delay Time Fixed Delay, bq2945x2 3.2 4 4.8 Fixed Delay, bq2945x4 5.2 6.5 7.8 s Product Preview only Specified by design. Not 100% tested in production. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562 bq294572 bq294582 bq294592 5 bq294502, bq294504, bq294512, bq294515 bq294522, bq294524, bq294532, bq294562 bq294572, bq294582, bq294592 SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012 www.ti.com DC CHARACTERISTICS (continued) Typical values stated where TA = 25°C and VDD = 10.8 V, MIN/MAX values stated where TA = –40°C to 110°C and VDD = 3 V to 15 V (unless otherwise noted). Symbol Parameter Condition Min Typ Max Unit Voltage Protection Threshold VCx 1.24 tDELAY_CTM Fault Detection Delay Time in Test Mode Fixed delay (Internal settings) 15 ms TYPICAL CHARACTERISTICS 1.3 ICC Current (µA) 1.2 1.1 1 0.9 0.8 0.7 -40 0 25 Temperature Deg C 60 110 Figure 2. ICC Current Consumption Versus Temperature Overoltage Threshold (V) 4.370 4.360 4.350 Min 4.340 Max Mean 4.330 4.320 4.310 –40 0 25 60 110 Temperature Deg C Figure 3. bq294502 Overvoltage Threshold (OVT) vs. Temp 6 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562 bq294572 bq294582 bq294592 bq294502, bq294504, bq294512, bq294515 bq294522, bq294524, bq294532, bq294562 bq294572, bq294582, bq294592 www.ti.com SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012 325 324 323 Vhys (mV) 322 321 320 319 318 317 316 315 -40 0 25 60 110 Temperature Deg C Figure 4. Hysteresis VHYS Versus Temperature –3.85 –3.9 I OUT (mA) –3.95 –4 –4.05 –4.1 –40 0 25 60 110 Temperature Deg C VOH (V) Figure 5. Output Current IOUT Versus Temperature 8.0 7.5 7.0 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 3-cell data 2-cell data 0 100 200 300 400 500 600 700 800 900 1,000 IOH (µA) Figure 6. Output Voltage Versus Output Current Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562 bq294572 bq294582 bq294592 7 bq294502, bq294504, bq294512, bq294515 bq294522, bq294524, bq294532, bq294562 bq294572, bq294582, bq294592 SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012 www.ti.com APPLICATION INFORMATION Pack + RVD bq2945xy RIN VCELL3 RIN VCELL2 RIN CIN V3 OUT V2 VDD CIN CVD V1 VSS PWRPAD VCELL1 CIN Pack– Figure 7. Application Configuration Changes to the ranges stated in Table 1 will impact the accuracy of the cell measurements. Figure 7 shows each external component. Table 1. Parameters PARAMETER External Component MIN NOM MAX Voltage monitor filter resistance RIN 900 1000 1100 Ω Voltage monitor filter capacitance CIN 0.01 0.1 µF Supply voltage filter resistance RVD 100 Supply voltage filter capacitance CVD 1K 0.1 UNIT Ω µF APPLICATION SCHEMATIC Pack + Pack + 100 100 bq2945xy 1k VCELL3 1k 0.1µF VCELL2 1k VCELL1 bq2945xy V3 OUT V2 VDD VSS V1 V3 OUT V2 VDD 1k VCELL2 0.1µF 1k 0.1 µF VSS 0.1 µF VCELL1 PWRPAD V1 0.1µF PWRPAD 0.1µF 0.1µF Pack – Pack – Figure 8. 3-Series Cell Configuration with Fixed Delay Figure 9. 2-Series Cell Configuration with Internal Fixed Delay CUSTOMER TEST MODE Customer Test Mode (CTM) helps to reduce test time for checking the overvoltage delay timer parameter once the circuit is implemented in the battery pack. To enter CTM, VDD should be set to at least 10 V higher than V3 (see Figure 10). The delay timer is greater than 10 ms, but considerably shorter than the timer delay in normal operation. To exit Customer Test Mode, remove the VDD to VC3 voltage differential of 10 V so that the decrease in this value automatically causes an exit. CAUTION Avoid exceeding any Absolute Maximum Voltages on any pins when placing the part into Customer Test Mode. Also avoid exceeding Absolute Maximum Voltages for the individual cell voltages (V3–V2), (V2–V1), and (V1–VSS). Stressing the pins beyond the rated limits may cause permanent damage to the device. 8 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562 bq294572 bq294582 bq294592 bq294502, bq294504, bq294512, bq294515 bq294522, bq294524, bq294532, bq294562 bq294572, bq294582, bq294592 www.ti.com SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012 Cell Voltage (V) (V3) VDD – V3 (V) Figure 10 shows the timing for the Customer Test Mode. 10 V VOV VOV – VHYS t DELAY > 10 ms OUT (V) Figure 10. Timing for Customer Test Mode Figure 11 shows the measurement for current consumption for the product for both VDD and Vx. bq2945xy IIN 3.6 V IIN 3.6 V IIN 3.6 V 1 V3 OUT 6 2 V2 VDD 5 V1 4 3 VSS I CC PWRPAD Figure 11. Configuration for IC Current Consumption Test Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562 bq294572 bq294582 bq294592 9 bq294502, bq294504, bq294512, bq294515 bq294522, bq294524, bq294532, bq294562 bq294572, bq294582, bq294592 SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012 www.ti.com REVISION HISTORY Changes from Original (September 2011) to Revision A • Page Added the bq294582 Device to Production Data ................................................................................................................. 2 Changes from Revision A (November 2011) to Revision B Page • Changed the bq294504 Device to Production Data ............................................................................................................. 1 • Added the bq294512 Device ................................................................................................................................................ 1 • Added the bq294592 Device ................................................................................................................................................ 1 • Added a second ICC Test Condition ...................................................................................................................................... 5 • Changed Fault Detection Delay Time in bq2945x4 Test Mode Specifications ..................................................................... 5 Changes from Revision B (February 2012) to Revision C Page • Added the bq294515 Device to Production Data ................................................................................................................. 2 • Added the bq294524 Device to Production Data ................................................................................................................. 2 • Added the bq294532 Device to Production Data ................................................................................................................. 2 • Added the bq294572 Device to Production Data ................................................................................................................. 2 • Changed Overvoltage Detection Hysteresis ......................................................................................................................... 5 • Added Output Voltage Versus Output Current graphic ........................................................................................................ 7 • Changed Timing for Customer Test Mode figure ................................................................................................................. 9 10 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562 bq294572 bq294582 bq294592 PACKAGE OPTION ADDENDUM www.ti.com 28-May-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) BQ294502DRVR ACTIVE SON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294502DRVT ACTIVE SON DRV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294504DRVR ACTIVE SON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294504DRVT ACTIVE SON DRV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294512DRVR ACTIVE SON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294512DRVT ACTIVE SON DRV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294515DRVR PREVIEW SON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294515DRVT PREVIEW SON DRV 6 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294522DRVR ACTIVE SON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294522DRVT ACTIVE SON DRV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294582DRVR ACTIVE SON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294582DRVT ACTIVE SON DRV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294592DRVR ACTIVE SON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ294592DRVT ACTIVE SON DRV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 28-May-2012 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 6-Jun-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing BQ294502DRVR SON DRV 6 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3000 330.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 BQ294502DRVT SON DRV 6 250 180.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 BQ294504DRVR SON DRV 6 3000 330.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 BQ294504DRVT SON DRV 6 250 180.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 BQ294512DRVR SON DRV 6 3000 330.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 BQ294512DRVT SON DRV 6 250 180.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 BQ294522DRVR SON DRV 6 3000 330.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 BQ294522DRVT SON DRV 6 250 180.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 BQ294582DRVR SON DRV 6 3000 330.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 BQ294582DRVT SON DRV 6 250 180.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 BQ294592DRVR SON DRV 6 3000 330.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 BQ294592DRVT SON DRV 6 250 180.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 6-Jun-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ294502DRVR SON DRV 6 3000 346.0 346.0 29.0 BQ294502DRVT SON DRV 6 250 210.0 185.0 35.0 BQ294504DRVR SON DRV 6 3000 346.0 346.0 29.0 BQ294504DRVT SON DRV 6 250 210.0 185.0 35.0 BQ294512DRVR SON DRV 6 3000 346.0 346.0 29.0 BQ294512DRVT SON DRV 6 250 210.0 185.0 35.0 BQ294522DRVR SON DRV 6 3000 346.0 346.0 29.0 BQ294522DRVT SON DRV 6 250 210.0 185.0 35.0 BQ294582DRVR SON DRV 6 3000 346.0 346.0 29.0 BQ294582DRVT SON DRV 6 250 210.0 185.0 35.0 BQ294592DRVR SON DRV 6 3000 346.0 346.0 29.0 BQ294592DRVT SON DRV 6 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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