Product Folder Order Now Support & Community Tools & Software Technical Documents LM139-MIL SLCS160 – JUNE 2017 LM139-MIL Quad Differential Comparators 1 Features 2 Applications • • • 1 • • • • • • • • • Wide Supply Ranges – Single Supply: 2 V to 36 V (Tested to 30 V) – Dual Supplies: ±1 V to ±18 V (Tested to ±15 V) Low Supply-Current Drain Independent of Supply Voltage: 0.8 mA (Typical) Low Input Bias Current: 25 nA (Typical) Low Input Offset Current: 3 nA (Typical) Low Input Offset Voltage: 2 mV (Typical) Common-Mode Input Voltage Range Includes Ground Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage: ±36 V Low Output Saturation Voltage Output Compatible With TTL, MOS, and CMOS On Products Compliant to MIL-PRF-38535, All Parameters Are Tested Unless Otherwise Noted. On All Other Products, Production Processing Does Not Necessarily Include Testing of All Parameters. • • • • Industrial Automotive – Infotainment and Clusters – Body Control Modules Power Supervision Oscillators Peak Detectors Logic Voltage Translation 3 Description The LM139-MIL device consists of four independent voltage comparators that are designed to operate from a single power supply over a wide range of voltages. Operation from dual supplies also is possible, as long as the difference between the two supplies is 2 V to 36 V, and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is independent of the supply voltage. The outputs can be connected to other open-collector outputs to achieve wired-AND relationships. The LM139-MIL device is characterized for operation over the full military temperature range of –55°C to +125°C. Device Information(1) PART NUMBER LM139-MIL PACKAGE BODY SIZE (NOM) CDIP (14) 21.30 mm × 7.60 mm LCCC (20) 8.90 mm × 8.90 mm CFP (14) 9.20 mm × 6.29 mm SOIC (14) 8.70 mm × 3.90 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic IN+ OUT IN− 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. LM139-MIL SLCS160 – JUNE 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 4 4 4 5 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics .......................................... Typical Characteristics .............................................. 7.3 Feature Description................................................... 7 7.4 Device Functional Modes.......................................... 7 8 Application and Implementation .......................... 8 8.1 Application Information.............................................. 8 8.2 Typical Application ................................................... 8 9 Power Supply Recommendations...................... 10 10 Layout................................................................... 10 10.1 Layout Guidelines ................................................. 10 10.2 Layout Example .................................................... 10 11 Device and Documentation Support ................. 11 11.1 11.2 11.3 11.4 11.5 Detailed Description .............................................. 7 7.1 Overview ................................................................... 7 7.2 Functional Block Diagram ......................................... 7 Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 11 11 11 11 11 12 Mechanical, Packaging, and Orderable Information ........................................................... 11 4 Revision History 2 DATE REVISION NOTES June 2017 * Initial release. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM139-MIL LM139-MIL www.ti.com SLCS160 – JUNE 2017 5 Pin Configuration and Functions D, J, or W Package SOIC, CDIP, or CFP Top View 14 2 13 3 12 4 11 5 10 6 9 7 8 2OUT 1OUT NC 3OUT 4OUT 1 OUT3 OUT4 GND 4IN+ 4IN− 3IN+ 3IN− 3 VC C NC 2IN− NC 2IN+ 4 2 1 20 19 18 17 16 5 6 15 7 8 14 9 10 11 12 13 GND NC 4IN+ NC 4IN− 1IN− 1IN+ NC 3IN− 3IN+ 1OUT 2OUT VC C 2IN− 2IN+ 1IN− 1IN+ FK Package 20-Pin LCCC Top View NC = no internal connection. Pin Functions PIN NAME I/O (1) DESCRIPTION D, J, W FK 1IN+ 7 10 I Positive input pin of the comparator 1 1IN– 6 9 I Negative input pin of the comparator 1 1OUT 1 2 O Output pin of the comparator 1 2IN+ 5 8 I Positive input pin of the comparator 2 2IN– 4 6 I Negative input pin of the comparator 2 2OUT 2 3 O Output pin of the comparator 2 3IN+ 9 13 I Positive input pin of the comparator 3 3IN– 8 12 I Negative input pin of the comparator 3 3OUT 14 20 O Output pin of the comparator 3 4IN+ 11 16 I Positive input pin of the comparator 4 4IN– 10 14 I Negative input pin of the comparator 4 4OUT 13 19 O Output pin of the comparator 4 GND 12 18 — Ground VCC 3 4 — Supply pin — No connect (no internal connection) 1 5 NC — 7 11 15 17 (1) I = Input, O = Output Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM139-MIL 3 LM139-MIL SLCS160 – JUNE 2017 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT 36 V ±36 V Supply voltage (2) VCC (3) VID Differential input voltage VI Input voltage range (either input) IK –0.3 36 V Input current (4) –50 mA VO Output voltage 36 V IO Output current 20 mA Duration of output short circuit to ground (5) TJ Operating virtual-junction temperature Tstg (1) (2) (3) (4) (5) Unlimited 150 °C Case temperature for 60 s FK package 260 °C Lead temperature 1.6 mm (1/16 in) from case for 60 s J package 300 °C 150 °C Storage temperature –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to network ground. Differential voltages are at xIN+ with respect to xIN–. Input current flows through parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output to be incorrect. Normal operation resumes when input is removed. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±500 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±750 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VCC Supply voltage TJ Junction temperature MIN MAX UNIT 2 30 V –55 125 °C 6.4 Thermal Information LM139-MIL THERMAL METRIC (1) UNIT D (SOIC) J (CDIP) W (CFP) FK (LCCC) 156.2 82.5 °C/W RθJA Junction-to-ambient thermal resistance 98.8 89.5 RθJC(top) Junction-to-case (top) thermal resistance 64.3 46.1 86.7 60.7 °C/W RθJB Junction-to-board thermal resistance 59.7 78.7 154.6 59.4 °C/W ψJT Junction-to-top characterization parameter 25.7 3 56.5 53 °C/W ψJB Junction-to-board characterization parameter 59.3 71.8 133.5 58.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — 24.2 14.3 9.7 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM139-MIL LM139-MIL www.ti.com SLCS160 – JUNE 2017 6.5 Electrical Characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER MIN TA = 25°C VIO Input offset voltage VCC = 5 V to 30 V, VIC = VICR min, VO = 1.4 V IIO Input offset current VO = 1.4 V IIB Input bias current VO = 1.4 V VICR Common-mode input-voltage range (2) AVD Large-signal differential-voltage amplification VCC+ = ±7.5 V, VO = –5 V to +5 V IOH High-level output current VID = 1 V VOL Low-level output voltage VID = –1 V, IOL = 4 mA TA = –55°C to +125°C IOL Low-level output current VID = –1 V, VOL = 1.5 V TA = 25°C ICC Supply current (four comparators) VO = 2.5 V, No load TA = 25°C MAX 2 5 TA = –55°C to +125°C UNIT mV 9 TA = 25°C 3 TA = –55°C to +125°C 25 nA 100 TA = 25°C –25 TA = –55°C to +125°C –100 nA –300 TA = 25°C 0 to VCC – 1.5 TA = –55°C to +125°C 0 to –2 VCC V TA = 25°C 200 V/mV VOH = 5 V TA = 25°C 0.1 nA VOH = 30 V TA = –55°C to +125°C 1 TA = 25°C (1) (2) TYP 150 400 700 6 μA 16 mV mA 0.8 2 mA All characteristics are measured with zero common-mode input voltage, unless otherwise specified. The voltage at either input or common-mode must not be allowed to go negative by more than 0.3 V. The upper end of the commonmode voltage range is VCC+ – 1.5 V; however, one input can exceed VCC, and the comparator will provide a proper output state as long as the other input remains in the common-mode range. Either or both inputs can go to 30 V without damage. 6.6 Switching Characteristics VCC = 5 V, TA = 25°C PARAMETER Response time (1) (2) TEST CONDITIONS RL connected to 5 V through 5.1 kΩ, CL = 15 pF (1) (2) TYP 100-mV input step with 5-mV overdrive 1.3 TTL-level input step 0.3 UNIT μs CL includes probe and jig capacitance. The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM139-MIL 5 LM139-MIL SLCS160 – JUNE 2017 www.ti.com 6.7 Typical Characteristics 80 1.8 1.6 IIN – Input Bias Current – nA ICC – Supply Current – mA 70 TA = –55°C 1.4 TA = 25°C TA = 0°C 1.2 1 TA = 70°C 0.8 TA = 125°C 0.6 0.4 TA = –55°C 60 TA = 0°C 50 TA = 25°C 40 TA = 70°C 30 TA = 125°C 20 10 0.2 0 0 0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 35 VCC – Supply Voltage – V VCC – Supply Voltage – V Figure 1. Supply Current vs Supply Voltage Figure 2. Input Bias Current vs Supply Voltage 6 10 Overdrive = 5 mV 1 VO – Output Voltage – V VO – Saturation Voltage – V 5 TA = 125°C TA = 25°C 0.1 TA = –55°C 0.01 4 Overdrive = 20 mV 3 Overdrive = 100 mV 2 1 0 0.001 0.01 0.1 1 10 -1 -0.3 100 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 t – Time – µs IO – Output Sink Current – mA Figure 4. Response Time for Various Overdrives Negative Transition Figure 3. Output Saturation Voltage 6 VO – Output Voltage – V 5 Overdrive = 5 mV 4 Overdrive = 20 mV 3 Overdrive = 100 mV 2 1 0 -1 -0.3 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 t – Time – µs Figure 5. Response Time for Various Overdrives Positive Transition 6 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM139-MIL LM139-MIL www.ti.com SLCS160 – JUNE 2017 7 Detailed Description 7.1 Overview The LM139-MIL is a quad comparators with the ability to operate up to an absolute maximum of 36 V on the supply pin. This standard device has proven ubiquity and versatility across a wide range of applications. This is due to very wide supply voltages range (2 V up to 32 V), low Iq, and fast response of the device. The open-drain output allows the user to configure the output logic low voltage (VOL) and allows the comparator to be used in AND functionality. 7.2 Functional Block Diagram VCC 80-µA Current Regulator 60 µA 10 µA 10 µA 80 µA IN+ COMPONENT COUNT OUT Epi-FET Diodes Resistors Transistors 1 2 2 30 IN− GND Figure 6. Schematic (Each Comparator) 7.3 Feature Description The comparator consists of a PNP Darlington pair input, allowing the device to operate with very high gain and fast response with minimal input bias current. The input Darlington pair creates a limit on the input commonmode voltage capability, allowing the comparator to accurately function from ground to (VCC – 1.5 V) differential input. Allow for (VCC – 2 V) at cold temperature. The output consists of an open-collector NPN (pulldown or low-side) transistor. The output NPN sinks current when the negative input voltage is higher than the positive input voltage and the offset voltage. The VOL is resistive and scales with the output current. See the Specifications section for VOL values with respect to the output current. 7.4 Device Functional Modes 7.4.1 Voltage Comparison The comparator operates solely as a voltage comparator, comparing the differential voltage between the positive and negative pins and outputting a logic low or high impedance (logic high with pullup) based on the input differential polarity. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM139-MIL 7 LM139-MIL SLCS160 – JUNE 2017 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Validate and test the design implementation to confirm system functionality. 8.1 Application Information Typically, a comparator compares either a single signal to a reference, or to two different signals. Many users take advantage of the open-drain output to drive the comparison logic output to a logic voltage level to an MCU or logic device. The wide supply range and high voltage capability makes the LM139-MIL device optimal for level shifting to a higher or lower voltage. 8.2 Typical Application VLOGIC VLOGIC VSUP Vin VSUP Rpullup + Vin+ TI Device R pullup + TI Device Vref VinCL CL Figure 7. Single-Ended and Differential Comparator Configurations 8.2.1 Design Requirements For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input Voltage Range 0 V to Vsup-1.5 V Supply Voltage 4.5 V to VCC maximum Logic Supply Voltage 0 V to VCC maximum Output Current (RPULLUP) 1 µA to 4 mA Input Overdrive Voltage 100 mV Reference Voltage 2.5 V Load Capacitance (CL) 15 pF 8.2.2 Detailed Design Procedure When using the LM139-MIL in a general comparator application, determine the following: • Input voltage range • Minimum overdrive voltage • Output and drive current • Response time 8.2.2.1 Input Voltage Range When choosing the input voltage range, the input common-mode voltage range (VICR) must be taken in to account. If temperature operation is above or below 25°C the VICR can range from 0 V to VCC– 2 V. This limits the input voltage range to as high as VCC– 2 V and as low as 0 V. Operation outside of this range can yield incorrect comparisons. 8 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM139-MIL LM139-MIL www.ti.com SLCS160 – JUNE 2017 The following list describes the outcomes of some input voltage situations. • • • • When both IN– and IN+ are both within the common-mode range: – If IN– is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current – If IN– is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not conducting When IN– is higher than common mode and IN+ is within common mode, the output is low and the output transistor is sinking current When IN+ is higher than common mode and IN– is within common mode, the output is high impedance and the output transistor is not conducting When IN– and IN+ are both higher than common mode, the output is low and the output transistor is sinking current 8.2.2.2 Minimum Overdrive Voltage Overdrive voltage is the differential voltage produced between the positive and negative inputs of the comparator over the offset voltage (VIO). To make an accurate comparison, the overdrive voltage (VOD) must be higher than the input offset voltage (VIO). Overdrive voltage can also determine the response time of the comparator, with the response time decreasing with increasing overdrive. Figure 8 and Figure 9 show positive and negative response times with respect to overdrive voltage. 8.2.2.3 Output and Drive Current Output current is determined by the load and pullup resistance and logic and pullup voltage. The output current produces a low-level output voltage (VOL) from the comparator, where VOL is proportional to the output current. The output current can also effect the transient response. 8.2.2.4 Response Time Response time is a function of input over-drive. See the Typical Characteristics graphs for typical response times. The rise and fall times can be determined by the load capacitance (CL), load/pull-up resistance (RPULLUP) and equivalent collector-emitter resistance (RCE). • • The rise time (τR) is approximately τR~ RPULLUP × CL The fall time (τF) is approximately τF ~ RCE × CL – RCE can be determined by taking the slope of Figure 3 in its linear region at the desired temperature, or by dividing the VOL by IOUT Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM139-MIL 9 LM139-MIL SLCS160 – JUNE 2017 www.ti.com 8.2.3 Application Curves 6 6 5 5 Output Voltage (Vo) Output Voltage, Vo(V) Figure 8 and Figure 9 were generated with scope probe parasitic capacitance of 50 pF. 4 3 2 5mV OD 1 20mV OD 4 3 2 5mV OD 1 0 20mV OD 0 100mV OD ±1 -0.25 0.25 0.75 1.25 1.75 2.25 Time (usec) VCC = 5 V 100mV OD ±1 ±0.25 0.00 0.25 VLogic = 5 V 0.50 0.75 1.00 1.25 1.50 1.75 Time (usec) C004 RPULLUP = 5.1 kΩ VCC = 5 V Figure 8. Response Time vs Output Voltage (Positive Transition) VLogic = 5 V 2.00 C006 RPULLUP = 5.1 kΩ Figure 9. Response Time vs Output Voltage (Negative Transition) 9 Power Supply Recommendations For fast response and comparison applications with noisy or AC inputs, use a bypass capacitor on the supply pin to reject any variation on the supply voltage. This variation can affect the common-mode range of the comparator input and create an inaccurate comparison. 10 Layout 10.1 Layout Guidelines To create an accurate comparator application without hysteresis, maintain a stable power supply with minimized noise and glitches, which can affect the high level input common-mode voltage range. To achieve this accuracy, add a bypass capacitor between the supply voltage and ground. Place a bypass capacitor on the positive power supply and negative supply (if available). NOTE If a negative supply is not being used, do not place a capacitor between the GND pin of the device and system ground. 10.2 Layout Example Ground Bypass Capacitor 0.1 μF Positive Supply 1OUT 2OUT VCC 2IN– 2IN+ 1IN– 1IN+ 1 2 14 3OUT 13 4OUT 3 12 GND 4 5 6 7 11 4IN+ 10 4IN– 9 3IN+ 8 3IN– Negative Supply or Ground Only needed for dual power 0.1 μF supplies Ground Figure 10. LM139-MIL Layout Example 10 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM139-MIL LM139-MIL www.ti.com SLCS160 – JUNE 2017 11 Device and Documentation Support 11.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser based versions of this data sheet, refer to the left hand navigation. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LM139-MIL 11 PACKAGE OPTION ADDENDUM www.ti.com 29-Jun-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 77008012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 77008012A LM139FKB 7700801CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 7700801CA LM139JB 7700801DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 7700801DA LM139WB JM38510/11201BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510 /11201BCA LM139FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 LM139FK LM139FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 77008012A LM139FKB LM139J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 LM139J LM139JB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 7700801CA LM139JB LM139W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 LM139W LM139WB ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 7700801DA LM139WB M38510/11201BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510 /11201BCA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-Jun-2017 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM139-MIL : • Space: LM139-SP NOTE: Qualified Version Definitions: • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 2 PACKAGE OUTLINE J0014A CDIP - 5.08 mm max height SCALE 0.900 CERAMIC DUAL IN LINE PACKAGE PIN 1 ID (OPTIONAL) A 4X .005 MIN [0.13] .015-.060 TYP [0.38-1.52] 1 14 12X .100 [2.54] 14X .014-.026 [0.36-0.66] 14X .045-.065 [1.15-1.65] .010 [0.25] C A B .754-.785 [19.15-19.94] 8 7 B .245-.283 [6.22-7.19] .2 MAX TYP [5.08] C .13 MIN TYP [3.3] SEATING PLANE .308-.314 [7.83-7.97] AT GAGE PLANE .015 GAGE PLANE [0.38] 0 -15 TYP 14X .008-.014 [0.2-0.36] 4214771/A 05/2017 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermitically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only. 5. Falls within MIL-STD-1835 and GDIP1-T14. www.ti.com EXAMPLE BOARD LAYOUT J0014A CDIP - 5.08 mm max height CERAMIC DUAL IN LINE PACKAGE (.300 ) TYP [7.62] SEE DETAIL A SEE DETAIL B 1 14 12X (.100 ) [2.54] SYMM 14X ( .039) [1] 8 7 SYMM LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 5X .002 MAX [0.05] ALL AROUND (.063) [1.6] METAL ( .063) [1.6] SOLDER MASK OPENING METAL (R.002 ) TYP [0.05] .002 MAX [0.05] ALL AROUND SOLDER MASK OPENING DETAIL A DETAIL B SCALE: 15X 13X, SCALE: 15X 4214771/A 05/2017 www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated