FEATURES FUNCTIONAL BLOCK DIAGRAM Tiny, 3.35 mm × 2.5 mm × 0.88 mm surface-mount package Omnidirectional response Very high SNR of 65 dBA Sensitivity of −38 dBV Extended frequency response from 100 Hz to 20 kHz Low current consumption: 180 μA Single-ended analog output 120 dB maximum SPL High PSR of 70 dBV Compatible with Sn/Pb and Pb-free solder processes RoHS/WEEE compliant OUTPUT AMPLIFIER ADMP504 OUTPUT POWER VDD 10140-001 Data Sheet Ultralow Noise Microphone with Bottom Port and Analog Output ADMP504 GND Figure 1. Smartphones and feature phones Tablet computers Teleconferencing systems Digital still and video cameras Bluetooth headsets Notebook PCs Security and surveillance TOP ISO BOTTOM ISO 10140-011 APPLICATIONS Figure 2. Isometric Views of ADMP504 Microphone Package GENERAL DESCRIPTION The ADMP5041 is a high performance, very low noise, low power, analog output, bottom-ported omnidirectional MEMS microphone. The ADMP504 consists of a MEMS microphone element, an impedance converter and an output amplifier. The ADMP504 sensitivity specification makes it an excellent choice for both near field and far field applications. The ADMP504 is function- and pin-compatible with the ADMP404 microphone, providing an easy upgrade path. The ADMP504 has very high SNR and extended wideband frequency response, resulting in natural sound with high 1 intelligibility. Low current consumption enables long battery life for portable applications. A built-in particle filter provides high reliability. The ADMP504 complies with the TIA-920 Telecommunications Telephone Terminal Equipment Transmission Requirements for Wideband Digital Wireline Telephones standard. The ADMP504 is available in an ultraminiature 3.35 mm × 2.5 mm × 0.88 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. The ADMP504 is halide free. Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. Other patents are pending. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved. ADMP504 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Supporting Documents ................................................................7 Applications ....................................................................................... 1 Handling Instructions .......................................................................8 Functional Block Diagram .............................................................. 1 Pick-and-Place Equipment ..........................................................8 General Description ......................................................................... 1 Reflow Solder .................................................................................8 Revision History ............................................................................... 2 Board Wash ....................................................................................8 Specifications..................................................................................... 3 PCB Land Pattern Layout .................................................................9 Absolute Maximum Ratings............................................................ 4 Reliability Specifications ................................................................ 10 ESD Caution .................................................................................. 4 Outline Dimensions ....................................................................... 11 Pin Configuration and Function Descriptions ............................. 5 Ordering Guide .......................................................................... 11 Typical Performance Characteristics ............................................. 6 Applications Information ................................................................ 7 REVISION HISTORY 10/11—Revision 0: Initial Version Rev. 0 | Page 2 of 12 Data Sheet ADMP504 SPECIFICATIONS TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed. Table 1. Parameter PERFORMANCE Directionality Sensitivity Signal-to-Noise Ratio Equivalent Input Noise Dynamic Range Frequency Response 1 Total Harmonic Distortion Power Supply Rejection Maximum Acoustic Input POWER SUPPLY Supply Voltage Supply Current OUTPUT CHARACTERISTICS Output Impedance Output DC Offset Output Current Limit Maximum Output Voltage Noise Floor 1 Symbol SNR EIN THD PSR VDD IS Test Conditions/Comments Min 1 kHz, 94 dB SPL 20 Hz to 20 kHz, A-weighted 20 Hz to 20 kHz, A-weighted Derived from EIN and maximum acoustic input Low frequency −3 dB point High frequency −3 dB point 104 dB SPL 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V Peak, 10% THD −41 Typ Max Unit −35 70 dBV dBA dBA SPL dB Hz kHz % dBV 120 dB SPL Omni −38 65 29 91 100 >20 3 1.6 VDD = 1.8 V VDD = 3.3 V 180 200 120 dB SPL input, peak 20 Hz to 20 kHz, A-weighted, rms 200 0.8 90 0.25 −103 ZOUT See Figure 5 and Figure 7. Rev. 0 | Page 3 of 12 3.3 200 225 V µA µA Ω V µA V dBV ADMP504 Data Sheet ABSOLUTE MAXIMUM RATINGS Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Parameter Supply Voltage Sound Pressure Level (SPL) Mechanical Shock Vibration Temperature Range Rating −0.3 V to +3.6 V 160 dB 10,000 g Per MIL-STD-883 Method 2007, Test Condition B −40°C to +85°C ESD CAUTION CRITICAL ZONE TL TO TP tP TP tL TSMAX TSMIN tS RAMP-DOWN PREHEAT 10140-002 TEMPERATURE RAMP-UP TL t25°C TO PEAK TIME Figure 3. Recommended Soldering Profile Limits Table 3. Recommended Soldering Profile Limits Profile Feature Average Ramp Rate (TL to TP) Preheat Minimum Temperature (TSMIN) Maximum Temperature (TSMAX) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Time Within 5°C of Actual Peak Temperature (tP) Ramp-Down Rate Time 25°C to Peak Temperature Rev. 0 | Page 4 of 12 Sn63/Pb37 1.25°C/sec maximum Pb-Free 1.25°C/sec maximum 100°C 150°C 60 sec to 75 sec 1.25°C/sec 45 sec to 75 sec 183°C 215°C + 3°C/−3°C 20 sec to 30 sec 3°C/sec maximum 5 minutes maximum 150°C 200°C 60 sec to 75 sec 1.25°C/sec ~50 sec 217°C 260°C + 0°C/−5°C 20 sec to 30 sec 3°C/sec maximum 5 minutes maximum Data Sheet ADMP504 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS GND 1 2 OUTPUT 3 VDD TOP VIEW (TERMINAL SIDE DOWN) Not to Scale Figure 4. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1 2 3 Mnemonic OUTPUT GND VDD Description Analog Output Signal Ground Power Supply Rev. 0 | Page 5 of 12 10140-003 ADMP504 ADMP504 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 10 10 8 5 6 SENSITIVITY (dB) SENSITIVITY (dB) 4 2 0 –2 –4 –6 0 –5 –10 –15 100 1k –20 20 10140-004 –10 10k FREQUENCY (Hz) –10 –20 –40 –50 –60 –70 10k 10140-005 PSR (dB) –30 1k 10k Figure 7. Typical Frequency Response (Measured) 0 FREQUENCY (Hz) 1k FREQUENCY (Hz) Figure 5. Frequency Response Mask –80 100 100 Figure 6. Typical Power Supply Rejection vs. Frequency Rev. 0 | Page 6 of 12 10140-006 –8 Data Sheet ADMP504 APPLICATIONS INFORMATION The ADMP504 output can be connected to a dedicated codec microphone input (see Figure 8) or to a high input impedance gain stage (see Figure 9). A 0.1 µF ceramic capacitor placed close to the ADMP504 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A dc-blocking capacitor is required at the output of the microphone. This capacitor creates a high-pass filter with a corner frequency at GAIN = (R1 + R2)/R1 R1 R2 VREF 0.1µF VDD ADMP504 ADA4897-1 1µF MINIMUM VOUT 10kΩ VREF fC = 1/(2π × C × R) 10140-008 OUTPUT GND Figure 9. ADMP504 Connected to the ADA4897-1 Op Amp where R is the codec’s input impedance. A minimum value of 2.2 μF is recommended in Figure 8 because the input impedance of the ADAU1361/ADAU1761 can be as low as 2 kΩ at its highest PGA gain setting, which would result in a high-pass filter corner frequency at about 37 Hz. Figure 9 shows the ADMP504 connected to an ADA4897-1 op amp configured as a noninverting preamplifier. SUPPORTING DOCUMENTS Evaluation Board User Guide UG-325, EVAL-ADMP504-FLEX: Bottom-Ported Analog Output MEMS Microphone Evaluation Board Circuit Note CN-0207, High Performance iMEMS Analog Microphone’s Simple Interface to SigmaDSP Audio Codec Application Notes AN-1003, Recommendations for Mounting and Connecting Analog Devices, Inc., Bottom-Ported MEMS Microphones MICBIAS 0.1µF ADMP504 OUTPUT GND 2.2µF MINIMUM AN-1068, Reflow Soldering of the MEMS Microphone AN-1112, Microphone Specifications Explained LINN LINP CM 10140-007 VDD ADAU1761 OR ADAU1361 Figure 8. ADMP504 Connected to the Analog Devices ADAU1761 or ADAU1361 Codec AN-1124, Recommendations for Sealing Analog Devices, Inc., Bottom-Port MEMS Microphones from Dust and Liquid Ingress Rev. 0 | Page 7 of 12 ADMP504 Data Sheet HANDLING INSTRUCTIONS PICK-AND-PLACE EQUIPMENT REFLOW SOLDER The MEMS microphone can be handled using standard pickand-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 3 and Table 3. • • • • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. Use care during pick-and-place to ensure that no high shock events above 10 kg are experienced because this may cause damage to the microphone. Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out or blow air into the microphone port. Do not use excessive force to place the microphone on the PCB. The ADMP504 has moisture sensitivity level (MSL) Class 3A. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Blow-off procedures and ultrasonic cleaning must not be used. Rev. 0 | Page 8 of 12 Data Sheet ADMP504 PCB LAND PATTERN LAYOUT paste stencil pattern layout is shown in Figure 11. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. The recommended PCB land pattern for the ADMP504 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 10. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder 1.52 0.68 1.22 0.61 Ø1.55 1.90 Ø0.95 10140-009 0.61 0.90 Figure 10. PCB Land Pattern Layout 0.8 × 0.6 1.55/1.05 DIA. 0.225 CUT WIDTH (2×) 2× 0.2 × 45° TYP 1.52mm Figure 11. Suggested Solder Paste Stencil Pattern Layout Rev. 0 | Page 9 of 12 10140-010 1.22 ADMP504 Data Sheet RELIABILITY SPECIFICATIONS The microphone sensitivity after stress must deviate by no more than 3 dB from the initial value. Table 5. Stress Test Low Temperature Operating Life High Temperature Operating Life Temperature Humidity Bias (THB) Temperature Cycle High Temperature Storage Low Temperature Storage Component CDM ESD Component HBM ESD Component MM ESD Description −40°C, 1000 hrs, powered +125°C, 1000 hrs, powered +85°C/+85% relative humidity (RH), 1000 hrs, powered −40°C/+125°C, one cycle per hour, 1000 cycles +150°C, 1000 hrs −40°C, 1000 hrs All pins, 0.5 kV All pins, 1.5 kV All pins, 0.2 kV Rev. 0 | Page 10 of 12 Data Sheet ADMP504 OUTLINE DIMENSIONS 3.425 3.350 3.275 0.75 REF REFERENCE CORNER 3.06 REF PIN 1 1.08 1.52 0.30 BSC 0.30 BSC 0.25 NOM DIA. 0.20 MIN THRU HOLE 0.90 × 0.68 (PINS 1, 3) 1.56 DIA. 1 2.575 2.500 2.425 (SOUND PORT) 0.95 DIA. 0.54 REF 2 1.22 BSC 2.21 REF 1.25 3 0.65 REF SIDE VIEW 0.64 REF 0.20 TYP × 45° BOTTOM VIEW 06-16-2010-A TOP VIEW 0.98 0.88 0.78 0.21 REF Figure 12. 3-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 3.35 mm × 2.50 mm Body (CE-3-2) Dimensions shown in millimeters ORDERING GUIDE Model1 ADMP504ACEZ-RL ADMP504ACEZ-RL7 EVAL-ADMP504Z-FLEX 1 2 Temperature Range −40°C to +85°C −40°C to +85°C Package Description 3-Terminal LGA_CAV, 13” Tape and Reel 3-Terminal LGA_CAV, 7” Tape and Reel Flex Evaluation Board Z = RoHS Compliant Part. This package option is halide free. Rev. 0 | Page 11 of 12 Package Option2 CE-3-2 CE-3-2 Ordering Quantity 10,000 1,000 ADMP504 Data Sheet NOTES ©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10140-0-10/11(0) Rev. 0 | Page 12 of 12