1/4 STRUCTURE Silicon Monolithic Integrated Circuit TYPE Step down DC/DC converter Controller IC for NOTE PC PRODUCT SERIES FEATURES BD95371MUV ・Built in H3Reg DC/DC controller ・Switching Frequency Variable (f=200kHz～500kHz) ○ ABSOLUTE MAXIMUM RATINGS（Ta=25℃） Parameter Input Voltage 1 Input Voltage 2 Input Voltage 3 BOOT Voltage BOOT-SW Voltage HG-SW Voltage LG Voltage Output Voltage EN Input Voltage Power Dissipation 1 Power Dissipation 2 Power Dissipation 3 Power Dissipation 4 Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Symbol VCC VDD VIN BOOT BOOT-SW HG-SW LG VOUT/Is+/IsEN Pd1 Pd2 Pd3 Pd4 Topr Tstg Tjmax Limit 7 ＊1＊2 7 ＊1＊2 28 ＊1＊2 35 ＊1＊2 7 ＊1＊2 7 ＊1＊2 VDD VCC 7 ＊1 0.34＊3 0.70＊4 2.20＊5 3.56＊6 -10～+100 -55～+150 +150 Unit V V V V V V V V V W W W W ℃ ℃ ℃ *1 Not to exceed Pd. *2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle. *3 Reduced by 2.7mW/℃ for each increase in Ta of 1℃ over 25℃. (when don’t mounted on a heat radiation board ) *4 Reduced by 5.6mW/℃ for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70.0mm×1.6mm 1-layer Glass-epoxy PCB, copper foil area: 10.29mm2 ) *5 Reduced by 17.6mW/℃ for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70.0mm×1.6mm 4-layer Glass-epoxy PCB, copper foil area: 10.29mm2 2,3-layer copper foil area: 5505mm2) *6 Reduced by 28.5mW/℃ for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70.0mm×1.6mm 4-layer Glass-epoxy PCB, copper foil area: 5505mm2 ) ○ OPERATING CONDITIONS（Ta=25℃） Parameter Input Voltage 1 Input Voltage 2 Input Voltage 3 BOOT Voltage SW Voltage BOOT-SW Voltage EN Input Voltage Is Input Voltage MIN ON Time Symbol VCC VDD VIN BOOT SW BOOT-SW EN Is+/IsTonmin ★ This product is not designed for protection against radioactive rays. REV. A MIN 4.5 4.5 4.5 4.5 -0.7 4.5 0 0.7 - MAX 5.5 5.5 25 30 25 5.5 5.5 2.7 80 Unit V V V V V V V V ns 2/4 ○ELECTRICAL CHARACTERISTICS （unless otherwise noted, Ta=25℃ VCC=5V,VDD=5V,EN=3V,VIN=12V,VOUT=1.05V,RFS=36kΩ） Parameter [Whole Device] VCC Bias Current VCC Standby Current VIN Bias Current VIN Standby Current EN Low Voltage EN HighVoltage (Forced Continuous mode) EN HighVoltage (SLLM Mode) EN Bias Current [Under Voltage Locked Out ] VCC threshold voltage VCC hysteresis voltage 3 [H REG Control] ON Time MAX ON Time MIN OFF Time [FET Driver] HG Higher side ON resistor HG Lower side ON resistor LG Higher side ON resistor LG Lower side ON resistor [SCP] SCP strat-up Voltage SCP delay time [OVP] FB threshold voltage [Soft start] Charge current Standby voltage [Current Limit Block] Setting Current Current limit threshold [Output Voltage setting ] VOUT typical voltage Is+ Input current Is- Input current [Power Good] FB Power Good Discharge ON resistor [BOOT Diode] VF voltage MIN Standard Value TYP MAX Icc Iccstb Iin Iinstb VEN_low GND 1500 0 30 0 - 1800 10 80 10 0.8 μA μA μA μA V VENth_con 2.3 - 3.8 V VENth_sllm Ien 4.5 - 15 5.5 25 V μA EN=3V Vcc_UVLO dVcc_UVLO 3.7 100 4.0 160 4.3 220 V mV VCC:Sweep up VCC:Sweep down Ton Tonmax Toffmin 194 - 219 3.5 490 244 700 ns μs ns HGhon HGlon LGhon LGlon - 3.0 2.0 3.0 0.5 6.0 4.0 6.0 1.0 Ω Ω Ω Ω Vscp Tscp 0.345 - 0.420 2.5 0.495 - V ms Vovp 0.825 0.900 0.975 V Iss Vss_stb 1 - 2 - 3 50 μA mV Iilim Ilim 75 10 100 125 μA mV RILIM=100kΩ REF IIs+ IIs- 0.743 -1 -1 0.750 0 0 0.757 1 1 V μA μA Is+=1.05V Is-=1.05V VPGOOD Ronpgood 0.38 - 0.47 50 0.56 150 V Ω VF 0.4 0.5 0.6 V Symbol REV. A Unit Condition EN＝0Ｖ EN＝0Ｖ IF=1mA 3/4 ○ PHYSICAL DIMENSIONS ○ Pin Number 4.0±0.1 4.0±0.1 Pin number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 reverse 95371 1.0Max. Lot.No 1pin mark 0.02 +0.03 -0.02 (0.22) S 0.08 S C0.2 2.1±0.1 5 6 16 1.0 10 15 2.1±0.1 0.4±0.1 1 20 11 0.25 +0.05 -0.04 0.5 VQFN020V4040 (Unit:mm) VCC 17 VIN Reference Block BG H Reg 16 BOOT Soft Start Block + REF×1.2 FB BG REF VDD SLLM + 2.5ms Delay EN/UVLO GND SS SCP 3 20 TSD Thermal Protection UVLO + - SS 1 EN REF×0.56 SS×0.56 FB VOUT SS EN/SLLM ILIM VCC FB VOUT FREQ FS IsIs+ PGND LG VDD SW HG BOOT VIN OUT PGOOD GND FIN VIN VDD EN/SLLM 2 PIN name Please connect FIN to GND. ○ BLOCK DIAGRAM 4 OVP 15 SLLM Q R Controller Driver SW VDD Circuit S + + OVP + - Current Limit ls+ + FREQ 7 9 ls- 10 Is+ ILIM + 8 VOUT REV. A 6 12 LG 11 PGND Is+ REF ×0.56 FB UVLO ILIM SCP TSD FS 13 SLLM 18 SS REF VOUT HG OUT 5 VIN 14 TM Block FB Pin Name 3 ILIM 19 + - PGOOD 4/4 ●Operation Notes 1. Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3. Power supply lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. 4. GND voltage The potential of GND pin must be minimum potential in all operating conditions. 5. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 6. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7. Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8. ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9. Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. BD95371MUV TSD on temperature [°C] (typ.) 175 Hysteresis temperature [°C](typ.) 15 10. Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 11. Heat sink (FIN) Since the heat sink (FIN) is connected with the Sub, short it to the GND. REV. 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