Nano Power, Push/Pull Output Comparator ISL28915 Features The ISL28915 is a nano power comparator optimized for low-power applications. This device is designed for single-supply operation from 1.8V to 5.5V and typically consumes 500nA of supply current. These devices also feature a push/pull output stage with rail-to-rail input and output swing (RRIO), allowing for maximum battery usage. • Low Active Current . . . . . . . . . . . . . . . . . . . . . . . . . . 600nA Max The combination of small footprint, low power, single supply, and rail-to-rail operation makes them ideally suited for all battery operated devices. • Operating Temperature Range. . . . . . . . . . .-40°C to +125°C The ISL28915 features an enable pin and is offered in the 6 Ld SOT-23 package. The device operates over the -40°C to +125°C temperature range. • Low Disable Current. . . . . . . . . . . . . . . . . . . . . . . . . . 20nA Max • Propagation Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150µs • Rail-to-Rail Input/Output Voltage Range (RRIO) • Wide Supply Range . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 5.5V Applications • • • • • • Battery-Powered/Portable Systems Telemetry and Remote Systems Alarm and Monitoring Systems Oscillator Circuits Window Comparators Threshold Detectors/Discriminators 520 VREF C1 IN+ RL = ∞ 500 V+ ISL28915 GND + 2kΩ RL 10µF SUPPLY CURRENT (nA) IN- 5V 480 460 440 420 400 380 AUDIO SIGNAL PEAK DETECTOR FIGURE 1. TYPICAL APPLICATION CIRCUIT July 12, 2012 FN8343.0 1 360 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SUPPLY VOLTAGE (V) FIGURE 2. SUPPLY CURRENT vs SUPPLY VOLTAGE CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2012. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL28915 Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING ISL28915FH6Z-T7 PACKAGE TAPE & REEL (Pb-Free) TEMP RANGE (°C) BENA -40°C to +125°C SOT23-6 PKG. DWG. # P6.064A NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pbfree products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL28915. For more information on MSL please see techbrief TB363. Pin Configuration ISL28915FH6Z (6 LD SOT-23) TOP VIEW OUT 1 6 V+ GND 2 + - IN+ 3 5 EN 4 IN- Pin Descriptions ISL28915FH6Z (6 LD SOT-23) PIN NAME EQUIVALENT CIRCUIT 1 OUT Circuit 3 Comparator output 2 GND Circuit 4 GROUND terminal 3 IN+ Circuit 1 Comparator non-inverting input 4 IN- Circuit 1 Comparator inverting input 5 EN Circuit 2 Comparator enable pin; Logic “1” selects the enabled state: Logic “0” selects the disabled state 6 V+ Circuit 4 Positive power supply DESCRIPTION V+ V+ V+ IN- IN+ LOGIC PIN GND GND CIRCUIT 2 2 CAPACITIVELY COUPLED ESD CLAMP OUT GND CIRCUIT 1 V+ GND CIRCUIT 3 CIRCUIT 4 July 12, 2012 FN8343.0 ISL28915 Absolute Maximum Ratings Thermal Information Maximum Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.75V Supply Turn-On Voltage Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1V/µs Maximum Differential Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA Maximum Differential Input Voltage . . . . . . . . . . . GND - 0.5V to V+ + 0.5V Min/Max Input Voltage . . . . . . . . . . . . . . . . . . . . . . GND - 0.5V to V+ + 0.5V Output Short-Circuit Duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite ESD Tolerance Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . . . 3kV Machine Model (Tested per JESD22-A115-C) . . . . . . . . . . . . . . . . . . 150V Charged Device Model (Tested per JESD22-C110D) . . . . . . . . . . . . . 1kV Latch-up (Tested per JESD-78B; Class 2, Level A) . . . . . . . . . . . . . . . at +125°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 6 Ld SOT-23 Package (Notes 4, 5) . . . . . . . 239 108 Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . .-40°C to +125°C Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+125°C Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 5.5V CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. For θJC, the “case temp” location is taken at the package top center. Electrical Specifications -40°C to +125°C. PARAMETER VOS V+ = 5V, GND = 0V, VCM = 2.5V, TA = +25°C, unless otherwise specified. Boldface limits apply over DESCRIPTION CONDITIONS Input Offset Voltage MIN (Note 6) TYP MAX (Note 6) UNIT -2 -0.2 2 mV 2.5 mV 25 pA 67 pA 31 pA -100 100 pA 5 V -2.5 IOS Input Offset Current -25 -3 -67 IB Input Bias Current -31 CMIR Common Mode Input Range Established by CMRR test 0 CMRR Common-Mode Rejection Ratio VCM = 0.5V to 3.5V 72 PSRR Power Supply Rejection Ratio 1.2 98 dB 70 dB VCM = 0V to 5V 60 dB V+ = 1.8V to 5.5V 77 100 dB 70 VOUT IS,ON IS,OFF Maximum Output Voltage Swing RL terminated to V+/2 Supply Current, Enabled Supply Current, Disabled VSUPPLY Supply Voltage Range CIN Input Capacitance Output low, RL = 10kΩ Output high, RL = 10kΩ dB 35 4.930 VEN = V+ - 0.3V mV 4.990 500 VEN = GND + 0.3V 70 0.25 1.8 V 600 nA 900 nA 20 nA 50 nA 5.5 V 6 pF ENABLE INPUT VENH Enable Pin High Level VENL Enable Pin Low Level IEN-H,L Enable Pin Input Current V+ - 0.3 VEN = 0V, 5V -80 -200 3 V 2.2 GND + 0.3 V 80 nA 200 nA July 12, 2012 FN8343.0 ISL28915 Electrical Specifications -40°C to +125°C. (Continued) PARAMETER V+ = 5V, GND = 0V, VCM = 2.5V, TA = +25°C, unless otherwise specified. Boldface limits apply over DESCRIPTION MIN (Note 6) CONDITIONS TYP MAX (Note 6) UNIT 150 260 µs 11 20 µs TIMING tPD± Propagation Delay Low to High and High to Low CL = 10pF, 20mV Overdrive tR/tF Output Rise/Fall Time CL = 10pF NOTE: 6. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. Typical Performance Curves 520 250 RL = ∞ +PROPAGATION DELAY (µs) SUPPLY CURRENT (nA) 500 480 460 440 420 400 380 360 1.5 2.0 2.5 3.0 3.5 4.0 4.5 RL = 10kΩ RL TO GND 200 OVERDRIVE = 20mV 150 100 RL TO V+ 50 OVERDRIVE = 100mV 0 1.5 5.0 2.0 FIGURE 3. SUPPLY CURRENT vs SUPPLY VOLTAGE RL = 10kΩ 160 RL TO V+ 4.0 4.5 5.0 100 RL TO V+ 80 60 RL TO GND OVERDRIVE = 100mV RL = 10kΩ V+ = 5V OVERDRIVE = 20mV 40 3.5 600 RL TO GND 140 120 3.0 FIGURE 4. PROPAGATION DELAY vs SUPPLY VOLTAGE (RISING EDGE) +PROPAGATION DELAY (µs) -PROPAGATION DELAY (µs) 180 2.5 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) 20 500 400 RL TO GND 300 V+ = 2V RL TO V+ 200 100 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SUPPLY VOLTAGE (V) FIGURE 5. PROPAGATION DELAY vs SUPPLY VOLTAGE (FALLING EDGE) 4 0 1 10 100 1000 OVERDRIVE (mV) FIGURE 6. PROPAGATION DELAY vs OVERDRIVE (RISING EDGE) July 12, 2012 FN8343.0 ISL28915 Typical Performance Curves (Continued) 30 400 RL = 10kΩ V+ = 5V 300 OUTPUT CURRENT (mA) -PROPAGATION DELAY (µs) 350 250 V+ = 2V 200 RL TO V+ 150 100 25 SINKING 20 SOURCING 15 10 RL TO GND 50 0 RL = 10Ω 1 10 100 5 1.5 1000 2.0 2.5 3.0 3.5 4.0 SUPPLY VOLTAGE (V) OVERDRIVE (mV) 2.5 900 2.3 880 2.1 1.9 1.7 1.5 1.3 1.5 2.0 2.5 3.0 3.5 4.0 SUPPLY VOLTAGE (V) 4.5 860 840 820 800 760 1.5 5.0 FIGURE 9. ENABLE THRESHOLD VOLTAGE vs SUPPLY VOLTAGE 9 650 8 600 7 6 5 4 3 2.5 3.0 3.5 4.0 SUPPLY VOLTAGE (V) 4.5 5.0 RL = ∞ 550 500 450 400 350 2 1 1.5 2.0 FIGURE 10. ENABLE TO OUTPUT DELAY TIME vs SUPPLY VOLTAGE SUPPLY CURRENT (nA) DISABLE TIME (µs) 5.5 780 1.1 0.9 5.0 FIGURE 8. SHORT CIRCUIT CURRENT vs SUPPLY VOLTAGE ENABLE TIME (µs) ENABLE THRESHOLD (V) FIGURE 7. PROPAGATION DELAY vs OVERDRIVE (FALLING EDGE) 4.5 2.0 2.5 3.0 3.5 4.0 SUPPLY VOLTAGE (V) 4.5 5.0 FIGURE 11. ENABLE LOW TO OUTPUT TURN-OFF TIME vs SUPPLY VOLTAGE 5 300 -60 -40 -20 0 20 40 60 80 TEMPERATURE (°C) 100 120 140 FIGURE 12. SUPPLY CURRENT vs TEMPERATURE, V+, GND = ±2.5V July 12, 2012 FN8343.0 ISL28915 (Continued) 4 6 3 5 2 4 IBIAS- (pA) IBIAS+ (pA) Typical Performance Curves 1 3 0 2 -1 1 -2 -60 -40 -20 0 20 40 60 80 TEMPERATURE (°C) 100 120 0 -60 140 FIGURE 13. IBIAS+ vs TEMPERATURE, V+, GND = ±2.5V 0 20 40 60 80 TEMPERATURE (°C) 100 120 140 250 230 OFFSET VOLTAGE (µV) 3.5 OFFSET CURRENT (pA) -20 FIGURE 14. IBIAS- vs TEMPERATURE, V+, GND = ±2.5V 4.0 3.0 2.5 2.0 1.5 1.0 210 190 170 150 130 110 90 70 0.5 0 -60 -40 -20 0 20 40 60 80 TEMPERATURE (°C) 100 120 50 -60 140 110 5.000 105 4.998 -20 0 20 40 60 80 TEMPERATURE (°C) 100 120 140 4.996 100 4.994 VOUT (V) 95 90 85 4.992 4.990 4.988 4.986 80 4.984 75 70 -60 -40 FIGURE 16. VOS vs TEMPERATURE, V+, GND = ±2.5V, VCM = 0V FIGURE 15. IOS vs TEMPERATURE, V+, GND = ±2.5V CMRR (dB) -40 4.982 -40 -20 0 20 40 60 80 TEMPERATURE (°C) FIGURE 17. CMRR vs TEMPERATURE, VCM = 0.5V TO 3.5, V+, GND = ±2.5V 6 100 120 140 4.980 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (°C) FIGURE 18. VOUT HIGH vs TEMPERATURE, V+, GND = ±2.5V, RL = 10k July 12, 2012 FN8343.0 ISL28915 Typical Performance Curves (Continued) 10 180 9 7 VOUT (mV) 170 +PROPAGATION DELAY (µs) 8 6 5 4 3 2 160 150 140 130 120 110 1 0 -60 -40 -20 0 20 40 60 80 100 120 100 -60 140 -40 -20 0 20 12.5 170 12.0 160 11.5 RISE DELAY (µs) 150 140 130 120 40 140 9.5 8.5 20 120 10.0 100 0 100 10.5 9.0 -20 80 11.0 110 -40 60 FIGURE 20. POSITIVE PROPAGATION DELAY vs TEMPERATURE 50% TO 50%, V+ = 5V 180 60 80 100 120 8.0 -60 140 -40 -20 TEMPERATURE (°C) FIGURE 21. NEGATIVE PROPAGATION DELAY vs TEMPERATURE 50% TO 50%, V+ = 5V 0 20 40 60 TEMPERATURE (°C) 80 100 120 140 FIGURE 22. RISE TIME vs TEMPERATURE 20% TO 80%, V+ = 5V 13 12 FALL DELAY (µs) -PROPAGATION DELAY (µs) FIGURE 19. VOUT LOW vs TEMPERATURE, V+, GND = ±2.5V, RL = 10k 90 -60 40 TEMPERATURE (°C) TEMPERATURE (°C) 11 10 9 8 7 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (°C) FIGURE 23. FALL TIME vs TEMPERATURE 20% TO 80%, V+ = 5V 7 July 12, 2012 FN8343.0 ISL28915 Applications Information Introduction The ISL28915 is a CMOS rail-to-rail input and output (RRIO) nanopower comparator. This device is designed to operate from single supply (1.8V to 5.5V) and have an input common mode range that extends to the positive rail and to the negative supply rail for true rail-to-rail performance. The CMOS output can swing within tens of millivolts to the rails. Featuring worst case maximum supply current of only 900nA, this comparator is ideally suited for solar and battery powered applications. Input Protection During the low to high transition, however, if the load resistor is tied to ground, then the additional break-before-make time is added to the propagation delay time because the output won’t pull high until the P-Channel turns on. V+ + - FIGURE 25A. RL TO GND V+ All input terminals have internal ESD protection diodes to both positive and negative supply rails, limiting the input voltage to within one diode beyond the supply rails. The ISL28915 has a maximum input differential voltage that extends beyond the rails (V+ + 0.5V to GND - 0.5V). + - Rail-to-Rail Output Break-Before-Make Operation of the Output The output circuit has a break-before-make response. This means that the P-Channel turns off before the N-Channel turns on during a high to low transition of the output (reference Figure 24). Likewise, the N-Channel turns off before the P-Channel turns on during a low to high transition. This results in different propagation delay times depending upon where the output load resistor is tied to. If the load resistor is tied to ground (Figure 25A), then the propagation delay is controlled by the P-Channel. For a high to low transition, the propagation delay does not include the additional break-before-make time because the load resistor will pull the output low once the P-Channel has turned off. ISL28915 OUTPUT STAGE P-CH ON V+ N-CH OFF N-CH ON P-CH OFF BREAK-BEFORE-MAKE P-CH ON RL VOUT FIGURE 25B. RL TO V+ A pair of complementary MOSFET devices are used to achieve the rail-to-rail output swing. The NMOS sinks current to swing the output in the negative direction. The PMOS sources current to swing the output in the positive direction. The ISL28915 with a 10kΩ load will typically swing to within 10mV of the positive supply rail and within 35mV of ground. N-CH OFF VOUT RL P-CHANNEL VOUT N-CHANNEL FIGURE 24. MAKE-BEFORE-BREAK ACTION OF THE OUTPUT STAGE 8 FIGURE 25. CONNECTION OF RL TO GND AND V+ If the load resistor is tied to V+ (Figure 25B), then the propagation delay is controlled by the N-Channel. For this condition, the additional delay time is added to the high to low transition because the output won’t pull low until the N-Channel turns on. Figures 4 through 7 show the differences in propagation delay depending upon where the load is tied. Propagation Delay The input to output propagation delay has a dependency on power supply voltage, overdrive and whether the output is sourcing or sinking current. Figures 4 and 5 show a decreasing time propagation delay vs supply voltage for the ISL28915. The output break-before-make mechanism results in a difference in propagation delay, depending on whether the output stage NMOS and PMOS are sourcing or sinking current. This delay difference is shown in the figures as a function of where the load is terminated (V+ or GND) and also as a function of supply voltage. The dependence of propagation delay as a function of power supply voltage and input overdrive (from 5mV to 1V) is shown in Figures 6 and 7. Propagation delay is measured from the time the input signal reached 50% of its final value to the time the output reaches 50% of its final value. Rise and fall times are measured from the time the signal is at 20% of its final value to the time it reaches 80% of the final value. Enable Feature The ISL28915 in the 6 Ld SOT-23 package offers an EN pin that enables the device when pulled high. The enable threshold is referenced to the GND terminal and has a level proportional to the total supply voltage (reference Figure 9 for EN Threshold vs Supply Voltage). The enable circuit has a delay time that changes as a function of supply voltage. Figures 10 and 11 show the effect of supply voltage on the enable and disable times. The enable and disable delay is measured from the time the signal crosses the enable threshold to the time the output reaches 20% of its final value. For supply voltages less than 3V, it is recommended that the user account for the increased enable/disable delay time. July 12, 2012 FN8343.0 ISL28915 In the disabled state (output in a high impedance state), the supply current is reduced to a typical of only 0.25nA. By disabling the devices, multiple parts can be connected together as a MUX. In this configuration, the outputs are tied together in parallel and a channel can be selected by the EN pin. The EN pin should never be left floating. The EN pin should be connected directly to the V+ supply when not in use. Proper Layout Maximizes Performance To achieve the maximum performance of the high input impedance, care should be taken in the circuit board layout. The PC board surface must remain clean and free of moisture to avoid leakage currents between adjacent traces. Surface coating of the circuit board will reduce surface moisture and provide a humidity barrier, reducing parasitic resistance on the board. When input leakage current is a concern, the use of guard rings around the comparator inputs will further reduce leakage currents. Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest revision. DATE REVISION July 16, 2012 FN8343.0 CHANGE Initial Release Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL28915 To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff FITs are available from our website at: http://rel.intersil.com/reports/sear For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 9 July 12, 2012 FN8343.0 ISL28915 Package Outline Drawing P6.064A 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE Rev 0, 2/10 1.90 0-3° 0.95 D 0.08-0.20 A 5 6 4 PIN 1 INDEX AREA 2.80 3 1.60 3 0.15 C D 2x 1 (0.60) 3 2 0.20 C 2x 0.40 ±0.05 B 5 SEE DETAIL X 3 0.20 M C A-B D TOP VIEW 2.90 5 END VIEW 10° TYP (2 PLCS) 0.15 C A-B 2x H 1.14 ±0.15 C SIDE VIEW 0.10 C 0.05-0.15 1.45 MAX SEATING PLANE DETAIL "X" (0.25) GAUGE PLANE 0.45±0.1 4 (0.60) (1.20) NOTES: (2.40) (0.95) 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 3. Dimension is exclusive of mold flash, protrusions or gate burrs. 4. Foot length is measured at reference to guage plane. 5. This dimension is measured at Datum “H”. 6. Package conforms to JEDEC MO-178AA. (1.90) TYPICAL RECOMMENDED LAND PATTERN 10 July 12, 2012 FN8343.0