STMicroelectronics NAND01GW3B2AZB6 1 gbit, 2 gbit, 2112 byte/1056 word page, 1.8v/3v, nand flash memory Datasheet

NAND01G-B
NAND02G-B
1 Gbit, 2 Gbit,
2112 Byte/1056 Word Page, 1.8V/3V, NAND Flash Memory
Feature summary
●
●
●
●
●
●
●
High Density NAND Flash memories
–
Up to 2 Gbit memory array
–
Up to 64Mbit spare area
–
Cost effective solutions for mass
storage applications
NAND interface
–
x8 or x16 bus width
–
Multiplexed Address/ Data
–
Pinout compatibility for all densities
–
1.8V device: VDD = 1.7 to 1.95V
–
3.0V device: VDD = 2.7 to 3.6V
VFBGA63 9.5 x 12 x 1mm
TFBGA63 9.5 x 12 x 1.2mm
Page size
–
x8 device: (2048 + 64 spare) Bytes
–
x16 device: (1024 + 32 spare) Words
Block size
–
x8 device: (128K + 4K spare) Bytes
–
x16 device: (64K + 2K spare) Words
●
Serial Number option
●
Data protection
Page Read/Program
–
Hardware and Software Block Locking
–
Hardware Program/Erase locked during
Power transitions
–
Random access: 25µs (max)
–
Sequential access: 50ns (min)
–
100,000 Program/Erase cycles
–
Page program time: 300µs (typ)
–
10 years Data Retention
Copy Back Program mode
Fast page copy without external
buffering
●
ECOPACK® packages
■
Development tools
Internal Cache Register to improve the
program and read throughputs
Fast Block Erase
–
Block erase time: 2ms (typ)
●
Status Register
●
Electronic Signature
●
Chip Enable ‘don’t care’
–
Data integrity
■
Cache Program and Cache Read modes
–
●
FBGA
Supply voltage
–
●
TSOP48 12 x 20mm
–
Error Correction Code software and
hardware models
–
Bad Blocks Management and Wear
Leveling algorithms
–
File System OS Native reference
software
–
Hardware simulation models
for simple interface with microcontroller
February 2006
Rev 4.0
1/64
www.st.com
2
NAND01G-B, NAND02G-B
Table 1.
Product List(1)
Reference
Part Number
NAND01GR3B
NAND01GW3B
NAND01G-B
NAND01GR4B
NAND01GW4B
NAND02GR3B
NAND02GW3B
NAND02G-B
NAND02GR4B
NAND02GW4B
1. x16 organization only available for MCP Products.
2/64
NAND01G-B, NAND02G-B
Contents
Contents
1
Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2
Memory array organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.1
3
4
Bad blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1
Inputs/Outputs (I/O0-I/O7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.2
Inputs/Outputs (I/O8-I/O15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.3
Address Latch Enable (AL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.4
Command Latch Enable (CL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.5
Chip Enable (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.6
Read Enable (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.7
Power-Up Read Enable, Lock/Unlock Enable (PRL) . . . . . . . . . . . . . . . . 18
3.8
Write Enable (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.9
Write Protect (WP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.10
Ready/Busy (RB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.11
VDD Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.12
VSS Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1
Command Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.2
Address Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.3
Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.4
Data Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.5
Write Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.6
Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5
Command Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6
Device operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.1
Read Memory Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.1.1
Random Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3/64
Contents
NAND01G-B, NAND02G-B
6.1.2
6.2
Cache Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6.3
Page Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8
9
4/64
6.3.1
Sequential Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.3.2
Random Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.4
Copy Back Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6.5
Cache Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.6
Block Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.7
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.8
Read Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6.9
7
Page Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.8.1
Write Protection Bit (SR7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6.8.2
P/E/R Controller and Cache Ready/Busy Bit (SR6) . . . . . . . . . . . . . . . 33
6.8.3
P/E/R Controller Bit (SR5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6.8.4
Cache Program Error Bit (SR1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.8.5
Error Bit (SR0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.8.6
SR4, SR3 and SR2 are Reserved . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Read Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Data protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.1
Blocks Lock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.2
Blocks Unlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.3
Blocks Lock-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
7.4
Block Lock Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Software algorithms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.1
Bad Block Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.2
Block Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.3
Garbage Collection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.4
Wear-leveling algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.5
Error Correction Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.6
Hardware Simulation models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8.6.1
Behavioral simulation models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8.6.2
IBIS simulations models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Program and Erase Times and Endurance cycles . . . . . . . . . . . . . . . . 44
NAND01G-B, NAND02G-B
Contents
10
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
11
DC And AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
11.1
Ready/Busy Signal electrical characteristics . . . . . . . . . . . . . . . . . . . . . . 57
11.2
Data Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
12
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
13
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
5/64
List of tables
NAND01G-B, NAND02G-B
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
6/64
Product List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Valid Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Address Insertion, x8 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Address Insertion, x16 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Address Definitions, x8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Address Definitions, x16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Copy Back Program x8 Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Copy Back Program x16 Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Status Register Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Electronic Signature Byte/Word 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Block Lock Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Block Failure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Program, Erase Times and Program Erase Endurance Cycles . . . . . . . . . . . . . . . . . . . . . 44
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
DC Characteristics, 1.8V Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
DC Characteristics, 3V Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
AC Characteristics for Command, Address, Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
AC Characteristics for Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20 mm, Package Mechanical Data. . . 59
VFBGA63 9.5x12mm - 6x8 active ball array, 0.80mm pitch, Package Mechanical Data . . 60
TFBGA63 9.5x12mm - 6x8 active ball array, 0.80mm pitch, Package Mechanical Data . . 61
Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
NAND01G-B, NAND02G-B
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Logic Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
TSOP48 Connections, x8 devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
FBGA63 Connections, x8 devices (Top view through package). . . . . . . . . . . . . . . . . . . . . 13
FBGA63 Connections, x16 devices (Top view through package). . . . . . . . . . . . . . . . . . . . 14
Memory Array Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Read Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Random Data Output During Sequential Data Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Cache Read Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Page Program Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Random Data Input During Sequential Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Copy Back Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Page Copy Back Program with Random Data Input. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Cache Program Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Block Erase Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Blocks Unlock Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Read Block Lock Status Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Block Protection State Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Bad Block Management Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Garbage Collection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Equivalent Testing Circuit for AC Characteristics Measurement . . . . . . . . . . . . . . . . . . . . 47
Command Latch AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Address Latch AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Data Input Latch AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Sequential Data Output after Read AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Read Status Register AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Read Electronic Signature AC Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Page Read Operation AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Page Program AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Block Erase AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Reset AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Ready/Busy AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Ready/Busy Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Resistor Value Versus Waveform Timings For Ready/Busy Signal . . . . . . . . . . . . . . . . . . 58
Data Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20 mm, Package Outline . . . . . . . . . . 59
VFBGA63 9.5x12mm - 6x8 active ball array, 0.80mm pitch, Package Outline. . . . . . . . . . 60
TFBGA63 9.5x12mm - 6x8 active ball array, 0.80mm pitch, Package Outline . . . . . . . . . . 61
7/64
Summary description
1
NAND01G-B, NAND02G-B
Summary description
The NAND Flash 2112 Byte/ 1056 Word Page is a family of non-volatile Flash memories
that uses NAND cell technology. The devices range from 1 Gbit to 2 Gbits and operate with
either a 1.8V or 3V voltage supply. The size of a Page is either 2112 Bytes (2048 + 64
spare) or 1056 Words (1024 + 32 spare) depending on whether the device has a x8 or x16
bus width.
The address lines are multiplexed with the Data Input/Output signals on a multiplexed x8 or
x16 Input/Output bus. This interface reduces the pin count and makes it possible to migrate
to other densities without changing the footprint.
Each block can be programmed and erased over 100,000 cycles. To extend the lifetime of
NAND Flash devices it is strongly recommended to implement an Error Correction Code
(ECC).
The devices have hardware and software security features:
●
A Write Protect pin is available to give a hardware protection against program and
erase operations.
●
A Block Locking scheme is available to provide user code and/or data protection.
The devices feature an open-drain Ready/Busy output that can be used to identify if the
Program/Erase/Read (P/E/R) Controller is currently active. The use of an open-drain output
allows the Ready/Busy pins from several memories to be connected to a single pull-up
resistor.
A Copy Back Program command is available to optimize the management of defective
blocks. When a Page Program operation fails, the data can be programmed in another page
without having to resend the data to be programmed.
Each device has Cache Program and Cache Read features which improve the program and
read throughputs for large files. During Cache Programming, the device loads the data in a
Cache Register while the previous data is transferred to the Page Buffer and programmed
into the memory array. During Cache Reading, the device loads the data in a Cache
Register while the previous data is transferred to the I/O Buffers to be read.
All devices have the Chip Enable Don’t Care feature, which allows code to be directly
downloaded by a microcontroller, as Chip Enable transitions during the latency time do not
stop the read operation.
All devices have the option of a Unique Identifier (serial number), which allows each device
to be uniquely identified.
The Unique Identifier options is subject to an NDA (Non Disclosure Agreement) and so not
described in the datasheet. For more details of this option contact your nearest ST Sales
office.
The devices are available in the following packages:
●
TSOP48 (12 x 20mm) for all products
●
VFBGA63 (9.5 x 12 x 1mm, 0.8mm pitch) for 1Gb products
●
TFBGA63 (9.5 x 12 x 1.2mm, 0.8mm pitch) for 2Gb Dual Die products
In order to meet environmental requirements, ST offers the NAND01G-B and NAND02G-B
in ECOPACK® packages. ECOPACK packages are Lead-free. The category of second Level
Interconnect is marked on the package and on the inner box label, in compliance with
8/64
NAND01G-B, NAND02G-B
Summary description
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark.
For information on how to order these options refer to Table 29: Ordering Information
Scheme. Devices are shipped from the factory with Block 0 always valid and the memory
content bits, in valid blocks, erased to ’1’.
See Table 2: Product Description, for all the devices available in the family.
Table 2.
Product Description(1)
Timings
Reference
Part Number
Density
Bus
Width
Page
Size
Block
Size
x8
2048+
64
Bytes
128K+
4K
Bytes
NAND01GR3B
NAND01GW3B
NAND01G
-B
1Gbit
NAND01GR4B
x16(2)
NAND01GW4B
NAND02GR3B
x8
NAND02GW3B
NAND02G
-B
1024+
32
Words
64K+
2K
Words
2048+
64
Bytes
128K+
4K
Bytes
2Gbit
NAND02GR4B
x16(2)
NAND02GW4B
1024+
32
Words
64K+
2K
Words
Memory Operating
Array
Voltage
64
Pages x
1024
Blocks
64
Pages x
2048
Blocks
Random
access
time
(max)
Sequential
Page
access
Program
time
time
(typ)
(min)
1.7 to
1.95V
25µs
60ns
300µs
2.7 to
3.6V
25µs
50ns
300µs
Block
Erase
(typ)
2ms
1.7 to
1.95V
25µs
60ns
300µs
2.7 to
3.6V
25µs
50ns
300µs
1.7 to
1.95V
25µs
60ns
300µs
2.7 to
3.6V
25µs
50ns
300µs
2ms
1.7 to
1.95V
25µs
60ns
300µs
2.7 to
3.6V
25µs
50ns
300µs
Packages
TSOP48
VFBGA63
TSOP48
TFBGA63
(2)
1. x16 organization only available for MCP
2. Dual Die devices only
9/64
Summary description
Figure 1.
NAND01G-B, NAND02G-B
Logic Block Diagram
AL
CL
W
E
WP
R
PRL
P/E/R Controller,
High Voltage
Generator
Command
Interface
Logic
X Decoder
Address
Register/Counter
NAND Flash
Memory Array
Page Buffer
Cache Register
Command Register
Y Decoder
I/O Buffers & Latches
RB
I/O0-I/O7, x8/x16
I/O8-I/O15, x16
AI09373b
Figure 2.
Logic Diagram
VDD
I/O8-I/O15, x16
E
R
I/O0-I/O7, x8/x16
W
AL
NAND Flash
RB
CL
WP
PRL
VSS
AI09372b
1. x16 organization only available for MCP
10/64
NAND01G-B, NAND02G-B
Table 3.
Summary description
Signal Names
I/O8-15
Data Input/Outputs for x16 devices
I/O0-7
Data Input/Outputs, Address Inputs, or Command Inputs for x8 and
x16 devices
AL
Address Latch Enable
CL
Command Latch Enable
E
Chip Enable
R
Read Enable
RB
Ready/Busy (open-drain output)
W
Write Enable
WP
Write Protect
PRL
Power-Up Read Enable, Lock/Unlock Enable
VDD
Supply Voltage
VSS
Ground
NC
Not Connected Internally
DU
Do Not Use
11/64
Summary description
Figure 3.
NAND01G-B, NAND02G-B
TSOP48 Connections, x8 devices
NC
NC
NC
NC
NC
NC
RB
R
E
NC
NC
VDD
VSS
NC
NC
CL
AL
W
WP
NC
NC
NC
NC
NC
1
12
13
24
48
NAND Flash
(x8)
37
36
25
NC
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
NC
PRL
VDD
VSS
NC
NC
NC
I/O3
I/O2
I/O1
I/O0
NC
NC
NC
NC
AI11750
12/64
NAND01G-B, NAND02G-B
Figure 4.
Summary description
FBGA63 Connections, x8 devices (Top view through package)
1
2
A
DU
DU
B
DU
3
4
5
6
7
8
C
WP
AL
VSS
E
W
RB
D
NC
R
CL
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
NC
NC
G
NC
NC
NC
NC
NC
PRL
H
NC
I/O0
NC
NC
NC
VDD
J
NC
I/O1
NC
VDD
I/O5
I/O7
K
VSS
I/O2
I/O3
I/O4
I/O6
VSS
9
10
DU
DU
DU
DU
L
DU
DU
DU
DU
M
DU
DU
DU
DU
AI09376
13/64
Summary description
Figure 5.
NAND01G-B, NAND02G-B
FBGA63 Connections, x16 devices (Top view through package)
1
2
A
DU
DU
B
DU
3
4
5
6
7
8
C
WP
AL
VSS
E
W
RB
D
NC
R
CL
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
NC
NC
G
NC
NC
NC
I/O5
I/O7
PRL
H
I/O8
I/O1
I/O10
I/O12
I/O14
VDD
J
I/O0
I/O9
I/O3
VDD
I/O6
I/O15
K
VSS
I/O2
I/O11
I/O4
I/O13
VSS
9
10
DU
DU
DU
DU
L
DU
DU
DU
DU
M
DU
DU
DU
DU
AI09377
14/64
NAND01G-B, NAND02G-B
2
Memory array organization
Memory array organization
The memory array is made up of NAND structures where 32 cells are connected in series.
The memory array is organized in blocks where each block contains 64 pages. The array is
split into two areas, the main area and the spare area. The main area of the array is used to
store data whereas the spare area is typically used to store Error correction Codes, software
flags or Bad Block identification.
In x8 devices the pages are split into a 2048 Byte main area and a spare area of 64 Bytes.
In the x16 devices the pages are split into a 1,024 Word main area and a 32 Word spare
area. Refer to Figure 6: Memory Array Organization.
2.1
Bad blocks
The NAND Flash 2112 Byte/ 1056 Word Page devices may contain Bad Blocks, that is
blocks that contain one or more invalid bits whose reliability is not guaranteed. Additional
Bad Blocks may develop during the lifetime of the device.
The Bad Block Information is written prior to shipping (refer to Section 8.1: Bad Block
Management for more details).
Table 4: Valid Blocks shows the minimum number of valid blocks in each device. The values
shown include both the Bad Blocks that are present when the device is shipped and the Bad
Blocks that could develop later on.
These blocks need to be managed using Bad Blocks Management, Block Replacement or
Error Correction Codes (refer to Section 8: Software algorithms).
Table 4.
Valid Blocks
Density of Device
Min
Max
2 Gbits
2008
2048
1 Gbit
1004
1024
15/64
Memory array organization
Figure 6.
NAND01G-B, NAND02G-B
Memory Array Organization
x8 DEVICES
x16 DEVICES
Block = 64 Pages
Page = 2112 Bytes (2,048 + 64)
a
Sp
re
Are
Block = 64 Pages
Page = 1056 Words (1024 + 32)
a
a
Sp
Main Area
Main Area
Block
Page
re
Are
a
Block
Page
16 bits
8 bits
2048 Bytes
1024 Words
64
Bytes
Page Buffer, 1056 Words
Page Buffer, 2112 Bytes
2,048 Bytes
64
Bytes
32
Words
8 bits
1,024 Words
32
Words
16 bits
AI09854
16/64
NAND01G-B, NAND02G-B
3
Signal descriptions
Signal descriptions
See Figure 2: Logic Diagram, and Table 3: Signal Names, for a brief overview of the signals
connected to this device.
3.1
Inputs/Outputs (I/O0-I/O7)
Input/Outputs 0 to 7 are used to input the selected address, output the data during a Read
operation or input a command or data during a Write operation. The inputs are latched on
the rising edge of Write Enable. I/O0-I/O7 are left floating when the device is deselected or
the outputs are disabled.
3.2
Inputs/Outputs (I/O8-I/O15)
Input/Outputs 8 to 15 are only available in x16 devices. They are used to output the data
during a Read operation or input data during a Write operation. Command and Address
Inputs only require I/O0 to I/O7.
The inputs are latched on the rising edge of Write Enable. I/O8-I/O15 are left floating when
the device is deselected or the outputs are disabled.
3.3
Address Latch Enable (AL)
The Address Latch Enable activates the latching of the Address inputs in the Command
Interface. When AL is high, the inputs are latched on the rising edge of Write Enable.
3.4
Command Latch Enable (CL)
The Command Latch Enable activates the latching of the Command inputs in the Command
Interface. When CL is high, the inputs are latched on the rising edge of Write Enable.
3.5
Chip Enable (E)
The Chip Enable input activates the memory control logic, input buffers, decoders and
sense amplifiers. When Chip Enable is low, VIL, the device is selected. If Chip Enable goes
high, vIH, while the device is busy, the device remains selected and does not go into standby
mode.
3.6
Read Enable (R)
The Read Enable pin, R, controls the sequential data output during Read operations. Data
is valid tRLQV after the falling edge of R. The falling edge of R also increments the internal
column address counter by one.
17/64
Signal descriptions
3.7
NAND01G-B, NAND02G-B
Power-Up Read Enable, Lock/Unlock Enable (PRL)
The Power-Up Read Enable, Lock/Unlock Enable input, PRL, is used to enable and disable
the lock mechanism. When PRL is High, VIH, the device is in Block Lock mode.
If the Power-Up Read Enable, Lock/Unlock Enable input is not required, the PRL pin should
be left unconnected (Not Connected) or connected to VSS.
3.8
Write Enable (W)
The Write Enable input, W, controls writing to the Command Interface, Input Address and
Data latches. Both addresses and data are latched on the rising edge of Write Enable.
During power-up and power-down a recovery time of 10µs (min) is required before the
Command Interface is ready to accept a command. It is recommended to keep Write Enable
high during the recovery time.
3.9
Write Protect (WP)
The Write Protect pin is an input that gives a hardware protection against unwanted program
or erase operations. When Write Protect is Low, VIL, the device does not accept any
program or erase operations.
It is recommended to keep the Write Protect pin Low, VIL, during power-up and power-down.
3.10
Ready/Busy (RB)
The Ready/Busy output, RB, is an open-drain output that can be used to identify if the P/E/R
Controller is currently active. When Ready/Busy is Low, VOL, a read, program or erase
operation is in progress. When the operation completes Ready/Busy goes High, VOH.
The use of an open-drain output allows the Ready/Busy pins from several memories to be
connected to a single pull-up resistor. A Low will then indicate that one, or more, of the
memories is busy.
Refer to the Section 11.1: Ready/Busy Signal electrical characteristics for details on how to
calculate the value of the pull-up resistor.
3.11
VDD Supply Voltage
VDD provides the power supply to the internal core of the memory device. It is the main
power supply for all operations (read, program and erase).
An internal voltage detector disables all functions whenever VDD is below VLKO (see
Table 22 and Table 23) or 1.5V (for 1.8V devices) to protect the device from any involuntary
program/erase during power-transitions.
Each device in a system should have VDD decoupled with a 0.1µF capacitor. The PCB track
widths should be sufficient to carry the required program and erase currents.
18/64
NAND01G-B, NAND02G-B
3.12
Bus operations
VSS Ground
Ground, VSS, is the reference for the power supply. It must be connected to the system
ground.
4
Bus operations
There are six standard bus operations that control the memory. Each of these is described
in this section, see Table 5: Bus Operations, for a summary.
Typically, glitches of less than 5 ns on Chip Enable, Write Enable and Read Enable are
ignored by the memory and do not affect bus operations.
4.1
Command Input
Command Input bus operations are used to give commands to the memory. Commands are
accepted when Chip Enable is Low, Command Latch Enable is High, Address Latch Enable
is Low and Read Enable is High. They are latched on the rising edge of the Write Enable
signal.
Only I/O0 to I/O7 are used to input commands.
See Figure 23 and Table 24 for details of the timings requirements.
4.2
Address Input
Address Input bus operations are used to input the memory addresses. Four bus cycles are
required to input the addresses for 1Gb devices whereas five bus cycles are required for the
2Gb device (refer to Table 6 and Table 7, Address Insertion).
The addresses are accepted when Chip Enable is Low, Address Latch Enable is High,
Command Latch Enable is Low and Read Enable is High. They are latched on the rising
edge of the Write Enable signal. Only I/O0 to I/O7 are used to input addresses.
See Figure 24 and Table 24 for details of the timings requirements.
4.3
Data Input
Data Input bus operations are used to input the data to be programmed.
Data is accepted only when Chip Enable is Low, Address Latch Enable is Low, Command
Latch Enable is Low and Read Enable is High. The data is latched on the rising edge of the
Write Enable signal. The data is input sequentially using the Write Enable signal.
See Figure 25 and Table 24 and Table 25 for details of the timings requirements.
19/64
Bus operations
4.4
NAND01G-B, NAND02G-B
Data Output
Data Output bus operations are used to read: the data in the memory array, the Status
Register, the lock status, the Electronic Signature and the Unique Identifier.
Data is output when Chip Enable is Low, Write Enable is High, Address Latch Enable is Low,
and Command Latch Enable is Low. The data is output sequentially using the Read Enable
signal.
See Figure 26 and Table 25 for details of the timings requirements.
4.5
Write Protect
Write Protect bus operations are used to protect the memory against program or erase
operations. When the Write Protect signal is Low the device will not accept program or erase
operations and so the contents of the memory array cannot be altered. The Write Protect
signal is not latched by Write Enable to ensure protection even during power-up.
4.6
Standby
When Chip Enable is High the memory enters Standby mode, the device is deselected,
outputs are disabled and power consumption is reduced.
Table 5.
Bus Operations
Bus Operation
E
AL
CL
R
W
WP
I/O0 - I/O7
I/O8 - I/O15(1)
Command Input
VIL
VIL
VIH
VIH
Rising
X(2)
Command
X
Address Input
VIL
VIH
VIL
VIH
Rising
X
Address
X
Data Input
VIL
VIL
VIL
VIH
Rising
VIH
Data Input
Data Input
Data Output
VIL
VIL
VIL
Fallin
g
VIH
X
Data Output
Data Output
Write Protect
X
X
X
X
X
VIL
X
X
Standby
VIH
X
X
X
X
VIL/VD
X
X
D
1. Only for x16 devices.
2. WP must be VIH when issuing a program or erase command.
Table 6.
Address Insertion, x8 Devices
Bus Cycle(1)
I/O7
I/O6
I/O5
I/O4
I/O3
I/O2
I/O1
I/O0
1st
A7
A6
A5
A4
A3
A2
A1
A0
2nd
VIL
VIL
VIL
VIL
A11
A10
A9
A8
3rd
A19
A18
A17
A16
A15
A14
A13
A12
4th
A27
A26
A25
A24
A23
A22
A21
A20
5th(2)
VIL
VIL
VIL
VIL
VIL
VIL
VIL
A28
1. Any additional address input cycles will be ignored.
2. The fifth cycle is valid for 2Gb devices. A28 is for 2Gb devices only.
20/64
NAND01G-B, NAND02G-B
Table 7.
Bus operations
Address Insertion, x16 Devices
I/O8-
Bus
Cycle(1)
I/O15
1st
I/O7
I/O6
I/O5
I/O4
I/O3
I/O2
I/O1
I/O0
X
A7
A6
A5
A4
A3
A2
A1
A0
2nd
X
VIL
VIL
VIL
VIL
VIL
A10
A9
A8
rd
X
A18
A17
A16
A15
A14
A13
A12
A11
th
X
A26
A25
A24
A23
A22
A21
A20
A19
th(2)
X
VIL
VIL
VIL
VIL
VIL
VIL
VIL
A27
3
4
5
1. Any additional address input cycles will be ignored.
2. The fifth cycle is valid for 2Gb devices. A27 is for 2Gb devices only.
Table 8.
Table 9.
Address Definitions, x8
Address
Definition
A0 - A11
Column Address
A12 - A17
Page Address
A18 - A27
Block Address
1Gb device
A18 - A28
Block Address
2Gb device
Address Definitions, x16
Address
Definition
A0 - A10
Column Address
A11 - A16
Page Address
A17 - A26
Block Address
1Gb device
A17 - A27
Block Address
2Gb device
21/64
Command Set
5
NAND01G-B, NAND02G-B
Command Set
All bus write operations to the device are interpreted by the Command Interface. The
Commands are input on I/O0-I/O7 and are latched on the rising edge of Write Enable when
the Command Latch Enable signal is high. Device operations are selected by writing
specific commands to the Command Register. The two-step command sequences for
program and erase operations are imposed to maximize data security.
The Commands are summarized in Table 10: Commands.
Table 10.
Commands
Bus Write Operations(1)(2)
Command
1st CYCLE
Commands
accepted
during
nd
rd
th
2 CYCLE 3 CYCLE 4 CYCLE
busy
00h(2)
30h
–
–
Random Data Output
05h
E0h
–
–
Cache Read
00h
31h
–
–
Exit Cache Read
34h
–
–
–
Page Program
(Sequential Input default)
80h
10h
–
–
Random Data Input
85h
–
–
–
Copy Back Program
00h
35h
85h
10h
Cache Program
80h
15h
–
–
Block Erase
60h
D0h
–
–
Reset
FFh
–
–
–
Read Electronic Signature
90h
–
–
–
Read Status Register
70h
–
–
–
Read Block Lock Status
7Ah
–
–
–
Blocks Unlock
23h
24h
–
–
Blocks Lock
2Ah
–
–
–
Blocks Lock-Down
2Ch
–
–
–
Read
1. The bus cycles are only shown for issuing the codes. The cycles required to input the
addresses or input/output data are not shown.
2. For consecutive Read operations the 00h command does not need to be repeated.
3. Only during Cache Read busy.
22/64
Yes(3)
Yes
Yes
NAND01G-B, NAND02G-B
6
Device operations
Device operations
The following section gives the details of the device operations.
6.1
Read Memory Array
At Power-Up the device defaults to Read mode. To enter Read mode from another mode the
Read command must be issued, see Table 10: Commands. Once a Read command is
issued, subsequent consecutive Read commands only require the confirm command code
(30h).
Once a Read command is issued two types of operations are available: Random Read and
Page Read.
6.1.1
Random Read
Each time the Read command is issued the first read is Random Read.
6.1.2
Page Read
After the first Random Read access, the page data (2112 Bytes or 1056 Words) is
transferred to the Page Buffer in a time of tWHBH (refer to Table 25 for value). Once the
transfer is complete the Ready/Busy signal goes High. The data can then be read out
sequentially (from selected column address to last column address) by pulsing the Read
Enable signal.
The device can output random data in a page, instead of the consecutive sequential data, by
issuing a Random Data Output command.
The Random Data Output command can be used to skip some data during a sequential
data output.
The sequential operation can be resumed by changing the column address of the next data
to be output, to the address which follows the Random Data Output command.
The Random Data Output command can be issued as many times as required within a
page.
The Random Data Output command is not accepted during Cache Read operations.
23/64
Device operations
Figure 7.
NAND01G-B, NAND02G-B
Read Operations
CL
E
W
AL
R
tBLBH1
RB
I/O
00h
Address Input
Command
Code
30h
Command
Code
Data Output (sequentially)
Busy
ai08657b
1. Highest address depends on device density.
24/64
NAND01G-B, NAND02G-B
Figure 8.
Device operations
Random Data Output During Sequential Data Output
tBLBH1
(Read Busy time)
RB
Busy
R
I/O
00h
Address
Inputs
Cmd
Code
30h
Data Output
Cmd
Code
05h
Address
Inputs
Cmd
Code
E0h
Data Output
Cmd
Code
2Add cycles
Col Add 1,2
5 Add cycles
Row Add 1,2,3 Col Add 1,2
Main Area
Spare
Area
Main Area
Spare
Area
ai08658
25/64
Device operations
6.2
NAND01G-B, NAND02G-B
Cache Read
The Cache Read operation is used to improve the read throughput by reading data using
the Cache Register. As soon as the user starts to read one page, the device automatically
loads the next page into the Cache Register.
An Cache Read operation consists of three steps (see Table 10: Commands):
1.
One bus cycle is required to setup the Cache Read command (the same as the
standard Read command)
2.
Four or Five (refer to Table 6 and Table 7) bus cycles are then required to input the
Start Address
3.
One bus cycle is required to issue the Cache Read confirm command to start the P/E/R
Controller.
The Start Address must be at the beginning of a page (Column Address = 00h, see Table 8
and Table 9). This allows the data to be output uninterrupted after the latency time (tBLBH1),
see Figure 9
The Ready/Busy signal can be used to monitor the start of the operation. During the latency
period the Ready/Busy signal goes Low, after this the Ready/Busy signal goes High, even if
the device is internally downloading page n+1.
Once the Cache Read operation has started, the Status Register can be read using the
Read Status Register command.
During the operation, SR5 can be read, to find out whether the internal reading is ongoing
(SR5 = ‘0’), or has completed (SR5 = ‘1’), while SR6 indicates whether the Cache Register
is ready to download new data.
To exit the Cache Read operation an Exit Cache Read command must be issued (see
Table 10).
If the Exit Cache Read command is issued while the device is internally reading page n+1,
page n will still be output, but not page n+1.
Figure 9.
Cache Read Operation
tBLBH1
(Read Busy time)
RB
Busy
I/O
00h
Read
Setup
Code
Address
Inputs
31h
Cache
Read
Confirm
Code
1st page
2nd page
3rd page
last page
Block N
Data Output
34h
Exit
Cache
Read
Code
ai08661
26/64
NAND01G-B, NAND02G-B
6.3
Device operations
Page Program
The Page Program operation is the standard operation to program data to the memory
array. Generally, data is programmed sequentially, however the device does support
Random Input within a page.
The memory array is programmed by page, however partial page programming is allowed
where any number of Bytes (1 to 2112) or Words (1 to 1056) can be programmed.
The maximum number of consecutive partial page program operations allowed in the same
page is eight. After exceeding this a Block Erase command must be issued before any
further program operations can take place in that page.
6.3.1
Sequential Input
To input data sequentially the addresses must be sequential and remain in one block.
For Sequential Input each Page Program operation consists of five steps (see Figure 10):
6.3.2
1.
one bus cycle is required to setup the Page Program (Sequential Input) command (see
Table 10)
2.
four or five bus cycles are then required to input the program address (refer to Table 6
and Table 7)
3.
the data is then loaded into the Data Registers
4.
one bus cycle is required to issue the Page Program confirm command to start the
P/E/R Controller. The P/E/R will only start if the data has been loaded in step 3.
5.
the P/E/R Controller then programs the data into the array.
Random Data Input
During a Sequential Input operation, the next sequential address to be programmed can be
replaced by a random address, by issuing a Random Data Input command. The following
two steps are required to issue the command:
1.
one bus cycle is required to setup the Random Data Input command (see Table 10)
2.
two bus cycles are then required to input the new column address (refer to Table 6)
Random Data Input can be repeated as often as required in any given page.
Once the program operation has started the Status Register can be read using the Read
Status Register command. During program operations the Status Register will only flag
errors for bits set to '1' that have not been successfully programmed to '0'.
During the program operation, only the Read Status Register and Reset commands will be
accepted, all other commands will be ignored.
Once the program operation has completed the P/E/R Controller bit SR6 is set to ‘1’ and the
Ready/Busy signal goes High.
The device remains in Read Status Register mode until another valid command is written to
the Command Interface.
27/64
Device operations
NAND01G-B, NAND02G-B
Figure 10. Page Program Operation
tBLBH2
(Program Busy time)
RB
Busy
I/O
80h
Address Inputs
Data Input
10h
70h
Confirm
Code
Page Program
Setup Code
SR0
Read Status Register
ai08659
Figure 11. Random Data Input During Sequential Data Input
tBLBH2
(Program Busy time)
RB
Busy
I/O
80h
Address
Inputs
Data Intput
85h
Cmd
Code
Cmd
Code
5 Add cycles
Row Add 1,2,3 Col Add 1,2
Main Area
Spare
Area
Address
Inputs
2 Add cycles
Col Add 1,2
Data Input
10h
Confirm
Code
Main Area
70h
SR0
Read Status Register
Spare
Area
ai08664
28/64
NAND01G-B, NAND02G-B
6.4
Device operations
Copy Back Program
The Copy Back Program operation is used to copy the data stored in one page and
reprogram it in another page.
The Copy Back Program operation does not require external memory and so the operation
is faster and more efficient because the reading and loading cycles are not required. The
operation is particularly useful when a portion of a block is updated and the rest of the block
needs to be copied to the newly assigned block.
If the Copy Back Program operation fails an error is signalled in the Status Register.
However as the standard external ECC cannot be used with the Copy Back Program
operation bit error due to charge loss cannot be detected. For this reason it is recommended
to limit the number of Copy Back Program operations on the same data and or to improve
the performance of the ECC.
The Copy Back Program operation requires four steps:
1.
The first step reads the source page. The operation copies all 1056 Words/ 2112 Bytes
from the page into the Data Buffer. It requires:
–
one bus write cycle to setup the command
–
4 bus write cycles to input the source page address
–
one bus write cycle to issue the confirm command code
2.
When the device returns to the ready state (Ready/Busy High), the next bus write cycle
of the command is given with the 4 bus cycles to input the target page address. Refer
to Table 11 for the addresses that must be the same for the Source and Target pages.
3.
Then the confirm command is issued to start the P/E/R Controller.
To see the Data Input cycle for modifying the source page and an example of the Copy Back
Program operation refer to Figure 12.
A data input cycle to modify a portion or a multiple distant portion of the source page, is
shown in Figure 13
Table 11.
Copy Back Program x8 Addresses
Density
Same Address for Source and Target Pages
1 Gbit
no constraint
2 Gbit
no constraint
2 Gbit DD(1)
A28
1. DD = Dual Die
Table 12.
Copy Back Program x16 Addresses
Density
1 Gbit
no constraint
2 Gbit
2 Gbit
Same Address for Source and Target Pages
no constraint
DD(1)
A27
1. DD = Dual Die
29/64
Device operations
NAND01G-B, NAND02G-B
Figure 12. Copy Back Program
I/O
00h
Source
Add Inputs
35h
85h
Read
Code
Target
Add Inputs
10h
70h
Copy Back
Code
SR0
Read Status Register
tBLBH1
tBLBH2
(Read Busy time)
(Program Busy time)
RB
Busy
Busy
ai09858b
1. Copy back program is only permitted between odd address pages or even address pages.
Figure 13. Page Copy Back Program with Random Data Input
I/O
00h
Source
Add Inputs 35h
Read
Code
85h
Copy Back
Code
tBLBH1
Target
Add Inputs
Data
85h
2 Cycle
Add Inputs
Data
10h
70h
SR0
Unlimited number of repetitions
tBLBH2
(Read Busy time)
(Program Busy time)
RB
Busy
Busy
ai11001
30/64
NAND01G-B, NAND02G-B
6.5
Device operations
Cache Program
The Cache Program operation is used to improve the programming throughput by
programming data using the Cache Register. The Cache Program operation can only be
used within one block. The Cache Register allows new data to be input while the previous
data that was transferred to the Page Buffer is programmed into the memory array.
Each Cache Program operation consists of five steps (refer to Figure 14):
1.
First of all the program setup command is issued (one bus cycle to issue the program
setup command then four bus write cycles to input the address), the data is then input
(up to 2112 Bytes/ 1056 Words) and loaded into the Cache Register.
2.
One bus cycle is required to issue the confirm command to start the P/E/R Controller.
3.
The P/E/R Controller then transfers the data to the Page Buffer. During this the device
is busy for a time of tWHBH2.
4.
Once the data is loaded into the Page Buffer the P/E/R Controller programs the data
into the memory array. As soon as the Cache Registers are empty (after tWHBH2) a new
Cache program command can be issued, while the internal programming is still
executing.
Once the program operation has started the Status Register can be read using the Read
Status Register command. During Cache Program operations SR5 can be read to find out
whether the internal programming is ongoing (SR5 = ‘0’) or has completed (SR5 = ‘1’) while
SR6 indicates whether the Cache Register is ready to accept new data. If any errors have
been detected on the previous page (Page N-1), the Cache Program Error Bit SR1 will be set
to ‘1', while if the error has been detected on Page N the Error Bit SR0 will be set to '1’.
When the next page (Page N) of data is input with the Cache Program command, tWHBH2 is
affected by the pending internal programming. The data will only be transferred from the
Cache Register to the Page Buffer when the pending program cycle is finished and the Page
Buffer is available.
If the system monitors the progress of the operation using only the Ready/Busy signal, the
last page of data must be programmed with the Page Program confirm command (10h).
If the Cache Program confirm command (15h) is used instead, Status Register bit SR5 must
be polled to find out if the last programming is finished before starting any other operations.
Figure 14. Cache Program Operation
tBLBH5
tBLBH5
(Cache Busy time)
tCACHEPG
RB
Busy
I/O
80h
Address
Inputs
Data
Inputs
Page
Program
Code
First Page
Busy
Busy
15h
80h
Cache
Program
Code
Page
Program
Code
Address
Inputs
Data
Inputs
15h
80h
Address
Inputs
Data
Inputs
Cache Program
Confirm Code
Second Page
10h
70h SR0
Read Status
Page
Register
Program
Confirm Code
Last Page
(can be repeated up to 63 times)
ai08672
1. Up to 64 pages can be programmed in one Cache Program operation.
2. tCACHEPG is the program time for the last page + the program time for the (last − 1)th page −(Program command cycle time
+ Last page data loading time).
31/64
Device operations
6.6
NAND01G-B, NAND02G-B
Block Erase
Erase operations are done one block at a time. An erase operation sets all of the bits in the
addressed block to ‘1’. All previous data in the block is lost.
An erase operation consists of three steps (refer to Figure 15):
1.
One bus cycle is required to setup the Block Erase command. Only addresses A18A28 (x8) or A17-A27 (x16) are used, the other address inputs are ignored.
2.
two or three bus cycles are then required to load the address of the block to be erased.
Refer to Table 8 and Table 9 for the block addresses of each device.
3.
one bus cycle is required to issue the Block Erase confirm command to start the P/E/R
Controller.
The operation is initiated on the rising edge of write Enable, W, after the confirm command
is issued. The P/E/R Controller handles Block Erase and implements the verify process.
During the Block Erase operation, only the Read Status Register and Reset commands will
be accepted, all other commands will be ignored.
Once the program operation has completed the P/E/R Controller bit SR6 is set to ‘1’ and the
Ready/Busy signal goes High. If the operation completed successfully, the Write Status Bit
SR0 is ‘0’, otherwise it is set to ‘1’.
Figure 15. Block Erase Operation
tBLBH3
(Erase Busy time)
RB
Busy
I/O
60h
Block Erase
Setup Code
Block Address
Inputs
D0h
Confirm
Code
70h
SR0
Read Status Register
ai07593
6.7
Reset
The Reset command is used to reset the Command Interface and Status Register. If the
Reset command is issued during any operation, the operation will be aborted. If it was a
program or erase operation that was aborted, the contents of the memory locations being
modified will no longer be valid as the data will be partially programmed or erased.
If the device has already been reset then the new Reset command will not be accepted.
The Ready/Busy signal goes Low for tBLBH4 after the Reset command is issued. The value
of tBLBH4 depends on the operation that the device was performing when the command was
issued, refer to Table 25: AC Characteristics for Operations for the values.
32/64
NAND01G-B, NAND02G-B
6.8
Device operations
Read Status Register
The device contains a Status Register which provides information on the current or previous
Program or Erase operation. The various bits in the Status Register convey information and
errors on the operation.
The Status Register is read by issuing the Read Status Register command. The Status
Register information is present on the output data bus (I/O0-I/O7) on the falling edge of Chip
Enable or Read Enable, whichever occurs last. When several memories are connected in a
system, the use of Chip Enable and Read Enable signals allows the system to poll each
device separately, even when the Ready/Busy pins are common-wired. It is not necessary to
toggle the Chip Enable or Read Enable signals to update the contents of the Status
Register.
After the Read Status Register command has been issued, the device remains in Read
Status Register mode until another command is issued. Therefore if a Read Status Register
command is issued during a Random Read cycle a new Read command must be issued to
continue with a Page Read operation.
The Status Register bits are summarized in Table 13: Status Register Bits,. Refer to
Table 13 in conjunction with the following text descriptions.
6.8.1
Write Protection Bit (SR7)
The Write Protection bit can be used to identify if the device is protected or not. If the Write
Protection bit is set to ‘1’ the device is not protected and program or erase operations are
allowed. If the Write Protection bit is set to ‘0’ the device is protected and program or erase
operations are not allowed.
6.8.2
P/E/R Controller and Cache Ready/Busy Bit (SR6)
Status Register bit SR6 has two different functions depending on the current operation.
During Cache Program operations SR6 acts as a Cache Program Ready/Busy bit, which
indicates whether the Cache Register is ready to accept new data. When SR6 is set to '0',
the Cache Register is busy and when SR6 is set to '1', the Cache Register is ready to
accept new data.
During all other operations SR6 acts as a P/E/R Controller bit, which indicates whether the
P/E/R Controller is active or inactive. When the P/E/R Controller bit is set to ‘0’, the P/E/R
Controller is active (device is busy); when the bit is set to ‘1’, the P/E/R Controller is inactive
(device is ready).
6.8.3
P/E/R Controller Bit (SR5)
The Program/Erase/Read Controller bit indicates whether the P/E/R Controller is active or
inactive. When the P/E/R Controller bit is set to ‘0’, the P/E/R Controller is active (device is
busy); when the bit is set to ‘1’, the P/E/R Controller is inactive (device is ready).
33/64
Device operations
6.8.4
NAND01G-B, NAND02G-B
Cache Program Error Bit (SR1)
The Cache Program Error bit can be used to identify if the previous page (page N-1) has
been successfully programmed or not in a Cache Program operation. SR1 is set to ’1’ when
the Cache Program operation has failed to program the previous page (page N-1) correctly.
If SR1 is set to ‘0’ the operation has completed successfully.
The Cache Program Error bit is only valid during Cache Program operations, during other
operations it is Don’t Care.
6.8.5
Error Bit (SR0)
The Error bit is used to identify if any errors have been detected by the P/E/R Controller. The
Error Bit is set to ’1’ when a program or erase operation has failed to write the correct data to
the memory. If the Error Bit is set to ‘0’ the operation has completed successfully. The Error
Bit SR0, in a Cache Program operation, indicates a failure on Page N.
6.8.6
SR4, SR3 and SR2 are Reserved
Table 13.
Status Register Bits
Bit
Name
SR7
Write Protection
Logic Level
Definition
'1'
Not Protected
'0'
Protected
'1'
P/E/R C inactive, device ready
'0'
P/E/R C active, device busy
'1'
Cache Register ready (Cache Program only)
'0'
Cache Register busy (Cache Program only)
Program/ Erase/ Read
Controller(2)
'1'
P/E/R C inactive, device ready
'0'
P/E/R C active, device busy
SR4, SR3, SR2
Reserved
Don’t Care
SR1
Cache Program Error(3)
Program/ Erase/ Read
Controller
SR6(1)
Cache Ready/Busy
SR5
'1'
Page N-1 failed in Cache Program operation
'0'
Page N-1 programmed successfully
‘1’
Error – operation failed
‘0’
No Error – operation successful
‘1’
Page N failed in Cache Program operation
‘0’
Page N programmed successfully
Generic Error
SR0(1)
Cache Program Error
1. The SR6 bit and SR0 bit have a different meaning during Cache Program and Cache Read operations.
2. Only valid for Cache Program operations, for other operations it is same as SR6.
3. Only valid for Cache Program operations, for other operations it is Don’t Care.
34/64
NAND01G-B, NAND02G-B
6.9
Device operations
Read Electronic Signature
The device contains a Manufacturer Code and Device Code. To read these codes three steps
are required:
1.
one Bus Write cycle to issue the Read Electronic Signature command (90h)
2.
one Bus Write cycle to input the address (00h)
3.
four Bus Read Cycles to sequentially output the data (as shown in Table 14: Electronic
Signature).
Table 14.
Electronic Signature
Part Number
Byte/Word 1
Byte/Word 2
Manufacturer
Code
Device code
NAND01GR3B
Byte/Word 3
Byte/Word 4
Reserved
80h
Page Size
Spare Area size
Sequential Access
Time
Block Size
Organization
(seeTable 15)
A1h
20h
NAND01GW3B
F1h
NAND01GR4B
B1h
0020h
NAND01GW4B
C1h
NAND02GR3B
AAh
20h
NAND02GW3B
DAh
NAND02GR4B
BAh
0020h
NAND02GW4B
Table 15.
CAh
Electronic Signature Byte/Word 4
I/O
Definition
Value
Description
I/O1-I/O0
Page Size
(Without Spare Area)
00
01
10
11
1K
2K
Reserved
Reserved
I/O2
Spare Area Size
(Byte / 512 Byte)
0
1
8
16
I/O3
Sequential Access Time
0
1
Standard (50 ns)
Fast
(30 ns)
I/O5-I/O4
Block Size
(Without Spare Area)
00
01
10
11
64K
128K
256K
Reserved
I/O6
Organization
0
1
X8
X16
I/O7
Not Used
Reserved
35/64
Data protection
7
NAND01G-B, NAND02G-B
Data protection
The device has both hardware and software features to protect against program and erase
operations.
It features a Write Protect, WP, pin, which can be used to protect the device against program
and erase operations. It is recommended to keep WP at VIL during power-up and powerdown.
In addition, to protect the memory from any involuntary program/erase operations during
power-transitions, the device has an internal voltage detector which disables all functions
whenever VDD is below VLKO (see Table 22 and Table 23).
The device features a Block Lock mode, which is enabled by setting the Power-Up Read
Enable, Lock/Unlock Enable, PRL, signal to High.
The Block Lock mode has two levels of software protection.
●
Blocks Lock/Unlock
●
Blocks Lock-down
Refer to Figure 18 for an overview of the protection mechanism.
7.1
Blocks Lock
All the blocks are locked simultaneously by issuing a Blocks Lock command (see Table 10:
Commands).
All blocks are locked after power-up and when the Write Protect signal is Low.
Once all the blocks are locked, one sequence of consecutive blocks can be unlocked by
using the Blocks Unlock command.
Refer to Figure 23: Command Latch AC Waveforms for details on how to issue the
command.
7.2
Blocks Unlock
A sequence of consecutive locked blocks can be unlocked, to allow program or erase
operations, by issuing an Blocks Unlock command (see Table 10: Commands).
The Blocks Unlock command consists of four steps:
1.
One bus cycle to setup the command
2.
two or three bus cycles to give the Start Block Address (refer to Table 8, Table 9 and
Figure 16)
3.
one bus cycle to confirm the command
4.
two or three bus cycles to give the End Block Address (refer to Table 8, Table 9 and
Figure 16).
The Start Block Address must be nearer the logical LSB (Least Significant Bit) than End
Block Address.
36/64
NAND01G-B, NAND02G-B
Data protection
If the Start Block Address is the same as the End Block Address, only one block is unlocked.
Only one consecutive area of blocks can be unlocked at any one time. It is not possible to
unlock multiple areas.
Figure 16. Blocks Unlock Operation
WP
I/O
23h
Blocks Unlock
Command
Add1
Add2
Add3
24h
Start Block Address, 3 cycles
Add1
Add2
Add3
End Block Address, 3 cycles
ai08670
1. Three address cycles are required for 2 Gb devices. 1Gb devices only require two address cycles.
7.3
Blocks Lock-Down
The Lock-Down feature provides an additional level of protection. A Locked-down block
cannot be unlocked by a software command. Locked-Down blocks can only be unlocked by
setting the Write Protect signal to Low for a minimum of 100ns.
Only locked blocks can be locked-down. The command has no affect on unlocked blocks.
Refer to Figure 23: Command Latch AC Waveforms for details on how to issue the
command.
7.4
Block Lock Status
In Block Lock mode (PRL High) the Block Lock Status of each block can be checked by
issuing a Read Block Lock Status command (see Table 10: Commands).
The command consists of:
●
one bus cycle to give the command code
●
three bus cycles to give the block address
After this, a read cycle will then output the Block Lock Status on the I/O pins on the falling
edge of Chip Enable or Read Enable, whichever occurs last. Chip Enable or Read Enable
do not need to be toggled to update the status.
The Read Block Lock Status command will not be accepted while the device is busy (RB
Low).
The device will remain in Read Block Lock Status mode until another command is issued.
37/64
Data protection
NAND01G-B, NAND02G-B
Figure 17. Read Block Lock Status Operation
W
tWHRL
R
I/O
Add1
7Ah
Read Block Lock
Status Command
Add2
Add3
Dout
Block Lock Status
Block Address, 3 cycles
ai08669
1. Three address cycles are required for 2 Gb devices. 1Gb devices only require two address cycles.
Table 16.
Block Lock Status
Status
I/O7-I/O3
I/O2
I/O1
I/O0
Locked
X
0
1
0
Unlocked
X
1
1
0
Locked-Down
X
0
0
1
Unlocked in
Locked-Down
Area
X
1
0
1
1. X = Don’t Care.
38/64
NAND01G-B, NAND02G-B
Data protection
Figure 18. Block Protection State Diagram
Power-Up
Block Unlock
Command
(start + end block address)
Locked
Blocks Lock
Command
Blocks Lock-Down
Command
WP VIL >100ns
WP VIL >100ns
Unlocked in
Locked Area
Locked-Down
WP VIL >100ns
Blocks Lock-Down
Command
Unlocked in
Locked-Down
Area
AI08663c
1. PRL must be High for the software commands to be accepted.
39/64
Software algorithms
8
NAND01G-B, NAND02G-B
Software algorithms
This section gives information on the software algorithms that ST recommends to implement
to manage the Bad Blocks and extend the lifetime of the NAND device.
NAND Flash memories are programmed and erased by Fowler-Nordheim tunneling using a
high voltage. Exposing the device to a high voltage for extended periods can cause the
oxide layer to be damaged. For this reason, the number of program and erase cycles is
limited (see Table 18 for value) and it is recommended to implement Garbage Collection, a
Wear-Leveling Algorithm and an Error Correction Code, to extend the number of program
and erase cycles and increase the data retention.
To help integrate a NAND memory into an application ST Microelectronics can provide a File
System OS Native reference software, which supports the basic commands of file
management.
Contact the nearest ST Microelectronics sales office for more details.
8.1
Bad Block Management
Devices with Bad Blocks have the same quality level and the same AC and DC
characteristics as devices where all the blocks are valid. A Bad Block does not affect the
performance of valid blocks because it is isolated from the bit line and common source line
by a select transistor.
The devices are supplied with all the locations inside valid blocks erased (FFh). The Bad
Block Information is written prior to shipping. Any block, where the 1st and 6th Bytes, or 1st
Word, in the spare area of the 1st page, does not contain FFh, is a Bad Block.
The Bad Block Information must be read before any erase is attempted as the Bad Block
Information may be erased. For the system to be able to recognize the Bad Blocks based on
the original information it is recommended to create a Bad Block table following the
flowchart shown in Figure 19
8.2
Block Replacement
Over the lifetime of the device additional Bad Blocks may develop. In this case the block has
to be replaced by copying the data to a valid block. These additional Bad Blocks can be
identified as attempts to program or erase them will give errors in the Status Register.
As the failure of a page program operation does not affect the data in other pages in the
same block, the block can be replaced by re-programming the current data and copying the
rest of the replaced block to an available valid block. The Copy Back Program command can
be used to copy the data to a valid block.
See the Section 6.4: Copy Back Program for more details.
Refer to Table 17 for the recommended procedure to follow if an error occurs during an
operation.
40/64
NAND01G-B, NAND02G-B
Table 17.
Software algorithms
Block Failure
Operation
Recommended Procedure
Erase
Block Replacement
Program
Block Replacement or ECC
Read
ECC
Figure 19. Bad Block Management Flowchart
START
Block Address =
Block 0
Data
= FFh?
Increment
Block Address
NO
Update
Bad Block table
YES
Last
block?
NO
YES
END
AI07588C
Figure 20. Garbage Collection
Old Area
New Area (After GC)
Valid
Page
Invalid
Page
Free
Page
(Erased)
AI07599B
41/64
Software algorithms
8.3
NAND01G-B, NAND02G-B
Garbage Collection
When a data page needs to be modified, it is faster to write to the first available page, and
the previous page is marked as invalid. After several updates it is necessary to remove
invalid pages to free some memory space.
To free this memory space and allow further program operations it is recommended to
implement a Garbage Collection algorithm. In a Garbage Collection software the valid
pages are copied into a free area and the block containing the invalid pages is erased (see
Figure 20).
8.4
Wear-leveling algorithm
For write-intensive applications, it is recommended to implement a Wear-leveling Algorithm
to monitor and spread the number of write cycles per block.
In memories that do not use a Wear-Leveling Algorithm not all blocks get used at the same
rate. Blocks with long-lived data do not endure as many write cycles as the blocks with
frequently-changed data.
The Wear-leveling Algorithm ensures that equal use is made of all the available write cycles
for each block. There are two wear-leveling levels:
●
First Level Wear-leveling, new data is programmed to the free blocks that have had the
fewest write cycles
●
Second Level Wear-leveling, long-lived data is copied to another block so that the
original block can be used for more frequently-changed data.
The Second Level Wear-leveling is triggered when the difference between the maximum
and the minimum number of write cycles per block reaches a specific threshold.
8.5
Error Correction Code
An Error Correction Code (ECC) can be implemented in the NAND Flash memories to
identify and correct errors in the data.
For every 2048 bits in the device it is recommended to implement 22 bits of ECC (16 bits for
line parity plus 6 bits for column parity).
An ECC model is available in VHDL or Verilog. Contact the nearest ST Microelectronics
sales office for more details.
42/64
NAND01G-B, NAND02G-B
Software algorithms
Figure 21. Error Detection
New ECC generated
during read
XOR previous ECC
with new ECC
All results
= zero?
NO
YES
>1 bit
= zero?
NO
YES
22 bit data = 0
11 bit data = 1
1 bit data = 1
No Error
Correctable
Error
ECC Error
ai08332
8.6
Hardware Simulation models
8.6.1
Behavioral simulation models
Denali Software Corporation models are platform independent functional models designed
to assist customers in performing entire system simulations (typical VHDL/Verilog). These
models describe the logic behavior and timings of NAND Flash devices, and so allow
software to be developed before hardware.
8.6.2
IBIS simulations models
IBIS (I/O Buffer Information Specification) models describe the behavior of the I/O buffers
and electrical characteristics of Flash devices.
These models provide information such as AC characteristics, rise/fall times and package
mechanical data, all of which are measured or simulated at voltage and temperature ranges
wider than those allowed by target specifications.
IBIS models are used to simulate PCB connections and can be used to resolve compatibility
issues when upgrading devices. They can be imported into SPICETOOLS.
43/64
Program and Erase Times and Endurance cycles
9
NAND01G-B, NAND02G-B
Program and Erase Times and Endurance cycles
The Program and Erase times and the number of Program/ Erase cycles per block are
shown in Table 18.
Table 18.
Program, Erase Times and Program Erase Endurance Cycles
NAND Flash
Parameters
Unit
Min
Page Program Time
Block Erase Time
Program/Erase Cycles (per block)
Data Retention
44/64
Typ
Max
300
700
µs
2
3
ms
100,000
cycles
10
years
NAND01G-B, NAND02G-B
10
Maximum rating
Maximum rating
Stressing the device above the ratings listed in Table 19: Absolute Maximum Ratings, may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 19.
Absolute Maximum Ratings
Value
Symbol
Parameter
Unit
Min
Max
TBIAS
Temperature Under Bias
– 50
125
°C
TSTG
Storage Temperature
– 65
150
°C
VIO(1)
1.8V devices
– 0.6
2.7
V
Input or Output Voltage
3 V devices
– 0.6
4.6
V
1.8V devices
– 0.6
2.7
V
3 V devices
– 0.6
4.6
V
VDD
Supply Voltage
1. Minimum Voltage may undershoot to –2V for less than 20ns during transitions on input and I/O pins.
Maximum voltage may overshoot to VDD + 2V for less than 20ns during transitions on I/O pins.
45/64
DC And AC parameters
11
NAND01G-B, NAND02G-B
DC And AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristics Tables that
follow, are derived from tests performed under the Measurement Conditions summarized in
Table 20: Operating and AC Measurement Conditions. Designers should check that the
operating conditions in their circuit match the measurement conditions when relying on the
quoted parameters.
Table 20.
Operating and AC Measurement Conditions
NAND Flash
Parameter
Supply Voltage (VDD)
Ambient Temperature (TA)
Load Capacitance (CL)
(1 TTL GATE and CL)
Units
Min
Max
1.8V devices
1.7
1.95
V
3V devices
2.7
3.6
V
Grade 1
0
70
°C
Grade 6
–40
85
°C
1.8V devices
30
pF
3V devices (2.7 - 3.6V)
50
pF
1.8V devices
0
VDD
V
3V devices
0.4
2.4
V
Input Pulses Voltages
1.8V devices
0.9
V
3V devices
1.5
V
8.35
kΩ
5
ns
Input and Output Timing Ref. Voltages
Output Circuit Resistor Rref
Input Rise and Fall Times
Table 21.
Capacitance(1)
Symbol
Parameter
Test Condition
Max
Unit
CIN
Input Capacitance
VIN = 0V
10
pF
CI/O
Input/Output
Capacitance(2)
VIL = 0V
10
pF
1. TA = 25°C, f = 1 MHz. CIN and CI/O are not 100% tested
2. Input/output capacitances double in stacked devices
46/64
Typ
NAND01G-B, NAND02G-B
Table 22.
Symbol
DC And AC parameters
DC Characteristics, 1.8V Devices
Parameter
Test Conditions
Min
Typ
Max
Unit
Sequential
Read
tRLRL minimum
E=VIL, IOUT = 0 mA
-
8
15
mA
Program
-
-
8
15
mA
IDD3
Erase
-
-
8
15
mA
IDD5
Standby Current (CMOS)(1)
E=VDD-0.2,
WP=0/VDD
-
10
50
µA
ILI
Input Leakage Current(1)
VIN= 0 to VDDmax
-
-
±10
µA
ILO
Output Leakage Current(1)
VOUT= 0 to VDDmax
-
-
±10
µA
VIH
Input High Voltage
-
VDD-0.4
-
VDD+0.3
V
VIL
Input Low Voltage
-
-0.3
-
0.4
V
VOH
Output High Voltage Level
IOH = -100µA
VDD-0.1
-
-
V
VOL
Output Low Voltage Level
IOL = 100µA
-
-
0.1
V
IOL (RB)
Output Low Current (RB)
VOL = 0.1V
3
4
VLKO
VDD Supply Voltage (Erase and
Program lockout)
-
-
-
IDD1
IDD2
Operating
Current
mA
1.1
V
1. Leakage current and standby current double in stacked devices
Figure 22. Equivalent Testing Circuit for AC Characteristics Measurement
VDD
2Rref
NAND Flash
CL
2Rref
GND
GND
Ai11085
47/64
DC And AC parameters
Table 23.
Symbol
NAND01G-B, NAND02G-B
DC Characteristics, 3V Devices
Parameter
Test Conditions
Min
Typ
Max
Unit
Sequential
Read
tRLRL minimum
E=VIL, IOUT = 0 mA
-
15
30
mA
Program
-
-
15
30
mA
IDD3
Erase
-
-
15
30
mA
IDD4
(1)
E=VIH, WP=0/VDD
1
mA
IDD1
IDD2
Operating
Current
Standby current (TTL)
IDD5
Standby Current (CMOS)(1)
E=VDD-0.2,
WP=0/VDD
-
10
50
µA
ILI
Input Leakage Current(1)
VIN= 0 to VDDmax
-
-
±10
µA
VOUT= 0 to VDDmax
-
-
±10
µA
ILO
Output Leakage
Current(1)
VIH
Input High Voltage
-
0.8VDD
-
VDD+0.3
V
VIL
Input Low Voltage
-
-0.3
-
0.2VDD
V
VOH
Output High Voltage Level
IOH = -400µA
2.4
-
-
V
VOL
Output Low Voltage Level
IOL = 2.1mA
-
-
0.4
V
IOL (RB)
Output Low Current (RB)
VOL = 0.4V
8
10
VLKO
VDD Supply Voltage (Erase and
Program lockout)
-
-
-
1. Leakage current and standby current double in stacked devices
48/64
mA
1.7
V
NAND01G-B, NAND02G-B
Table 24.
Symbol
tALLWL
tALHWL
tCLHWL
DC And AC parameters
AC Characteristics for Command, Address, Data Input
Alt.
Symbol
1.8V
3V
Unit
Devices Devices
Parameter
Address Latch Low to Write Enable Low
tALS
tCLS
tCLLWL
AL Setup time
Min
0
0
ns
CL Setup time
Min
0
0
ns
Address Latch High to Write Enable Low
Command Latch High to Write Enable
Low
Command Latch Low to Write Enable Low
tDVWH
tDS
Data Valid to Write Enable High
Data Setup time
Min
20
20
ns
tELWL
tCS
Chip Enable Low to Write Enable Low
E Setup time
Min
0
0
ns
tWHALH
tALH
Write Enable High to Address Latch High
AL Hold time
Min
10
10
ns
CL hold time
Min
10
10
ns
Write Enable High to Command Latch
High
tWHCLH
tCLH
tWHCLL
Write Enable High to Command Latch
Low
tWHDX
tDH
Write Enable High to Data Transition
Data Hold time
Min
10
10
ns
tWHEH
tCH
Write Enable High to Chip Enable High
E Hold time
Min
10
10
ns
tWHWL
tWH
Write Enable High to Write Enable Low
W High Hold
time
Min
20
20
ns
(1)
tWP
Write Enable Low to Write Enable High
W Pulse Width
Min
25
25
ns
tWLWL
tWC
Write Enable Low to Write Enable Low
Write Cycle time
Min
60
50
ns
tWLWH
1. If tELWL is less than 10ns, tWLWH must be minimum 35ns, otherwise, tWLWH may be minimum 25ns.
49/64
DC And AC parameters
Table 25.
Symbol
tALLRL1
tALLRL2
tBHRL
AC Characteristics for Operations(1)(2)
Alt.
Symbol
Address Latch Low to Read Electronic Signature
Read Enable Low
Read cycle
Min
10
10
ns
tAR
Min
10
10
ns
tRR
Ready/Busy High to Read Enable Low
Min
20
20
ns
Read Busy time
Max
25
25
µs
Program Busy time
Max
700
700
µs
Erase Busy time
Max
3
3
ms
Reset Busy time, during ready
Max
5
5
µs
Typ
3
3
µs
Max
700
700
µs
Reset Busy time, during read
Max
5
5
µs
Reset Busy time, during program
Max
10
10
µs
Reset Busy time, during erase
Max
500
500
µs
Command Latch Low to Read Enable Low
Min
10
10
ns
Data Hi-Z to Read Enable Low
Min
0
0
ns
tBLBH2
tPROG
tBLBH3
tBERS
tBLBH4
tWHBH1
1.8V
3V
Unit
Devices Devices
Parameter
tBLBH1
tBLBH5
NAND01G-B, NAND02G-B
Ready/Busy Low to
Ready/Busy High
tCBSY
tRST
Cache Busy time
Write Enable High to
Ready/Busy High
tCLLRL
tCLR
tDZRL
tIR
tEHQZ
tCHZ
Chip Enable High to Output Hi-Z
Max
20
20
ns
tELQV
tCEA
Chip Enable Low to Output Valid
Max
45
45
ns
tRHRL
tREH
Read Enable High to
Read Enable Low
Min
20
20
ns
TOH
Chip Enable high or Read Enable high to Output Hold
Min
15
15
ns
tRLRH
tRP
Read Enable Low to
Read Enable High
Read Enable Pulse Width
Min
25
25
ns
tRLRL
tRC
Read Enable Low to
Read Enable Low
Read Cycle time
Min
60
50
ns
tRLQV
tREA
Read Enable Low to
Output Valid
Max
35
35
ns
tWHBH
tR
Write Enable High to
Ready/Busy High
Max
25
25
µs
tWHBL
tWB
Write Enable High to Ready/Busy Low
Max
100
100
ns
tWHRL
tWHR
Write Enable High to Read Enable Low
Min
60
60
ns
tWLWL
tWC
Write Enable Low to
Write Enable Low
Min
60
50
ns
TEHQX
TRHQX
Read Enable High Hold time
Read Enable Access time
Read ES Access time(3)
Read Busy time
Write Cycle time
1. The time to Ready depends on the value of the pull-up resistor tied to the Ready/Busy pin. See Figure 33, Figure 34 and
Figure 35.
2. To break the sequential read cycle, E must be held High for longer than tEHEL.
3. ES = Electronic Signature.
50/64
NAND01G-B, NAND02G-B
DC And AC parameters
Figure 23. Command Latch AC Waveforms
CL
tWHCLL
tCLHWL
(CL Setup time)
(CL Hold time)
tWHEH
tELWL
(E Hold time)
(E Setup time)
E
tWLWH
W
tALLWL
tWHALH
(ALSetup time)
(AL Hold time)
AL
tDVWH
tWHDX
(Data Setup time)
(Data Hold time)
I/O
Command
ai08028
Figure 24. Address Latch AC Waveforms
tCLLWL
(CL Setup time)
CL
tELWL
tWLWL
tWLWL
(E Setup time)
tWLWL
E
tWLWH
tWLWH
tWLWH
tWLWH
W
tWHWL
tALHWL
tWHWL
tWHWL
(AL Setup time)
tWHALL
tWHALL
tWHALL
(AL Hold time)
AL
tDVWH
tDVWH
(Data Setup time)
tDVWH
tDVWH
tWHDX
tWHDX
tWHDX
tWHDX
(Data Hold time)
I/O
Adrress
cycle 1
Adrress
cycle 2
Adrress
cycle 3
Adrress
cycle 4
ai08029
1. A fifth address cycle is required for 2Gb devices.
51/64
DC And AC parameters
NAND01G-B, NAND02G-B
Figure 25. Data Input Latch AC Waveforms
tWHCLH
(CL Hold time)
CL
tWHEH
(E Hold time)
E
tALLWL
tWLWL
(ALSetup time)
AL
tWLWH
tWLWH
tWLWH
W
tDVWH
tDVWH
tDVWH
(Data Setup time)
tWHDX
tWHDX
tWHDX
(Data Hold time)
I/O
Data In 0
Data In 1
Data In
Last
ai08030
1. Data In Last is 2112 in x8 devices and 1056 in x16 devices.
Figure 26. Sequential Data Output after Read AC Waveforms
tRLRL
(Read Cycle time)
E
tRHRL
tEHQZ
(R High Holdtime)
R
tRHQZ
tRLQV
tRLQV
tRHQZ
tRLQV
(R Accesstime)
I/O
Data Out
Data Out
Data Out
tBHRL
RB
ai08031
1. CL = Low, AL = Low, W = High.
52/64
NAND01G-B, NAND02G-B
DC And AC parameters
Figure 27. Read Status Register AC Waveform
tCLLRL
CL
tWHCLL
tCLHWL
tWHEH
E
tELWL
tWLWH
W
tELQV
tWHRL
tEHQZ
R
tDZRL
tDVWH
tWHDX
tRLQV
70h/ 72h/
73h/ 74h/ 75h
I/O
tRHQZ
(Data Hold time)
(Data Setup time)
Status Register
Output
ai08666
Figure 28. Read Electronic Signature AC Waveform
CL
E
W
AL
tALLRL1
R
tRLQV
(Read ES Access time)
I/O
90h
Read Electronic
Signature
Command
00h
Byte1
Byte2
Byte3
Byte4
1st Cycle
Address
Man.
code
Device
code
00h
see Note.1
ai08667
1. Refer to Table 14 for the values of the Manufacturer and Device Codes, and to Table 15 for the information contained in
Byte4.
53/64
DC And AC parameters
NAND01G-B, NAND02G-B
Figure 29. Page Read Operation AC Waveform
CL
tEHEL
E
tWLWL
tEHQZ
W
tWHBL
tEHBH
AL
tALLRL2
tWHBH
tRLRL
tRHQZ
(Read Cycle time)
R
tRLRH
tRHBL
tBLBH1
RB
I/O
00h
Add.N
cycle 1
Command
Code
Add.N
cycle 2
Add.N
cycle 3
Add.N
cycle 4
Address N Input
Data
N
30h
Busy
Data
N+1
Data
N+2
Data
Last
Data Output
from Address N to Last Byte or Word in Page
ai08660
1. A fifth address cycle is required for 2Gb devices.
54/64
NAND01G-B, NAND02G-B
DC And AC parameters
Figure 30. Page Program AC Waveform
CL
E
tWLWL
tWLWL
tWLWL
(Write Cycle time)
W
tWHBL
tBLBH2
(Program Busy time)
AL
R
I/O
80h
Add.N
cycle 1
Add.N Add.N Add.N
cycle 2 cycle 3 cycle 4
N
Last
10h
70h
SR0
RB
Page Program
Setup Code
Address Input
Data Input
Confirm
Code
Page
Program Read Status Register
ai08668
1. A fifth address cycle is required for 2Gb devices.
55/64
DC And AC parameters
NAND01G-B, NAND02G-B
Figure 31. Block Erase AC Waveform
CL
E
tWLWL
(Write Cycle time)
W
tBLBH3
tWHBL
(Erase Busy time)
AL
R
I/O
60h
Add.
Add.
Add.
cycle 1 cycle 2 cycle 3
70h
D0h
SR0
RB
Block Erase
Setup Command
Block Address Input
Confirm
Code
Block Erase
Read Status Register
ai08038b
1. Address cycle 3 is required for 2Gb devices only.
Figure 32. Reset AC Waveform
W
AL
CL
R
I/O
FFh
tBLBH4
(Reset Busy time)
RB
ai08043
56/64
NAND01G-B, NAND02G-B
11.1
DC And AC parameters
Ready/Busy Signal electrical characteristics
Figure 34, Figure 33 and Figure 35 show the electrical characteristics for the Ready/Busy
signal. The value required for the resistor RP can be calculated using the following equation:
(V
–
)
DDmax V OLmax R P min = -----------------------------------------------------------+
I
I OL
L
So,
1.85V R P min ( 1.8V ) = -------------------------3mA + I L
3.2V
R P min ( 3V ) = --------------------------8mA + I L
where IL is the sum of the input currents of all the devices tied to the Ready/Busy signal. RP
max is determined by the maximum value of tr.
Figure 33. Ready/Busy AC Waveform
ready VDD
VOH
VOL
busy
tr
tf
AI07564B
Figure 34. Ready/Busy Load Circuit
VDD
RP
ibusy
DEVICE
RB
Open Drain Output
VSS
AI07563B
57/64
DC And AC parameters
NAND01G-B, NAND02G-B
Figure 35. Resistor Value Versus Waveform Timings For Ready/Busy Signal
VDD = 1.8V, CL = 30pF
VDD = 3.3V, CL = 100pF
400
400
4
4
200
2
1.7
300
2.4
200
0
0.85
30
1.7
1
60
1.7
100
0.8
1
3.6
3.6
100
0.6
0.43
1.7
2
1.2
1
90
0.57
2
200
120
100
3
300
1.7
3
ibusy (mA)
3
tr, tf (ns)
300
ibusy (mA)
tr, tf (ns)
400
0
4
3.6
3.6
1
2
RP (KΩ)
3
4
RP (KΩ)
tf
tr
ibusy
ai07565B
1. T = 25°C.
11.2
Data Protection
The ST NAND device is designed to guarantee Data Protection during Power Transitions.
A VDD detection circuit disables all NAND operations, if VDD is below the VLKO threshold.
In the VDD range from VLKO to the lower limit of nominal range, the WP pin should be kept
low (VIL) to guarantee hardware protection during power transitions as shown in the below
figure.
Figure 36. Data Protection
VDD
Nominal Range
VLKO
Locked
Locked
W
Ai11086
58/64
NAND01G-B, NAND02G-B
12
Package mechanical
Package mechanical
Figure 37. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20 mm, Package Outline
1
48
e
D1
B
24
L1
25
A2
E1
E
A
A1
DIE
α
L
C
CP
TSOP-G
1. Drawing is not to scale.
Table 26.
TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20 mm, Package Mechanical Data
millimeters
inches
Symbol
Typ
Min
A
Max
Typ
Min
1.200
Max
0.0472
A1
0.100
0.050
0.150
0.0039
0.0020
0.0059
A2
1.000
0.950
1.050
0.0394
0.0374
0.0413
B
0.220
0.170
0.270
0.0087
0.0067
0.0106
0.100
0.210
0.0039
0.0083
C
CP
0.080
0.0031
D1
12.000
11.900
12.100
0.4724
0.4685
0.4764
E
20.000
19.800
20.200
0.7874
0.7795
0.7953
E1
18.400
18.300
18.500
0.7244
0.7205
0.7283
e
0.500
–
–
0.0197
–
L
0.600
0.500
0.700
0.0236
0.0197
0.0276
L1
0.800
a
3°
0°
5°
0.0315
0°
5°
3°
59/64
Package mechanical
NAND01G-B, NAND02G-B
Figure 38. VFBGA63 9.5x12mm - 6x8 active ball array, 0.80mm pitch, Package Outline
D
D2
D1
FD1
SD
FD
e
e
E E2
SE
E1
ddd
FE1
BALL "A1"
FE
e
b
A
A2
A1
BGA-Z67
1. Drawing is not to scale
Table 27.
VFBGA63 9.5x12mm - 6x8 active ball array, 0.80mm pitch, Package Mechanical Data
millimeters
inches
Symbol
Typ
Min
A
Typ
Min
1.05
A1
Max
0.0413
0.25
A2
0.0098
0.70
0.0276
b
0.45
0.40
0.50
0.0177
0.0157
0.0197
D
9.50
9.40
9.60
0.3740
0.3701
0.3780
D1
4.00
0.1575
D2
7.20
0.2835
ddd
60/64
Max
0.10
11.90
E
12.00
E1
5.60
0.2205
E2
8.80
0.3465
e
0.80
FD
2.75
0.1083
FD1
1.15
0.0453
FE
3.20
0.1260
FE1
1.60
0.0630
SD
0.40
0.0157
SE
0.40
0.0157
–
12.10
0.0039
–
0.4724
0.0315
0.4685
0.4764
–
–
NAND01G-B, NAND02G-B
Package mechanical
Figure 39. TFBGA63 9.5x12mm - 6x8 activeD ball array, 0.80mm pitch, Package Outline
D2
D1
FD1
SD
FD
e
e
E E2
SE
E1
ddd
FE1
BALL "A1"
FE
e
b
A
A2
A1
1. Drawing is not to scale
Table 28.
TFBGA63 9.5x12mm - 6x8 active ball array, 0.80mm pitch, Package Mechanical Data
millimeters
inches
Symbol
Typ
Min
A
Max
Typ
Min
1.20
A1
Max
0.0472
0.25
0.0098
A2
0.80
0.0315
b
0.45
0.40
0.50
0.0177
0.0157
0.0197
D
9.50
9.40
9.60
0.3740
0.3701
0.3780
D1
4.00
0.1575
D2
7.20
0.2835
ddd
0.10
11.90
E
12.00
E1
5.60
0.2205
E2
8.80
0.3465
e
0.80
FD
2.75
0.1083
FD1
1.15
0.0453
FE
3.20
0.1260
FE1
1.60
0.0630
SD
0.40
0.0157
SE
0.40
0.0157
–
12.10
0.0039
–
0.4724
0.0315
0.4685
0.4764
–
–
61/64
Part numbering
13
NAND01G-B, NAND02G-B
Part numbering
Table 29.
Ordering Information Scheme
Example:
NAND02GR3B
2
A N
6
E
Device Type
NAND Flash Memory
Density
01G = 1Gb
02G = 2Gb
Operating Voltage
R = VDD = 1.7 to 1.95V
W = VDD = 2.7 to 3.6V
Bus Width
3 = x8
4 = x16
Family Identifier
B = 2112 Bytes/ 1056 Word Page
Device Options
2 = Chip Enable Don't Care Enabled
Product Version
A = First Version
B= Second Version
C= Third Version
Package
N = TSOP48 12 x 20mm (all devices)
ZA = VFBGA63 9.5 x 12 x 1mm, 0.8mm pitch (1Gb devices)
ZB = TFBGA63 9.5 x 12 x 1.2mm, 0.8mm pitch (2Gb Dual Die devices)
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Option
E = Lead Free Package, Standard Packing
F = Lead Free Package, Tape & Reel Packing
Devices are shipped from the factory with the memory content bits, in valid blocks, erased to
’1’. For further information on any aspect of this device, please contact your nearest ST
Sales Office.
62/64
NAND01G-B, NAND02G-B
14
Revision history
Revision history
Table 30.
Document Revision History
Date
Version
25-Feb-2005
1
Revision Details
First Issue
Automatic Page 0 Read feature removed throughout document.
LFBGA63 package removed throughout document.
Section 11.2: Data Protection and Figure 22: Equivalent Testing
Circuit for AC Characteristics Measurement added.
16-Aug-2005
2
TFBGA63 and VFBGA63 packages updated. Note added to Figure 3:
TSOP48 Connections, x8 devices and Table 3: TSOP48 Connections, x8
devices regarding the USOP package.
Section 3.8: Write Enable (W), Table 11, Table 12, Table 14,
Section 7.4: Block Lock Status, Figure 18, Table 20, Table 22,
Table 23, Table 25 and Table 30 modified.
18-Oct-2005
3
512 device and USOP package removed throughout document.
Figure 3, <Blue>Figure 5., Table 22, Table 23 and Section 6.4: Copy
Back Program modified.
13-Feb-2006
4.0
4 Gbit and 8 Git devices removed.
VIH minimum value and VIL maximum value updated in Table 23: DC
Characteristics, 3V Devices.
63/64
NAND01G-B, NAND02G-B
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED,
AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS,
NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR
SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
64/64