Material Content Data Sheet Sales Product Name SP370-25-106-0 MA# MA000979032 Package PG-DSOSP-14-64 Issued Weight* Construction Element Material Group Substances chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver maleimide resin silver wire encapsulation leadfinish plating glue *deviation 29. August 2013 620.40 mg CAS# if applicable Weight [mg] Average Mass [%] Sum [%] Average Mass [ppm] Sum [ppm] 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 28.549 4.60 0.044 0.01 4.60 46017 46017 0.176 0.03 283 3.511 0.57 5660 142.572 22.98 23.59 229805 235819 0.941 0.15 0.15 1517 1517 0.820 0.13 71 1322 44.294 7.14 365.014 58.84 66.11 588349 661066 4.526 0.73 0.73 7295 7295 2.637 0.42 0.42 4250 4250 5.464 0.88 21.856 3.52 71395 8807 4.40 35229 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 44036 1000000