Product Folder Sample & Buy Support & Community Tools & Software Technical Documents L293, L293D SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 L293x Quadruple Half-H Drivers 1 Features 3 Description • • • • • The L293 and L293D devices are quadruple highcurrent half-H drivers. The L293 is designed to provide bidirectional drive currents of up to 1 A at voltages from 4.5 V to 36 V. The L293D is designed to provide bidirectional drive currents of up to 600-mA at voltages from 4.5 V to 36 V. Both devices are designed to drive inductive loads such as relays, solenoids, DC and bipolar stepping motors, as well as other high-current/high-voltage loads in positivesupply applications. 1 • • Wide Supply-Voltage Range: 4.5 V to 36 V Separate Input-Logic Supply Internal ESD Protection High-Noise-Immunity Inputs Output Current 1 A Per Channel (600 mA for L293D) Peak Output Current 2 A Per Channel (1.2 A for L293D) Output Clamp Diodes for Inductive Transient Suppression (L293D) 2 Applications • • • Stepper Motor Drivers DC Motor Drivers Latching Relay Drivers Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudoDarlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4 enabled by 3,4EN. The L293 and L293D are characterized for operation from 0°C to 70°C. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) L293NE PDIP (16) 19.80 mm × 6.35 mm L293DNE PDIP (16) 19.80 mm × 6.35 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Logic Diagram 1A 1,2EN 2A 3A 3,4EN 4A 2 3 1Y 1 7 6 10 11 2Y 3Y 9 15 14 4Y 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. L293, L293D SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 4 4 4 5 5 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics ......................................... Typical Characteristics .............................................. Parameter Measurement Information .................. 6 Detailed Description .............................................. 7 8.1 Overview ................................................................... 7 8.2 Functional Block Diagram ......................................... 7 8.3 Feature Description................................................... 7 8.4 Device Functional Modes.......................................... 8 9 Application and Implementation .......................... 9 9.1 Application Information.............................................. 9 9.2 Typical Application ................................................... 9 9.3 System Examples ................................................... 10 10 Power Supply Recommendations ..................... 13 11 Layout................................................................... 14 11.1 Layout Guidelines ................................................. 14 11.2 Layout Example .................................................... 14 12 Device and Documentation Support ................. 15 12.1 12.2 12.3 12.4 12.5 Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 15 15 15 15 15 13 Mechanical, Packaging, and Orderable Information ........................................................... 15 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (November 2004) to Revision D Page • Removed Ordering Information table .................................................................................................................................... 1 • Added ESD Ratings and Thermal Information tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .................................... 1 2 Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D L293, L293D www.ti.com SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 5 Pin Configuration and Functions NE Package 16-Pin PDIP Top View 1,2EN 1A 1Y 1 16 2 15 3 14 4 13 5 12 2Y 2A 6 11 7 10 VCC2 8 9 HEAT SINK AND GROUND VCC1 4A 4Y HEAT SINK AND GROUND 3Y 3A 3,4EN Pin Functions PIN NAME NO. 1,2EN 1 <1:4>A <1:4>Y 3,4EN TYPE DESCRIPTION I Enable driver channels 1 and 2 (active high input) 2, 7, 10, 15 I Driver inputs, noninverting 3, 6, 11, 14 O Driver outputs 9 I Enable driver channels 3 and 4 (active high input) 4, 5, 12, 13 — Device ground and heat sink pin. Connect to printed-circuit-board ground plane with multiple solid vias VCC1 16 — 5-V supply for internal logic translation VCC2 8 — Power VCC for drivers 4.5 V to 36 V GROUND Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D 3 L293, L293D SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MAX UNIT Supply voltage, VCC1 (2) MIN 36 V Output supply voltage, VCC2 36 V Input voltage, VI 7 V VCC2 + 3 V Output voltage, VO –3 Peak output current, IO (nonrepetitive, t ≤ 5 ms): L293 Peak output current, IO (nonrepetitive, t ≤ 100 µs): L293D Continuous output current, IO: L293 Continuous output current, IO: L293D –2 2 A –1.2 1.2 A –1 1 A –600 600 mA 150 °C 150 °C Maximum junction temperature, TJ Storage temperature, Tstg (1) (2) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal. 6.2 ESD Ratings VALUE Electrostatic discharge V(ESD) (1) (2) Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN Supply voltage VIH High-level input voltage VIL Low-level output voltage TA Operating free-air temperature (1) NOM MAX UNIT VCC1 4.5 7 VCC2 VCC1 36 VCC1 ≤ 7 V 2.3 VCC1 V VCC1 ≥ 7 V 2.3 7 V –0.3 (1) 1.5 V 0 70 °C V The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage levels. 6.4 Thermal Information L293, L293D THERMAL METRIC (1) NE (PDIP) UNIT 16 PINS (2) RθJA Junction-to-ambient thermal resistance 36.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 22.5 °C/W RθJB Junction-to-board thermal resistance 16.5 °C/W ψJT Junction-to-top characterization parameter 7.1 °C/W ψJB Junction-to-board characterization parameter 16.3 °C/W (1) (2) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D L293, L293D www.ti.com SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 6.5 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS L293: IOH = −1 A VOH High-level output voltage VOL Low-level output voltage VOKH High-level output clamp voltage L293D: IOK = –0.6 A VOKL Low-level output clamp voltage L293D: IOK = 0.6 A IIH High-level input current IIL Low-level input current ICC1 L293D: IOH = − 0.6 A MIN TYP VCC2 – 1.8 VCC2 – 1.4 L293: IOL = 1 A 1.2 L293D: IOL = 0.6 A A A Logic supply current IO = 0 Output supply current IO = 0 V V V 0.2 100 0.2 10 –3 –10 –2 –100 All outputs at high level 13 22 All outputs at low level 35 60 8 24 All outputs at high level 14 24 All outputs at low level 2 6 All outputs at high impedance 2 4 TYP MAX All outputs at high impedance ICC2 1.8 1.3 VI = 0 EN UNIT V VCC2 + 1.3 VI = 7 V EN MAX µA µA mA mA 6.6 Switching Characteristics over operating free-air temperature range (unless otherwise noted) VCC1 = 5 V, VCC2 = 24 V, TA = 25°C PARAMETER TEST CONDITIONS MIN tPLH Propagation delay time, low-tohigh-level output from A input L293NE, L293DNE L293DWP, L293N L293DN 750 tPHL Propagation delay time, high-tolow-level output from A input L293NE, L293DNE 400 tTLH Transition time, low-to-high-level output L293NE, L293DNE L293DWP, L293N L293DN 100 tTHL Transition time, high-to-low-level output L293NE, L293DNE 300 L293DWP, L293N L293DN 350 L293DWP, L293N L293DN 800 200 CL = 30 pF, See Figure 2 300 UNIT ns ns ns ns 6.7 Typical Characteristics P TOT − Power Dissipation − W 5 With Infinite Heat Sink 4 3 Heat Sink With θJA = 25°C/W 2 Free Air 1 0 −50 0 50 100 150 TA − Ambient Temperature − °C Figure 1. Maximum Power Dissipation vs Ambient Temperature Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D 5 L293, L293D SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 www.ti.com 7 Parameter Measurement Information tf tr Input 5 V 24 V Input 50% 50% 10% Pulse Generator (see Note B) 10% VCC1 VCC2 0 tw A tPHL Y 3V 3V 90% 90% Output CL = 30 pF (see Note A) EN tPLH 90% 90% 50% VOH 50% Output 10% 10% tTHL VOL tTLH VOLTAGE WAVEFORMS TEST CIRCUIT NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, tw = 10 µs, PRR = 5 kHz, ZO = 50 Ω. Figure 2. Test Circuit and Voltage Waveforms 6 Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D L293, L293D www.ti.com SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 8 Detailed Description 8.1 Overview The L293 and L293D are quadruple high-current half-H drivers. These devices are designed to drive a wide array of inductive loads such as relays, solenoids, DC and bipolar stepping motors, as well as other high-current and high-voltage loads. All inputs are TTL compatible and tolerant up to 7 V. Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudo-Darlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4 enabled by 3,4EN. When an enable input is high, the associated drivers are enabled, and their outputs are active and in phase with their inputs. When the enable input is low, those drivers are disabled, and their outputs are off and in the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge) reversible drive suitable for solenoid or motor applications. On the L293, external high-speed output clamp diodes should be used for inductive transient suppression. On the L293D, these diodes are integrated to reduce system complexity and overall system size. A VCC1 terminal, separate from VCC2, is provided for the logic inputs to minimize device power dissipation. The L293 and L293D are characterized for operation from 0°C to 70°C. 8.2 Functional Block Diagram VCC1 1 0 1 0 1 16 2 15 1 M 14 4 13 5 12 6 11 7 8 M 4 3 2 1 0 1 0 3 10 9 1 0 1 0 M VCC2 Output diodes are internal in L293D. 8.3 Feature Description The L293x has TTL-compatible inputs and high voltage outputs for inductive load driving. Current outputs can get up to 2 A using the L293. Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D 7 L293, L293D SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 www.ti.com 8.4 Device Functional Modes Table 1 lists the fuctional modes of the L293x. Table 1. Function Table (Each Driver) (1) INPUTS (1) (2) (2) OUTPUT (Y) A EN H H L H L X L Z H H = high level, L = low level, X = irrelevant, Z = high impedance (off) In the thermal shutdown mode, the output is in the high-impedance state, regardless of the input levels. VCC1 Current Source Input GND Figure 3. Schematic of Inputs for the L293x VCC2 VCC2 Output Output GND GND Figure 4. Schematic of Outputs for the L293 8 Figure 5. Schematic of Outputs for the L293D Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D L293, L293D www.ti.com SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information A typical application for the L293 device is driving a two-phase motor. Below is an example schematic displaying how to properly connect a two-phase motor to the L293 device. Provide a 5-V supply to VCC1 and valid logic input levels to data and enable inputs. VCC2 must be connected to a power supply capable of supplying the needed current and voltage demand for the loads connected to the outputs. 9.2 Typical Application 5V 24 V VCC1 16 10 kΩ VCC2 8 1,2EN 1 1A Control A 1Y 2 3 Motor 2A 2Y 7 6 3,4EN 9 Control B 3A 3Y 10 11 4A 4Y 15 14 Thermal Shutdown 4, 5, 12, 13 GND Figure 6. Two-Phase Motor Driver (L293) 9.2.1 Design Requirements The design techniques in the application above as well as the applications below should fall within the following design requirements. 1. VCC1 should fall within the limits described in the Recommended Operating Conditions. 2. VCC2 should fall within the limits described in the Recommended Operating Conditions. 3. The current per channel should not exceed 1 A for the L293 (600mA for the L293D). 9.2.2 Detailed Design Procedure When designing with the L293 or L293D, careful consideration should be made to ensure the device does not exceed the operating temperature of the device. Proper heatsinking will allow for operation over a larger range of current per channel. Refer to the Power Supply Recommendations as well as the Layout Example. Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D 9 L293, L293D SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 www.ti.com Typical Application (continued) 9.2.3 Application Curve Refer to Power Supply Recommendations for additional information with regards to appropriate power dissipation. Figure 7 describes thermal dissipation based on Figure 14. 80 θJA 3 60 2 40 PTOT (TA = 70°C) 1 20 0 θJA − Thermal Resistance − °C/W P TOT − Power Dissipation − W 4 0 0 10 20 30 Side 50 40 − mm Figure 7. Maximum Power and Junction vs Thermal Resistance 9.3 System Examples 9.3.1 L293D as a Two-Phase Motor Driver Figure 8 below depicts a typical setup for using the L293D as a two-phase motor driver. Refer to the Recommended Operating Conditions when considering the appropriate input high and input low voltage levels to enable each channel of the device. 5V 24 V VCC1 10 kΩ VCC2 8 16 1,2EN 1 Control A 1A 2 1Y 2A 2Y 7 6 3 Motor 3,4EN 9 Control B 3A 10 3Y 4A 15 4Y 11 14 Thermal Shutdown 4, 5, 12, 13 GND Figure 8. Two-Phase Motor Driver (L293D) 10 Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D L293, L293D www.ti.com SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 System Examples (continued) 9.3.2 DC Motor Controls Figure 9 and Figure 10 below depict a typical setup for using the L293 device as a controller for DC motors. Note that the L293 device can be used as a simple driver for a motor to turn on and off in one direction, and can also be used to drive a motor in both directions. Refer to the function tables below to understand unidirectional vs bidirectional motor control. Refer to the Recommended Operating Conditions when considering the appropriate input high and input low voltage levels to enable each channel of the device. VCC2 SES5001 M1 SES5001 M2 3A 10 4A 15 11 14 16 8 1/2 L293 9 VCC1 EN 4, 5, 12, 13 GND Connections to ground and to supply voltage Figure 9. DC Motor Controls Table 2. Unidirectional DC Motor Control (1) EN 3A M1 (1) 4A H H Fast motor stop H Run H L run L Fast motor stop L X Free-running motor stop X Free-running motor stop M2 L = low, H = high, X = don’t care VCC2 2 × SES5001 M 2 × SES5001 2A 1A 7 6 3 2 16 8 1/2 L293 VCC1 1 EN 4, 5, 12, 13 GND Figure 10. Bidirectional DC Motor Control Table 3. Bidrectional DC Motor Control 1A 2A FUNCTION (1) H L H Turn right H H L Turn left EN (1) L = low, H = high, X = don’t care Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D 11 L293, L293D SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 www.ti.com Table 3. Bidrectional DC Motor Control (continued) EN 1A 2A FUNCTION (1) H L L Fast motor stop H H H Fast motor stop L X X Free-running motor stop 9.3.3 Bipolar Stepping-Motor Control Figure 11 below depicts a typical setup for using the L293D as a two-phase motor driver. Refer to the Recommended Operating Conditions when considering the appropriate input high and input low voltage levels to enable each channel of the device. IL1/IL2 = 300 mA C1 0.22 µF 16 L293 1 2 D5 L1 VCC2 IL1 15 + D1 + D8 3 14 4 13 5 12 6 11 + D6 VCC1 D4 L2 IL2 + 7 10 8 9 D7 D3 D2 D1−D8 = SES5001 Figure 11. Bipolar Stepping-Motor Control 12 Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D L293, L293D www.ti.com SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 10 Power Supply Recommendations VCC1 is 5 V ± 0.5 V and VCC2 can be same supply as VCC1 or a higher voltage supply with peak voltage up to 36 V. Bypass capacitors of 0.1 uF or greater should be used at VCC1 and VCC2 pins. There are no power up or power down supply sequence order requirements. Properly heatsinking the L293 when driving high-current is critical to design. The Rthj-amp of the L293 can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board or to an external heat sink. Figure 14 shows the maximum package power PTOT and the θJA as a function of the side of two equal square copper areas having a thickness of 35 μm (see Figure 14). In addition, an external heat sink can be used (see Figure 12). During soldering, the pin temperature must not exceed 260°C, and the soldering time must not exceed 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. 17.0 mm 11.9 mm 38.0 mm Figure 12. External Heat Sink Mounting Example (θJA = 25°C/W) Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D 13 L293, L293D SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 www.ti.com 11 Layout 11.1 Layout Guidelines Place the device near the load to keep output traces short to reduce EMI. Use solid vias to transfer heat from ground pins to ground plane of the printed-circuit-board. 11.2 Layout Example GND 0.1 μF 5V TTL Logic 1 1,2EN TTL Logic 2 1A 4A 15 TTL Logic 1 Ampere 3 1Y 4Y 14 1 Ampere GND VIAS VCC1 16 4 13 5 12 1 Ampere 6 2Y 3Y 11 1 Ampere TTL Logic 7 2A 3A 10 TTL Logic 5V to 36V 8 VCC2 3,4EN 9 TTL Logic 1 μF GND Figure 13. Layout Diagram Copper Area 35-µm Thickness Printed Circuit Board Figure 14. Example of Printed-Circuit-Board Copper Area (Used as Heat Sink) 14 Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D L293, L293D www.ti.com SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016 12 Device and Documentation Support 12.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 4. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY L293 Click here Click here Click here Click here Click here L293D Click here Click here Click here Click here Click here 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated Product Folder Links: L293 L293D 15 PACKAGE OPTION ADDENDUM www.ti.com 3-Nov-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) L293DNE ACTIVE PDIP NE 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 L293DNE L293DNEE4 ACTIVE PDIP NE 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 L293DNE L293DWP L293DWP OBSOLETE SOIC DW 28 TBD Call TI Call TI 0 to 70 L293DWPG4 OBSOLETE SOIC DW 28 TBD Call TI Call TI 0 to 70 L293DWPTR OBSOLETESO PowerPAD DWP 28 TBD Call TI Call TI 0 to 70 L293N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 L293N L293NE ACTIVE PDIP NE 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 L293NE L293NEE4 ACTIVE PDIP NE 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 L293NE L293NG4 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 3-Nov-2015 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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