MADP-042XX8-13060 Series
SURMOUNTTM 8µM PIN Diodes
RoHS Compliant
Rev. V2
Features
Surface Mount
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Average and Peak Power Handling
RoHS Compliant
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM Technology Solutions’ patented
HMICTM process. This device features two silicon
pedestals embedded in a low loss, low dispersion glass.
The diode is formed on the top of one pedestal and
connections to the backside of the device are facilitated by
making the pedestal sidewalls electrically conductive.
Selective backside metallization is applied producing a
surface mount device. This vertical topology provides for
exceptional heat transfer. The topside is fully
encapsulated with silicon nitride and has an additional
polymer layer for scratch and impact protection. These
protective coatings prevent damage to the junction and the
anode air-bridge during handling and assembly.
Applications
These packageless devices are suitable for moderate
incident power applications, ≤ 10W/C.W. or where the
peak power is ≤ 52W, pulse width is ≤ 1μS, and duty cycle
is ≤ 0.01%. Their low parasitic inductance, 0.4 nH, and
excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
Absolute Maximum Ratings1@ TAMB = +25°C
(unless otherwise specified)
Parameter
MADP-042…-13060
308
408
508
908
C.W. Incident Power dBm
+42
+44
+43
+39
250 mA
Reverse Voltage
-100 V
Operating Temperature
-55°C to +125°C
Storage Temperature
-55°C to +150°C
Junction Temperature
+175°C
Mounting Temperature
+280°C for 10 seconds
D
DIM
E
F
INCHES
MM
MIN.
MAX.
MIN.
MAX.
A
0.040
0.042
1.025
1.075
B
0.021
0.023
0.525
0.575
C
0.004
0.008
0.102
0.203
D
0.013
0.015
0.325
0.375
E
0.011
0.013
0.275
0.325
F
0.013
0.015
0.325
0.375
G
0.019
0.021
0.475
0.525
Notes:
Absolute Maximum
Forward Current
G
1. Backside metal: 0.1 μM thick.
2. Yellow hatched areas indicate backside ohmic gold contacts.
3. All devices have the same outline dimensions ( A to G).
1. Exceeding these limits may cause permanent damage.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-042XX8-13060 Series
SURMOUNTTM 8µM PIN Diodes
RoHS Compliant
Rev. V2
Electrical Specifications @ TAMB = + 25 °C
Parameter
Symbol
Capacitance
CT1,3
CT1,3
CT1,3
CT1,3
RS2,3
RS2,3
Capacitance
Capacitance
Capacitance
Resistance
Resistance
Conditions
- 10V, 1 MHz
Units
1
MADP-042308-13060 MADP-042508-13060
Typ.
Max.
Typ.
Max.
0.20
0.18
0.30
pF
0.10
- 10 V, 1 GHz 1,3
pF
0.10
- 40 V, 1 MHz 1
pF
0.09
- 40 V, 1 GHz 1,3
pF
0.10
0.18
+ 20 mA, 1 GHz 2,3
Ω
1.38
0.97
2,3
0.20
0.18
Ω
1.18
+ 10 mA
V
0.85
IR
-100V
µA
Input Third Order
Intercept Point
IIP3
F 1= 1000 MHz
F2 = 1010 MHz
Input Power = +20 dBm
I bias = + 20 mA
dBm
73
77
C.W. Thermal Resistance
θ
°C/W
145
115
Lifetime
TL
+10 mA / -6 mA
( 50% - 90% V )
nS
280
310
Parameter
Symbol
Conditions
Units
Capacitance
CT1,3
- 10 V, 1 MHz
Capacitance
CT1,3
- 10 V, 1 GHz 1,3
Capacitance
CT1,3
- 40 V, 1 MHz 1
pF
0.36
Capacitance
CT1,3
- 40 V, 1 GHz 1,3
pF
0.37
0.05
Resistance
RS2,3
+ 20 mA, 1 GHz 2,3
Ω
0.67
3.63
Resistance
2,3
+ 50 mA, 1 GHz 2,3
Ω
0.61
3.02
0.80
Forward Voltage
Reverse Leakage
Current
+ 50 mA, 1 GHz
0.19
VF
RS
1
MADP-042408-13060 MADP-042908-13060
pF
0.38
0.50
0.05
0.15
0.39
V
µA
Input Third Order
Intercept Point
IIP3
-100V
F 1= 1000 MHz
F2 = 1010 MHz
Input Power = +20 dBm
I bias = + 20 mA
1.
2.
3.
4.
10
pF
+ 10 mA
TL
10
Max.
IR
Lifetime
1.00
Typ.
VF
+10 mA / -6 mA
( 50% - 90% V )
0.82
Max.
Forward Voltage
θ4
0.87
1.00
Typ.
Reverse Leakage Current
C.W. Thermal Resistance
0.30
0.05
0.50
1.00
0.04
0.91
10
1.00
10
dBm
81
66
°C/W
100
185
nS
380
230
Total capacitance, CT, is equivalent to the sum of junction capacitance ,CJ , and parasitic capacitance, Cpar.
Series resistance RS is equivalent to the total diode resistance : RS = RJ ( Junction Resistance) + RC ( Ohmic Resistance)
RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package.
Theta (θ) is measured with the die mounted in an ODS-1134 package.
Specifications Subject to Change Without Notice.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
0.15
MADP-042XX8-13060 Series
SURMOUNTTM 8µM PIN Diodes
RoHS Compliant
Rev. V2
Typical Performance @ TAMB = +25 °C
Ct @ 10V
Ct @ 40V
0.45
0.40
0.35
0.35
0.30
0.30
0.25
042508
0.20
0.15
042408
0.40
Ct (pF)
Ct (pF)
0.45
042408
0.25
042508
0.20
0.15
042308
0.10
042308
0.10
0.05
0.05
042908
0.00
042908
0.00
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.0
0.2
0.4
0.6
Freq (GHz)
0.8
1.0
1.2
1.8
10.000
0.60
0.50
042908
Rs (ohm)
042408
0.40
Ct (pF)
1.6
Rs @ 1GHz
Ct @ 1GHz
0.30
042508
0.20
042308
042508
1.000
042408
042308
0.10
042908
0.100
0.001
0.00
0
5
10
15
20
25
30
35
40
0.010
0.100
Bias (A)
Bias (V)
Rs @ 20mA
Rs @ 10mA
5.00
5.00
042908
4.50
4.50
4.00
4.00
3.50
3.50
3.00
3.00
Rs (ohm)
Rs (ohm)
1.4
Freq (GHz)
2.50
2.00
042308
1.50
042508
042908
2.50
2.00
042308
1.50
042508
1.00
1.00
0.50
0.50
042408
042408
0.00
0.00
0.0
0.2
0.4
0.6
0.8
1.0
Freq (GHz)
1.2
1.4
1.6
1.8
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Freq (GHz)
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1.8
MADP-042XX8-13060 Series
SURMOUNTTM 8µM PIN Diodes
RoHS Compliant
Rev. V2
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently
located on the bottom surface of these devices and are removed from the active junction locations. These devices are well
suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is
recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per
manufacturers recommended time and temperature. Typically 1 hour at 150°C.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of
60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it
is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads
are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die,
apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a
time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat
to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads
can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538 , “Surface Mounting
Instructions“ and can viewed on the MA-COM Tech”s website @ www.macomtech.com
Ordering Information
The MADP-042XX8-13060 series of surmounts may be ordered in either gel packs or tape and reeled by adding the
appropriate suffix per the table below. Tape and reel dimensions are provided in Application Note M513 located on the
M/A-COM website @ www.macomtech.com.
Part Number
Gel Pack
Tape and Reel (Surf Tape)
Tape and Reel (Pocket Tape)
MADP-042308-13060G
MADP-042308-13060T
MADP-042308-13060P
MADP-042408-13060G
MADP-042408-13060T
MADP-042408-13060P
MADP-042508-13060G
MADP-042508-13060T
MADP-042508-13060P
MADP-042908-13060G
MADP-042908-13060T
MADP-042908-13060P
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-042XX8-13060 Series
SURMOUNTTM 8µM PIN Diodes
RoHS Compliant
Rev. V2
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
5
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support