To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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HD74HC02 Quad. 2-input NOR Gates REJ03D0533-0200 (Previous ADE-205-405) Rev.2.00 Oct 06, 2005 Features • • • • • • High Speed Operation: tpd = 6.5 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 1 µA max (Ta = 25°C) Ordering Information Part Name Package Type HD74HC02P DILP-14 pin HD74HC02FPEL SOP-14 pin (JEITA) HD74HC02RPEL SOP-14 pin (JEDEC) HD74HC02TELL TSSOP-14 pin Package Code (Previous Code) PRDP0014AB-B (DP-14AV) PRSP0014DF-B (FP-14DAV) PRSP0014DE-A (FP-14DNV) PTSP0014JA-B (TTP-14DV) Package Abbreviation Taping Abbreviation (Quantity) P — FP EL (2,000 pcs/reel) RP EL (2,500 pcs/reel) T ELL (2,000 pcs/reel) Note: Please consult the sales office for the above package availability. Function Table Inputs H: L: Output A L B L Y H L H H L L L H H L High level Low level Rev.2.00, Oct 06, 2005 page 1 of 6 HD74HC02 Pin Arrangement 1Y 1 14 VCC 1A 2 13 4Y 1B 3 12 4B 2Y 4 11 4A 2A 5 10 3Y 2B 6 9 3B GND 7 8 3A (Top view) Absolute Maximum Ratings Item Symbol Ratings Unit Supply voltage range Input / Output voltage VCC Vin, Vout –0.5 to 7.0 –0.5 to VCC +0.5 V V IIK, IOK IO ±20 ±25 mA mA ICC or IGND PT ±50 500 mA mW Input / Output diode current Output current VCC, GND current Power dissipation Storage temperature Tstg –65 to +150 °C Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. Recommended Operating Conditions Item Supply voltage Symbol VCC Ratings 2 to 6 Unit V Input / Output voltage Operating temperature VIN, VOUT Ta 0 to VCC –40 to 85 V °C tr , tf 0 to 1000 0 to 500 ns Input rise / fall time Note: *1 0 to 400 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics. Rev.2.00, Oct 06, 2005 page 2 of 6 Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V HD74HC02 Electrical Characteristics Ta = 25°C Item Input voltage Symbol VCC (V) VIH VIL Output voltage VOH VOL Ta = –40 to+85°C Unit Test Conditions 2.0 Min 1.5 Typ — Max — Min 1.5 Max — 4.5 6.0 3.15 4.2 — — — — 3.15 4.2 — — 2.0 4.5 — — — — 0.5 1.35 — — 0.5 1.35 6.0 2.0 — 1.9 — 2.0 1.8 — — 1.9 1.8 — 4.5 6.0 4.4 5.9 4.5 6.0 — — 4.4 5.9 — — 4.5 6.0 4.18 5.68 — — — — 4.13 5.63 — — 2.0 4.5 — — 0.0 0.0 0.1 0.1 — — 0.1 0.1 6.0 4.5 — — 0.0 — 0.1 0.26 — — 0.1 0.33 — — — — 0.26 ±0.1 — — 0.33 ±1.0 IOL = 5.2 mA µA Vin = VCC or GND — — 1.0 — 10 µA Vin = VCC or GND, Iout = 0 µA Input current Iin 6.0 6.0 Quiescent supply current ICC 6.0 V V V Vin = VIH or VIL IOH = –20 µA IOH = –4 mA IOH = –5.2 mA V Vin = VIH or VIL IOL = 20 µA IOL = 4 mA Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = 25°C Item Propagation delay time Symbol VCC (V) tPLH tPHL Output rise time Output fall time Input capacitance tTLH tTHL Cin Ta = –40 to +85°C 2.0 Min — Typ — Max 90 Min — Max 115 4.5 6.0 — — 7 — 18 15 — — 23 20 2.0 4.5 — — — 6 90 18 — — 115 23 6.0 2.0 — — — — 15 75 — — 20 95 4.5 6.0 — — 5 — 15 13 — — 19 16 2.0 4.5 — — — 5 75 15 — — 95 19 6.0 — — — — 5 13 10 — — 16 10 Rev.2.00, Oct 06, 2005 page 3 of 6 Unit ns ns ns ns pF Test Conditions HD74HC02 Test Circuit Measurement point CL* Note: CL includes the probe and fig capacitance. Waveforms • Waveform − 1 tr tf Input VCC 90% 50% 90% 50% 10% 10% t PHL 0V t PLH VOH Output 50% 50% VOL t THL t TLH Notes: 1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 6 ns, tf ≤ 6 ns 2. The output are measured one at a time with one transition per measurement. Rev.2.00, Oct 06, 2005 page 4 of 6 HD74HC02 Package Dimensions JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B Previous Code DP-14AV MASS[Typ.] 0.97g D 8 E 14 1 7 b3 Z A1 A Reference Symbol Nom e1 7.62 D 19.2 E 6.3 A1 0.51 bp 0.40 L e1 0.48 c 0.19 θ 0° JEITA Package Code P-SOP14-3.95x8.65-1.27 RENESAS Code PRSP0014DE-A *1 0.56 e 2.29 0.31 2.54 2.79 15° 2.39 L 2.54 MASS[Typ.] 0.13g Previous Code FP-14DNV NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F D 14 7.4 0.25 Z ( Ni/Pd/Au plating ) 20.32 1.30 b3 c Max 5.06 A θ bp e Dimension in Millimeters Min 8 c *2 Index mark HE E bp Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 8.65 9.05 E 3.95 A2 A1 7 1 Z e *3 bp 0.10 0.14 A x M bp L1 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25 6.10 6.20 b1 c A c1 A1 θ L y Detail F θ 0° HE 5.80 1.27 e x 0.25 y 0.15 0.635 Z L L Rev.2.00, Oct 06, 2005 page 5 of 6 8° 0.40 1 0.60 1.08 1.27 HD74HC02 JEITA Package Code P-SOP14-5.5x10.06-1.27 RENESAS Code PRSP0014DF-B *1 Previous Code FP-14DAV MASS[Typ.] 0.23g D NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 8 c *2 E HE bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 e *3 Nom Max D 10.06 10.5 E 5.50 A2 7 Z A1 bp Dimension in Millimeters Min x M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 2.20 A L1 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 1.27 e x 0.12 y 0.15 Z 1.42 0.50 L L JEITA Package Code P-TSSOP14-4.4x5-0.65 RENESAS Code PTSP0014JA-B *1 Previous Code TTP-14DV D 0.70 0.90 1.15 1 MASS[Typ.] 0.05g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 8° 8 HE c *2 E bp Reference Symbol Index mark Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 5.00 5.30 E 4.40 A2 7 1 *3 Z bp A1 x 0.03 0.07 0.10 0.15 0.20 0.25 0.10 0.15 0.20 6.40 6.60 1.10 A M L1 bp e b1 c A c A1 θ L y Detail F 1 θ 0° HE 6.20 0.65 e x 0.13 y 0.10 Z 0.83 0.4 L L Rev.2.00, Oct 06, 2005 page 6 of 6 8° 1 0.5 1.0 0.6 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. 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