DSC2311 Crystal-less™ Configurable Two-Output Clock Generator Features General Description • Two Simultaneous CMOS Outputs - Output 1 Range: 2.3 MHz to 170 MHz - Output 2 Range: 2.3 MHz to 170 MHz • Low RMS Phase Jitter: <1 ps (typ.) • High Stability: ±25 ppm, ±50 ppm • Wide Temperature Range - Automotive: –40°C to +125°C - Ext. Industrial –40°C to +105°C - Industrial –40°C to +85°C - Ext. Commercial –20°C to +70°C • High Supply Noise Rejection: –50 dBc • High Shock and Vibration Immunity - Qualified to MIL-STD-883 • High Reliability - 20x higher MTBF than crystal-based clock generator designs • Supply Range of 2.25V to 3.6V • Lead Free and RoHS-Compliant The DSC2311 is a crystal-less™ clock generator that is factory-configurable to simultaneously output two separate frequencies from 2.3 MHz to 170 MHz. The clock generator uses proven silicon MEMS technology to provide low jitter and high frequency stability across a wide range of supply voltages and temperatures. By eliminating the external quartz crystal, crystal-less clock generators significantly enhance reliability and accelerate product development, while meeting stringent clock performance criteria for a variety of consumer electronics, communications, and storage applications. DSC2311 has an Output Enable/Disable feature that allows it to disable the outputs when OE is low. The device is available in a space-saving 6-pin 2.5 mm x 2.0 mm crystal-less VDFN package that uses only a single external bypass capacitor. This requires a PCB footprint equivalent to that of a 1.0 mm x 1.0 mm crystal-based clock generator. Applications • • • • • Consumer Electronics Camera and Imaging Modules Home Automation Industrial and Power Conversion Mobile Communications, Internet, and Sensor Devices • Solid State, Hard Drive, and Flash Drive Storage Block Diagram Control Circuitry MEMS OE 2016 Microchip Technology Inc. PLL Output Control and Divider FOUT1 FOUT2 DS20005611A-page 1 DSC2311 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage .......................................................................................................................................... –0.3V to +4.0V Input Voltage .......................................................................................................................................–0.3V to VDD+0.3V ESD Protection (HBM) ...............................................................................................................................................4 kV ESD Protection (CDM) ............................................................................................................................................1.5 kV † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified. Parameters Sym. Min. Typ. Max. Units Conditions Supply Voltage (Note 1) VDD 2.25 — 3.6 V Supply Current (Note 2) IDD — 21 23 mA EN pin low. All outputs disabled. — — ±25 — — ±50 ppm Includes frequency variations due to initial tolerance, temperature, and power supply voltage. One year at +25°C — Frequency Stability (Note 3) ∆f Aging ∆f — — ±5 ppm Start-up Time (Note 4) tSU — — 5 ms VIH 0.75 x VDD — — VIL — — 0.25 x VDD Output Disable Time tDA — — 5 ns — Output Enable Time tEN — — 20 ns — Pull-Up Resistor (Note 2) — — 40 — kΩ Pull-up exists on all digital IO VOH 0.9 x VDD — — VOL — — 0.1 x VDD tR — 1.1 2.0 Input Logic Levels Output Logic Levels tF Note 1: 2: 3: 4: 5: V ns Output Transition Time Frequency V f0 T = +25°C Input logic high Input logic low Output logic high, I = ±6 mA Output logic low, I = ±6 mA Rise time. 20% to 80%; CL = 15 pF — 1.4 2.0 Fall time. 20% to 80%; CL = 15 pF 2.3 — 170 Commercial/Industrial temp. range 3.3 — 100 3.3 — 170 MHz Automotive temp. range Extended Industrial temp. range Pin 4 VDD should be filtered with a 0.01 µF capacitor. Output is enabled if Enable pad is floated or not connected. Operating current = disabled current + ∆IDD from FOUT1 + ∆IDD from FOUT2. See Current Consumption graph for more information. For other ppm stabilities, please contact the factory. tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled. Period jitter includes crosstalk from adjacent output. DS20005611A-page 2 2016 Microchip Technology Inc. DSC2311 ELECTRICAL CHARACTERISTICS (CONTINUED) Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified. Parameters Sym. Min. Typ. Max. Units Output Duty Cycle SYM 45 — 55 % Period Jitter (Note 5) JPER — 3 — psRMS — 0.3 — — 0.38 — — 1.7 2 Integrated Phase Noise Note 1: 2: 3: 4: 5: JCC Conditions — FO1 = FO2 = 25 MHz 200 kHz to 20 MHz @ 25 MHz psRMS 100 kHz to 20 MHz @ 25 MHz 12 kHz to 20 MHz @ 25 MHz Pin 4 VDD should be filtered with a 0.01 µF capacitor. Output is enabled if Enable pad is floated or not connected. Operating current = disabled current + ∆IDD from FOUT1 + ∆IDD from FOUT2. See Current Consumption graph for more information. For other ppm stabilities, please contact the factory. tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled. Period jitter includes crosstalk from adjacent output. 2016 Microchip Technology Inc. DS20005611A-page 3 DSC2311 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions TA –20 — +70 °C Ordering Option E TA –40 — +85 °C Ordering Option I TA –40 — +105 °C Ordering Option L Temperature Ranges Operating Temperature Range (T) TA –40 — +125 °C Ordering Option M Junction Temperature TJ — — +150 °C — Storage Temperature Range TS –40 — +150 °C — Soldering Temperature Range — — — +260 °C 40 sec. max. Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. DS20005611A-page 4 2016 Microchip Technology Inc. DSC2311 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin Number Pin Name 1 ENABLE Description Output Enable for both CLK0 and CLK1. 2 N/C 3 GROUND 4 CLK0 5 CLK1 Clock Output 1 (CMOS). 6 VDD Supply Voltage. 2016 Microchip Technology Inc. Do not connect. Ground. Clock Output 0 (CMOS). DS20005611A-page 5 DSC2311 3.0 OUTPUT WAVEFORM tR tF VOH Output VOL tEN 1/fo tDA VIH Enable FIGURE 3-1: DS20005611A-page 6 VIL OE Function and Output Waveform: LVCMOS. 2016 Microchip Technology Inc. DSC2311 4.0 CURRENT CONSUMPTION Total Current = Disabled Current + ∆IDD FOUT1 + ∆IDD FOUT2 18 16 14 ΔIDD (mA) 12 10 3 pF 8 5 pF 10 pF 6 15 pF 4 2 0 0 20 40 60 80 100 120 140 FOUT (MHz) FIGURE 4-1: ∆IDD / Output vs. Frequency and Load @ 3.3V VDD 2016 Microchip Technology Inc. DS20005611A-page 7 DSC2311 SOLDER REFLOW PROFILE . 5.0 EC .M AX 3° C/ S 60-150 SECONDS AX M C. 3° C/ SE REFLOW PRE-HEAT . 60-180 SECONDS AX 150°C M C. . 217°C 200°C /SE 6°C TEMPERATURE (°C) 260°C 20-40 SECONDS COOL 25°C 8 MINUTES MAX. TIME 6-PIN QFN MSL 1 @ 260°C refer to JSTD-020C Ramp-Up Rate (200°C to Peak Temp) Preheat Time 150°C to 200°C Time Maintained above 217°C Peak Temperature Time within 5°C of Actual Peak 3°C/sec. max. 60-180 sec. 60-150 sec. 255°C to 260°C 20-40 sec. Ramp-Down Rate 6°C/sec. max. Time 25°C to Peak Temperature 8 minutes max. DS20005611A-page 8 2016 Microchip Technology Inc. DSC2311 6.0 PACKAGE MARKING INFORMATION 6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.05 C 1 2X 2 TOP VIEW 0.05 C 0.10 C C A A1 SEATING PLANE 6X 0.08 C SIDE VIEW 2X b2 1 2 L2 5X L1 N 4X b1 0.10 0.05 e C A B C BOTTOM VIEW Microchip Technology Drawing C04-1005A Sheet 1 of 2 2016 Microchip Technology Inc. DS20005611A-page 9 DSC2311 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Terminals N e Pitch Overall Height A Standoff A1 Overall Length D Overall Width E b1 Terminal Width Terminal Width b2 Terminal Length L1 Terminal Length L2 MILLIMETERS MAX NOM 6 0.825 BSC 0.80 0.90 0.85 0.05 0.02 0.00 2.50 BSC 2.00 BSC 0.60 0.70 0.65 0.20 0.25 0.30 0.60 0.70 0.80 0.665 0.865 0.765 MIN Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1005A Sheet 2 of 2 DS20005611A-page 10 2016 Microchip Technology Inc. DSC2311 6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X1 X2 2 1 Y G2 C 6 G1 SILK SCREEN E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Width (X4) X1 Contact Pad Width (X2) X2 Contact Pad Length (X6) Y Contact Pad Spacing C Space Between Contacts (X4) G1 Space Between Contacts (X3) G2 MIN MILLIMETERS NOM 0.825 BSC MAX 0.65 0.25 0.85 1.45 0.38 0.60 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing C04-3005A 2016 Microchip Technology Inc. DS20005611A-page 11 DSC2311 NOTES: DS20005611A-page 12 2016 Microchip Technology Inc. DSC2311 APPENDIX A: REVISION HISTORY Revision A (September 2016) • Converted Micrel data sheet DSC2311 to Microchip DS20005611A. • Minor text changes throughout. • Package name updated to VDFN. 2016 Microchip Technology Inc. DS20005611A-page 13 DSC2311 NOTES: DS20005611A-page 14 2016 Microchip Technology Inc. DSC2311 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device X X X X -Rxxxx Examples: a) DSC2311KE1-RxxxxT: Crystal-less Configurable Package Temperature Stability Frequency Package Range Device: DSC2311: Package: K = 6-LEAD 2.5 mm x 2.0 mm VDFN Temperature Range: E I L M = = = = –20C to +70C (Extended Commercial) –40C to +85C (Industrial) –40C to +105C (Extended Industrial) –40C to +125C (Automotive) Stability: 1 2 = = ±50 ppm ±25 ppm Frequency: Rxxxx Packing Option: Blank T Two-Output Clock Generator, 6-LD VDFN, Extended Commercial Temp. Range, ±50 ppm Stability, Custom Frequency (FOUT1 and FOUT2), Tape & Reel Crystal-less Configurable Two-Output Clock Generator b) = = = DSC2311KM2-Rxxxx: Crystal-less Configurable Two-Output Clock Generator, 6-LD VDFN, Automotive Temp. Range, ±25 ppm Stability, Custom Frequency (FOUT1 and FOUT2), Tube Custom Frequency Code Tube Tape & Reel Output Clock Frequencies Output frequencies are factory-configured to individual customer and product requirements, subject to output control and divider limitations. Contact sales with your custom frequency needs. Frequency Code FOUT1 (MHz) FOUT2 (MHz) R0001 127 127 R0002 25 125 2016 Microchip Technology Inc. DS20005611A-page 15 DSC2311 NOTES: DS20005611A-page 16 2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2016 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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