Anpec APL1187DE-TUL 600ma low dropout fast response positive fixed 1.2v regulator Datasheet

APL1187
600mA Low Dropout Fast Response Positive Fixed 1.2V Regulator
Features
General Description
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The APL1187 is a low dropout three-terminal adjustable
regulators with 0.6A output current capability. In order to
obtain lower dropout voltage and faster transient
response, which is critical for low voltage applications,
the APL1187 has been optimized.
Guaranteed Output Voltage Accuracy within 2%
Fast Transient Response
Guaranteed Dropout Voltage at Multiple Currents
Load Regulation : 0.4% Typ.
Line Regulation : 1mV Typ.
The device is available in 1.2V with an input supply below
9V. Dropout voltage is guaranteed at a maximum of 1.55V
at 0.6A.
Low Dropout Voltage : 1.4V Typ. at IOUT = 600mA
Current Limit : 0.8A Min. at TJ=25°C
On-Chip Thermal Limiting : 150°C Typ.
Current limit is trimmed to ensure specified output current
and controlled short-circuit current. On-chip thermal
limiting provides protection against any combination of
over load t hat wo uld cre ate excessive junc tion
temperatures.
Fixed Output : 1.2V
Standard 3-pin, SOT-89 and SOT-223 Package
Lead Free Available (RoHS Compliant)
The APL1187 is available in the industry standard 3-pin,
SOT-89 and SOT-223 package.
Typical Application Circuit
Applications
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APL1187
VIN
VIN
+
10µF
VOUT
VOUT
+
GND
10µF
Voltage Regulator for CD-ROM Drivers
Voltage Regulator for LAN Cards
Voltage Regulator for mother Boards
Wireless Communication Systems
Portable Instrument
Portable Consumer Equipment
Low Voltage Systems
Ordering and Marking Information
Package Code
D: SOT-89
V : SOT-223
Operating Ambient Temperature Range
E : -20 to 70° C
Handling Code
TU : Tube
TR : Tape & Reel
Voltage Code
12 : 1.2V
Blank : Adjustable Version
Lead Free Code
L : Lead Free Device
Blank : Original Device
APL1187Lead Free Code
Handling Code
Temperature Range
Package Code
APL1187-12 D:
APL1187
XXXXX12
XXXXX - Date Code
APL1187-12 V:
APL1187
XXXXX12
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully
compliant with RoHS and compatible with both SnPb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the leadfree requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2006
1
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APL1187
Pin Configurations
SOT-89 Top View
VOUT 1
SOT-223 Top View
VOUT 1
GND
(Tab)
GND 2
VIN 3
GND
(Tab)
GND 2
VIN 3
APL1187
APL1187
Absolute Maximum Ratings
Symbol
(Note 1,2)
Parameter
VI
Input Voltage
PD
Power Dissipation, TA=25°C
TJ
Operating Junction Temperature Range
TSTG
TL
θJA
θJC
Rating
Storage Temperature Range
Unit
9
V
1.3
W
0 to 150
°C
-65 to +150
°C
260
°C
130
75
°C/W
40
15
°C/W
Lead Temperature (Soldering, 10 second)
Thermal Resistance from Junction to Ambient
SOT-89
SOT-223
Thermal Resistance from Junction to Case
SOT-89
SOT-223
Note 1: Stresses beyond the absolute maximum rating may damage the device and operating in the absolute maximum rating conditions may affect
device reliability.
Note 2: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD (max) = (TJ – T A) / θJA; TJ = 125°C. Exceeding
the maximum allowable power dissipation will result in excessive die temperature.
Electrical Characteristics
Symbol
VOUT
VIN
Parameter
Output Voltage
APL1187-12
Test Conditions
TJ =0~125°C, 0≤ IOUT≤ 0.6A,
2.8V≤VIN≤9V,
Input Voltage
APL1187
Unit
Min
Typ
Max
1.176
1.200
1.224
V
9
V
6
mV
2.8
REGLINE
Line Regulation
APL1087-12
TJ =0~125°C, IOUT=0mA,
2.8V≤VIN≤9V (note3)
1
REGLOAD
Load Regulation
APL1187-12
TJ =0~125°C, VIN=2.8V,
0≤ IOUT ≤0.6A (note 3)
0.4
0.6
%
VD
Dropout Voltage
IOUT=0.6A, TJ =0~125°C
1.4
1.55
V
Current Limit
(VIN -VOUT)=5V, TJ=25°C
800
Ripple Rejection
FRIPPLE=120Hz, VRIPPLE=1VP-P,
(VIN -VOUT)=3V, TJ=0~125°C
60
ILIMIT
PSRR
OT
Over Temperature Point
OTP Hysteresis
IQ
Quiescent Current
APL1187-12
mA
75
dB
150
°C
20
°C
TJ=0~125°C, VIN≤9V
5.5
10
mA
Note 3: See thermal regulation specifications for changes in output voltage due to heating effects. Load line regulations are measured at a constant junction
temperature by low duty cycle pulse testing.
Note 4: Dropout voltage is specified over the full output current range of the device. Dropout voltage is defined as the minimum input/output differential
measured at the specified output current. Test points and limits are also shown on the Dropout Voltage curve.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2006
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APL1187
Typical Operating Characteristics
Load Transient Response
Line Transient Response
3.5
VIN
-5
2
-10
1.5
-15
1
IOUT
-20
0.5
0
-25
-30
-0.5
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
50
7
40
6
4
10
3
V OUT
0
2
-10
1
0
0.2 0.4 0.6 0.8
Time (ms)
1
1.2 1.4 1.6 1.8
2
0
Time (µs)
Current Limit vs. Temperature
Current Limit vs. Input Voltage
940
940
920
930
920
880
Current Limit (mA)
900
Current Limit (mA)
5
20
-20
1
V IN
30
Input Voltage (V)
2.5
0
Output Voltage Deviation (mV)
3
5
Output Current (A)
Output Voltage Deviation (mV)
10
VIN=5V
860
840
820
800
910
900
890
880
870
860
850
780
840
760
-50
830
0
50
100
150
4
5
Temperature (°C)
7
8
9
Input Voltage (V)
Load Regulation vs. Output Current
Dropout Voltage vs. Output Current
8
1.8
7
1.6
6
Dropout Voltage (V)
Load Regulation(mV)
6
VIN=5V
5
4
3
2
1.4
1.2
1
0.8
0.6
1
0
0.4
100
200
300
400
500
600
700
800
0
Output Current (mA)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2006
200
400
600
800
Output Current (mA)
3
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APL1187
Typical Operating Characteristics (Cont.)
Output Voltage vs. Tempeture
1.205
Output Voltage (V)
1.2
1.195
1.19
1.185
1.18
1.175
1.17
-50
-25
0
25
50
75
100
125
150
Tempeture (°C)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2006
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APL1187
Packaging Information
SOT89
A
C
L
H
E
E1
D
D1
e
e1
B
B1
SOT89
S
Y
M
B
O
L
A
MIN.
MAX.
MIN.
MAX.
1.40
1.60
0.055
0.063
B
0.44
0.56
0.017
0.022
B1
0.36
0.48
0.014
0.019
C
0.35
0.44
0.014
0.017
D
4.40
4.60
0.173
0.181
0.072
MILLIMETERS
INCHES
D1
1.62
1.83
0.064
E
2.29
2.60
0.090
0.102
2.29
0.084
0.090
E1
2.13
e
1.50 BSC
e1
0.059 BSC
3..00 BSC
0.118 BSC
H
3.94
4.25
0.155
0.167
L
0.89
1.20
0.035
0.047
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2006
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APL1187
Packaging Information
SOT223
D
b2
E
E1
SEE
VIEW A
e
c
0.25°
L
b
0
A
A1
A2
e1
GAUGE PLANE
SEATING PLANE
VIEW A
S
Y
M
B
O
L
SOT223
MILLIMETERS
MIN.
INCHES
MAX.
A
MIN.
MAX.
1.80
0.071
A1
0.02
0.10
0.001
0.004
A2
1.50
1.70
0.059
0.067
b
0.66
0.84
0.026
0.033
b2
2.90
3.10
0.114
0.122
0.013
c
0.23
0.33
0.009
D
6.30
6.70
0.248
0.264
0.287
0.146
E
6.70
7.30
0.264
E1
3.30
3.70
0.130
e
2.30 BSC
0.091 BSC
e1
4.60 BSC
0.181 BSC
L
0
0.030
0.75
0°
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2006
0°
10 °
6
10 °
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APL1187
Carrier Tape & Reel Dimensions
t
D
P
Po
E
P1
B
o
F
W
Ko
Ao
D1
T2
J
C
A
B
T1
Application
SOT-89
A
B
C
J
T1
T2
W
P
E
178 ±1
70 ± 2
13.5 ± 0.15
3 ± 0.15
14 ± 2
1.3 ± 0.3
8 ± 0.1
1.75± 0.1
F
D
D1
Po
P1
Ao
12 + 0.3
12 - 0.1
Bo
Ko
T
5.5 ± 0.05 1.5± 0.1
Application
SOT-223
1.5± 0.1
4.0 ± 0.1 2.0 ± 0.1 4.8 ± 0.1
A
B
C
330±1
62±1.5
12.75± 0.15
F
D
D1
Po
1.5+ 0.1
4.0 ± 0.1
5.5 ± 0.05 1.5+ 0.1
J
T1
4.5± 0.1
T2
W
2± 0.2
12 ± 0.3
P1
Ao
2.0 ±
0.05
6.9 ± 0.1
2 ± 0.6 12.4 +0.2
1.80± 0.1 0.3±0.013
P
E
8 ± 0.1
1.75± 0.1
Bo
Ko
T
7.5± 0.1
2.1± 0.1
0.3±0.05
(mm)
Cover Tape Dimensions
Application
Carrier Width
Cover Tape Width
Devices Per Reel
SOT- 89
12
9.3
1000
SOT- 223
12
9.3
2500
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2006
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APL1187
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material: 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical Zone
TL to TP
Ramp-up
Temperature
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25°C to Peak
Time
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classificatioon Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Notes: All temperatures refer to topside of the package. Measured on the body surface.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2006
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APL1187
Classification Reflow Profiles (Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures
3
3
Volume mm
≥350
225 +0/-5°C
225 +0/-5°C
Volume mm
<350
240 +0/-5°C
225 +0/-5°C
Package Thickness
<2.5 mm
≥2.5 mm
Table 2. Pb-free Process – Package Classification Reflow Temperatures
3
3
3
Volume mm
Volume mm
Volume mm
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated
classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL
level.
Package Thickness
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 SEC
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2006
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