MC10138 Bi-Quinary Counter The MC10138 is a four bit counter capable of divide by two, five, or ten functions. It is composed of four set–reset master–slave flip–flops. Clock inputs trigger on the positive going edge of the clock pulse. Set or reset input override the clock, allowing asynchronous “set” or “clear.” Individual set and common reset inputs are provided, as well as complementary outputs for the first and fourth bits. • PD = 370 mW typ/pkg (No Load) • ftog = 150 MHz typ • tr, tf = 2.5 ns typ (20%–80%) http://onsemi.com MARKING DIAGRAMS 16 CDIP–16 L SUFFIX CASE 620 LOGIC DIAGRAM 11 S0 15 Q0 10 S1 13 Q1 6 S2 4 Q2 5 S3 2 Q3 MC10138L AWLYYWW 1 16 S D1 12 Clock C1 S S S Q D1 Q D1 Q D1 Q' D2 Q' C1 Q' D2 Q Q C2 Q C2 Q C2 Q R R PDIP–16 P SUFFIX CASE 648 R Q' 1 1 R PLCC–20 FN SUFFIX CASE 775 9 Reset 14 Q0 C2 MC10138P AWLYYWW 7 3 VCC1 = PIN 1; VCC2 = PIN 16; VEE = PIN 8 Q3 DIP PIN ASSIGNMENT VCC1 1 16 VCC2 Q3 2 15 Q0 Q3 3 14 Q0 Q2 4 13 Q1 S3 5 12 C1 S2 6 11 S0 C2 7 10 S1 VEE 8 9 RESET 10138 AWLYYWW A WL YY WW = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION Device Package Shipping MC10138L CDIP–16 25 Units / Rail MC10138P PDIP–16 25 Units / Rail MC10138FN PLCC–20 46 Units / Rail Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). Semiconductor Components Industries, LLC, 2002 January, 2002 – Rev. 7 1 Publication Order Number: MC10138/D MC10138 COUNTER TRUTH TABLES BCD (Clock connected to C1 and Q0 connected to C2) BI–QUINARY (Clock connected to C2 and Q3 connected to C1) COUNT Q1 Q2 Q3 Q0 COUNT Q0 Q1 Q2 Q3 0 1 2 3 L H L H L L H H L L L L L L L L 0 1 2 3 L H L H L L H H L L L L L L L L 4 5 6 7 L L H L L L L H H L L L L H H H 4 5 6 7 L H L H L L H H H H H H L L L L 8 9 H L H L L H H H 8 9 L H L L L L H H COUNTER STATE DIAGRAM — POSITIVE LOGIC CLOCK CONNECTED TO C2 Q0 CONNECTED TO C2 0 4 0 7 1 5 1 2 3 14 10 11 15 12 13 8 7 6 4 6 3 9 2 http://onsemi.com 2 5 MC10138 ELECTRICAL CHARACTERISTICS Test Limits Characteristic Power Supply Drain Current Input Current Symbol Pin Under Test IE 8 97 IinH 12 5,6,10,11 7 9 350 390 460 650 –30°C Min +25°C Max Min +85°C Typ Max Max Unit 70 88 97 mAdc 220 245 290 410 220 245 290 µAdc µAdc IinL All 0.5 Output Voltage Logic 1 VOH 3,14 (3.) 2,4,13,15 (2.) –1.060 –1.060 –0.890 –0.890 –0.960 –0.960 –0.810 –0.810 –0.890 –0.890 –0.700 –0.700 Vdc Output Voltage Logic 0 VOL 3,14 (2.) 2,4,13,15 (3.) –1.890 –1.890 –1.675 –1.675 –1.850 –1.850 –1.650 –1.650 –1.825 –1.825 –1.615 –1.615 Vdc Threshold Voltage Logic 1 VOHA 2,4,13,15 (2.) 3,14 (3.) 13,15 (2.) –1.080 –1.080 –1.080 Threshold Voltage Logic 0 VOLA 2,4,13,15 (3.) 3,14 (2.) 13,15 (3.) Switching Times Load) 0.5 Min 0.3 –0.980 –0.980 –0.980 –0.910 –0.910 –0.910 –1.655 –1.655 –1.655 –1.630 –1.630 –1.630 Vdc –1.595 –1.595 –1.595 (50Ω Propagation Clock Delays Delay ns t12+15+ t12+14+ t7+13+ t7+4+ t7+2+ t7+3+ 15 14 13 4 2 3 1.4 1.4 1.4 1.4 1.4 1.4 5.0 5.0 5.2 5.2 5.2 5.2 1.5 1.5 1.5 1.5 1.5 1.5 3.5 3.5 3.5 3.5 3.5 3.5 4.8 4.8 5.0 5.0 5.0 5.0 1.5 1.5 1.5 1.5 1.5 1.5 5.3 5.3 5.5 5.5 5.5 5.5 t12+15– t12+14– t7+13– t7+4– t7+2– t7+3– 15 14 13 4 2 3 1.4 1.4 1.4 1.4 1.4 1.4 5.0 5.0 5.2 5.2 5.2 5.2 1.5 1.5 1.5 1.5 1.5 1.5 3.5 3.5 3.5 3.5 3.5 3.5 4.8 4.8 5.0 5.0 5.0 5.0 1.5 1.5 1.5 1.5 1.5 1.5 5.3 5.3 5.5 5.5 5.5 5.5 Set Delay t11+15+ t11+14– 15 14 1.4 1.4 5.2 5.2 1.5 1.5 5.0 5.0 1.5 1.5 5.5 5.5 Reset Delay t9+14+ t9+15– 14 15 1.4 1.4 5.2 5.2 1.5 1.5 5.0 5.0 1.5 1.5 5.5 5.5 Rise Time (20 to 80%) t14+ t15+ 14 15 1.1 1.1 4.7 4.7 1.1 1.1 2.5 2.5 4.5 4.5 1.1 1.1 5.0 5.0 Fall Time (20 to 80%) t14– t15– 14 15 1.1 1.1 4.7 4.7 1.1 1.1 2.5 2.5 4.5 4.5 1.1 1.1 5.0 5.0 fcount 2 15 125 125 125 125 150 150 Counting Frequency Vdc 1. Individually test each input; apply VILmin to pin under test. VIHmax 2. Set all four flip–flops by applying pulse VILmin VIHmax 3. Reset all four flip–flops by applying pulse VILmin 125 125 to pins 5, 6, 10, and 11 prior to applying test voltage indicated. to pin 9 prior to applying test voltage indicated. http://onsemi.com 3 MHz MC10138 ELECTRICAL CHARACTERISTICS (continued) NOTE: Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater g than 500 linear fpm is maintained maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the same manner. Characteristic Power Supply Drain Current Input Current TEST VOLTAGE VALUES (Volts) @ Test Temperature VIHmax VILmin VIHAmin VILAmax VEE –30°C –0.890 –1.890 –1.205 –1.500 –5.2 +25°C –0.810 –1.850 –1.105 –1.475 –5.2 +85°C –0.700 –1.825 –1.035 –1.440 –5.2 TEST VOLTAGE APPLIED TO PINS LISTED BELOW Symbol Pin Under Test VIHmax IE 8 IinH 12 5,6,10,11 7 9 IinL All VEE (VCC) Gnd 9 8 1, 16 12 5,6,10,11 7 9 8 8 8 8 1, 16 1, 16 1, 16 1, 16 8 1, 16 VILmin VIHAmin VILAmax Note 1. Output Voltage Logic 1 VOH 3,14 (3.) 2,4,13,15 (2.) 9 5,6,10,11 8 8 1, 16 1, 16 Output Voltage Logic 0 VOL 3,14 (2.) 2,4,13,15 (3.) 5,6,10,11 9 8 8 1, 16 1, 16 Threshold Voltage Logic 1 VOHA 2,4,13,15 (2.) 3,14 (3.) 13,15 (2.) 8 8 8 1, 16 1, 16 1, 16 Threshold Voltage Logic 0 VOLA 2,4,13,15 (3.) 3,14 (2.) 13,15 (3.) 5,6,10,11 9 7,12 8 8 8 1, 16 1, 16 1, 16 Pulse In Pulse Out –3.2 V +2.0 V Switching Times 5,6,10,11 9 7,12 (50Ω Load) Propagation Delay Clock Delays t12+15+ t12+14+ t7+13+ t7+4+ t7+2+ t7+3+ 15 14 13 4 2 3 12 12 7 7 7 7 15 14 13 4 2 3 8 8 8 8 8 8 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16 t12+15– t12+14– t7+13– t7+4– t7+2– t7+3– 15 14 13 4 2 3 12 12 7 7 7 7 15 14 13 4 2 3 8 8 8 8 8 8 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16 Set Delay t11+15+ t11+14– 15 14 11 11 15 14 8 8 1, 16 1, 16 Reset Delay t9+14+ t9+15– 14 15 9 9 14 15 8 8 1, 16 1, 16 Rise Time (20 to 80%) t14+ t15+ 14 15 11 11 14 15 8 8 1, 16 1, 16 Fall Time (20 to 80%) t14– t15– 14 15 9 9 14 15 8 8 1, 16 1, 16 fcount 2 15 7 12 2 15 8 8 1, 16 1, 16 Counting Frequency 1. Individually test each input; apply V ILmin to pin under test. VIHmax 2. Set all four flip–flops by applying pulse VILmin VIHmax 3. Reset all four flip–flops by applying pulse VILmin to pins 5, 6, 10, and 11 prior to applying test voltage indicated. to pin 9 prior to applying test voltage indicated. http://onsemi.com 4 MC10138 PACKAGE DIMENSIONS PLCC–20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) B Y BRK –N– M T L-M 0.007 (0.180) U M N S T L-M S G1 0.010 (0.250) S N S D –L– –M– Z W 20 D 1 X V S T L-M S N S VIEW D–D A 0.007 (0.180) M T L-M S N S R 0.007 (0.180) M T L-M S N S Z 0.007 (0.180) H M T L-M S N S K1 K C E F 0.004 (0.100) G J –T– VIEW S G1 0.010 (0.250) S T L-M S N S 0.007 (0.180) M T L-M S VIEW S SEATING PLANE NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 5 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --0.025 --0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --0.020 2 10 0.310 0.330 0.040 --- MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --0.64 --8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --0.50 2 10 7.88 8.38 1.02 --- N S MC10138 PACKAGE DIMENSIONS –A– 16 9 1 8 –B– CDIP–16 L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE T C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M S PDIP–16 P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R –A– 16 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M S T A M http://onsemi.com 6 INCHES MIN MAX 0.750 0.785 0.240 0.295 --0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0 15 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0 15 0.51 1.01 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0 10 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0 10 0.51 1.01 MC10138 Notes http://onsemi.com 7 MC10138 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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