BELLING BL24C02A Single supply voltage and high speed Datasheet

BL24C02A/04A/08A/16A
Features


Compatible with all I2C bidirectional data
–
Page Write within 3 ms
transfer protocol
–
Partial Page Writes Allowed
Memory array:
2K bits (256X 8) / 4K bits (512 X 8) / 8K
–

Write Protect Pin for Hardware Data Protection

Schmitt Trigger, Filtered Inputs for Noise
bits (1024 X 8) / 16K bits (2048 X 8) of
Suppression
EEPROM
Page size: 16 bytes
–


Single supply voltage and high speed:
–
1 MHz

Random and sequential Read modes

–
Endurance: 1 Million Write Cycles
–
Data Retention: 100 Years
Enhanced ESD/Latch-up protection
HBM 8000V
–
Write:
–
High-reliability

Byte Write within 3 ms
8-lead PDIP/SOP/TSSOP/UDFN and WLCSP4
packages
Description

The BL24C02A/BL24C04A/BL24C08A/BL24C16A

The device is optimized for use in many
provides 2048/4096/8192/16384 bits of serial
industrial and commercial applications where
electrically erasable and programmable read-
low-power
only memory (EEPROM), organized as
essential.
and
low-voltage
operation
are
256/512/1024/2048 words of 8 bits each.
Pin Configuration
8-lead PDIP
8-lead SOP
8-lead TSSOP
8-pad DFN
WLCSP4
1
A0
1
5
VCC
A0
1
5
VCC
A0
1
5
VCC
VCC
1
5 A0
A1
2
6
WP
A1
2
6
WP
A1
2
6
WP
WP
2
6 A1
A2
3
7
SCL
A2
3
7
SCL
A2
3
7
SCL
SCL 3
7 A2
GND
4
8
SDA
GND
4
8
SDA
GND
4
8
SDA
SDA 4
8
GND
Bottem view
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2
A
Vcc
Vss
B
SCL
SDA
Marking side
(top view)
1-16
BL24C02A/04A/08A/16A
Pin Descriptions
Pin Name
Type
Functions
A0-A2
I
Address Inputs
SDA
I/O
Serial Data
SCL
I
Serial Clock Input
WP
I
Write Protect
GND
P
Ground
Vcc
P
Power Supply
Table 1
Block Diagram
Vcc
GND
WP
SCL
START STOP
LOGIC
SDA
EN
SERIAL CONTROL
LOGIC
HIGH VOLTAGE
PUMP/TIMING
LOAD
DATA RECOVERY
CCMP
DEVICE ADDRESS
COMPARATOR
LOAD
INC
DATA WORD
ADRESS COUNTER
A1
A2
X DECODER
A0
EEPROM
Y DECODER
DIN
SERIAL MUX
DOUT/ACKNOWLEDGE
DOUT
Figure 1
DEVICE/PAGE ADDRESSES (A2, A1 and A0): The A2, A1 and A0 pins are device address inputs that are hard
wire for the BL24C02A/BL24C04A/BL24C08A/BL24C16A. Eight 2K/4K/8K/16K devices may be addressed
on a single bus system (device addressing is discussed in detail under the Device Addressing section).
SERIAL DATA (SDA): The SDA pin is bi-directional for serial data transfer. This pin is open-drain driven
and may be wire-ORed with any number of other open-drain or open- collector devices.
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device
and negative edge clock data out of each device.
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BL24C02A/04A/08A/16A
WRITE PROTECT (WP): The BL24C02A/BL24C04A/BL24C08A/BL24C16A has a Write Protect pin that
provides hardware data protection. The Write Protect pin allows normal read/write operations when
connected to ground (GND). When the Write Protection pin is connected to Vcc, the write protection
feature is enabled and operates as shown in the following Table 2.
WP Pin Status
BL24C02A/04A/08A/16A
At VCC
Full Array
At GND
Normal Read/Write Operations
Table 2
Functional Description
1.
Memory Organization
BL24C02A, 2K SERIAL EEPROM: Internally organized with 16 pages of 16 bytes each, the 2K requires an 8bit data word address for random word addressing.
BL24C04A, 4K SERIAL EEPROM: Internally organized with 32 pages of 16 bytes each, the 4K requires a 9bit data word address for random word addressing.
BL24C08A, 8K SERIAL EEPROM: Internally organized with 64 pages of 16 bytes each, the 8K requires a 10bit data word address for random word addressing.
BL24C16A, 16K SERIAL EEPROM: Internally organized with 128 pages of 16 bytes each, the 16K requires an
11-bit data word address for random word addressing.
2.
Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the
SDA pin may change only during SCL low time periods (see Figure 2). Data changes during SCL high
periods will indicate a start or stop condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must
precede any other command (see Figure 3).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read
sequence, the stop command will place the EEPROM in a standby power mode (see Figure 3).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit
words. The EEPROM sends a "0" to acknowledge that it has received each word. This happens during
the ninth clock cycle.
STANDBY MODE: The BL24C02A/BL24C04A/BL24C08A/BL24C16A features a low-power standby mode
which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the completion of any
internal operations.
MEMORY RESET: After an interruption in protocol, power loss or system reset, any two-wire part can be
reset by following these steps:
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BL24C02A/04A/08A/16A
1. Clock up to 9 cycles.
2. Look for SDA high in each cycle while SCL is high.
3. Create a start condition.
Figure 2. Data Validity
SDA
SCL
DATA STABLE
DATA CHANGE
DATA STABLE
Figure 3. Start and Stop Definition
SDA
SCL
START
STOP
Figure 4. Output Acknowledge
SCL
1
8
9
DATA IN
DATA OUT
START
ACKNOWLEDGE
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BL24C02A/04A/08A/16A
3.
Device Addressing
The 2K/4K/8K/16K EEPROM devices all require an 8-bit device address word following a start condition
to enable the chip for a read or write operation (see Figure 5)
The device address word consists of a mandatory "1", "0" sequence for the first four most significant
bits as shown. This is common to all the Serial EEPROM devices.
The next 3 bits are the A2, A1 and A0 device address bits for the 2K EEPROM. These 3 bits must
compare to their corresponding hardwired input pins.
The 4K EEPROM only uses the A2 and A1 device address bits with the third bit being a memory page
address bit. The two device address bits must compare to their corresponding hardwired input pins.
The A0 pin is no connect.
The 8K EEPROM only uses the A2 device address bit with the next 2 bits being for memory page
addressing. The A2 bit must compare to its corresponding hard-wired input pin. The A1 and A0 pins are
no connect.
The 16K does not use any device address bits but instead the 3 bits are used for memory page
addressing. These page addressing bits on the 4K, 8K and 16K devices should be considered the most
significant bits of the data word address which follows. The A0, A1 and A2 pins are no connect
The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if
this bit is high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a "0". If a compare is not made, the
chip will return to a standby state.
4.
Write Operations
BYTE WRITE: A write operation requires an 8-bit data word address following the device address word
and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a "0" and then
clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a "0"
and the addressing device, such as a microcontroller, must terminate the write sequence with a stop
condition. At this time the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile
memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the write
is complete (see Figure 6).
PAGE WRITE: The 2K EEPROM is capable of an 8-byte page write, and the 4K, 8K and 16K devices are
capable of 16-byte page writes.
A page write is initiated the same as a byte write, but the microcontroller does not send a stop
condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the
first data word, the microcontroller can transmit up to seven (2K) or fifteen (4K, 8K, 16K) more data
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BL24C02A/04A/08A/16A
words. The EEPROM will respond with a "0" after each data word received. The microcontroller must
terminate the page write sequence with a stop condition (see Figure 7).
The data word address lower three (2K) or four (4K, 8K, 16K) bits are internally incremented following
the receipt of each data word. The higher data word address bits are not incremented, retaining the
memory page row location. When the word address, internally generated, reaches the page boundary,
the following byte is placed at the beginning of the same page. If more than eight (2K) or sixteen (4K,
8K, 16K) data words are transmitted to the EEPROM, the data word address will "roll over" and previous
data will be overwritten.
ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the EEPROM inputs are
disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the
device address word. The read/write bit is representative of the operation desired. Only if the internal
write cycle has completed will the EEPROM respond with a "0", allowing the read or write sequence to
continue.
5.
Read Operations
Read operations are initiated the same way as write operations with the exception that the read/write
select bit in the device address word is set to "1". There are three read operations: current address read,
random address read and sequential read.
CURRENT ADDRESS READ:
The internal data word address counter maintains the last address accessed during the last read or
write operation, incremented by one. This address stays valid between operations as long as the chip
power is maintained. The address "roll over" during read is from the last byte of the last memory page
to the first byte of the first page. The address "roll over" during write is from the last byte of the current
page to the first byte of the same page. Once the device address with the read/write select bit set to
"1" is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked
out. The microcontroller does not respond with an input "0" but does generate a following stop
condition (see Figure 8).
RANDOM READ:
A random read requires a "dummy" byte write sequence to load in the data word address. Once the
device address word and data word address are clocked in and acknowledged by the EEPROM, the
microcontroller must generate another start condition. The microcontroller now initiates a current
address read by sending a device address with the read/write select bit high. The EEPROM
acknowledges the device address and serially clocks out the data word. The microcontroller does not
respond with a "0" but does generate a following stop condition (see Figure 9)
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address
read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the
EEPROM receives an acknowledge, it will continue to increment the data word address and serially
clock out sequential data words. When the memory address limit is reached, the data word address will
"roll over" and the sequential read will continue. The sequential read operation is terminated when the
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BL24C02A/04A/08A/16A
microcontroller does not respond with a "0" but does generate a following stop condition (see Figure
10).
Figure 5. Device Address
MSB
LSB
2K
1
0
1
0
0
0
0
R/W
4K
1
0
1
0
0
0
P0
R/W
8K
1
0
1
0
0
P1
P0
R/W
16K
1
0
1
0
P2
P1
P0
R/W
Figure 6. Byte Write
S
T
A
R
T
W
R
I
T
E
DEVICE
ADDRESS
WORD
ADDRESS
S
T
O
P
DATA
SDA
LINE
M
S
B
L R A
S / C
BWK
L A
S C
B K
L A
S C
B K
Figure 7. Page Write
S
T
A
R
T
DEVICE
ADDRESS
W
R
I
T
E
WORD
ADDRESS
DATA(n)
DATA(n+1)
S
T
O
P
DATA(n+1)
SDA
LINE
M
S
B
L R A
S / C
BWK
L A
S C
B K
A
C
K
A
C
K
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A
C
K
7-16
BL24C02A/04A/08A/16A
Figure 8. Current Address Read
S
T
A
R
T
R
E
A
D
DEVICE
ADDRESS
S
T
O
P
DATA
SDA
LINE
M
S
B
L R A
S / C
BWK
NO
ACK
Figure 9. Random Read
S
T
A
R
T
DEVICE
ADDRESS
W
R
I
T
E
S
T
A
R
T
WORD
ADDRESS
DEVICE
ADDRESS
R
E
A
D
DATA(n)
S
T
O
P
SDA
LINE
M
S
B
L R A
S / C
BWK
L A
S C
B K
A
C
K
NO
ACK
DUMMY WRITE
Figure 10. Sequential Read
DEVICE
ADDRESS
R
E
A
D
DATA(n)
DATA(n+1)
DATA(n+2)
DATA(n+x)
S
T
O
P
SDA
LINE
R A
/ C
WK
A
C
K
A
C
K
A
C
K
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NO
ACK
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BL24C02A/04A/08A/16A
Electrical Characteristics
Absolute Maximum Stress Ratings:

DC Supply Voltage . . . . . . . . . . . . . . . . .-0.3V to +6.5V

Input / Output Voltage . . . . . . . .GND-0.3V to VCC+0.3V

Operating Ambient Temperature . . . . . -40℃ to +85℃

Storage Temperature . . . . . . . . . . . . -65℃ to +150℃

Electrostatic pulse (Human Body model) . . . . . . . 8000V
Comments:
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this
device. These are stress ratings only. Functional operation of this device at these or any other
conditions above those indicated in the operational sections of this specification is not implied or
intended. Exposure to the absolute maximum rating conditions for extended periods may affect device
reliability.
DC Electrical Characteristics
Applicable over recommended operating range from: TA = -40℃ to +85℃, VCC = +1.7V to +5.5V
(unless otherwise noted)
Parameter
Symbol
Min
Typ
Max
Unit
Condition
Supply Voltage
VCC1
1.7
-
5.5
V
-
Supply Voltage
VCC2
2.5
-
5.5
V
-
Supply Current VCC=5.0V
ICC1
-
0.14
0.3
mA
READ at 400KHZ
Supply Current VCC=5.0V
ICC2
-
0.28
0.5
mA
WRITE at 400KHZ
Supply Current VCC=5.0V
ISB1
-
0.03
0.5
μA
VIN=VCC or VSS
Input Leakage Current
IL1
-
0.10
1.0
μA
VIN=VCC or VSS
Output Leakage Current
ILO
-
0.05
1.0
μA
VOUT=VCC or VSS
Input Low Level
VIL1
-0.3
-
VCC×0.3
V
VCC=1.7V to 5.5V
Input High Level
VIH1
VCC×0.7
-
VCC+0.3
V
VCC=1.7V to 5.5V
Output Low Level VCC=1.7V
VOL1
-
-
0.2
V
IOL=0.15mA
Output Low Level VCC=5.0V
VOL2
-
-
0.4
V
IOL=3.0mA
Table 5
Pin Capacitance
Applicable over recommended operating range from TA = 25℃, f = 1.0 MHz, VCC = +1.7V
Parameter
Symbol
Min
Typ
Max
Unit
Condition
Input/Output Capacitance(SDA)
CI/O
-
-
8
pF
VIO=0V
Input Capacitance(A0,A1,A2,SCL)
CIN
-
-
6
pF
VIN=0V
Table 6
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BL24C02A/04A/08A/16A
AC Electrical Characteristics
Applicable over recommended operating range from TA = -40℃ to +85℃, VCC = +1.7V to +5.5V, CL =
1 TTL Gate and 100 pF (unless otherwise noted)
Parameter
Symbol
1.7V≤VCC﹤2.5V
2.5V≤VCC﹤5.5V
Min
Typ
Max
Min
Typ
Max
Units
Clock Frequency,SCL
fSCL
-
-
400
-
-
1000
KHZ
Clock Pulse Width Low
tLOW
0.6
-
-
0.6
-
-
μs
Clock Pulse Width High
tHIGH
0.4
-
-
0.4
-
-
μs
Noise Suppression Time
tI
-
-
50
-
-
50
ns
Clock Low to Data Out Valid
tAA
0.1
-
0.55
0.1
-
0.55
μs
Time the bus must be free before a
new transmission can start
tBUF
0.5
-
-
0.5
-
-
μs
Start Hold Time
tHD:STA
0.25
-
-
0.25
-
-
μs
Start Setup Time
tSU:DAT
0.25
-
-
0.25
-
-
μs
Data In Hold Time
tHD:DAT
0
-
-
0
-
-
μs
Data in Setup Time
tSU:DAT
100
-
-
100
-
-
ns
Input Rise Time(1)
tR
-
-
0.3
-
-
0.3
μs
Input Fall Time(1)
tF
-
-
0.3
-
-
0.3
μs
Stop Setup Time
tSu:STO
0.25
-
-
0.25
-
-
μs
Data Out Hold Time
tDH
50
-
-
50
-
-
ns
Write Cycle Time
twR
-
1.9
3
-
1.9
3
ms
Endurance
1M
-
-
-
-
-
Write Cycle
5.0V,25℃,Byte Mode(1)
Table 7
Notes:
1. This parameter is characterized and is not 100% tested.
2. AC measurement conditions:
RL (connects to VCC): 1.3 k
Input pulse voltages: 0.3 VCC to 0.7 VCC
Input rise and fall time: 50 ns
Input and output timing reference voltages: 0.5 VCC
The value of RL should be concerned according to the actual loading on the user's system.
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Bus Timing
Figure 11. SCL: Serial Clock, SDA: Serial Data I/O
tF
tHIGH
tR
tLOW
tLOW
SCL
tSU.DAT
tHD.DAT
tHD.STA
tSU.STA
tSU.STO
SDA_IN
tAA
t BUF
tDH
SDA_OUT
Write Cycle Timing
Figure 12. SCL: Serial Clock, SDA: Serial Data I/O
SCL
ACK
SDA
Word n
tWR(1)
STOP
CONDITION
START
CONDITION
Notes:
The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal
clear/write cycle.
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BL24C02A/04A/08A/16A
Package Information
PDIP Outline Dimensions
E
E1
C
eA
Top View
End View
COMMON DIMENSIONS
(Unit of Measure=inches)
D
D1
e
B3
4PLCS
A2 A
b2
b
Side View
L
SYMBOL
A
A2
b
b2
b3
c
D
D1
E
E1
e
eA
L
MIN
NOM
0.115
0.014
0.045
0.030
0.008
0.355
0.005
0.300
0.240
0.130
0.018
0.060
0.039
0.010
0.365
0.115
0.310
0.250
0.100BSC
0.300BSC
0.130
MAX
0.210
0.195
0.022
0.070
0.045
0.014
0.400
NOTE
2
5
6
6
0.325
0.280
3
3
4
3
0.150
4
2
Notes:
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional
information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed
0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010
(0.25 mm).
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BL24C02A/04A/08A/16A
SOP
1
E
E1
N
L
Φ
COMMON DIMENSIONS
(Unit of Measure=mm)
B
e
D
A
A1
SYMBOL
A
A1
b
C
D
E1
E
e
L
Φ
MIN
1.35
0.10
0.31
0.17
4.80
3.81
5.79
0.40
0"
NOM
1.27BSC
-
MAX
1.75
0.25
0.51
0.25
5.00
3.99
6.20
NOTE
1.27
8"
Notes:
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper
dimensions, tolerances, datums, etc.
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TSSOP
3
2
1
E1
E
L1
End View
N
L
COMMON DIMENSIONS
Unit of Measure=mm
Top View
A
b
e
D
Side View
A2
SYMBOL
D
E
E1
A
A2
b
e
L
L1
MIN
2.90
4.30
0.80
0.19
0.45
NOM
MAX
3.00
3.10
6.40BSC
4.40
4.50
1.20
1.00
1.05
0.30
0.65BSC
0.60
0.75
1.00REF
NOTE
2,5
3,5
4
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
not exceed 0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
0.25 mm (0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess
of the b dimension at maximummaterial condition. Dambar cannot be located on the lower radius of the foot.
Minimum space between protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
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BL24C02A/04A/08A/16A
UDFN
D
D2
L
PIN 1 DOT
BY MARKING
E
E2
PIN #1 IDENTIFICATION
CHAMFER
TOP VIEW
b
e
BOTTOM VIEW
A
PKG
REF
A
A1
A3
D
E
b
L
D2
E2
e
A3
A1
SIDE VIEW
COMMON DIMENSION(MM)
UT:ULTRA THIN
MIN
NOM
MAX
>0.50
0.55
0.60
0.00
0.05
0.15REF
1.95
2.00
2.05
2.95
3.00
3.05
0.20
0.25
0.30
0.20
0.30
0.40
1.25
1.40
1.50
1.15
1.30
1.40
0.50BSC
WLCSP
X1
E1
X2
E
Y1
b
D
D1
PIN1
Y2
TOP VIEW
(MARK SIDE)
BOTTOM VIEW
(BALL SIDE)
COMMON DIMENSIONS
(UNITS OF MEASURE=MILLIMETER)
A2
A1
SIDE VIEW
A
SYMBOL
A
A1
A2
D
D1
E
E1
b
x1
x2
y1
y2
MIN
0.270
0.045
0.215
0.738
0.668
0.160
NOM
0.290
0.055
0.235
0.758
0.400BSC
0.688
0.400BSC
0.180
0.144 REF
0.144 REF
0.179 REF
0.179 REF
MAX
0.310
0.065
0.255
0.778
0.708
0.200
NOTES: All wafer orientation notch down
BL24C02A/04A/08A/16A Belling Proprietary Information. Unauthorized Photocopy and Duplication Prohibited
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BL24C02A/04A/08A/16A
Ordering Information
BL24C02A/ BL24C04A/BL24C08A/BL24C16A
Code
1 2 3
Description
Package type
PA: SOP-8L
SF: TSSOP-8L
DA: PDIP-8L
1
NO: UDFN-8L
TC: SOT23-5L
RR: TSOT23-5L
MA: M2.2
MB: M3.2
CS: WLCSP-4
Packing type
2
R: Tape and Reel
T: Tube
Feature
3
S: Standard (default, Pb Free RoHS Std.)
C: Green (Halogen Free)
BL24C02A/04A/08A/16A Belling Proprietary Information. Unauthorized Photocopy and Duplication Prohibited
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