MBS2 thru MBS10 Taiwan Semiconductor CREAT BY ART Glass Passivated Bridge Rectifiers FEATURES - Ideal for automated placement - Reliable low cost construction utilizing molded plastic technique - High surge current capability - Moisture sensitivity level: level 1, per J-STD-020 - UL Recognized File # E-326854 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition MBS - AEC-Q101 qualified MECHANICAL DATA Case: Molded plastic body Molding compound, UL flammability classification rating 94V-0 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: Polarity as marked on the body Weight: 0.12 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL MBS2 MBS4 MBS6 MBS8 MBS10 Unit Maximum repetitive peak reverse voltage VRRM 200 400 600 800 1000 V Maximum RMS voltage VRMS 140 280 420 560 700 V Maximum DC blocking voltage VDC 200 400 600 800 1000 V Maximum average forward rectified current On glass-epoxy P.C.B. On aluminum substrate IF(AV) 0.5 0.8 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 35 A VF 1.0 V IR 5 100 μA Maximum instantaneous forward voltage (Note 1) IF= 0.4 A Maximum DC reverse current at rated DC blocking voltage TJ=25 °C TJ=125 °C I2t CJ 5.08 (Note 3) Typical thermal resistance (Note 4) (Note 3) RθJL RθJA RθJA 20 70 85 °C/W Operating junction temperature range TJ - 55 to +150 °C TSTG - 55 to +150 °C Rating for fusing (t<8.3ms) Typical junction capacitance per leg (Note 2) Storage temperature range A2s pF 13 Note 1: Pulse Test with PW=300μs,1% Duty Cycle Note 2: Measure at 1.0MHz and Applied Reverse Voltage of 4.0 Volts D.C. Note 3: On glass epoxy P.C.B. mounted on 0.05" x 0.05" (1.3mm x 1.3mm) pads Note 4: On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20mm x 20mm) mounted on 0.05" x 0.05" (1.3mm x 1.3mm) solder pads Document Number: DS_D1410054 Version: N14 MBS2 thru MBS10 Taiwan Semiconductor ORDERING INFORMATION PART NO. PACKING CODE PACKING CODE PACKAGE PACKING MBS 3,000 / 13" Paper reel SUFFIX MBSx (Note 1, 2) RC G Note 1: "x" defines voltage from 200V (MBS2) to 1000V (MBS10) Note 2: Whole series with green compound EXAMPLE PREFERRED PART NO. MBS10 RCG PART NO. PACKING CODE MBS10 RC PACKING CODE DESCRIPTION SUFFIX AEC-Q101 qualified Green compound G RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) FIG.1 MAXIMUM FORWARD CURRENT DERATING CURVE FIG. 2 TYPICAL REVERSE CHARACTERISTICS PER LEG RESISTIVE OR INDUCTIVE LOAD WITH HEATSINK 0.8 INSTANTANEOUS REVERSE CURRENT (μA) AVERAGE FORWARD CURRENT (A) 1 Aluminum Substrate 0.6 0.4 0.2 Glass Epoxy P.C.B. 0 0 20 40 60 80 100 120 140 100 10 TJ=125°C 1 0.1 TJ=25°C 0.01 0 160 20 AMBIENT TEMPERATURE (oC) 60 80 100 PERCENT OF RATED PEAK REVERSE VOLYAGE(%) FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT PER LEG FIG. 4 TYPICAL FORWARD CHARACTERISTICS PER LEG 35 10 Single Half Sine-Wave 30 INSTANTANEOUS FORWARD A CURRENT (A) PEAK FORWARD SURGE CURRENT (A) 40 25 F=60Hz 20 15 F=50Hz 10 5 0 1 10 NUMBER OF CYCLES AT 60 Hz Document Number: DS_D1410054 100 1 0.1 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 FORWARD VOLTAGE (V) Version: N14 MBS2 thru MBS10 Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE PER LEG 30 CAPACITANCE (pF) a 25 20 15 10 f=1.0MHz Vslg=50mVp-p 5 0 0.1 1 10 100 REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS MBS DIM. Unit (mm) Unit (inch) Min Max Min Max A 4.50 4.90 0.177 0.193 B 0.56 0.84 0.022 0.033 C 3.60 5.00 0.142 0.197 D - 6.90 - 0.272 E 2.20 2.60 0.087 0.102 F 2.30 2.70 0.091 0.106 G - 0.20 - 0.008 H - 2.90 - 0.114 I 0.95 1.53 0.037 0.060 J 0.70 1.10 0.028 0.043 K 0.15 0.35 0.006 0.014 L 1.10 2.12 0.043 0.083 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.7 0.067 B 0.9 0.035 C 4.4 0.173 D 8.1 0.319 E 1.3 0.051 F 6.3 0.248 MARKING DIAGRAM P/N = Specific Device Code YW = Date Code F = Factory Code Document Number: DS_D1410054 Version: N14 MBS2 thru MBS10 Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1410054 Version: N14