CHV2411aQDG RoHS COMPLIANT Fully Integrated HBT K-band VCO GaAs Monolithic Microwave IC In QFN package Description The CHV2411a-QDG is a monolithic multifunction for frequency generation. It integrates a X-band “push-push” oscillator with frequency control (VCO) thanks to basecollector diodes, used as varactors, a K-band buffer amplifiers and a divider by 8. The VCO is fully integrated on HBT process. All the active devices are internally self biased. The circuit is fully integrated on InGaP HBT process: 2µm emitter length, via holes through the substrate and high Q passive elements. The chip is delivered in a 24 Leads RoHS compliant QFN4x4 package. Main Features K-band VCO+K-band buffers+Prescalar/8 Fully integrated VCO (no need for external Resonator Low phase noise High temperature range High frequency stability On chip self biased devices Standard SMD package : 24L-QFN4x4 Main Characteristics Symbol Parameter F_out Specified output frequency range F_vco Oscillator frequency IF_out Pout Min 24 Typ Max 24.125 24.25 F_out/2 Output Intermediate frequency Output power at F_out 13 PFI Output power at Intermediate frequency (IF) -3 PN SSB Phase Noise @ F_out @ 100 kHz Unit GHz GHz F_out/16 GHz 16 dBm 0 -90 dBm -80 dBc/Hz ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions ! Ref. : DSCHV2411aQDG7254 - 11 Sept 07 1/10 Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band VCO CHV2411aQDG Electrical Characteristics Full temperature range VCO & buffer Part Symbol F_out Parameters Output Frequency range (Operating band) Min 24 F_vco V_Tune VCO frequency Voltage Tuning range Tuning sensitivity Frequency drift rate 1 250 H1 H3 H4 PN Typ Unit GHz 6 725 V MHz/V MHz/°C -20 -40 -20 -80 dBc dBc dBc dBc/Hz F_out/2 400 5 Harmonics ½ F_out Harmonics 3/2 F_out Harmonics 2 F_out SSB Phase Noise given @ F_out @ 100 KHz Main Output (RF_Out) VSWR Pulling into 2:1 VSWR for all phases Pushing @ within the V_tune range Output Power on RF_out port Positive supply current P_out Max 24.25 -90 2:1 13 16 140 Min Typ F_out/16 -3 0 80 8 MHz 250 19 170 MHz/V dBm mA Max Unit GHz Prescalar Part Symbol IF_out Parameters IF Output Frequency Output Power Positive supply current Prescalar Output (IF) VSWR dBm mA 110 2:1 General Symbol VB,V1,VB1,V2,V B2,VD Parameters Positive supply voltage +I (IB1+IB2+I1+I2) Total Positive supply current Top Operating temperature range Min Typ 5 Max Unit V 220 280 mA +100 °C -40 All the parameters are specified between 1V and 6V of Tuning Voltage Remark : The minimum and maximum values take into account the spread due to the operating temperature and process spread. These performance has been obtained with the chip in QFN package assembled on the recommended boards (ref. 96348 B) described in this document. These performances are highly dependent on this environment. Absolute Maximum Ratings (1) Symbol V_tune +V +ID +IB1 / +IB2 +I1 / +I2 +IB Parameters Positive Tuning voltage Positive supply voltage Positive supply current (Prescalar) Positive supply current (buffers 2 & 3) Positive supply current (VCO+ buffer 1) Positive supply current (prescalar‘s buffer) Values Unit 10 6 120 50 / 55 35 / 50 15 V V mA mA mA mA Top Operating temperature range (2) -40 to +100 °C Tstg Storage temperature range -55 to +125 °C (1) Operation of this device above anyone of these parameters may cause permanent damage. Duration < 1s (2) temperature of the back side of the QFN package Ref. : DSCHV2411aQDG7254 - 11 Sept 07 2/10 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice K-band VCO CHV2411aQDG Typical QFN measurements on board 95791 (QFN plan) Remark : The temperature mentioned below is taken at the back side of the QFN package. Sensitivity versus Vtune T=100°C T=25°C T= - 40°C Output Frequency versus Vtune T= - 40°C T=25°C T=100°C Ref. : DSCHV2411aQDG7254 - 11 Sept 07 3/10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band VCO CHV2411aQDG Output Power @24GHz versus Vtune T= - 40°C T=25°C T=100°C IF Output Power versus Vtune T=100°C T=25°C T= - 40°C Ref. : DSCHV2411aQDG7254 - 11 Sept 07 4/10 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice K-band VCO CHV2411aQDG Phase vsversus Tuning Vtune Voltage PhaseNoise Noise @ 10 kHz from Carrier T=25°C @ 100 kHz from Carrier Phase Noise Offset frequencyfrom fromcarrier carrier Phase Noiseversus vs Offset frequency 0,00 Over Operating Tuning Range -10,00 -20,00 -30,00 Phase Noise (dBc/Hz) -40,00 -50,00 -60,00 - 40°C -70,00 100°C -80,00 -90,00 -100,00 -110,00 -120,00 -130,00 1,00 10,00 100,00 1000,00 Offset Frequency from Carrier (kHz) Ref. : DSCHV2411aQDG7254 - 11 Sept 07 5/10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band VCO CHV2411aQDG QFN Outline Ref. : DSCHV2411aQDG7254 - 11 Sept 07 6/10 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice K-band VCO CHV2411aQDG QFN Pin-out description Pin number Pin name Symbol Name Description 15,17 GND 2 P IF_out 4 VT V_Tune Frequency Tuning Port 5,11,13,20,21,23 VB, V1, VB1, VB2,V2, VD +V Positive supply voltage 5 VB Ground IF output at 1.5 GHz Positive supply voltage of 12 GHz prescalar’s buffer st Positive supply voltage of the VCO core+1 stage of the 24GHZ buffers nd rd Positive supply voltage of the 2 & 3 stages of the 24GHZ buffers 11,21 V1,V2 13 VB1 20 VB2 Positive supply voltage of the 4 stages of the 24GHZ buffers 23 VD Positive supply voltage of the Prescalar 16 RF F_out 2 P F_out/16 th 1,3,6,7,8,9,10,12,14,18, 19,22,24 RF output at 24 GHz Prescalar output at 1.5 GHz Nc Not connected External Components and bias configuration (recommended) Important: Need for a capacitor on the prescalar output port as a DC block (C2). Ref. : DSCHV2411aQDG7254 - 11 Sept 07 7/10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band VCO CHV2411aQDG Recommended Test Fixture (Ref. 96348 B) for measurements over Temperature Range Ref. : DSCHV2411aQDG7254 - 11 Sept 07 8/10 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice K-band VCO CHV2411aQDG ESD sensitivity Norm MIL-STD-1686C ESD STM5.1-1998 Value HBM Class 1 (<1000V) HBM Class 0 (<250V) Package Information Parameter Package body material Lead finish MSL Rating RoHS-compliant Low stress Injection Molded Plastic 100% matte Sn MSL1 Recommended surface mount package assembly (see UMS AN0017) For volume production the SMD type package can be treated as a standard surface mount component (please refer to the IPC/JEDEC J-STD-020C standard or equivalent). The assembly on the motherboard can be performed using a standard assembly process (e.g. stencil solder printing, standard pick-and-place machinery, and solder reflow oven). However, caution should be taken to perform a good and reliable contact over the whole pad area. MAXIMUM RECOMMENDED REFLOW PROFILE for LEADFREE SMT ASSEMBLY PRODUCTS 300 280 255 260 240 217 220 Temperature (°C) 200 180 150 160 140 120 Maximum Ramp up rate : 3°C / second 100 30s Max 80 60 40 20 0 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 Time (s) Attention: The solder thickness after reflow should be typical 50µm [2 mils] and the lateral alignment between the package and the motherboard should be within 50µm [2 mils]. It is important for the performance of the product that the whole overlapping area between the motherboard and package pads is connected. Voids or other improper connections, in particular, between the ground pads on motherboard and package will lead to a deterioration of the RF performance and the heat dissipation. The latter effect can reduce drastically reliability and lifetime of the product. Ref. : DSCHV2411aQDG7254 - 11 Sept 07 9/10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band VCO CHV2411aQDG Ordering Information 24L-QFN4x4 Lead Free Package : Stick: XY=20 CHV2411aQDG/XY Tape and reel: XY=21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHV2411aQDG7254 - 11 Sept 07 10/10 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice