19-3294; Rev 1; 8/04 KIT ATION EVALU LE B A IL A AV 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports Features The MAX1040–MAX1043/MAX1046–MAX1049 integrate a multichannel, 10-bit, analog-to-digital converter (ADC) and a quad, 10-bit, digital-to-analog converter (DAC) in a single IC. The devices also include a temperature sensor and configurable general-purpose I/O ports (GPIOs) with a 25MHz SPI™-/QSPI™-/MICROWIRE™-compatible serial interface. The ADC is available in a 4 or an 8 inputchannel version. The four DAC outputs settle within 2.0µs, and the ADC has a 300ksps conversion rate. All devices include an internal reference (2.5V or 4.096V) providing a well-regulated, low-noise reference for both the ADC and DAC. Programmable reference modes for the ADC and DAC allow the use of an internal reference, an external reference, or a combination of both. Features such as an internal ±1°C accurate temperature sensor, FIFO, scan modes, programmable internal or external clock modes, data averaging, and AutoShutdown™ allow users to minimize both power consumption and processor requirements. The low glitch energy (4nV•s) and low digital feedthrough (0.5nV •s) of the integrated quad DACs make these devices ideal for digital control of fastresponse closed-loop systems. The devices are guaranteed to operate with a supply voltage from +2.7V to +3.6V (MAX1041/MAX1043/MAX1047/ MAX1049) and from +4.75V to +5.25V (MAX1040/ MAX1042/MAX1046/MAX1048). These devices consume 2.5mA at 300ksps throughput, only 22µA at 1ksps throughput, and under 0.2µA in the shutdown mode. The MAX1042/MAX1043/MAX1048/MAX1049 offer four GPIOs that can be configured as inputs or outputs. The MAX1040–MAX1043/MAX1046–MAX1049 are available in 36-pin thin QFN packages. All devices are specified over the -40°C to +85°C temperature range. ♦ 10-Bit, 300ksps ADC Analog Multiplexer with True-Differential Track/Hold (T/H) 8 Single-Ended Channels or 4 Differential Channels (Unipolar or Bipolar) 4 Single-Ended Channels or 2 Differential Channels (Unipolar or Bipolar) Excellent Accuracy: ±0.5 LSB INL, ±0.5 LSB DNL, No Missing Codes Over Temperature ♦ 10-Bit, Quad, 2µs Settling DAC Ultra-Low-Glitch Energy (4nV•s) Power-Up Options from Zero Scale or Full Scale Excellent Accuracy: ±0.5 LSB INL ♦ Internal Reference or External Single-Ended/ Differential Reference Internal Reference Voltage 2.5V or 4.096V ♦ Internal ±1°C Accurate Temperature Sensor ♦ On-Chip FIFO Capable of Storing 16 ADC Conversion Results and One Temperature Result ♦ On-Chip Channel-Scan Mode and Internal Data-Averaging Features ♦ Analog Single-Supply Operation +2.7V to +3.6V or +4.75V to +5.25V ♦ 25MHz, SPI/QSPI/MICROWIRE Serial Interface ♦ AutoShutdown Between Conversions ♦ Low-Power ADC 2.5mA at 300ksps 22µA at 1ksps 0.2µA at Shutdown ♦ Low-Power DAC: 1.5µA ♦ Evaluation Kit Available (Order MAX1258EVKIT) Applications Closed-Loop Controls for Optical Components and Base Stations System Supervision and Control Data-Acquisition Systems SPI and QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corp. AutoShutdown is a trademark of Maxim Integrated Products, Inc. Ordering Information/Selector Guide REF ANALOG RESOLUTION ADC DAC VOLTAGE SUPPLY GPIOs CHANNELS CHANNELS BITS*** (V) VOLTAGE (V) PART TEMP RANGE PIN-PACKAGE MAX1040BETX -40°C to +85°C 36 Thin QFN-EP** 4.096 4.75 to 5.25 10 8 4 MAX1041BETX* -40°C to +85°C 36 Thin QFN-EP** 2.5 2.7 to 3.6 10 8 4 0 MAX1042BETX -40°C to +85°C 36 Thin QFN-EP** 4.096 4.75 to 5.25 10 8 4 4 MAX1043BETX* -40°C to +85°C 36 Thin QFN-EP** *Future product—contact factory for availability. **EP = Exposed pad. ***Number of resolution bits refers to both DAC and ADC. 2.5 0 2.7 to 3.6 10 8 4 4 Ordering Information/Selector Guide continued on last page. Pin Configurations appear at end of data sheet. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX1040–MAX1043/MAX1046–MAX1049 General Description MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports ABSOLUTE MAXIMUM RATINGS Maximum Current into OUT_.............................................100mA Continuous Power Dissipation (TA = +70°C) 36-Pin Thin QFN (6mm x 6mm) (derate 26.3mW/°C above +70°C) ..........................2105.3mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range .............................-60°C to +150°C Junction Temperature ......................................................+150°C Lead Temperature (soldering, 10s) .................................+300°C AVDD to AGND .........................................................-0.3V to +6V DGND to AGND.....................................................-0.3V to +0.3V DVDD to AVDD .......................................................-3.0V to +0.3V Digital Inputs to DGND.............................................-0.3V to +6V Digital Outputs to DGND .........................-0.3V to (DVDD + 0.3V) Analog Inputs, Analog Outputs and REF_ to AGND ...............................................-0.3V to (AVDD + 0.3V) Maximum Current into Any Pin (except AGND, DGND, AVDD, DVDD, and OUT_) ...........................................................50mA Note: If the package power dissipation is not exceeded, one output at a time can be shorted to AVDD, DVDD, AGND, or DGND indefinitely. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (AVDD = DVDD = 2.7V to 3.6V (MAX1041/MAX1043/MAX1047/MAX1049), external reference VREF = 2.5V (MAX1041/MAX1043/ MAX1047/MAX1049), AVDD = DVDD = 4.75V to 5.25V (MAX1040/MAX1042/MAX1046/MAX1048), external reference VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fSCLK = 4.8MHz (50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AV DD = DV DD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), AV DD = DV DD = 5V (MAX1040/MAX1042/ MAX1046/MAX1048), TA = +25°C. Outputs are unloaded, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ADC DC ACCURACY (Note 1) Resolution 10 Bits Integral Nonlinearity INL ±0.5 ±1.0 LSB Differential Nonlinearity DNL ±0.5 ±1 LSB ±0.25 ±2.0 LSB ±0.025 ±2.0 Offset Error Gain Error (Note 2) LSB Gain Temperature Coefficient ±1.4 ppm/°C Channel-to-Channel Offset ±0.1 LSB DYNAMIC SPECIFICATIONS (10kHz sine wave input, VIN = 2.5VP-P (MAX1041/MAX1043/MAX1047/MAX1049), VIN = 4.096VP-P (MAX1040/MAX1042/MAX1046/MAX1048), 300ksps, fSCLK = 4.8MHz) Signal-to-Noise Plus Distortion SINAD 61 dB Total Harmonic Distortion (Up to the Fifth Harmonic) THD -70 dBc Spurious-Free Dynamic Range SFDR 66 dBc fIN1 = 9.9kHz, fIN2 = 10.2kHz 72 dBc Full-Linear Bandwidth SINAD > 70dB 100 kHz Full-Power Bandwidth -3dB point 1 MHz External reference 0.8 µs Internal reference (Note 4) 218 Conversion clock cycles Intermodulation Distortion IMD CONVERSION RATE (Note 3) Power-Up Time 2 tPU _______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports (AVDD = DVDD = 2.7V to 3.6V (MAX1041/MAX1043/MAX1047/MAX1049), external reference VREF = 2.5V (MAX1041/MAX1043/ MAX1047/MAX1049), AVDD = DVDD = 4.75V to 5.25V (MAX1040/MAX1042/MAX1046/MAX1048), external reference VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fSCLK = 4.8MHz (50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AV DD = DV DD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), AV DD = DV DD = 5V (MAX1040/MAX1042/ MAX1046/MAX1048), TA = +25°C. Outputs are unloaded, unless otherwise noted.) PARAMETER Acquisition Time SYMBOL tACQ Conversion Time tCONV Internal Clock Frequency External Clock Frequency CONDITIONS (Note 5) MIN Externally clocked conversion (Note 5) Duty Cycle UNITS µs 3.5 µs 2.7 Internally clocked conversion fCLK MAX 0.6 Internally clocked Externally clocked TYP 4.3 MHz 0.1 4.8 MHz 40 60 % Aperture Delay 30 ns Aperture Jitter <50 ps ANALOG INPUTS Unipolar Input Voltage Range (Note 6) Bipolar 0 VREF -VREF / 2 VREF / 2 Input Leakage Current ±0.01 Input Capacitance ±1 24 V µA pF INTERNAL TEMPERATURE SENSOR Measurement Error (Notes 5, 7) TA = +25°C ±0.7 TA = TMIN to TMAX ±1.0 Temperature Resolution ±3.0 1/8 °C °C/LSB INTERNAL REFERENCE REF1 Output Voltage REF1 Voltage Temperature Coefficient MAX1041/MAX1043/MAX1047/MAX1049 2.482 2.50 2.518 MAX1040/MAX1042/MAX1046/MAX1048 4.066 4.096 4.126 TCREF REF1 Output Impedance V ±30 ppm/°C 6.5 kΩ VREF = 2.5V (MAX1041/MAX1043/ MAX1047/MAX1049) 0.39 VREF = 4.096V (MAX1040/MAX1042/ MAX1046/MAX1048) 0.63 REF1 Short-Circuit Current mA EXTERNAL REFERENCE REF1 Input Voltage Range VREF1 REF2 Input Voltage Range (Note 4) VREF2 REF mode 11 (Note 4) 1 AVDD + 0.05 REF mode 01 1 AVDD + 0.05 REF mode 11 0 1 V V _______________________________________________________________________________________ 3 MAX1040–MAX1043/MAX1046–MAX1049 ELECTRICAL CHARACTERISTICS (continued) MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports ELECTRICAL CHARACTERISTICS (continued) (AVDD = DVDD = 2.7V to 3.6V (MAX1041/MAX1043/MAX1047/MAX1049), external reference VREF = 2.5V (MAX1041/MAX1043/ MAX1047/MAX1049), AVDD = DVDD = 4.75V to 5.25V (MAX1040/MAX1042/MAX1046/MAX1048), external reference VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fSCLK = 4.8MHz (50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AV DD = DV DD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), AV DD = DV DD = 5V (MAX1040/MAX1042/ MAX1046/MAX1048), TA = +25°C. Outputs are unloaded, unless otherwise noted.) PARAMETER REF1 Input Current (Note 9) SYMBOL IREF1 TYP MAX VREF = 2.5V (MAX1041/MAX1043/ MAX1047/MAX1049), fSAMPLE = 300ksps CONDITIONS MIN 25 80 VREF = 4.096V (MAX1040/MAX1042/ MAX1046/MAX1048), fSAMPLE = 300ksps 40 80 ±0.01 ±1 VREF = 2.5V (MAX1041/MAX1043/ MAX1047/MAX1049), fSAMPLE = 300ksps 25 80 VREF = 4.096V (MAX1040/MAX1042/ MAX1046/MAX1048), fSAMPLE = 300ksps 40 80 ±0.01 ±1 Acquisition between conversions REF2 Input Current IREF2 Acquisition between conversions UNITS µA µA DAC DC ACCURACY (Note 10) Resolution 10 Integral Nonlinearity INL Differential Nonlinearity DNL Offset Error VOS ±0.5 Guaranteed monotonic ±3 Offset-Error Drift Gain Error Bits ±1 LSB ±0.5 LSB ±10 mV ppm of FS/°C ±10 GE ±1.25 Gain Temperature Coefficient ±10 LSB ppm of FS/°C ±8 DAC OUTPUT No load 0.02 AVDD 0.02 10kΩ load to either rail 0.1 AVDD 0.1 V Output Voltage Range DC Output Impedance (Note 11) RL 1 AVDD = 2.7V, VREF = 2.5V (MAX1041/ MAX1043/MAX1047/MAX1049), gain error < 1% 2000 AVDD = 4.75V, VREF = 4.096V (MAX1040/ MAX1042/MAX1046/MAX1048), gain error < 2% 500 nF Ω Resistive Load to AGND 4 Ω 0.5 Capacitive Load _______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports (AVDD = DVDD = 2.7V to 3.6V (MAX1041/MAX1043/MAX1047/MAX1049), external reference VREF = 2.5V (MAX1041/MAX1043/ MAX1047/MAX1049), AVDD = DVDD = 4.75V to 5.25V (MAX1040/MAX1042/MAX1046/MAX1048), external reference VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fSCLK = 4.8MHz (50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AV DD = DV DD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), AV DD = DV DD = 5V (MAX1040/MAX1042/ MAX1046/MAX1048), TA = +25°C. Outputs are unloaded, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS From power-down mode, AVDD = 5V 25 From power-down mode, AVDD = 2.7V 21 1kΩ Output Termination Programmed in power-down mode 1 kΩ 100kΩ Output Termination At wake-up or programmed in power-down mode 100 kΩ Wake-Up Time (Note 12) µs DYNAMIC PERFORMANCE (Notes 5, 13) Output-Voltage Slew Rate SR Positive and negative Output-Voltage Settling Time tS To 1 LSB, 400 - C00 hex (Note 7) Digital Feedthrough Code 0, all digital inputs from 0 to DVDD Major Code Transition Glitch Impulse Between codes 2047 and 2048 Output Noise (0.1Hz to 50MHz) Output Noise (0.1Hz to 500kHz) 3 V/µs 2 µs nV•s 4 nV•s From VREF 660 Using internal reference 720 From VREF 260 Using internal reference 320 DAC-to-DAC Transition Crosstalk 5 0.5 µVP-P µVP-P 0.5 nV•s INTERNAL REFERENCE REF1 Output Voltage REF1 Temperature Coefficient MAX1041/MAX1043/MAX1047/MAX1049 2.482 2.50 2.518 MAX1040/MAX1042/MAX1046/MAX1048 4.066 4.096 4.126 TCREF ppm/°C ±30 VREF = 2.5V (MAX1041/MAX1043/ MAX1047/MAX1049) V 0.39 REF1 Short-Circuit Current mA VREF = 4.096V (MAX1040/MAX1042/ MAX1046/MAX1048) 0.63 EXTERNAL REFERENCE INPUT REF1 Input Voltage Range VREF1 REF1 Input Impedance RREF1 REF modes 01, 10, and 11 (Note 4) 0.7 70 100 AVDD V 130 kΩ DIGITAL INTERFACE DIGITAL INPUTS (SCLK, DIN, CS, CNVST, LDAC) Input-Voltage High VIH Input-Voltage Low VIL DVDD = 2.7V to 5.25V 2.4 DVDD = 3.6V to 5.25V 2.0 V DVDD = 2.7V to 3.6V 0.8 DVDD = 3V to 3.6V 0.6 DVDD = 2.7V to 3V Input Leakage Current IL V 0.5 0.01 ±10 µA _______________________________________________________________________________________ 5 MAX1040–MAX1043/MAX1046–MAX1049 ELECTRICAL CHARACTERISTICS (continued) MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports ELECTRICAL CHARACTERISTICS (continued) (AVDD = DVDD = 2.7V to 3.6V (MAX1041/MAX1043/MAX1047/MAX1049), external reference VREF = 2.5V (MAX1041/MAX1043/ MAX1047/MAX1049), AVDD = DVDD = 4.75V to 5.25V (MAX1040/MAX1042/MAX1046/MAX1048), external reference VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fSCLK = 4.8MHz (50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AV DD = DV DD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), AV DD = DV DD = 5V (MAX1040/MAX1042/ MAX1046/MAX1048), TA = +25°C. Outputs are unloaded, unless otherwise noted.) PARAMETER SYMBOL Input Capacitance CONDITIONS MIN CIN TYP MAX 15 UNITS pF DIGITAL OUTPUT (DOUT) (Note 14) Output-Voltage Low VOL ISINK = 2mA Output-Voltage High VOH ISOURCE = 2mA 0.4 DVDD 0.5 V Tri-State Leakage Current Tri-State Output Capacitance ±10 COUT V 15 µA pF DIGITAL OUTPUT (EOC) (Note 14) Output-Voltage Low VOL ISINK = 2mA Output-Voltage High VOH ISOURCE = 2mA 0.4 DVDD 0.5 V Tri-State Leakage Current Tri-State Output Capacitance ±10 COUT V 15 µA pF DIGITAL OUTPUTS (GPIO_) (Note 14) GPIOC_ Output-Voltage Low ISINK = 2mA 0.4 ISINK = 4mA 0.8 GPIOC_ Output-Voltage High ISOURCE = 2mA GPIOA_ Output-Voltage Low ISINK = 15mA GPIOA_ Output-Voltage High DVDD 0.5 V 0.8 DVDD 0.8 ISOURCE = 15mA ±10 COUT V V Tri-State Leakage Current Tri-State Output Capacitance V 15 µA pF POWER REQUIREMENTS (Note 15) Digital Positive-Supply Voltage DVDD Digital Positive-Supply Current DIDD Analog Positive-Supply Voltage AVDD 2.7 Idle, all blocks shut down Only ADC on, external reference REF1 Positive-Supply Rejection 6 AIDD AVDD V 4 µA 1 mA MAX1041/MAX1043/MAX1047/MAX1049 2.7 3.6 MAX1040/MAX1042/MAX1046/MAX1048 4.75 5.25 Idle, all blocks shut down Analog Positive-Supply Current 0.2 0.2 2 fSAMPLE = 300ksps 2.8 4.2 fSAMPLE = 100ksps 2.6 All DACs on, no load, internal reference 1.5 AVDD = 2.7V (MAX1041/MAX1043/ MAX1047/MAX1049) -77 AVDD = 4.75V (MAX1040/MAX1042/ MAX1046/MAX1048) -80 Only ADC on, external reference V µA mA 4.0 dB PSRR _______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports (AVDD = DVDD = 2.7V to 3.6V (MAX1041/MAX1043/MAX1047/MAX1049), external reference VREF = 2.5V (MAX1041/MAX1043/ MAX1047/MAX1049), AVDD = DVDD = 4.75V to 5.25V (MAX1040/MAX1042/MAX1046/MAX1048), external reference VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fSCLK = 4.8MHz (50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AV DD = DV DD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), AV DD = DV DD = 5V (MAX1040/MAX1042/ MAX1046/MAX1048), TA = +25°C. Outputs are unloaded, unless otherwise noted.) PARAMETER DAC Positive-Supply Rejection ADC Positive-Supply Rejection SYMBOL CONDITIONS PSRD AVDD = 2.7V to 3.6V (MAX1041/ Output MAX1043/MAX1047/MAX1049) code = FFFhex AVDD = 4.75V to 5.25V (MAX1040/ MAX1042/MAX1046/MAX1048) PSRA Fullscale input MIN TYP MAX ±0.1 ±0.5 UNITS mV ±0.1 ±0.5 AVDD = 2.7V to 3.6V (MAX1041/ MAX1043/MAX1047/MAX1049) ±0.06 ±0.5 AVDD = 4.75V to 5.25V (MAX1040/ MAX1042/MAX1046/MAX1048) ±0.06 ±0.5 mV TIMING CHARACTERISTICS (Figures 6–13) SCLK Clock Period tCP 40 ns SCLK Pulse-Width High tCH 40/60 duty cycle 16 ns SCLK Pulse-Width Low tCL 60/40 duty cycle 16 ns GPIO Output Rise/Fall After CS Rise tGOD GPIO Input Setup Before CS Fall tGSU LDAC Pulse Width CLOAD = 20pF 0 tLDACPWL SCLK Fall to DOUT Transition (Note 16) tDOT SCLK Rise to DOUT Transition (Notes 16, 17) tDOT CS Fall to SCLK Fall Setup Time tCSS SCLK Fall to CS Rise Setup Time 100 ns ns 20 ns CLOAD = 20pF, SLOW = 0 1.8 12.0 CLOAD = 20pF, SLOW = 1 10 40 CLOAD = 20pF, SLOW = 0 1.8 12.0 CLOAD = 20pF, SLOW = 1 10 40 ns ns 10 ns ns tCSH 0 DIN to SCLK Fall Setup Time tDS 10 ns DIN to SCLK Fall Hold Time tDH 0 ns CS Pulse-Width High tCSPWH 50 CS Rise to DOUT Disable tDOD CLOAD = 20pF CS Fall to DOUT Enable tDOE CLOAD = 20pF EOC Fall to CS Fall tRDS CS or CNVST Rise to EOC Fall tDOV 1.5 ns 25 ns 25.0 ns 30 ns CKSEL = 01 (temp sense) or CKSEL = 10 (temp sense), internal reference on 55 CKSEL = 01 (temp sense) or CKSEL = 10 (temp sense), internal reference initially off 120 CKSEL = 01 (voltage conversion) 8 CKSEL = 10 (voltage conversion), internal reference on 8 CKSEL = 10 (voltage conversion), internal reference initially off 80 µs _______________________________________________________________________________________ 7 MAX1040–MAX1043/MAX1046–MAX1049 ELECTRICAL CHARACTERISTICS (continued) ELECTRICAL CHARACTERISTICS (continued) (AVDD = DVDD = 2.7V to 3.6V (MAX1041/MAX1043/MAX1047/MAX1049), external reference VREF = 2.5V (MAX1041/MAX1043/ MAX1047/MAX1049), AVDD = DVDD = 4.75V to 5.25V (MAX1040/MAX1042/MAX1046/MAX1048), external reference VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fSCLK = 4.8MHz (50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AV DD = DV DD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), AV DD = DV DD = 5V (MAX1040/MAX1042/ MAX1046/MAX1048), TA = +25°C. Outputs are unloaded, unless otherwise noted.) PARAMETER SYMBOL CNVST Pulse Width tCSW CONDITIONS MIN TYP MAX UNITS CKSEL = 00, CKSEL = 01 (temp sense) 40 ns CKSEL = 01 (voltage conversion) 1.4 µs Note 1: Tested at DVDD = AVDD = 3.6V (MAX1041/MAX1043/MAX1047/MAX1049), DVDD = AVDD = 5.25V (MAX1040/MAX1042/ MAX1046/MAX1048). Note 2: Offset nulled. Note 3: No bus activity during conversion. Conversion time is defined as the number of conversion clock cycles multiplied by the clock period. Note 4: See Table 5 for reference-mode details. Note 5: Not production tested. Guaranteed by design. Note 6: See the ADC/DAC References section. Note 7: Fast automated test, excludes self-heating effects. Note 8: Specified over the -40°C to +85°C temperature range. Note 9: REFSEL[1:0] = 00 or when DACs are not powered up. Note 10: DAC linearity, gain, and offset measurements are made between codes 115 and 3981. Note 11: The DAC buffers are guaranteed by design to be stable with a 1nF load. Note 12: Time required by the DAC output to power up and settle within 1 LSB in the external reference mode. Note 13: All DAC dynamic specifications are valid for a load of 100pF and 10kΩ. Note 14: Only one digital output (either DOUT, EOC, or the GPIOs) can be indefinitely shorted to either supply at one time. Note 15: All digital inputs at either DVDD or DGND. DVDD should not exceed AVDD. Note 16: See the Reset Register section and Table 9 for details on programming the SLOW bit. Note 17: Clock mode 11 only. Typical Operating Characteristics (AVDD = DVDD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), external VREF = 2.5V (MAX1041/MAX1043/MAX1047/MAX1049), AVDD = DVDD = 5V (MAX1040/MAX1042/MAX1046/MAX1048), external VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fCLK = 4.8MHz (50% duty cycle), fSAMPLE = 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.) 0.15 0.10 0.16 0.14 0.12 0.05 4.75 4.85 4.95 5.05 SUPPLY VOLTAGE (V) 5.15 MAX1040 toc03 0.5 0.4 0.3 0.2 0.1 MAX1041/MAX1043/MAX1047/MAX1049 MAX1040/MAX1042/MAX1046/MAX1048 0 0.10 0 8 0.18 SHUTDOWN CURRENT (µA) 0.20 0.6 MAX1040 toc02 0.25 0.20 SHUTDOWN CURRENT (µA) MAX1040 toc01 0.30 SHUTDOWN CURRENT vs. TEMPERATURE SHUTDOWN CURRENT vs. ANALOG SUPPLY VOLTAGE SHUTDOWN CURRENT vs. ANALOG SUPPLY VOLTAGE SHUTDOWN CURRENT (µA) MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports 5.25 2.7 3.0 3.3 SUPPLY VOLTAGE (V) 3.6 -40 -15 10 35 TEMPERATURE (°C) _______________________________________________________________________________________ 60 85 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports INTERNAL OSCILLATOR FREQUENCY vs. ANALOG SUPPLY VOLTAGE 4.3 4.2 4.1 MAX1040/MAX1042/MAX1046/MAX1048 4.80 4.75 4.70 4.65 4.60 4.85 4.95 5.05 5.15 5.25 4.6 MAX1041/MAX1043/MAX1047/MAX1049 4.4 4.2 4.0 MAX1040/MAX1042/MAX1046/MAX1048 3.0 3.3 3.6 -40 -15 10 35 60 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) TEMPERATURE (°C) ADC INTEGRAL NONLINEARITY vs. OUTPUT CODE ADC INTEGRAL NONLINEARITY vs. OUTPUT CODE ADC DIFFERENTIAL NONLINEARITY vs. OUTPUT CODE 0.1 0 -0.1 -0.2 0.1 0 -0.1 -0.2 -0.3 512 768 0.1 0 -0.1 -0.2 MAX1040/MAX1042/MAX1046/MAX1048 -0.3 -0.3 256 0.2 MAX1041/MAX1043/MAX1047/MAX1049 MAX1040/MAX1042/MAX1046/MAX1048 1024 0 256 512 768 0 1024 256 512 768 OUTPUT CODE OUTPUT CODE OUTPUT CODE ADC DIFFERENTIAL NONLINEARITY vs. OUTPUT CODE ADC OFFSET ERROR vs. ANALOG SUPPLY VOLTAGE ADC OFFSET ERROR vs. ANALOG SUPPLY VOLTAGE 0.1 0 -0.1 -0.5 OFFSET ERROR (LSB) OFFSET ERROR (LSB) -0.6 1024 MAX1040 toc10 0.2 0 MAX1040 toc11 -0.4 MAX1040 toc10 0.3 85 MAX1040 toc09 0.2 0.3 DIFFERENTIAL NONLINEARITY (LSB) 0.2 0.3 MAX1040 toc08 MAX1040 toc07 0.3 0 4.8 3.8 2.7 INTEGRAL NONLINEARITY (LSB) 4.75 DIFFERENTIAL NONLINEARITY (LSB) 5.0 MAX1040 toc06 4.85 MAX1041/MAX1043/MAX1047/MAX1049 4.0 INTEGRAL NONLINEARITY (LSB) MAX1040 toc05 4.4 4.90 INTERNAL OSCILLATOR FREQUENCY (MHz) MAX1040 toc04 INTERNAL OSCILLATOR FREQUENCY (MHz) 4.5 INTERNAL OSCILLATOR FREQUENCY vs. TEMPERATURE INTERNAL OSCILLATOR FREQUENCY (MHz) INTERNAL OSCILLATOR FREQUENCY vs. ANALOG SUPPLY VOLTAGE -0.5 -1.0 -1.5 -0.7 -0.2 MAX1041/MAX1043/MAX1047/MAX1049 MAX1041/MAX1043/MAX1047/MAX1049 MAX1040/MAX1042/MAX1046/MAX1048 -2.0 -0.8 -0.3 0 256 512 OUTPUT CODE 768 1024 4.75 4.85 4.95 5.05 SUPPLY VOLTAGE (V) 5.15 5.25 2.7 3.0 3.3 3.6 SUPPLY VOLTAGE (V) _______________________________________________________________________________________ 9 MAX1040–MAX1043/MAX1046–MAX1049 Typical Operating Characteristics (continued) (AVDD = DVDD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), external VREF = 2.5V (MAX1041/MAX1043/MAX1047/MAX1049), AVDD = DVDD = 5V (MAX1040/MAX1042/MAX1046/MAX1048), external VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fCLK = 4.8MHz (50% duty cycle), fSAMPLE = 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (AVDD = DVDD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), external VREF = 2.5V (MAX1041/MAX1043/MAX1047/MAX1049), AVDD = DVDD = 5V (MAX1040/MAX1042/MAX1046/MAX1048), external VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fCLK = 4.8MHz (50% duty cycle), fSAMPLE = 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.) ADC GAIN ERROR vs. ANALOG SUPPLY VOLTAGE MAX1040 toc14 0.50 0.025 0.45 0 -0.025 MAX1041/MAX1043/MAX1047/MAX1049 -1.5 -0.050 0.40 0.35 0.30 0.25 MAX1041/MAX1043/MAX1047/MAX1049 MAX1040/MAX1042/MAX1046/MAX1048 -0.075 -2.0 10 35 60 5.25 2.7 3.0 3.3 3.6 ANALOG SUPPLY CURRENT vs. SAMPLING RATE MAX1041/MAX1043/MAX1047/MAX1049 0 MAX1040/MAX1042/MAX1046/MAX1048 10 35 60 50 40 MAX1040/MAX1042/MAX1046/MAX1048 30 20 10 2.5 MAX1040/MAX1042/MAX1046/MAX1048 2.0 1.5 1.0 0.5 MAX1041/MAX1043/MAX1047/MAX1049 0 MAX1041/MAX1043/MAX1047/MAX1049 0 0 85 3.0 ANALOG SUPPLY CURRENT (mA) MAX1040 toc16 0.25 60 50 100 150 200 250 300 0 50 100 150 200 250 TEMPERATURE (°C) SAMPLING RATE (ksps) SAMPLING RATE (ksps) ANALOG SUPPLY CURRENT vs. ANALOG SUPPLY VOLTAGE ANALOG SUPPLY CURRENT vs. ANALOG SUPPLY VOLTAGE ANALOG SUPPLY CURRENT vs. TEMPERATURE 2.6 2.5 2.4 2.3 2.4 2.3 2.2 2.1 300 MAX1040 toc21 2.5 SUPPLY CURRENT (mA) 2.7 2.7 ANALOG SUPPLY CURRENT (mA) 2.6 MAX1040 toc19 2.8 MAx1040 toc20 GAIN ERROR (LSB) 5.15 ADC EXTERNAL REFERENCE INPUT CURRENT vs. SAMPLING RATE -0.50 2.6 2.5 2.4 2.0 MAX1040/MAX1042/MAX1046/MAX1048 MAX1041/MAX1043/MAX1047/MAX1049 MAX1040/MAX1042/MAX1046/MAX1048 2.2 2.3 1.9 4.75 4.85 4.95 5.05 SUPPLY VOLTAGE (V) 10 5.05 ADC GAIN ERROR vs. TEMPERATURE 0.50 -15 4.95 SUPPLY VOLTAGE (V) 0.75 -40 4.85 SUPPLY VOLTAGE (V) 1.00 -0.25 4.75 85 TEMPERATURE (°C) MAX1040 toc17 -15 ADC EXTERNAL REFERENCE INPUT CURRENT (µA) -40 0.20 MAX1040 toc18 -1.0 GAIN ERROR (LSB) -0.5 GAIN ERROR (LSB) OFFSET ERROR (LSB) MAX1040/MAX1042/MAX1046/MAX1048 0.050 MAX1040 toc13 0 ADC GAIN ERROR vs. ANALOG SUPPLY VOLTAGE MAX1040 toc15 ADC OFFSET ERROR vs. TEMPERATURE SUPPLY CURRENT (mA) MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports 5.15 5.25 2.7 3.0 3.3 SUPPLY VOLTAGE (V) 3.6 -40 -15 10 35 TEMPERATURE (°C) ______________________________________________________________________________________ 60 85 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports ANALOG SUPPLY CURRENT vs. TEMPERATURE 2.13 2.12 2.11 0.1 0 -0.1 -0.2 35 60 0 256 512 768 1024 0 256 512 768 OUTPUT CODE DAC DIFFERENTIAL NONLINEARITY vs. OUTPUT CODE DAC DIFFERENTIAL NONLINEARITY vs. OUTPUT CODE DAC FULL-SCALE ERROR vs. ANALOG SUPPLY VOLTAGE 0 -0.05 1029 1032 1035 0.02 0.01 MAX1040/MAX1042/MAX1046/MAX1048 -0.10 1026 0.03 MAX1041/MAX1043/MAX1047/MAX1049 MAX1040/MAX1042/MAX1046/MAX1048 0 1023 1038 1026 1029 1032 1035 1038 4.75 4.85 4.95 5.05 5.15 OUTPUT CODE OUTPUT CODE SUPPLY VOLTAGE (V) DAC FULL-SCALE ERROR vs. ANALOG SUPPLY VOLTAGE DAC FULL-SCALE ERROR vs. TEMPERATURE DAC FULL-SCALE ERROR vs. TEMPERATURE -0.60 -0.65 1.0 0.5 0 EXTERNAL REFERENCE = 4.096V -0.5 MAX1041/MAX1043/MAX1047/MAX1049 3.0 3.3 -0.50 EXTERNAL REFERENCE = 2.500V -0.75 -1.00 INTERNAL REFERENCE -1.25 -1.50 -1.75 MAX1041/MAX1043/MAX1047/MAX1049 -2.00 -1.0 SUPPLY VOLTAGE (V) -0.25 MAX1040/MAX1042/MAX1046/MAX1048 -0.70 3.6 5.25 MAX1040 toc30 MAX1040 toc29 INTERNAL REFERENCE 1.5 0 DAC FULL-SCALE ERROR (LSB) -0.55 2.0 DAC FULL-SCALE ERROR (LSB) MAX1040 toc28 -0.50 1024 MAX1040 toc27 MAX1040 toc26 0.05 0.04 DAC FULL-SCALE ERROR (LSB) -0.05 DIFFERENTIAL NONLINEARITY (LSB) 0 0.10 -0.10 DAC FULL-SCALE ERROR (LSB) -0.3 OUTPUT CODE MAX1040 toc25 DIFFERENTIAL NONLINEARITY (LSB) 85 0.05 2.7 -0.1 TEMPERATURE (°C) 0.10 1023 0 MAX1041/MAX1043/MAX1047/MAX1049 -0.3 10 0.1 MAX1040/MAX1042/MAX1046/MAX1048 2.10 -15 0.2 -0.2 MAX1041/MAX1043/MAX1047/MAX1049 -40 MAX1040 toc24 0.2 0.3 INTEGRAL NONLINEARITY (LSB) 2.14 DAC INTEGRAL NONLINEARITY vs. OUTPUT CODE MAX1040 toc23 2.15 0.3 INTEGRAL NONLINEARITY (LSB) MAX1040 toc22 ANALOG SUPPLY CURRENT (mA) 2.16 DAC INTEGRAL NONLINEARITY vs. OUTPUT CODE -40 -15 10 35 TEMPERATURE (°C) 60 85 -40 -15 10 35 60 85 TEMPERATURE (°C) ______________________________________________________________________________________ 11 MAX1040–MAX1043/MAX1046–MAX1049 Typical Operating Characteristics (continued) (AVDD = DVDD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), external VREF = 2.5V (MAX1041/MAX1043/MAX1047/MAX1049), AVDD = DVDD = 5V (MAX1040/MAX1042/MAX1046/MAX1048), external VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fCLK = 4.8MHz (50% duty cycle), fSAMPLE = 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (AVDD = DVDD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), external VREF = 2.5V (MAX1041/MAX1043/MAX1047/MAX1049), AVDD = DVDD = 5V (MAX1040/MAX1042/MAX1046/MAX1048), external VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fCLK = 4.8MHz (50% duty cycle), fSAMPLE = 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.) 0.50 0.25 0 -0.25 -0.50 -1.0 -1.5 -2.0 1 -2.5 -0.75 1 2 3 4 5 0.5 0 1.0 1.5 2.0 2.5 -1 -2 -3 -4 -3.0 15 20 25 LOAD CURRENT (mA) DAC FULL-SCALE ERROR vs. LOAD CURRENT INTERNAL REFERENCE VOLTAGE vs. TEMPERATURE INTERNAL REFERENCE VOLTAGE vs. TEMPERATURE -1 -2 -3 4.11 4.10 4.09 2.51 2.50 2.49 MAX1041/MAX1043/MAX1047/MAX1049 MAX1040/MAX1042/MAX1046/MAX1048 -4 4.08 0.5 1.0 1.5 2.0 2.5 3.0 2.48 -40 -15 10 35 60 85 -40 -15 10 35 60 LOAD CURRENT (mA) TEMPERATURE (°C) TEMPERATURE (°C) ADC REFERENCE SUPPLY CURRENT vs. ANALOG SUPPLY VOLTAGE ADC REFERENCE SUPPLY CURRENT vs. ANALOG SUPPLY VOLTAGE ADC REFERENCE SUPPLY CURRENT vs. TEMPERATURE 42.4 42.2 25.7 25.6 25.5 MAX1040/MAX1042/MAX1046/MAX1048 4.85 4.95 5.05 SUPPLY VOLTAGE (V) 5.15 5.25 2.7 3.0 3.3 SUPPLY VOLTAGE (V) MAX1040 toc39 48 46 44 42 40 25.4 4.75 85 MAX1040/MAX1042/MAX1046/MAX1048 MAX1041/MAX1043/MAX1047/MAX1049 42.0 50 ADC REFERENCE SUPPLY CURRENT (µA) 42.6 MAX1040 toc38 42.8 25.8 ADC REFERENCE SUPPLY CURRENT (µA) MAX1040 toc37 43.0 30 MAX1040 toc36 2.52 INTERNAL REFERENCE VOLTAGE (V) 0 4.12 INTERNAL REFERENCE VOLTAGE (V) MAX1041/MAX1043/MAX1047/MAX1049 12 10 REFERENCE VOLTAGE (V) 1 0 5 0 3.0 REFERENCE VOLTAGE (V) MAX1040 toc34 0 0 MAX1040/MAX1042/MAX1046/MAX1048 MAX1041/MAX1043/MAX1047/MAX1049 MAX1040/MAX1042/MAX1046/MAX1048 -1.00 MAX1040 toc33 MAX1040 toc32 -0.5 MAX1040 toc35 DAC FULL-SCALE ERROR (LSB) 0.75 0 DAC FULL-SCALE ERROR (LSB) MAX1040 toc31 1.00 DAC FULL-SCALE ERROR (LSB) DAC FULL-SCALE ERROR vs. LOAD CURRENT DAC FULL-SCALE ERROR vs. REFERENCE VOLTAGE DAC FULL-SCALE ERROR (LSB) DAC FULL-SCALE ERROR vs. REFERENCE VOLTAGE ADC REFERENCE SUPPLY CURRENT (µA) MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports 3.6 -40 -15 10 35 TEMPERATURE (°C) ______________________________________________________________________________________ 60 85 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports ADC FFT PLOT fSAMPLE = 32.768kHz fANALOG_)N = 10.080kHz fCLK = 5.24288MHz SINAD = 61.21dBc SNR = 61.21dBc THD = 73.32dBc SFDR = 81.25dBc -20 26.50 AMPLITUDE (dB) -40 26.25 26.00 25.75 -60 fCLK = 5.24288MHz fIN1 = 9.0kHz fIN2 = 11.0kHz AIN = -6dBFS IMD = 78.0dBc -20 -40 AMPLITUDE (dB) 26.75 ADC IMD PLOT 0 MAX1040 toc41 0 MAX1040 toc40 ADC REFERENCE SUPPLY CURRENT (µA) 27.00 -80 -100 MAX1040 toc42 ADC REFERENCE SUPPLY CURRENT vs. TEMPERATURE -60 -80 -100 25.50 -120 -120 25.25 -140 -140 MAX1041/MAX1043/MAX1047/MAX1049 -160 -15 10 35 50 100 150 200 0 200 150 ADC CROSSTALK PLOT DAC OUTPUT LOAD REGULATION vs. OUTPUT CURRENT DAC OUTPUT LOAD REGULATION vs. OUTPUT CURRENT -80 -100 -120 2.06 2.05 2.04 2.03 SINKING SOURCING 2.02 -140 2.01 -160 2.00 MAX1040 toc45 2.07 1.29 MAX1040 toc44 MAX1040/MAX1042/MAX1046/MAX1048 1.28 DAC OUTPUT VOLTAGE (V) -60 2.08 DAC OUTPUT VOLTAGE (V) -40 1.27 1.26 1.25 1.24 SINKING 1.23 SOURCING 1.22 DAC OUTPUT = MIDSCALE MAX1041/MAX1043/MAX1047/MAX1049 DAC OUTPUT = MIDSCALE 50 100 150 200 1.21 -30 0 30 90 60 ANALOG INPUT FREQUENCY (kHz) OUTPUT CURRENT (mA) 0 10 -10 OUTPUT CURRENT (mA) GPIO OUTPUT VOLTAGE vs. SOURCE CURRENT GPIO OUTPUT VOLTAGE vs. SOURCE CURRENT GPIO OUTPUT VOLTAGE vs. SINK CURRENT GPIOB0–B3, C0–C3 OUTPUTS 2 1 MAX1040/MAX1042/ MAX1046/MAX1048 GPIOA0–A3 OUTPUTS 2.5 2.0 1.5 GPIOB0–B3, C0–C3 OUTPUTS 1.0 0.5 20 40 60 SOURCE CURRENT (mA) 80 100 0 20 40 60 SOURCE CURRENT (mA) 80 100 20 30 GPIOB0–B3, C0–C3 OUTPUTS 1200 900 600 GPIOA0–A3 OUTPUTS 300 MAX1040/MAX1042/MAX1046/MAX1048 0 0 0 -20 1500 GPIO OUTPUT VOLTAGE (mV) GPIOA0–A3 OUTPUTS 3 MAX1041/MAX1043/MAX1047/MAX1049 -30 MAX1040 toc47 4 3.0 GPIO OUTPUT VOLTAGE (V) MAX1040 toc46 5 0 100 ANALOG INPUT FREQUENCY (kHz) fCLK = 5.24288MHz fIN1 = 10.080kHz fIN2 = 8.0801kHz SNR = 61.11dBc THD = 73.32dBc ENOB = 9.86 BITS SFDR = 86.34dBc 0 50 ANALOG INPUT FREQUENCY (kHz) -20 GPIO OUTPUT VOLTAGE (V) -160 0 TEMPERATURE (°C) 0 AMPLITUDE (dB) 85 60 MAX1040 toc43 -40 MAX1040 toc48 25.00 0 20 40 60 80 100 SINK CURRENT (mA) ______________________________________________________________________________________ 13 MAX1040–MAX1043/MAX1046–MAX1049 Typical Operating Characteristics (continued) (AVDD = DVDD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), external VREF = 2.5V (MAX1041/MAX1043/MAX1047/MAX1049), AVDD = DVDD = 5V (MAX1040/MAX1042/MAX1046/MAX1048), external VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fCLK = 4.8MHz (50% duty cycle), fSAMPLE = 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (AVDD = DVDD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), external VREF = 2.5V (MAX1041/MAX1043/MAX1047/MAX1049), AVDD = DVDD = 5V (MAX1040/MAX1042/MAX1046/MAX1048), external VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fCLK = 4.8MHz (50% duty cycle), fSAMPLE = 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.) GPIO OUTPUT VOLTAGE vs. SINK CURRENT 900 600 GPIOA0–A3 OUTPUTS MAX1040 toc50 1200 MAX1040 toc51 1.00 TEMPERATURE SENSOR ERROR (°C) MAX1040 toc49 GPIOB0–B3, C0–C3 OUTPUTS 300 DAC-TO-DAC CROSSTALK RLOAD = 10kΩ, CLOAD = 100pF TEMPERATURE SENSOR ERROR vs. TEMPERATURE 1500 GPIO OUTPUT VOLTAGE (mV) MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports 0.75 VOUTA 1V/div 0.50 0.25 0 -0.25 VOUTB 10mV/div AC-COUPLED -0.50 -0.75 MAX1041/MAX1043/MAX1047/MAX1049 MAX1041/MAX1043/MAX1047/MAX1049 0 -1.00 0 10 20 30 40 50 60 -40 -15 10 35 60 SINK CURRENT (mA) TEMPERATURE (°C) DAC-TO-DAC CROSSTALK RLOAD = 10kΩ, CLOAD = 100pF DYNAMIC RESPONSE RISE TIME RLOAD = 10kΩ, CLOAD = 100pF MAX1040 toc52 100µs 85 DYNAMIC RESPONSE RISE TIME RLOAD = 10kΩ, CLOAD = 100pF MAX1040 toc54 MAX1040 toc53 MAX1041/MAX1043/MAX1047/MAX1049 VOUTA 2V/div CS 2V/div VOUT 1V/div VOUTB 10mV/div AC-COUPLED VOUT 2V/div CS 1V/div MAX1040/MAX1042/MAX1046/MAX1048 MAX1040/MAX1042/MAX1046/MAX1048 100µs 1µs 1µs DYNAMIC RESPONSE FALL TIME RLOAD = 10kΩ, CLOAD = 100pF DYNAMIC RESPONSE FALL TIME RLOAD = 10kΩ, CLOAD = 100pF MAX1040 toc55 MAJOR CARRY TRANSITION RLOAD = 10kΩ, CLOAD = 100pF MAX1040 toc56 MAX1040 toc57 MAX1041/MAX1043/MAX1047/MAX1049 CS 2V/div VOUT 1V/div MAX1040/MAX1042/MAX1046/MAX1048 14 VOUT 10mV/div AC-COUPLED VOUT 2V/div CS 1V/div 1µs CS 1V/div 1µs MAX1041/MAX1043/MAX1047/MAX1049 1µs ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports DAC DIGITAL FEEDTHROUGH RLOAD = 10kΩ, CLOAD = 100pF, CS = HIGH, DIN = LOW MAJOR CARRY TRANSITION RLOAD = 10kΩ, CLOAD = 100pF DAC DIGITAL FEEDTHROUGH RLOAD = 10kΩ, CLOAD = 100pF, CS = HIGH, DIN = LOW MAX1040 toc60 MAX1040 toc59 MAX1040 toc58 CS 2V/div VOUT 100mV/div AC-COUPLED VOUT 100mV/div AC-COUPLED VOUT 20mV/div AC-COUPLED MAX1040/MAX1042/MAX1046/MAX1048 MAX1041/MAX1043/MAX1047/MAX1049 MAX1040/MAX1042/MAX1046/MAX1048 SCLK 2V/div SCLK 1V/div 1µs 200ns 200ns NEGATIVE FULL-SCALE SETTLING TIME RLOAD = 10kΩ, CLOAD = 100pF NEGATIVE FULL-SCALE SETTLING TIME RLOAD = 10kΩ, CLOAD = 100pF MAX1040 toc61 MAX1040 toc62 POSITIVE FULL-SCALE SETTLING TIME RLOAD = 10kΩ, CLOAD = 100pF MAX1040 toc63 MAX1041/MAX1043/MAX1047/MAX1049 MAX1041/MAX1043/MAX1047/MAX1049 VLDAC 2V/div VOUT 1V/div VOUT_ 1V/div VOUT_ 2V/div VLDAC 1V/div VLDAC 1V/div MAX1040/MAX1042/MAX1046/MAX1048 1µs 2µs 1µs POSITIVE FULL-SCALE SETTLING TIME RLOAD = 10kΩ, CLOAD = 100pF ADC REFERENCE FEEDTHROUGH RLOAD = 10kΩ, CLOAD = 100pF ADC REFERENCE FEEDTHROUGH RLOAD = 10kΩ, CLOAD = 100pF VREF2 1V/div VLDAC 2V/div VOUT_ 2V/div MAX1040/MAX1042/MAX1046/MAX1048 1µs MAX1040 toc66 MAX1040 toc65 MAX1040 toc64 VREF2 2V/div VDAC-OUT 10mV/div AC-COUPLED MAX1041/MAX1043/MAX1047/MAX1049 ADC REFERENCE SWITCHING MAX1040/MAX1042/MAX1046/MAX1048 ADC REFERENCE SWITCHING 200µs 200µs VDAC-OUT 2mV/div AC-COUPLED ______________________________________________________________________________________ 15 MAX1040–MAX1043/MAX1046–MAX1049 Typical Operating Characteristics (continued) (AVDD = DVDD = 3V (MAX1041/MAX1043/MAX1047/MAX1049), external VREF = 2.5V (MAX1041/MAX1043/MAX1047/MAX1049), AVDD = DVDD = 5V (MAX1040/MAX1042/MAX1046/MAX1048), external VREF = 4.096V (MAX1040/MAX1042/MAX1046/MAX1048), fCLK = 4.8MHz (50% duty cycle), fSAMPLE = 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.) MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports Pin Description MAX1040 MAX1041 MAX1042 MAX1043 MAX1046 MAX1047 MAX1048 MAX1049 NAME 1, 2, 15–19, 23, 24, 25, 32, 33 15–19, 23, 32, 33 1, 2, 15–19, 23, 24, 25, 31–34 15–19, 23, 31–34 N.C. No Connection. Not internally connected. 3 3 3 3 EOC Active-Low End-of-Conversion Output. Data is valid after the falling edge of EOC. 4 4 4 4 DVDD Digital Positive Power Input. Bypass DVDD to DGND with a 0.1µF capacitor. 5 5 5 5 DGND Digital Ground. Connect DGND to AGND. 16 FUNCTION 6 6 6 6 DOUT Serial Data Output. Data is clocked out on the falling edge of the SCLK clock in clock modes 00, 01, and 10. Data is clocked out on the rising edge of the SCLK clock in clock mode 11. High impedance when CS is high. 7 7 7 7 SCLK Serial Clock Input. Clocks data in and out of the serial interface. (Duty cycle must be 40% to 60%.) See Table 4 for details on programming the clock mode. 8 8 8 8 DIN Serial Data Input. DIN data is latched into the serial interface on the falling edge of SCLK. 9–12 9–12 9–12 9–12 OUT0– OUT3 DAC Outputs 13 13 13 13 AVDD Positive Analog Power Input. Bypass AVDD to AGND with a 0.1µF capacitor. 14 14 14 14 AGND Analog Ground 20 20 20 20 LDAC Active-Low Load DAC. LDAC is an asynchronous active-low input that updates the DAC outputs. Drive LDAC low to make the DAC registers transparent. 21 21 21 21 CS Active-Low Chip-Select Input. When CS is low, the serial interface is enabled. When CS is high, DOUT is high impedance. ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports MAX1040 MAX1041 22 MAX1042 MAX1043 22 MAX1046 MAX1047 22 MAX1048 MAX1049 22 NAME FUNCTION RES_SEL Reset Select. Selects DAC wake-up mode. Set RES_SEL low to wake up the DAC outputs with a 100kΩ resistor to GND or set RES_SEL high to wake up the DAC outputs with a 100kΩ resistor to VREF. Set RES_SEL high to power up the DAC input register to FFFh. Set RES_SEL low to power up the DAC input register to 000h. Reference 1 Input. Reference voltage. Leave unconnected to use the internal reference (2.5V for the MAX1041/MAX1043/MAX1047/MAX1049 or 4.096V for the MAX1040/MAX1042/MAX1046/MAX1048). REF1 is the positive reference in ADC external differential mode. Bypass REF1 to AGND with a 0.1µF capacitor in external reference mode only. See the ADC/DAC References section. 26 26 26 26 REF1 27–31, 34 27–31, 34 — — AIN0–AIN5 Analog Inputs 35 35 — — REF2/AIN6 Reference 2 Input/Analog Input Channel 6. See Table 5 for details on programming the setup register. REF2 is the negative reference in the ADC external differential reference mode. 36 36 — — CNVST/ AIN7 Active-Low Conversion Start Input/Analog Input 7. See Table 5 for details on programming the setup register. — 1, 2 — 1, 2 GPIOA0, GPIOA1 General-Purpose I/O A0, A1. GPIOA0, GPIOA1 can sink and source 15mA. — 24, 25 — 24, 25 GPIOC0, GPIOC1 General-Purpose I/O C0, C1. GPIOC0, GPIOC1 can sink 4mA and source 2mA. — — 27–30 27–30 AIN0–AIN3 — — 35 35 REF2 — — 36 36 CNVST — — — — EP Analog Inputs Reference 2 Input. See Table 5 for details on programming the setup register. REF2 is the negative reference in the ADC external differential reference mode. Active-Low Conversion Start Input. See Table 5 details on programming the setup register. Exposed Paddle. Must be externally connected to AGND. Do not use as a ground connect. ______________________________________________________________________________________ 17 MAX1040–MAX1043/MAX1046–MAX1049 Pin Description (continued) MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports Detailed Description The MAX1040–MAX1043/MAX1046–MAX1049 integrate a multichannel 10-bit ADC and a quad 10-bit DAC in a single IC. These devices also include a temperature sensor and configurable GPIOs with a 25MHz SPI/QSPI-/MICROWIRE-compatible serial interface. The ADC is available in a 4 or an 8 input-channel version. The four DAC outputs settle within 2.0µs, and the ADC has a 300ksps conversion rate. All devices include an internal reference (2.5V or 4.096V) providing a well-regulated, low-noise reference for both the ADC and DAC. Programmable reference modes for the ADC and DAC allow the use of an internal reference, an external reference, or a combination of both. Features such as an internal ±1°C accurate temperature sensor, FIFO, scan modes, programmable internal or external clock modes, data averaging, and AutoShutdown allow users to minimize both power consumption and processor requirements. The low glitch energy (4nV•s) and low digital feedthrough (0.5nV•s) of the integrated quad DACs make these devices ideal for digital control of fast-response closed-loop systems. The devices are guaranteed to operate with a supply voltage from +2.7V to +3.6V (MAX1041/MAX1043/ MAX1047/MAX1049) and from +4.5V to +5.5V (MAX1040/MAX1042/MAX1046/MAX1048). These devices consume 2.5mA at 300ksps throughput, only 0.22µA at 1ksps throughput, and under 0.2µA in the shutdown mode. The MAX1042/MAX1043/MAX1048/ MAX1049 offer four GPIOs that can be configured as inputs or outputs. Figure 1 shows the MAX1042/MAX1043 functional diagram. The MAX1042/MAX1043/MAX1048/MAX1049 only include the GPIO A0, A1, GPIO C0, C1 blocks. The MAX1040/MAX1041/MAX1046/MAX1047 exclude the GPIOs. The output-conditioning circuitry takes the internal parallel data bus and converts it to a serial data format at DOUT, with the appropriate wake-up timing. The arithmetic logic unit (ALU) performs the averaging function. SPI-Compatible Serial Interface The MAX1040–MAX1043/MAX1046–MAX1049 feature a serial interface that is compatible with SPI and MICROWIRE devices. For SPI, ensure the SPI bus master (typically a microcontroller (µC)) runs in master mode so that it generates the serial clock signal. Select the SCLK frequency of 25MHz or less, and set the clock polarity (CPOL) and phase (CPHA) in the µC con- 18 trol registers to the same value. The MAX1040– MAX1043/MAX1046–MAX1049 operate with SCLK idling high or low, and thus operate with CPOL = CPHA = 0 or CPOL = CPHA = 1. Set CS low to latch any input data at DIN on the falling edge of SCLK. Output data at DOUT is updated on the falling edge of SCLK in clock modes 00, 01, and 10. Output data at DOUT is updated on the rising edge of SCLK in clock mode 11. See Figures 6–11. Bipolar true-differential results and temperature-sensor results are available in two’s complement format, while all other results are in binary. A high-to-low transition on CS initiates the data-input operation. Serial communications to the ADC always begin with an 8-bit command byte (MSB first) loaded from DIN. The command byte and the subsequent data bytes are clocked from DIN into the serial interface on the falling edge of SCLK. The serial-interface and fastinterface circuitry is common to the ADC, DAC, and GPIO sections. The content of the command byte determines whether the SPI port should expect 8, 16, or 24 bits and whether the data is intended for the ADC, DAC, or GPIOs (if applicable). See Table 1. Driving CS high resets the serial interface. The conversion register controls ADC channel selection, ADC scan mode, and temperature-measurement requests. See Table 4 for information on writing to the conversion register. The setup register controls the clock mode, reference, and unipolar/bipolar ADC configuration. Use a second byte, following the first, to write to the unipolar-mode or bipolar-mode registers. See Table 5 for details of the setup register and see Tables 6, 7, and 8 for setting the unipolar- and bipolarmode registers. Hold CS low between the command byte and the second and third byte. The ADC averaging register is specific to the ADC. See Table 9 to address that register. Table 11 shows the details of the reset register. Begin a write to the DAC by writing 0001XXXX as a command byte. The last 4 bits of this command byte are don’t-care bits. Write another 2 bytes (holding CS low) to the DAC interface register following the command byte to select the appropriate DAC and the data to be written to it. See the DAC Serial Interface section and Tables 10, 17, and 18. Write to the GPIOs (if applicable) by issuing a command byte to the appropriate register. Writing to the MAX1042/MAX1043/MAX1048/MAX1049 GPIOs requires 1 additional byte following the command byte. ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports USER-PROGRAMMABLE I/O MAX1040–MAX1043/MAX1046–MAX1049 AVDD GPIOC0, GPIOC1 GPIOA0, GPIOA1 DVDD MAX1042 MAX1043 GPIO CONTROL OSCILLATOR INPUT REGISTER DAC REGISTER 10-BIT DAC BUFFER OUTPUT CONDITIONING OUT0 INPUT REGISTER DAC REGISTER 10-BIT DAC BUFFER OUTPUT CONDITIONING OUT1 INPUT REGISTER DAC REGISTER 10-BIT DAC BUFFER OUTPUT CONDITIONING OUT2 INPUT REGISTER DAC REGISTER 10-BIT DAC BUFFER OUTPUT CONDITIONING OUT3 SCLK CS SPI PORT DIN DOUT TEMPERATURE SENSOR ADDRESS EOC LOGIC CONTROL CNVST AIN0 AIN5 REF2/ AIN6 CNVST/ AIN7 REF1 T/H 10-BIT SAR ADC FIFO AND ALU REF2 INTERNAL REFERENCE LDAC AGND DGND RES_SEL Figure 1. MAX1042/MAX1043 Functional Diagram ______________________________________________________________________________________ 19 MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports Table 1. Command Byte (MSB First) REGISTER NAME BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Conversion* 1 X CHSEL2 CHSEL1 CHSEL0 SCAN1 SCAN0 TEMP Setup 0 1 CKSEL1 CKSEL0 REFSEL1 REFSEL0 DIFFSEL1 DIFFSEL0 ADC Averaging 0 0 1 AVGON NAVG1 NAVG0 NSCAN1 NSCAN0 DAC Select 0 0 0 1 X X X X Reset 0 0 0 0 1 RESET SLOW FBGON GPIO Configure** 0 0 0 0 0 0 1 1 GPIO Write** 0 0 0 0 0 0 1 0 GPIO Read** 0 0 0 0 0 0 0 1 No Operation 0 0 0 0 0 0 0 0 X = Don’t care. *CHESL2 bit is only valid on the MAX1040–MAX1043. Set CHSEL2 to 0 on the MAX1046–MAX1049. **Only applicable on the MAX1042/MAX1043/MAX1048/MAX1049. See Tables 12–16 for details on GPIO configuration, writes, and reads. See the GPIO Command section. Command bytes written to the GPIOs on devices without GPIOs are ignored. Power-Up Default State The MAX1040–MAX1043/MAX1046–MAX1049 power up with all blocks in shutdown (including the reference). All registers power up in state 00000000, except for the setup register and the DAC input register. The setup register powers up at 0010 1000 with CKSEL1 = 1 and REFSEL1 = 1. The DAC input register powers up to FFFh when RES_SEL is high, and it powers up to 000h when RES_SEL is low. 10-Bit ADC The MAX1040–MAX1043/MAX1046–MAX1049 ADCs use a fully differential successive-approximation register (SAR) conversion technique and on-chip track-andhold (T/H) circuitry to convert temperature and voltage signals into 10-bit digital results. The analog inputs accept both single-ended and differential input signals. Single-ended signals are converted using a unipolar transfer function, and differential signals are converted using a selectable bipolar or unipolar transfer function. See the ADC Transfer Functions section for more data. ADC Clock Modes When addressing the setup, register bits 5 and 4 of the command byte (CKSEL1 and CKSEL0, respectively) control the ADC clock modes. See Table 5. Choose between four different clock modes for various ways to start a conversion and determine whether the acquisitions are internally or externally timed. Select clock mode 00 to configure CNVST/AIN_ to act as a conver- 20 sion start and use it to request internally timed conversions, without tying up the serial bus. In clock mode 01, use CNVST to request conversions one channel at a time, thereby controlling the sampling speed without tying up the serial bus. Request and start internally timed conversions through the serial interface by writing to the conversion register in the default clock mode, 10. Use clock mode 11 with SCLK up to 4.8MHz for externally timed acquisitions to achieve sampling rates up to 300ksps. Clock mode 11 disables scanning and averaging. See Figures 6–9 for timing specifications on how to begin a conversion. These devices feature an active-low, end-of-conversion output. EOC goes low when the ADC completes the last requested operation and is waiting for the next command byte. EOC goes high when CS or CNVST go low. EOC is always high in clock mode 11. Single-Ended or Differential Conversions The MAX1040–MAX1043/MAX1046–MAX1049 use a fully differential ADC for all conversions. When a pair of inputs are connected as a differential pair, each input is connected to the ADC. When configured in singleended mode, the positive input is the single-ended channel and the negative input is referred to AGND. See Figure 2. In differential mode, the T/H samples the difference between two analog inputs, eliminating common-mode DC offsets and noise. IN+ and IN- are selected from the following pairs: AIN0/AIN1, AIN2/AIN3, AIN4/AIN5, AIN6/AIN7. AIN0–AIN3 are available on all devices. AIN0–AIN7 are available on the MAX1040–MAX1043. See Tables 5–8 for more details on configuring the ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports Unipolar or Bipolar Conversions Address the unipolar- and bipolar-mode registers through the setup register (bits 1 and 0). See Table 5 for the setup register. See Figures 3 and 4 for the transferfunction graphs. Program a pair of analog inputs for differential operation by writing a one to the appropriate bit of the bipolar- or unipolar-mode register. Unipolar mode sets the differential input range from 0 to VREF1. A negative differential analog input in unipolar mode causes the digital output code to be zero. Selecting bipolar mode sets the differential input range to ±VREF1/2. The digital output code is binary in unipolar mode and two’s complement in bipolar mode. In single-ended mode, the MAX1040–MAX1043/ MAX1046–MAX1049 always operate in unipolar mode. The analog inputs are internally referenced to AGND with a full-scale input range from 0 to the selected reference voltage. Analog Input (T/H) The equivalent circuit of Figure 2 shows the ADC input architecture of the MAX1040–MAX1043/MAX1046– MAX1049. In track mode, a positive input capacitor is connected to AIN0–AIN7 in single-ended mode and AIN0, AIN2, AIN4, and AIN6 in differential mode. A negative input capacitor is connected to AGND in single-ended mode or AIN1, AIN3, AIN5, and AIN7 in AIN0–AIN7 (SINGLE-ENDED), AIN0, AIN2, AIN4, AIN6 (DIFFERENTIAL) REF1 ACQ DAC AGND CIN+ COMPARATOR HOLD CINAGND (SINGLE-ENDED), AIN1, AIN3, AIN5, AIN7 (DIFFERENTIAL) ACQ HOLD AVDD / 2 ACQ HOLD differential mode. For external T/H timing, use clock mode 01. After the T/H enters hold mode, the difference between the sampled positive and negative input voltages is converted. The input capacitance charging rate determines the time required for the T/H to acquire an input signal. If the input signal’s source impedance is high, the required acquisition time lengthens. Any source impedance below 300Ω does not significantly affect the ADC’s AC performance. A high-impedance source can be accommodated either by lengthening tACQ (only in clock mode 01) or by placing a 1µF capacitor between the positive and negative analog inputs. The combination of the analog-input source impedance and the capacitance at the analog input creates an RC filter that limits the analog input bandwidth. Input Bandwidth The ADC’s input-tracking circuitry has a 1MHz smallsignal bandwidth, making it is possible to digitize highspeed transient events and measure periodic signals with bandwidths exceeding the ADC’s sampling rate by using undersampling techniques. Anti-alias prefiltering of the input signals is necessary to avoid high-frequency signals aliasing into the frequency band of interest. Analog-Input Protection Internal electrostatic-discharge (ESD) protection diodes clamp all analog inputs to AVDD and AGND, allowing the inputs to swing from (AGND - 0.3V) to (AV DD + 0.3V) without damage. However, for accurate conversions near full scale, the inputs must not exceed AVDD by more than 50mV or be lower than AGND by 50mV. If an analog input voltage exceeds the supplies, limit the input current to 2mA. Internal FIFO The MAX1040–MAX1043/MAX1046–MAX1049 contain a first-in/first-out (FIFO) buffer that holds up to 16 ADC results plus one temperature result. The internal FIFO allows the ADC to process and store multiple internally clocked conversions and a temperature measurement without being serviced by the serial bus. If the FIFO is filled and further conversions are requested without reading from the FIFO, the oldest ADC results are overwritten by the new ADC results. Each result contains 2 bytes, with the MSB preceded by four leading zeros. After each falling edge of CS, the oldest available pair of bytes of data is available at DOUT, MSB first. When the FIFO is empty, DOUT is zero. The first 2 bytes of data read out after a temperature measurement always contain the 10-bit temperature result, preceded by four leading zeros, MSB first. The Figure 2. Equivalent Input Circuit ______________________________________________________________________________________ 21 MAX1040–MAX1043/MAX1046–MAX1049 inputs. For the inputs that are configurable as CNVST, REF2, and an analog input, only one function can be used at a time. MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports LSB is followed by 2 sub-bits. If another temperature measurement is performed before the first temperature result is read out, the old measurement is overwritten by the new result. Temperature results are in degrees Celsius (two’s complement), at a resolution of 8 LSB per degree. See the Temperature Measurements section for details on converting the digital code to a temperature. 10-Bit DAC In addition to the 10-bit ADC, the MAX1040–MAX1043/ MAX1046–MAX1049 also include four voltage-output, 10-bit, monotonic DACs with less than 1 LSB integral nonlinearity error and less than 0.5 LSB differential nonlinearity error. Each DAC has a 2µs settling time and ultra-low glitch energy (4nV•s). The 10-bit DAC code is unipolar binary with 1 LSB = VREF / 1024. DAC Digital Interface Figure 1 shows the functional diagram of the MAX1042/ MAX1043. The shift register converts a serial 16-bit word to parallel data for each input register operating with a clock rate up to 25MHz. The SPI-compatible digital interface to the shift register consists of CS, SCLK, DIN, and DOUT. Serial data at DIN is loaded on the falling edge of SCLK. Pull CS low to begin a write sequence. Begin a write to the DAC by writing 0001XXXX as a command byte. The last 4 bits of the DAC select register are don’t-care bits. See Table 10. Write another 2 bytes to the DAC interface register following the command byte to select the appropriate DAC and the data to be written to it. See Tables 17 and 18. The four double-buffered DACs include an input and a DAC register. The input registers are directly connected to the shift register and hold the result of the most recent write operation. The four 10-bit DAC registers hold the current output code for the respective DAC. Data can be transferred from the input registers to the DAC registers by pulling LDAC low or by writing the appropriate DAC command sequence at DIN. See Table 17. The outputs of the DACs are buffered through four rail-to-rail op amps. The MAX1040–MAX1043/MAX1046–MAX1049 DAC output-voltage range is based on the internal reference or an external reference. Write to the setup register (see Table 5) to program the reference. If using an external voltage reference, bypass REF1 with a 0.1µF capacitor to AGND. The MAX1041/MAX1043/MAX1047/ 22 MAX1049 internal reference is 2.5V. The MAX1040/ MAX1042/MAX1046/MAX1048 internal reference is 4.096V. When using an external reference on any of these devices, the voltage range is 0.7V to AVDD. DAC Transfer Function See Table 2 for various analog outputs from the DAC. DAC Power-On Wake-Up Modes The state of the RES_SEL input determines the wake-up state of the DAC outputs. Connect RES_SEL to AVDD or AGND upon power-up to be sure the DAC outputs wake up to a known state. Connect RES_SEL to AGND to wake up all DAC outputs at 000h. While RES_SEL is low, the 100kΩ internal resistor pulls the DAC outputs to AGND and the output buffers are powered down. Connect RES_SEL to AVDD to wake up all DAC outputs at FFFh. While RES_SEL is high, the 100kΩ pullup resistor pulls the DAC outputs to VREF1 and the output buffers are powered down. DAC Power-Up Modes See Table 18 for a description of the DAC power-up and power-down modes. GPIOs In addition to the internal ADC and DAC, the MAX1042/MAX1043/MAX1048/MAX1049 also provide four GPIO channels, GPIOA0, GPIOA1, GPIOC0, and GPIOC1. Table 2. DAC Output Code Table DAC CONTENTS MSB LSB ANALOG OUTPUT 11 1111 1111 ⎛ 1023 ⎞ + VREF ⎜ ⎟ ⎝ 1024 ⎠ 10 0000 0001 ⎛ 1023 ⎞ + VREF ⎜ ⎟ ⎝ 1024 ⎠ 10 0000 0000 ⎛ 512 ⎞ ⎛ + VREF ⎞ + VREF ⎜ ⎟ = ⎜ ⎟ ⎝ 1024 ⎠ ⎝ 2 ⎠ 01 0111 0111 ⎛ 511 ⎞ + VREF ⎜ ⎟ ⎝ 1024 ⎠ 00 0000 0001 ⎛ 1 ⎞ + VREF ⎜ ⎟ ⎝ 1024 ⎠ 00 0000 0000 ______________________________________________________________________________________ 0 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports Clock Modes Internal Clock The MAX1040–MAX1043/MAX1046–MAX1049 can operate from an internal oscillator. The internal oscillator is active in clock modes 00, 01, and 10. Figures 6, 7, and 8 show how to start an ADC conversion in the three internally timed conversion modes. Read out the data at clock speeds up to 25MHz through the SPI interface. External Clock Set CKSEL1 and CKSEL0 in the setup register to 11 to set up the interface for external clock mode 11. See Table 5. Pulse SCLK at speeds from 0.1MHz to 4.8MHz. Write to SCLK with a 40% to 60% duty cycle. The SCLK frequency controls the conversion timing. See Figure 9 for clock mode 11 timing. See the ADC Conversions in Clock Mode 11 section. ADC/DAC References Address the reference through the setup register, bits 3 and 2. See Table 5. Following a wake-up delay, set REFSEL[1:0] = 00 to program both the ADC and DAC for internal reference use. Set REFSEL[1:0] = 10 to program the ADC for internal reference. Set REFSEL[1:0] = 10 to program the DAC for external reference, REF1. When using REF1 or REF2/AIN_ in external reference mode, connect a 0.1µF capacitor to AGND. Set REFSEL[1:0] = 01 to program the ADC and DAC for Table 3. GPIO Maximum Sink/Source Current MAX1042/MAX1043/ MAX1048/MAX1049 CURRENT GPIOA0, GPIOA1 GPIOC0, GPIOC1 SINK CURRENT 15mA 4mA SOURCE CURRENT 15mA 2mA external reference mode. The DAC uses REF1 as its external reference, while the ADC uses REF2 as its external reference. Set REFSEL[1:0] = 11 to program the ADC for external differential-reference mode. REF1 is the positive reference and REF2 is the negative reference in the ADC external differential mode. When REFSEL[1:0] = 00 or 10, REF2/AIN_ functions as an analog input channel. When REFSEL[1:0] = 01 or 11, REF2/AIN_ functions as the device’s negative reference. Temperature Measurements Issue a command byte setting bit 0 of the conversion register to one to take a temperature measurement. See Table 4. The MAX1040–MAX1043/MAX1046– MAX1049 perform temperature measurements with an internal diode-connected transistor. The diode bias current changes from 68µA to 4µA to produce a temperature-dependent bias voltage difference. The second conversion result at 4µA is subtracted from the first at 68µA to calculate a digital value that is proportional to absolute temperature. The output data appearing at DOUT is the digital code above, minus an offset to adjust from Kelvin to Celsius. The reference voltage used for the temperature measurements is always derived from the internal reference source to ensure that 1 LSB corresponds to 1/8th of a degree Celsius. On every scan where a temperature measurement is requested, the 12-bit temperature conversion is carried out first. The first 2 bytes of data read from the FIFO contain the result of the 12-bit temperature measurement. If another temperature measurement is performed before the first temperature result is read out, the old measurement is overwritten by the new result. Temperature results are in degrees Celsius (two’s complement). See the Applications Information section for information on how to perform temperature measurements in each clock mode. Register Descriptions The MAX1040–MAX1043/MAX1046–MAX1049 communicate between the internal registers and the external circuitry through the SPI-compatible serial interface. Table 1 details the command byte, the registers, and the bit names. Tables 4–12 show the various functions within the conversion register, setup register, unipolarmode register, bipolar-mode register, ADC averaging register, DAC select register, reset register, and GPIO command register, respectively. Conversion Register Select active analog input channels, scan modes, and a single temperature measurement per scan by issuing ______________________________________________________________________________________ 23 MAX1040–MAX1043/MAX1046–MAX1049 Read and write to the GPIOs as detailed in Table 1 and Tables 12–16. Also, see the GPIO Command section. See Figures 11 and 12 for GPIO timing. Write to the GPIOs by writing a command byte to the GPIO command register. Write a single data byte to the MAX1042/MAX1043/MAX1048/MAX1049 following the command byte. The GPIOs can sink and source current. The MAX1042/MAX1043/MAX1048/MAX1049 GPIOA0 and GPIOA1 can sink and source up to 15mA. GPIOC0 and GPIOC1 can sink 4mA and source 2mA. See Table 3. MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports a command byte to the conversion register. Table 4 details channel selection, the four scan modes, and how to request a temperature measurement. Start a scan by writing to the conversion register when in clock mode 10 or 11, or by applying a low pulse to the CNVST pin when in clock mode 00 or 01. See Figures 6 and 7 for timing specifications for starting a scan with CNVST. A conversion is not performed if it is requested on a channel or one of the channel pairs that has been configured as CNVST or REF2. For channels configured as differential pairs, the CHSEL0 bit is ignored and the two pins are treated as a single differential channel. For the MAX1046–MAX1049, the CHSEL2 bit must be zero. Channels 4–7 are invalid. Any scans or averages on these channles can cause corrupt data. Select scan mode 00 or 01 to return one result per single-ended channel and one result per differential pair within the selected scanning range (set by bits 2 and 1, SCAN1 and SCAN0), plus one temperature result if selected. Select scan mode 10 to scan a single input channel numerous times, depending on NSCAN1 and NSCAN0 in the ADC averaging register (Table 9). Select scan mode 11 to return only one result from a single channel. Setup Register Issue a command byte to the setup register to configure the clock, reference, power-down modes, and ADC single-ended/differential modes. Table 5 details the bits in the setup-register command byte. Bits 5 and 4 (CKSEL1 and CKSEL0) control the clock mode, acquisition and sampling, and the conversion start. Bits 3 and 2 (REFSEL1 and REFSEL0) set the device for either internal or external reference. Bits 1 and 0 (DIFFSEL1 and DIFFSEL0) address the ADC unipolar-mode and bipolar-mode registers and configure the analog-input channels for differential operation. The ADC reference is always on if any of the following conditions are true: 1)The FBGON bit is set to one in the reset register. 2)At least one DAC output is powered up and REFSEL[1:0] (in the setup register) = 00. 3)At least one DAC is powered down through the 100kΩ to VREF and REFSEL[1:0] = 00. If any of the above conditions exist, the ADC reference is always on, but there is a 188 clock-cycle delay before temperature-sensor measurements begin, if requested. 24 Table 4. Conversion Register* BIT NAME — BIT FUNCTION 7 (MSB) Set to one to select conversion register. X 6 Don’t care. CHSEL2 5 Analog-input channel select. (MAX1040–MAX1043). Set to 0 on MAX1046–MAX1049 CHSEL1 4 Analog-input channel select. CHSEL0 3 Analog-input channel select. SCAN1 2 Scan-mode select. SCAN0 1 Scan-mode select. TEMP Set to one to take a single temperature measurement. The first conversion result of a scan contains temperature information. 0 (LSB) *See below for bit details. CHSEL2** CHSEL1 CHSEL0 SELECTED CHANNEL (N) 0 0 0 AIN0 0 0 1 AIN1 0 1 0 AIN2 0 1 1 AIN3 1 0 0 AIN4 1 0 1 AIN5 1 1 0 AIN6 1 1 1 AIN7 **Channels 4–7 are invalid on the MAX1046–MAX1049. Set CHSEL2 bit to 0 on those devices. SCAN MODE (CHANNEL N IS SELECTED BY BITS CHSEL2, CHSEL1, AND CHSEL0) SCAN1 SCAN0 0 0 Scans channels 0 through N. 0 1 Scans channels N through the highest numbered channel. 1 0 Scans channel N repeatedly. The ADC averaging register sets the number of results. 1 1 No scan. Converts channel N once only. ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports BIT NAME BIT — 7 (MSB) Set to zero to select setup register. FUNCTION — 6 Set to one to select setup register. CKSEL1 5 Clock mode and CNVST configuration; resets to one at power-up. CKSEL0 4 Clock mode and CNVST configuration. REFSEL1 3 Reference-mode configuration. REFSEL0 2 Reference-mode configuration. DIFFSEL1 1 Unipolar-/bipolar-mode register configuration for differential mode. DIFFSEL0 0 (LSB) Unipolar-/bipolar-mode register configuration for differential mode. *See below for bit details. Table 5a. Clock Modes (see the Clock Modes section) ACQUISITION/SAMPLING CNVST CONFIGURATION Internal Internally timed. CNVST Internal Externally timed by CNVST. CNVST 0 Internal Internally timed. AIN7 1 External (4.8MHz max) Externally timed by SCLK. AIN7 CKSEL1 CKSEL0 CONVERSION CLOCK 0 0 0 1 1 1 Table 5b. Clock Modes 00, 01, and 10 REFSEL1 REFSEL0 VOLTAGE REFERENCE OVERRIDE CONDITIONS AIN 0 0 Internal (DAC and ADC) 0 1 1 0 AIN 1 Internal reference required. There is a programmed delay of 244 internal-conversion clock cycles for the internal reference to settle after wake-up. Internal reference not used. Internal reference required. There is a programmed delay of 244 internal-conversion clock cycles for the internal reference to settle after wake-up. AIN Default reference mode. Internal reference turns off after scan is complete. If internal reference is turned off, there is a programmed delay of 218 internalconversion clock cycles. Temperature 1 Internal reference turns off after scan is complete. If internal reference is turned off, there is a programmed delay of 218 internal-conversion clock cycles. Temperature Internal (ADC) and external REF1 (DAC) External differential (ADC), external REF1 (DAC) REF2 CONFIGURATION AIN6 Temperature External singleended (REF1 for DAC and REF2 for ADC) AUTOSHUTDOWN AIN Temperature REF2 AIN6 Internal reference required. There is a programmed delay of 244 internal-conversion clock cycles for the internal reference to settle after wake-up. Internal reference not used. Internal reference required. There is a programmed delay of 244 internal-conversion clock cycles for the internal reference to settle after wake-up. REF2 ______________________________________________________________________________________ 25 MAX1040–MAX1043/MAX1046–MAX1049 Table 5. Setup Register* MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports Table 5c. Clock Mode 11 REFSEL1 REFSEL0 0 0 VOLTAGE REFERENCE OVERRIDE CONDITIONS AIN Internal reference turns off after scan is complete. If internal reference is turned off, there is a programmed delay of 218 external conversion clock cycles. Temperature Internal reference required. There is a programmed delay of 244 external conversion clock cycles for the internal reference. Temperature-sensor output appears at DOUT after 188 further external clock cycles. Internal (DAC and ADC) AIN 0 1 1 0 External singleended (REF1 for DAC and REF2 for ADC) Temperature AIN Default reference mode. Internal reference turns off after scan is complete. If internal reference is turned off, there is a programmed delay of 218 external conversion clock cycles. Temperature Internal reference required. There is a programmed delay of 244 external conversion clock cycles for the internal reference. Temperature-sensor output appears at DOUT after 188 further external clock cycles. 1 AIN6 REF2 AIN6 AIN 1 REF2 CONFIGURATION Internal reference not used. Internal reference required. There is a programmed delay of 244 external conversion clock cycles for the internal reference. Temperature-sensor output appears at DOUT after 188 further external clock cycles. Internal (ADC) and external REF1 (DAC) External differential (ADC), external REF1 (DAC) AUTOSHUTDOWN Temperature Internal reference not used. Internal reference required. There is a programmed delay of 244 external conversion clock cycles for the internal reference. Temperature-sensor output appears at DOUT after 188 further external clock cycles. REF2 Table 5d. Differential Select Modes DIFFSEL1 DIFFSEL0 26 FUNCTION 0 0 No data follows the command setup byte. Unipolar-mode and bipolar-mode registers remain unchanged. 0 1 No data follows the command setup byte. Unipolar-mode and bipolar-mode registers remain unchanged. 1 0 1 byte of data follows the command setup byte and is written to the unipolar-mode register. 1 1 1 byte of data follows the command setup byte and is written to the bipolar-mode register. ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports BIT NAME BIT UCH0/1 7 (MSB) Configure AIN0 and AIN1 for unipolar differential conversion. FUNCTION UCH2/3 6 Configure AIN2 and AIN3 for unipolar differential conversion. UCH4/5 5 Configure AIN4 and AIN5 for unipolar differential conversion (MAX1040–MAX1043). Set UCH4/5 to 0 on the MAX1046–MAX1049. UCH6/7 4 Configure AIN6 and AIN7 for unipolar differential conversion (MAX1040–MAX1043). Set UCH6/7 to 0 on the MAX1046–MAX1049. X 3 Don’t care. X 2 Don’t care. X 1 Don’t care. X 0 (LSB) Don’t care. Table 7. Bipolar-Mode Register (Addressed Through the Setup Register) BIT NAME BIT FUNCTION BCH0/1 7 (MSB) Set to one to configure AIN0 and AIN1 for bipolar differential conversion. Set the corresponding bits in the unipolar-mode and bipolar-mode registers to zero to configure AIN0 and AIN1 for unipolar single-ended conversion. BCH2/3 6 Set to one to configure AIN2 and AIN3 for bipolar differential conversion. Set the corresponding bits in the unipolar-mode and bipolar-mode registers to zero to configure AIN2 and AIN3 for unipolar single-ended conversion. BCH4/5 5 Set to one to configure AIN4 and AIN5 for bipolar differential conversion (MAX1040–MAX1043). Set the corresponding bits in the unipolar-mode and bipolar-mode registers to zero to configure AIN4 and AIN5 for unipolar single-ended conversion. Set BCH4/5 to 0 on the MAX1046–MAX1049. BCH6/7 4 Set to one to configure AIN6 and AIN7 for bipolar differential conversion (MAX1040–MAX1043). Set the corresponding bits in the unipolar-mode and bipolar-mode registers to zero to configure AIN6 and AIN7 for unipolar single-ended conversion. Set BCH6/7 to 0 on the MAX1046–MAX1049. X 3 Don’t care. X 2 Don’t care. X 1 Don’t care. X 0 (LSB) Don’t care. ______________________________________________________________________________________ 27 MAX1040–MAX1043/MAX1046–MAX1049 Table 6. Unipolar-Mode Register (Addressed Through the Setup Register) MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports Unipolar/Bipolar Registers The final 2 bits (LSBs) of the setup register control the unipolar-/bipolar-mode address registers. Set DIFFSEL[1:0] = 10 to write to the unipolar-mode register. Set bits DIFFSEL[1:0] = 11 to write to the bipolarmode register. In both cases, the setup command byte must be followed by 1 byte of data that is written to the unipolar-mode register or bipolar-mode register. Hold CS low and run 16 SCLK cycles before pulling CS high. Table 8. Unipolar/Bipolar Channel Function UNIPOLARMODE REGISTER BIT BIPOLAR-MODE REGISTER BIT CHANNEL PAIR FUNCTION 0 0 Unipolar single ended 0 1 Bipolar differential 1 0 Unipolar differential 1 1 Unipolar differential If the last 2 bits of the setup register are 00 or 01, neither the unipolar-mode register nor the bipolar-mode register is written. Any subsequent byte is recognized as a new command byte. See Tables 6, 7, and 8 to program the unipolar- and bipolar-mode registers. Both registers power up at all zeros to set the inputs as eight unipolar single-ended channels. To configure a channel pair as single-ended unipolar, bipolar differential, or unipolar differential, see Table 8. In unipolar mode, AIN+ can exceed AIN- by up to VREF. The output format in unipolar mode is binary. In bipolar mode, either input can exceed the other by up to VREF/2. The output format in bipolar mode is two’s complement (see the ADC Transfer Functions section). ADC Averaging Register Write a command byte to the ADC averaging register to configure the ADC to average up to 32 samples for each requested result, and to independently control the number of results requested for single-channel scans. Table 9. ADC Averaging Register* BIT NAME BIT — 7 (MSB) Set to zero to select ADC averaging register. FUNCTION — 6 Set to zero to select ADC averaging register. — 5 Set to one to select ADC averaging register. AVGON 4 Set to one to turn averaging on. Set to zero to turn averaging off. NAVG1 3 Configures the number of conversions for single-channel scans. NAVG0 2 Configures the number of conversions for single-channel scans. NSCAN1 1 Single-channel scan count. (Scan mode 10 only.) NSCAN0 0 (LSB) Single-channel scan count. (Scan mode 10 only.) *See below for bit details. FUNCTION AVGON NAVG1 0 X X Performs one conversion for each requested result. 1 0 0 Performs four conversions and returns the average for each requested result. 1 0 1 Performs eight conversions and returns the average for each requested result. 1 1 0 Performs 16 conversions and returns the average for each requested result. 1 1 1 Performs 32 conversions and returns the average for each requested result. 28 NAVG0 NSCAN1 NSCAN0 0 0 Scans channel N and returns four results. FUNCTION (APPLIES ONLY IF SCAN MODE 10 IS SELECTED) 0 1 Scans channel N and returns eight results. 1 0 Scans channel N and returns 12 results. 1 1 Scans channel N and returns 16 results. ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports DAC Select Register Write a command byte 0001XXXX to the DAC select register (as shown in Table 9) to set up the DAC interface and indicate that another word will follow. The last 4 bits of the DAC select register are don’t-care bits. The word that follows the DAC select-register command byte controls the DAC serial interface. See Table 17 and the DAC Serial Interface section. Table 10. DAC Select Register BIT NAME — BIT FUNCTION 7 (MSB) Set to zero to select DAC select register. — 6 Set to zero to select DAC select register. — 5 Set to zero to select DAC select register. Reset Register Write to the reset register (as shown in Table 11) to clear the FIFO or to reset all registers to their default states. Set the RESET bit to one to reset the FIFO. Set the RESET bit to zero to return the MAX1040–MAX1043/ MAX1046–MAX1049 to their default power-up state. All registers power up in state 00000000, except for the setup register that powers up in clock mode 10 (CKSEL1 = 1). Set the SLOW bit to one to add a 15ns delay in the DOUT signal path to provide a longer hold time. Writing a one to the SLOW bit also clears the contents of the FIFO. Set the FBGON bit to one to force the bias block and bandgap reference to power up regardless of the state of the DAC and activity of the ADC block. Setting the FBGON bit high also removes the programmed wake-up delay between conversions in clock modes 01 and 11. Setting the FBGON bit high also clears the FIFO. GPIO Command Write a command byte to the GPIO command register to configure, write, or read the GPIOs, as detailed in Table 12. Write the command byte 00000011 to configure the GPIOs. The eight SCLK cycles following the command byte load data from DIN to the GPIO configuration register in the MAX1042/MAX1043/MAX1048/MAX1049. — 4 Set to one to select DAC select register. X 3 Don’t care. X 2 Don’t care. X 1 Don’t care. BIT NAME BIT FUNCTION Don’t care. — 7 (MSB) Set to zero to select GPIO register. — 6 Set to zero to select GPIO register. — 5 Set to zero to select GPIO register. — 4 Set to zero to select GPIO register. — 3 Set to zero to select GPIO register. — 2 Set to zero to select GPIO register. GPIOSEL1 1 GPIO configuration bit. GPIOSEL2 0 (LSB) GPIOSEL1 GPIOSEL2 1 1 GPIO configuration; written data is entered in the GPIO configuration register. 1 0 GPIO write; written data is entered in the GPIO write register. 0 1 GPIO read; the next 8 SCLK cycles transfer the state of all GPIO drivers into DOUT. X 0 Table 12. GPIO Command Register Table 11. Reset Register BIT NAME — BIT FUNCTION 7 (MSB) Set to zero to select ADC reset register. — 6 Set to zero to select ADC reset register. — 5 Set to zero to select ADC reset register. — 4 Set to zero to select ADC reset register. — 3 Set to one to select ADC reset register. RESET 2 SLOW 1 FBGON 0 (LSB) Set to zero to clear the FIFO only. Set to one to set the device in its power-on condition. Set to one to turn on slow mode. Set to one to force internal bias block and bandgap reference to be always powered up. GPIO write bit. FUNCTION ______________________________________________________________________________________ 29 MAX1040–MAX1043/MAX1046–MAX1049 Table 9 details the four scan modes available in the ADC conversion register. All four scan modes allow averaging as long as the AVGON bit, bit 4 in the averaging register, is set to 1. Select scan mode 10 to scan the same channel multiple times. Clock mode 11 disables averaging. For example, if AVGON = 1, NAVG[1:0] = 00, NSCAN [1:0] = 11 and SCAN [1:0] = 10, 16 results are written to the FIFO, with each result being the average of four conversions of channel N. MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports DAC Serial Interface Write a command byte 0001XXXX to the DAC select register to indicate the word to follow is written to the DAC serial interface, as detailed in Tables 1, 10, 17, and 18. Write the next 16 bits to the DAC interface register, as shown in Tables 17 and 18. Following the high-to-low transition of CS, the data is shifted synchronously and latched into the input register on each falling edge of SCLK. Each word is 16 bits. The first 4 bits are the control bits, followed by 10 data bits (MSB first), followed by 2 sub-bits. See Figures 9–12 for DAC timing specifications. See Tables 13 and 14. The register bits are updated after the last CS rising edge. All GPIOs default to inputs upon power-up. The data in the register controls the function of each GPIO, as shown in Tables 13, 14, and 16. GPIO Write Write the command byte 00000010 to indicate a GPIO write operation. The eight SCLK cycles following the command byte load data from DIN into the GPIO write register in the MAX1042/MAX1043/MAX1048/MAX1049. See Tables 14 and 15. The register bits are updated after the last CS rising edge. If CS goes high prior to completing 16 SCLK cycles, the command is discarded. To initiate a new transfer, drive CS low again. GPIO Read Write the command byte 00000001 to indicate a GPIO read operation. The eight SCLK cycles following the command byte transfer the state of the GPIOs to DOUT in the MAX1042/MAX1043/MAX1048/MAX1049. See Table 16. For example, writing the DAC serial interface word 1111 0000 and 0011 0100 disconnects DAC outputs 2 and 3 and forces them to a high-impedance state. DAC outputs 0 and 1 remain in their previous state. Table 13. MAX1042/MAX1043/MAX1048/MAX1049 GPIO Configuration DATA PIN GPIO COMMAND BYTE DATA BYTE DIN 0 0 0 0 0 0 1 1 GPIOC1 GPIOC0 GPIOA1 GPIOA0 X X X X DOUT 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Table 14. MAX1042/MAX1043/MAX1048/MAX1049 GPIO Write DATA PIN GPIO COMMAND BYTE DATA BYTE DIN 0 0 0 0 0 0 1 0 GPIOC1 GPIOC0 GPIOA1 GPIOA0 X X X X DOUT 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Table 15. GPIO-Mode Control CONFIGURATION BIT WRITE BIT OUTPUT STATE GPIO FUNCTION 1 1 1 Output 1 0 0 Output 0 1 Tri-state Input 0 0 0 Pulldown (open drain) Table 16. MAX1042/MAX1043/MAX1048/MAX1049 GPIO Read DATA PIN GPIO COMMAND BYTE DATA BYTE DIN 0 0 0 0 0 0 0 1 X X X X X X X X DOUT 0 0 0 0 0 0 0 0 0 0 0 0 GPIOC1 GPIOC0 GPIOA1 GPIOA0 30 ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports 16-BIT SERIAL WORD MSB LSB CONTROL DATA BITS BITS C3 C2 C1 C0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 X X X X X X X X X X FUNCTION DESCRIPTION X X X X NOP No Operation. Reset all internal registers to 000h and leave output buffers in their present state. Preset all internal registers to FFFh and leave output buffers in their present state. 0 0 0 1 0 X X X X X X X X X X X RESET 0 0 0 1 1 X X X X X X X X X X X Pull-High 0 0 1 0 — — — — — — — — — — X X DAC0 D9–D0 to input register 0, DAC output unchanged. 0 0 1 1 — — — — — — — — — — X X DAC1 D9–D0 to input register 1, DAC output unchanged. 0 1 0 0 — — — — — — — — — — X X DAC2 D9–D0 to input register 2, DAC output unchanged. 0 1 0 1 — — — — — — — — — — X X DAC3 D9–D0 to input register 3, DAC output unchanged. 0 1 1 0 X X X X X X X X X X X X NOP No Operation. 0 1 1 1 X X X X X X X X X X X X NOP No Operation. 1 0 0 0 X X X X X X X X X X X X NOP No Operation. 1 0 0 1 X X X X X X X X X X X X NOP No Operation. 1 0 1 0 — — — — — — — — — — X X DAC0–DAC3 1 0 1 1 X X X X X X X X X X X X NOP D9–D0 to input registers 0–3 and DAC register 0–3. DAC outputs updated (write-through). No Operation. — — — — — — — — — — X X DAC0–DAC3 1 1 0 1 — — — — — — — — — — X X DAC0–DAC3 D9–D0 to input registers 0–3. DAC outputs unchanged. DAC0–DAC3 Input registers to DAC registers indicated by ones, DAC outputs updated, equivalent to software LDAC. (No effect on DACs indicated by zeros.) 1 1 1 0 X X X X DAC0 0 DAC1 0 DAC2 1 DAC3 1 D9–D0 to input registers 0–3 and DAC Register 0–3. DAC outputs updated (write-through). X X X X ______________________________________________________________________________________ 31 MAX1040–MAX1043/MAX1046–MAX1049 Table 17. DAC Serial-Interface Configuration Table 18. DAC Power-Up and Power-Down Commands CONTROL BITS 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 X X X X X X X X X X X X X X X X X X X X X X DAC0 X DAC1 C3 C2 C1 C0 X DAC2 DATA BITS DAC3 MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports DESCRIPTION D3 D2 D1 D0 — — — — 0 — — — — 0 — — — — 1 — — — — 0 — — — — 1 0 1 0 0 1 1 0 0 0 1 X Power-Up Power up individual DAC buffers indicated by data in DAC0 through DAC3. A one indicates the DAC output is connected and active. A zero does not affect the DAC’s present state. X Power down individual DAC buffers indicated by data in DAC0 through DAC3. A one indicates the Power-Down 1 DAC output is disconnected and high impedance. A zero does not affect the DAC’s present state. X Power down individual DAC buffers indicated by data in DAC0 through DAC3. A one indicates the Power-Down 2 DAC output is disconnected and pulled to AGND with a 1kΩ resistor. A zero does not affect the DAC’s present state. X Power down individual DAC buffers indicated by data in DAC0 through DAC3. A one indicates the Power-Down 3 DAC output is disconnected and pulled to AGND with a 100kΩ resistor. A zero does not affect the DAC’s present state. X Power down individual DAC buffers indicated by data in DAC0 through DAC3. A one indicates the Power-Down 4 DAC output is disconnected and pulled to REF1 with a 100kΩ resistor. A zero does not affect the DAC’s present state. Output-Data Format Figures 6–9 illustrate the conversion timing for the MAX1040–MAX1043/MAX1046–MAX1049. All 10-bit conversion results are output in 2-byte format, MSB first, with four leading zeros and the LSB followed by 2 sub-bits. Data appears on DOUT on the falling edges of SCLK. Data is binary for unipolar mode and two’s complement for bipolar mode and temperature results. See Figures 3, 4, and 5 for input/output and temperature-transfer functions. ADC Transfer Functions Figure 3 shows the unipolar transfer function for singleended or differential inputs. Figure 4 shows the bipolar 32 FUNCTION transfer function for differential inputs. Code transitions occur halfway between successive-integer LSB values. Output coding is binary, with 1 LSB = VREF1 / 1024 for unipolar and bipolar operation, and 1 LSB = +0.125°C for temperature measurements. Bipolar true-differential results and temperature-sensor results are available in two’s complement format, while all others are in binary. See Tables 6, 7, and 8 for details on which setting (unipolar or bipolar) takes precedence. In unipolar mode, AIN+ can exceed AIN- by up to VREF1. In bipolar mode, either input can exceed the other by up to VREF1/2. ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports Internally Timed Acquisitions and Conversions Using CNVST ADC Conversions in Clock Mode 00 In clock mode 00, the wake-up, acquisition, conversion, and shutdown sequence is initiated through CNVST and performed automatically using the internal oscillator. Results are added to the internal FIFO to be read out later. See Figure 6 for clock mode 00 timing after a command byte is issued. See Table 5 for details on programming the clock mode in the setup register. Initiate a scan by setting CNVST low for at least 40ns before pulling it high again. The MAX1040–MAX1043/ VREF = VREF+ - VREFVREF VREF 011....111 OFFSET BINARY OUTPUT CODE (LSB) Applications Information MAX1046–MAX1049 then wake up, scan all requested channels, store the results in the FIFO, and shut down. After the scan is complete, EOC is pulled low and the results are available in the FIFO. Wait until EOC goes low before pulling CS low to communicate with the serial interface. EOC stays low until CS or CNVST is pulled low again. A temperature-conversion result, if requested, precedes all other FIFO results. Temperature results are available in 12-bit format. 011....110 011....101 FS = VREF / 2 + VCOM ZS = COM -FS = -VREF / 2 VREF 1 LSB = VREF / 1024 000....001 000....000 (COM) 111....111 VREF 100....011 100....010 100....001 100....000 -FS -1 0 +1 (COM) INPUT VOLTAGE (LSB) +FS - 1 LSB Figure 4. Bipolar Transfer Function—Full Scale (±FS) = ±VREF / 2 OUTPUT CODE FULL-SCALE TRANSITION OFFSET BINARY OUTPUT CODE (LSB) 111....111 111....110 FS = VREF 111....101 1 LSB = VREF / 1024 011....111 011....110 000....010 000....001 000....000 111....111 000....011 111....110 111....101 000....010 000....001 000....000 0 1 2 3 FS 100....001 100....000 INPUT VOLTAGE (LSB) FS - 3/2 LSB -256 0 +255.5 TEMPERATURE (°C) Figure 3. Unipolar Transfer Function—Full Scale (FS) = VREF Figure 5. Temperature Transfer Function ______________________________________________________________________________________ 33 MAX1040–MAX1043/MAX1046–MAX1049 Partial Reads and Partial Writes If the first byte of an entry in the FIFO is partially read (CS is pulled high after fewer than eight SCLK cycles), the remaining bits are lost for that byte. The next byte of data that is read out contains the next 8 bits. If the first byte of an entry in the FIFO is read out fully, but the second byte is read out partially, the rest of that byte is lost. The remaining data in the FIFO is unaffected and can be read out normally after taking CS low again, as long as the 4 leading bits (normally zeros) are ignored. If CS is pulled low before EOC goes low, a conversion may not be completed and the FIFO data may not be correct. Incorrect writes (pulling CS high before completing eight SCLK cycles) are ignored and the register remains unchanged. MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports CNVST (UP TO 514 INTERNALLY CLOCKED ACQUISITIONS AND CONVERSIONS) CS SCLK DOUT MSB1 LSB1 MSB2 tRDS EOC Figure 6. Clock Mode 00—After writing a command byte, set CNVST low for at least 40ns to begin a conversion. tCSW CNVST (CONVERSION 2) (ACQUISITION 1) (ACQUISITION 2) CS tDOV SCLK (CONVERSION 1) DOUT MSB1 LSB1 MSB2 EOC Figure 7. Clock Mode 01—After writing a command byte, request multiple conversions by setting CNVST low for each conversion. Do not issue a second CNVST signal before EOC goes low; otherwise, the FIFO can be corrupted. Wait until all conversions are complete before reading the FIFO. SPI communications to the DAC and GPIO registers are permitted during conversion. However, coupled noise may result in degraded ADC signal-to-noise ratio (SNR). Externally Timed Acquisitions and Internally Timed Conversions with CNVST ADC Conversions in Clock Mode 01 In clock mode 01, conversions are requested one at a time using CNVST and performed automatically using the internal oscillator. See Figure 7 for clock mode 01 timing after a command byte is issued. Setting CNVST low begins an acquisition, wakes up the ADC, and places it in track mode. Hold CNVST low for 34 at least 1.4µs to complete the acquisition. If reference mode 00 or 10 is selected, an additional 45µs is required for the internal reference to power up. If a temperature measurement is being requested, reference power-up and temperature measurement is internally timed. In this case, hold CNVST low for at least 40ns. Set CNVST high to begin a conversion. Sampling is completed approximately 500ns after CNVST goes high. After the conversion is complete, the ADC shuts down and pulls EOC low. EOC stays low until CS or CNVST is pulled low again. Wait until EOC goes low before pulling CS or CNVST low. The number of CNVST signals must equal the number of conversions requested by the scan and averaging registers to correctly update the FIFO. Wait until all conversions are complete before reading the FIFO. SPI communications to the DAC and GPIO registers are permitted during con- ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports (CONVERSION BYTE) (UP TO 514 INTERNALLY CLOCKED ACQUISITIONS AND CONVERSIONS) CS SCLK DOUT MSB1 tDOV LSB1 MSB2 EOC Figure 8. Clock Mode 10—The command byte to the conversion register begins the acquisition (CNVST is not required). version. However, coupled noise may result in degraded ADC SNR. If averaging is turned on, multiple CNVST pulses need to be performed before a result is written to the FIFO. Once the proper number of conversions has been performed to generate an averaged FIFO result (as specified to the averaging register), the scan logic automatically switches the analog-input multiplexer to the next requested channel. If a temperature measurement is programmed, it is performed after the first rising edge of CNVST following the command byte written to the conversion register. The temperature-conversion result is available on DOUT once EOC has been pulled low. Temperature results are available in 12-bit format. Internally Timed Acquisitions and Conversions Using the Serial Interface ADC Conversions in Clock Mode 10 In clock mode 10, the wake-up, acquisition, conversion, and shutdown sequence is initiated by writing a command byte to the conversion register, and is performed automatically using the internal oscillator. This is the default clock mode upon power-up. See Figure 8 for clock mode 10 timing. Initiate a scan by writing a command byte to the conversion register. The MAX1040–MAX1043/MAX1046– MAX1049 then power up, scan all requested channels, store the results in the FIFO, and shut down. After the scan is complete, EOC is pulled low and the results are available in the FIFO. If a temperature measurement is requested, the temperature result precedes all other FIFO results. Temperature results are available in 12-bit format. EOC stays low until CS is pulled low again. Wait until all conversions are complete before reading the FIFO. SPI communications to the DAC and GPIO registers are permitted during conversion. However, coupled noise may result in degraded ADC SNR. ______________________________________________________________________________________ 35 MAX1040–MAX1043/MAX1046–MAX1049 DIN MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports DIN (CONVERSION BYTE) (ACQUISITION1) (CONVERSION1) (ACQUISITION2) CS SCLK DOUT MSB1 LSB1 MSB2 EOC Figure 9. Clock Mode 11—Externally Timed Acquisition, Sampling, and Conversion without CNVST Externally Clocked Acquisitions and Conversions Using the Serial Interface ADC Conversions in Clock Mode 11 In clock mode 11, acquisitions and conversions are initiated by writing a command byte to the conversion register and are performed one at a time using the SCLK as the conversion clock. Scanning, averaging and the FIFO are disabled, and the conversion result is available at DOUT during the conversion. Output data is updated on the rising edge of SCLK in clock mode 11. See Figure 9 for clock mode 11 timing. Initiate a conversion by writing a command byte to the conversion register followed by 16 SCLK cycles. If CS is pulsed high between the eighth and ninth cycles, the pulse width must be less than 100µs. To continuously convert at 16 cycles per conversion, alternate 1 byte of zeros (NOP byte) between each conversion byte. If 2 NOP bytes follow a conversion byte, the analog cells power down at the end of the second NOP. Set the FBGON bit to one in the reset register to keep the internal bias block powered. If reference mode 00 is requested, or if an external reference is selected but a temperature measurement is being requested, wait 45µs with CS high after writing the conversion byte to extend the acquisition and allow the internal reference to power up. To perform a temperature measurement, write 24 bytes (192 cycles) of zeros after the conversion byte. The temperature result appears on DOUT during the last 2 bytes of the 192 cycles. Temperature results are available in 12-bit format. 36 Conversion-Time Calculations The conversion time for each scan is based on a number of different factors: conversion time per sample, samples per result, results per scan, if a temperature measurement is requested, and if the external reference is in use. Use the following formula to calculate the total conversion time for an internally timed conversion in clock mode 00 and 10 (see the Electrical Characteristics, as applicable): Total conversion time = tCNV x nAVG x nSCAN + tTS + tINT-REF,SU where: tCNV = tDOV (where tDOV is dependent on clock mode and reference mode selected). nAVG = samples per result (amount of averaging) nSCAN = number of times each channel is scanned; set to one unless [SCAN1, SCAN0] = 10 t TS = time required for temperature measurement (53.1µs); set to zero if temperature measurement is not requested tINT-REF,SU = tWU (external-reference wake-up); if a conversion using the external reference is requested In clock mode 01, the total conversion time depends on how long CNVST is held low or high. Conversion time in externally clocked mode (CKSEL1, CKSEL0 = 11) depends on the SCLK period and how long CS is held high between each set of eight SCLK cycles. In clock mode 01, the total conversion time does not include the time required to turn on the internal reference. ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports SCLK 1 tDS 2 3 D13 D14 D12 D11 D1 D0 tDOT tDOE D15 D7 DOUT 32 16 8 5 4 tDH D15 DIN tCH D14 D6 D13 D5 tDOD D12 D4 D1 D0 tCSS tCSPWH tCSH CS Figure 10. DAC/GPIO Serial-Interface Timing (Clock Modes 00, 01, and 10) DAC/GPIO Timing Figures 10–13 detail the timing diagrams for writing to the DAC and GPIOs. Figure 10 shows the timing specifications for clock modes 00, 01, and 10. Figure 11 shows the timing specifications for clock mode 11. Figure 12 details the timing specifications for the DAC input select register and 2 bytes to follow. Output data is updated on the rising edge of SCLK in clock mode 11. Figure 13 shows the GPIO timing. Figure 14 shows the timing details of a hardware LDAC command DACregister update. For a software-command DAC-register update, tS is valid from the rising edge of CS, which follows the last data bit in the software command word. ______________________________________________________________________________________ 37 MAX1040–MAX1043/MAX1046–MAX1049 tCL MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports tCH tCL SCLK 1 2 3 32 16 8 5 4 tDH tDS D15 DIN D14 D13 D12 D11 D1 D0 tDOT tDOE D15 D7 DOUT D14 D6 tDOD D13 D5 D12 D4 D1 D0 tCSS tCSPWH tCSH CS Figure 11. DAC/GPIO Serial-Interface Timing (Clock Mode 11) SCLK DIN 1 2 BIT 7 (MSB) 8 BIT 6 BIT 0 (LSB) 10 9 BIT 15 BIT 14 24 BIT 1 BIT 0 DOUT THE COMMAND BYTE INITIALIZES THE DAC SELECT REGISTER THE NEXT 16 BITS SELECT THE DAC AND THE DATA WRITTEN TO IT CS Figure 12. DAC-Select Register Byte and DAC Serial-Interface Word 38 ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports tGOD tGSU GPIO INPUT/OUTPUT Figure 13. GPIO Timing tLDACPWL LDAC tS ±1 LSB OUT_ Figure 14. LDAC Functionality LDAC Functionality Drive LDAC low to transfer the content of the input registers to the DAC registers. Drive LDAC permanently low to make the DAC register transparent. The DAC output typically settles from zero to full scale within ±1 LSB after 2µs. See Figure 14. Layout, Grounding, and Bypassing For best performance, use PC boards. Ensure that digital and analog signal lines are separated from each other. Do not run analog and digital signals parallel to one another (especially clock signals) or do not run digital lines underneath the MAX1040–MAX1043/ MAX1046–MAX1049 package. High-frequency noise in the AV DD power supply may affect performance. Bypass the AV DD supply with a 0.1µF capacitor to AGND, close to the AVDD pin. Bypass the DVDD supply with a 0.1µF capacitor to DGND, close to the DVDD pin. Minimize capacitor lead lengths for best supply-noise rejection. If the power supply is very noisy, connect a 10Ω resistor in series with the supply to improve powersupply filtering. The MAX1040–MAX1043/MAX1046–MAX1049 thin QFN packages contain an exposed pad on the underside of the device. Connect this exposed pad to AGND. Refer to the MAX1258EVKIT for an example of proper layout. Definitions Integral Nonlinearity Integral nonlinearity (INL) is the deviation of the values on an actual transfer function from a straight line. This straight line can be either a best-straight-line fit or a line drawn between the end points of the transfer function, once offset and gain errors have been nullified. INL for the MAX1040–MAX1043/MAX1046–MAX1049 is measured using the end-point method. Differential Nonlinearity Differential nonlinearity (DNL) is the difference between an actual step width and the ideal value of 1 LSB. A DNL error specification of less than 1 LSB guarantees no missing codes and a monotonic transfer function. ______________________________________________________________________________________ 39 MAX1040–MAX1043/MAX1046–MAX1049 CS MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports Unipolar ADC Offset Error Signal-to-Noise Plus Distortion For an ideal converter, the first transition occurs at 0.5 LSB, above zero. Offset error is the amount of deviation between the measured first transition point and the ideal first transition point. Signal-to-noise plus distortion (SINAD) is the ratio of the fundamental input frequency’s RMS amplitude to the RMS equivalent of all other ADC output signals: SINAD(dB) = 20 x log (SignalRMS / NoiseRMS) Bipolar ADC Offset Error While in bipolar mode, the ADC’s ideal midscale transition occurs at AGND -0.5 LSB. Bipolar offset error is the measured deviation from this ideal value. ADC Gain Error Gain error is defined as the amount of deviation between the ideal transfer function and the measured transfer function, with the offset error removed and with a full-scale analog input voltage applied to the ADC, resulting in all ones at DOUT. DAC Offset Error DAC offset error is determined by loading a code of all zeros into the DAC and measuring the analog output voltage. DAC Gain Error DAC gain error is defined as the amount of deviation between the ideal transfer function and the measured transfer function, with the offset error removed, when loading a code of all ones into the DAC. Aperture Jitter Aperture jitter (tAJ) is the sample-to-sample variation in the time between the samples. Aperture Delay Aperture delay (tAD ) is the time between the rising edge of the sampling clock and the instant when an actual sample is taken. Signal-to-Noise Ratio For a waveform perfectly reconstructed from digital samples, signal-to-noise ratio (SNR) is the ratio of full-scale analog input (RMS value) to the RMS quantization error (residual error). The ideal, theoretical minimum analogto-digital noise is caused by quantization error only and results directly from the ADC’s resolution (N bits): SNR = (6.02 x N + 1.76)dB In reality, there are other noise sources besides quantization noise, including thermal noise, reference noise, clock jitter, etc. Therefore, SNR is calculated by taking the ratio of the RMS signal to the RMS noise. RMS noise includes all spectral components to the Nyquist frequency excluding the fundamental, the first five harmonics, and the DC offset. 40 Effective Number of Bits Effective number of bits (ENOB) indicates the global accuracy of an ADC at a specific input frequency and sampling rate. An ideal ADC’s error consists of quantization noise only. With an input range equal to the fullscale range of the ADC, calculate the ENOB as follows: ENOB = (SINAD - 1.76) / 6.02 Total Harmonic Distortion Total harmonic distortion (THD) is the ratio of the RMS sum of the first five harmonics of the input signal to the fundamental itself. This is expressed as: THD = 20 x log⎡ ⎢⎣ (V22 + V32 + V42 + V52 + V62) / V1⎤⎥⎦ where V1 is the fundamental amplitude, and V2 through V6 are the amplitudes of the first five harmonics. Spurious-Free Dynamic Range Spurious-free dynamic range (SFDR) is the ratio of RMS amplitude of the fundamental (maximum signal component) to the RMS value of the next largest distortion component. ADC Channel-to-Channel Crosstalk Bias the ON channel to midscale. Apply a full-scale sine wave test tone to all OFF channels. Perform an FFT on the ON channel. ADC channel-to-channel crosstalk is expressed in dB as the amplitude of the FFT spur at the frequency associated with the OFF channel test tone. Intermodulation Distortion (IMD) IMD is the total power of the intermodulation products relative to the total input power when two tones, f1 and f2, are present at the inputs. The intermodulation products are (f1 ± f2), (2 x f1), (2 x f2), (2 x f1 ± f2), (2 x f2 ± f1). The individual input tone levels are at -7dB FS. Small-Signal Bandwidth A small -20dB FS analog input signal is applied to an ADC so the signal’s slew rate does not limit the ADC’s performance. The input frequency is then swept up to the point where the amplitude of the digitized conversion result has decreased by -3dB. Note that the T/H performance is usually the limiting factor for the smallsignal input bandwidth. ______________________________________________________________________________________ 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports DAC Power-Supply Rejection DAC PSR is the amount of change in the converter’s value at full-scale as the power-supply voltage changes from its nominal value. PSR assumes the converter’s linearity is unaffected by changes in the powersupply voltage. DAC Digital Feedthrough DAC digital feedthrough is the amount of noise that appears on the DAC output when the DAC digital control lines are toggled. ADC Power-Supply Rejection ADC power-supply rejection (PSR) is defined as the shift in offset error when the power-supply is moved from the minimum operating voltage to the maximum operating voltage. Chip Information TRANSISTOR COUNT: 58,141 PROCESS: BiCMOS Ordering Information/Selector Guide REF ANALOG RESOLUTION ADC DAC VOLTAGE SUPPLY GPIOs CHANNELS CHANNELS BITS*** (V) VOLTAGE (V) PART TEMP RANGE PIN-PACKAGE MAX1046BETX -40°C to +85°C 36 Thin QFN-EP** 4.096 4.75 to 5.25 10 4 4 0 MAX1047BETX* -40°C to +85°C 36 Thin QFN-EP** 2.5 2.7 to 3.6 10 4 4 0 MAX1048BETX -40°C to +85°C 36 Thin QFN-EP** 4.096 4.75 to 5.25 10 4 4 4 2.5 2.7 to 3.6 10 4 4 4 MAX1049BETX* -40°C to +85°C 36 Thin QFN-EP** *Future product—contact factory for availability. **EP = Exposed pad. ***Number of resolution bits refers to both DAC and ADC. ______________________________________________________________________________________ 41 MAX1040–MAX1043/MAX1046–MAX1049 Full-Power Bandwidth A large -0.5dB FS analog input signal is applied to an ADC, and the input frequency is swept up to the point where the amplitude of the digitized conversion result has decreased by -3dB. This point is defined as fullpower input bandwidth frequency. 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports 36 35 34 33 32 31 30 29 28 AIN1 AIN2 AIN3 AIN4 N.C. N.C. AIN5 36 35 34 33 32 31 30 29 28 N.C. 1 27 AIN0 GPIOA0 1 27 AIN0 N.C. 2 26 REF1 GPIOA1 2 26 REF1 EOC 3 25 N.C. EOC 3 25 GPIOC1 DVDD 4 24 N.C. DVDD 4 24 GPIOC0 DGND 5 23 N.C. DGND 5 22 RES_SEL DOUT 6 21 CS SCLK 7 20 LDAC 19 N.C. 19 N.C. N.C. N.C. AIN1 AIN2 AIN3 N.C. N.C. N.C. N.C. CNVST AIN1 AIN2 AIN3 N.C. N.C. N.C. N.C. 36 35 34 33 32 31 30 29 28 REF2 6mm x 6mm x 0.8mm THIN QFN TOP VIEW REF2 CNVST TOP VIEW N.C. OUT1 6mm x 6mm x 0.8mm THIN QFN N.C. 10 11 12 13 14 15 16 17 18 N.C. N.C. N.C. N.C. AGND AVDD OUT3 OUT2 20 LDAC OUT0 9 10 11 12 13 14 15 16 17 18 OUT1 21 CS AGND OUT0 9 22 RES_SEL DIN 8 AVDD DIN 8 OUT3 SCLK 7 23 N.C. MAX1042 MAX1043 OUT2 MAX1040 MAX1041 DOUT 6 36 35 34 33 32 31 30 29 28 N.C. 1 27 AIN0 GPIOA0 1 27 AIN0 N.C. 2 26 REF1 GPIOA1 2 26 REF1 EOC 3 25 N.C. EOC 3 25 GPIOC1 DVDD 4 24 N.C. DVDD 4 24 GPIOC0 DGND 5 23 N.C. DGND 5 22 RES_SEL DOUT 6 21 CS SCLK 7 MAX1046 MAX1047 DOUT 6 SCLK 7 DIN 8 20 LDAC OUT0 9 23 N.C. MAX1048 MAX1049 22 RES_SEL 21 CS DIN 8 20 LDAC OUT0 9 6mm x 6mm x 0.8mm THIN QFN ______________________________________________________________________________________ N.C. N.C. N.C. N.C. AGND AVDD OUT3 OUT2 N.C. N.C. N.C. N.C. AGND AVDD OUT3 OUT2 10 11 12 13 14 15 16 17 18 OUT1 19 N.C. 10 11 12 13 14 15 16 17 18 OUT1 19 N.C. 6mm x 6mm x 0.8mm THIN QFN 42 REF2/AIN6 CNVST/AIN7 AIN1 AIN2 AIN3 AIN4 N.C. N.C. TOP VIEW AIN5 TOP VIEW REF2/AIN6 CNVST/AIN7 MAX1040–MAX1043/MAX1046–MAX1049 Pin Configurations 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports QFN THIN 6x6x0.8.EPS D2 D CL D/2 b D2/2 k E/2 E2/2 (NE-1) X e E CL E2 k e L (ND-1) X e e L CL CL L1 L L e A1 A2 e A PACKAGE OUTLINE 36, 40, 48L THIN QFN, 6x6x0.8mm 21-0141 E 1 2 ______________________________________________________________________________________ 43 MAX1040–MAX1043/MAX1046–MAX1049 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) MAX1040–MAX1043/MAX1046–MAX1049 10-Bit, Multichannel ADCs/DACs with FIFO, Temperature Sensing, and GPIO Ports Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT FOR 0.4mm LEAD PITCH PACKAGE T4866-1. PACKAGE OUTLINE 36, 40, 48L THIN QFN, 6x6x0.8mm 10. WARPAGE SHALL NOT EXCEED 0.10 mm. 21-0141 E 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 44 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.