Datasheet 80-mW Coupling Capacitorless Stereo Headphone Amplifiers BD88400FJ General Description Package BD88400FJ is an output coupling capacitorless headphone amplifier. This IC has a built-in regulated negative voltage generator type that generates the direct regulated negative voltage from the supply voltage. It is possible to drive headphones in a ground standard with both voltage of the positive voltage (+2.4V) and the negative voltage (-2.4V). Therefore a large capacitance output coupling capacitor becomes needless and can reduce cost, board area and height of the part. In addition, there is no signal degradation at the low range caused by the output coupling capacitor and output load impedance, thus a rich low tone can be outputted. W(Typ) x D(Typ) x H(Max) SOP-J14 8.65mm x 6.00mm x 1.65mm Features No Bulky DC-Blocking Capacitors Required No Degradation of Low-Frequency Response Due to Output Capacitors Ground-Referenced Outputs Gain setting: Variable Gain with External Resistors Low THD+N Low Supply Current Integrated Negative Power Supply Integrated Short-Circuit and Thermal-Overload Protection Applications Home Audio, TVs, Portable Audio Players, PCs, Digital Cameras, Electronic Dictionaries, Voice Recorders, Bluetooth Headsets, etc. Key Specifications and Lineup Supply Voltage [V] +2.4 to +5.5 Supply Current [mA] Gain [V/V] Maximum Output Power [mW] THD+N [%] Noise Voltage [µVrms] PSRR [dB] ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 2.0 (No Signal) Variable Gain with External Resistor 80 (VDD=3.3V,RL=16Ω, THD+N≤1%,f=1kHz) 0.006 (VDD=3.3V,RL=16Ω,Po=10mW,f=1kHz) 10 -80 (f=217Hz) ○This product has no designed protection against radioactive rays 1/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Typical Application Circuit SHUTDOWN Control Lch Input Cil 1.0μF 1 INL SHDNLB SHDNRB Ri 4 10kΩ Rf 10kΩ 3.3V 14 SVDD SVDD 3.3V 12 Csvdd 1.0μF PVDD 5 SVDD 14kΩ Cpvdd 1.0μF 11 C1P Part Function Value Remarks CF Flying Capacitor 2.2µF Temp. Characteristic： Class-B CH Hold Capacitor 2.2µF Temp. Characteristic： Class-B CPVDD Bypass Capacitor 1.0µF Temp. Characteristic： Class-B CSVDD Bypass Capacitor 1.0µF Temp. Characteristic： Class-B Cil Coupling Capacitor 1.0µF Temp. Characteristic： Class-B Cir Coupling Capacitor 1.0µF OUTL + 6 SVSS SVDD SGND SHDNRB PGND CF 2.2μF 7 CHARGE PUMP SVDD UVLO/ SHUTDOWN CONTROL SHORT PROTECTION TSD CH 2.2μF C1N CHARGE PUMP CONTROL PVSS SGND SVSS SVDD PVDD 8 OUTR + CLOCK GENERATOR 13 14kΩ - 9 SVDD SVSS SVSS 3 INR SGND SGND 10 2 Rf Ri 10kΩ 10kΩ Cir 1.0μF Ri Rch Input Rf Input Resistor Feedback Resistor 10kΩ 10kΩ Temp. Characteristic： Class-B MCR006YZPJ103 (ROHM) MCR006YZPJ103 (ROHM) In BD88400FJ, the Pass Gain follows formula (4). The Pass Gain and the resistor Rf is limited by table.1. Gain = Rf Ri (4) Table 1. Pass Gain and Resistor Limit Min Typ Max Unit Pass Gain 0.5 1.0 2.0 V/V Rf 1.0 10 - kΩ Ri - 10 - kΩ Item Ri is not limited. But, if this resistor Ri is very small, the signal degradation happens at the low frequency (Refer to formula (2)). www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Pin Configuration (Top View) 1 SHDNRB INL 14 2 INR 3 SGND OUTR 13 BD88400FJ SVDD 12 4 SHDNLB OUTL 11 5 PVDD SVSS 10 6 C1P PVSS 9 7 PGND C1N 8 Pin Descriptions No. Pin Name 1 SHDNRB Function Headphone Amplifier (Rch) Shutdown Control (H:active, L:shutdown) Headphone Amplifier (Rch) input Symbol Ground for Headphone Amplifier Headphone Amplifier (Lch) Shutdown Control (H:active, L:shutdown) Positive Power Supply for Charge Pump E E 2 INR 3 SGND C 4 SHDNLB 5 PVDD 6 C1P Flying Capacitor Positive A 7 PGND Ground for Charge Pump - Flying Capacitor Negative B Negative Supply Voltage output F - 8 C1N 9 PVSS 10 SVSS Negative Supply Voltage for Signal - 11 OUTL Headphone Amplifier (Lch) output D 12 SVDD Ground for Headphone Amplifier - 13 OUTR 14 INL Headphone Amplifier (Rch) output D Headphone Amplifier (Lch) input C www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ INL 1 SHDNLB SHDNRB Block Diagram 4 14 SVDD SVDD 12 PVDD 5 SVDD 14kΩ OUTL - 11 C1P + 6 SVSS SVDD SGND SHDNRB PGND 7 CHARGE PUMP SVDD UVLO/ SHUTDOWN CONTROL C1N 8 PVDD CHARGE PUMP CONTROL PVSS SHORT PROTECTION TSD SGND SVSS SVDD OUTR + CLOCK GENERATOR 14kΩ 13 - 9 SVDD SVSS SVSS www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3 INR SGND SGND 4/27 10 2 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Absolute Maximum Ratings Parameter Symbol Rating Unit SGND to PGND Voltage VGG 0.0 V SVDD to PVDD Voltage VDD -0.3 to +0.3 V SVSS to PVSS Voltage VSS 0.0 V SGND or PGND to SVDD, PVDD Voltage (Note 1) VDG -0.3 to +6.0 V SVSS, PVSS to SGND Or PGND Voltage VSG -3.5 to +0.3 V SGND to IN_- Voltage VIN (SVSS-0.3) to 2.8 V SGND to OUT_- Voltage VOUT (SVSS-0.3) to 2.8 V PGND to C1P- Voltage VC1P (PGND-0.3) to (PVDD+0.3) V PGND to C1N- Voltage VC1N (PVSS-0.3) to (PGND+0.3) V SGND to SHDN_B- Voltage VSH (SGND-0.3) to (SVDD+0.3) V Input Current IIN -10 to +10 mA Power Dissipation (Note 2) Pd 1.02 W Tstg -55 to +150 °C Tjmax +150 °C Storage Temperature Range Maximum Junction Temperature (Note 1) Pd must not be exceeded. (Note 2) When mounted on 70mm×70mm×1.6mm FR4, 1-layer glass epoxy board. Derate by 8.19mW/°C when operating above Ta=25°C Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Supply Voltage Range Operating Temperature Range www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Rating Symbol Min Typ Max Unit VSVDD,VPVDD 2.4 - 5.5 V TOPR -40 - +85 °C 5/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Electrical Characteristics Unless otherwise specified, T Ta=25°C, SVDD=PVDD=3.3V, SGND=PGND=0V, SHDNLB=SHDNRB=SVDD, CF=CH=2.2µF, RL=No load, Ri=Rf=10kΩ Limit Parameter Symbol Unit Conditions Min Typ Max Supply Current Shutdown Supply Current IST - 0.1 2 µA IDD1 - 1.3 - mA IDD2 - 2.0 7.4 mA H Level Input Voltage VIH 1.95 - - V L Level Input Voltage VIL - - 0.70 V ILEAK - - ±1 µA Shutdown to Full Operation tSON - 80 - µs Offset Voltage VIS - ±0.5 ±6.0 mV 30 60 - mW 40 80 - mW - 0.008 0.056 % - 0.006 0.100 % AV - -1.00 - V/V ΔAV - 1 - % Noise VN - 10 - Slew Rate SR - 0.15 - V/µs Maximum Capacitive Load CL - 200 - pF Crosstalk CT - -90 - dB PSRR - -80 - dB Charge-Pump Oscillator Frequency fOSC 200 300 430 kHz Thermal-Shutdown Threshold TSD - 145 - °C Thermal-Shutdown Hysteresis THYS - 5 - °C Quiescent Supply Current SHDNLB=SHDNRB=L (SHDNLB,SHDNRB)=(H,L) or (L,H), No Signal SHDNLB=SHDNRB=H, No Signal SHDN_B Terminal Input Leak Current Headphone Amplifier Maximum Output Power Total Harmonic Distortion + Noise Gain Gain Match Power Supply Rejection Ratio www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 POUT THD+N 6/27 SHDNLB=SHDNRB=L to H RL=32Ω, THD+N≤-40dB, f=1kHz, 20kHz LPF, for Single Channel RL=16Ω, THD+N≤-40dB, f=1kHz, 20kHz LPF, for Single Channel RL=32Ω, POUT=10mW, f=1 kHz, 20kHz LPF RL=16Ω, POUT=10mW, f= kHz, 20kHz LPF Gain Is variable by the external resistor of Ri and Rf. µVrms 20kHz LPF + JIS-A RL=32Ω, f=1kHz, VOUT=200mVP-P, 1kHz BPF f=217Hz, 100mVP-P‐ripple, 217Hz BPF TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Typical Performance Curves General Items Unless otherwise specified, Ta=25°C, SGND=PGND=0V, SHDNLB=SHDNRB=SVDD, CF=CH=2.2µF, Input coupling capacitor=1µF, RL=No Load (Note) In BD88400FJ the input resistor (Ri)=10kΩ, feedback resistor(Rf)=10kΩ. 4.0 1u SHDNLB=VDD SHDNLB=VDD SHDNRB=0V SHDNRB=0V Operating Current [mA] Standby Current [A] SHDNLB=0V SHDNLB=0V SHDNRB=0V SHDNRB=0V 100n 10n 1n 0.1n 0.0 UVLO. 2.0 1.0 0.0 1.0 2.0 3.0 4.0 5.0 0.0 6.0 1.0 2.0 3.0 4.0 5.0 6.0 Supply Voltage [V] Supply Voltage [V] Figure 1. Standby Current vs Supply Voltage Figure 2. Monaural Operating Current vs Supply Voltage 0 4.0 SHDNLB=VDD SHDNLB=VDD SHDNRB=VDD SHDNRB=VDD This * (Note) This caracteristics has characteristics hysteresis (40mV has typ) by hysteresis (40mV typ) UVLO. 3.0 SHDNLB=VDD SHDNLB=VDD SHDNRB=VDD SHDNRB=VDD No Load No Load -0.5 VSS Voltage [V] Operating Current [mA] (Note) This * This caracteristics has characteristics has by hysteresis (40mV typ) hysteresis (40mV typ) by UVLO. 3.0 by UVLO. 2.0 -1 -1.5 -2 1.0 -2.5 -3 0.0 0.0 1.0 2.0 3.0 4.0 5.0 2.0 6.0 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage [V] Supply Voltage [V] Figure 4. Negative Voltage vs Supply Voltage Figure 3. Stereo Operating Current vs Supply Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2.5 7/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Typical Performance Curves – continued General Items 100 200 SHDNLB=SHDNRB SHDNLB=SHDNRB =L->H =L->H VSS 90% Setup time VSS 90% Setup time No Load No Load Setup SetupTime time[µs] [us] 160 140 RL=16Ω, RL=16in in phase Ω,phase 90 RRL=16 out of of phase phase L=16Ω, Ω,out Maximum Output Power [mW] 180 120 100 80 60 40 80 70 60 50 phase RRL=32 Ω,ininphase L=32Ω, 40 outof ofphase phase RRL=32 Ω,out L=32Ω, 30 THD+N -40dB THD+N ≦ ≤-40dB 20kHz LPF 20kHz LPF Stereo Stereo 20 10 20 0 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.0 6.0 Supply Voltage [V] 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage [V] Figure 5. Setup Time vs Supply Voltage Figure 6. Maximum Output Power vs Supply Voltage 0 0 VDD=2.4V VDD=2.4V Ripple=100mVp-p Ripple = 100mVp-p BPF BPF -10 -20 VDD=3.3V VDD=3.3V Ripple=100mVp-p Ripple = 100mVp-p BPF BPF -10 -20 -30 PSRR [dB] -30 PSRR [dB] 2.5 -40 -50 -60 -40 -50 -60 -70 -70 -80 -80 -90 -90 -100 -100 10 100 1k 10k 100k 10 Frequency [Hz] 1k 10k 100k Frequency [Hz] Figure 7. PSRR vs Frequency (VDD=2.4V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100 Figure 8. PSRR vs Frequency (VDD=3.3V) 8/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Typical Performance Curves – continued General Items 0 0 VDD=5.5V VDD=5.5V Ripple = 100mVp-p Ripple=100mVp-p BPF BPF -10 -20 -20 -30 -30 Cross Talk [dB] PSRR [dB] VDD=2.4V VDD=2.4V VOUT=200mVp-p VOUT = 200mVp-p R L=32Ω RL=32Ω BPF BPF -10 -40 -50 -60 -70 -40 LtoR RtoL -50 -60 -70 -80 -80 -90 -90 -100 -100 10 100 1k 10k 100k 10 100 Frequency [Hz] 10k 100k Frequency [Hz] Figure 10. Crosstalk vs Frequency (VDD=2.4V) Figure 9. PSRR vs Frequency (VDD=5.5V) 0 0 VDD=3.3V VDD=3.3V VOUT=200mVp-p VOUT = 200mVp-p RL=32Ω RL=32 BPF Ω BPF -20 -30 VDD=5.5V VDD=3.3V VOUT=200mVp-p VOUT = 200mVp-p RL=32Ω RL=32 BPF Ω BPF -10 -20 -30 Cross Talk [dB] -10 Cross Talk [dB] 1k -40 LtoR RtoL -50 -60 -40 -60 -70 -70 -80 -80 -90 -90 -100 LtoR RtoL -50 -100 10 100 1k 10k 100k 10 Frequency [Hz] 1k 10k 100k Frequency [Hz] Figure 12.Crosstalk vs Frequency (VDD=5.5V) Figure 11. Crosstalk vs Frequency (VDD=3.3V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100 9/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Typical Performance Curves – continued BD88400FJ 10 VDD=3.3V VDD=3.3V f=1kHz f=1kHz 20kHz-LPF BPF BPF -20 RL=32 RL=32ΩΩ VDD=3.3V, Po=10mW VDD=3.3V, Po=10mW Input coupling RI=10kΩ, Ri=10k , Input coupling Ω capacitor=1.0µF capacitor = 1.0uF 8 6 4 -40 Gain [dB] Output Voltage [dBV] 0 RL=16 Ω RL=16Ω -60 -80 RL=16ΩΩ RL=16 2 0 -2 RL=32 RL=32ΩΩ -4 -6 -100 -8 -120 -120 -10 -100 -80 -60 -40 -20 0 10 100 Input Voltage [dBV] 10 10 THD+N [%] THD+N [%] 100 In phase VDD=3.3V VDD=3.3V 20kHz-LPF 20kHz-LPF f=1kHz f=1kHz Stereo Stereo RL=16Ω RL=16Ω 0.01 100n In phase 1 0.1 VDD=3.3V VDD=3.3V 20kHz-LPF 20kHz-LPF f=1kHz f=1kHz Stereo RL=32Ω Stereo RL=32Ω 0.01 Out of phase Out of phase 0.001 0.001 1n 100k Figure 14. Gain vs Frequency (VDD=3.3V) 100 0.1 10k Frequency [Hz] Figure 13. Output Voltage vs Input Voltage (VDD=3.3V) 1 1k 10u 1m 1n 100m 100n 10u 1m Output Power [W] Output Power [W] Figure 15. THD+N vs Output Power (VDD=3.3V, RL=16Ω) Figure 16. THD+N vs Output Power (VDD=3.3V, RL=32Ω) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/27 100m TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Typical Performance Curves – continued BD88400FJ 100 100 VDD=3.3V VDD=3.3V RL=16Ω RL=16Ω 20kHz-LPF 20kHz-LPF Stereo (in phase) Stereo (in phase) 10 THD+N [%] THD+N [%] 10 1 Po=0.1mW Po=1mW 0.1 VDD=3.3V VDD=3.3V R L=32Ω RL=32Ω 20kHz-LPF 20kHz-LPF Stereo (in phase) Stereo (in phase) 0.01 1 Po=0.1mW Po=1mW 0.1 0.01 Po=10mW Po=10mW 0.001 0.001 10 100 1k 10k 100k 10 Frequency [Hz] 100 1k 10k 100k Frequency [Hz] Figure 18. THD+N vs Frequency (VDD=3.3V, RL=32Ω) Figure 17. THD+N vs Frequency (VDD=3.3V, RL=16Ω) 0 VDD=3.3V VDD=3.3V Input connect Input connect to the ground towith the1.0µF ground with 1.0uF Spectrum [dBV] -20 -40 -60 -80 -100 -120 -140 10 100 1k 10k 100k Frequency [Hz] Figure 19. Noise Spectrum vs Frequency (VDD=3.3V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Timing Chart (Usually Operation) PVDD,SVDD SHDNLB SHDNRB Amp enable PVSS,SVSS INL,INR OUTL OUTR Shutdow n Setup Signal output Shutdow n Figure 20. Usually Operation (UVLO Operation) PVDD,SVDD SHDNLB, SHDNRB PVSS,SVSS OUTL OUTR Signal output UVLO Setup Signal output Figure 21. UVLO Operation (TSD Operation) Hy steresis = 5℃ Ta PVDD,SVDD SHDNLB, SHDNRB PVSS,SVSS OUTL OUTR Signal output TSD Signal output Figure 22. TSD Operation www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Application Information 1. Functional Descriptions Figure 23 shows the conventional headphone amplifier circuit. In this circuit, the signal is outputted using the middle point bias circuit based on the middle point bias. Therefore, the output coupling capacitor that removes the DC voltage difference and does the AC coupling is necessary. This coupling capacitor and the impedance of the headphone compose the high-pass filter. Therefore, the signal degradation in the low frequency region is experienced. The output coupling capacitor should be of large capacitance because the cutoff frequency of this high-pass filter follows formula (1). fc = 1 2πRLCC (1) (Note) Cc is the coupling capacitor, and RL is the impedance of the headphone. Moreover, POP noise by the middle point bias start-up is generated and the degradation of PSRR is experienced. VDD Cc + Vhp VHP VDD Vout V [V] OUT [V] + OUT Vout Input VDD/2 0 time [s] V HP [V] Vhp [V] GND Middle Point BiasCircuit 0 time [s] Figure 23. Conventional Headphone Amplifier Circuit Figure 24 shows the BD88400FJ series circuit. In this circuit, the signal is outputted using a negative voltage based on the ground level. Therefore, the amplifier output can be connected directly to the headphone, making the output coupling capacitor unnecessary. In addition, the signal degradation in the low frequency region with the coupling capacitor is not generated, thus a deep bass is achieved. Moreover, POP noise is not controlled by the middle point bias start-up. Thus, the degradation of PSRR doesn't occur since it is based on the ground. OUT Vout Input + CF : Flying Capacitor VDD VVout OUT [V] HPVDD VHP Vhp HPVDD 0 time [s] Charge Pump V HP [V] Vhp [V] VSS CH : Hold Capacitor 0 time [s] Figure 24.BD88400FJ Series Circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ (1) CHARGE PUMP / CHARGE PUMP CONTROL The negative power supply circuit is composed of the regulated charge-pump. This circuit outputs the regulated negative voltage (PVSS) directly from power-supply voltage (PVDD). Therefore, it doesn't depend on the power-supply voltage and a constant voltage is outputted (PVSS=-2.4V@Typ, refer to Figure 4). Moreover, there is no power supply swinging caused by the output current of the headphone amplifier. Also, it doesn't influence the headphone amplifier characteristic. VSS vsSupply LoadVoltage Current VSSVoltage Voltage vs. [Ta=25℃, VDD=3.3V, [Ta=25°C, VDD =3.3V, CF=CH=2.2uF] CF=CH=2.2µF] 0 VSS Voltage [V][V] VSS Voltage -0.5 -1 -1.5 -2 -2.5 -3 0 20 40 60 80 100 120 Load Current Current [mA] Load [mA] Figure 25. PVSS Load Current Regulation Characteristics (Reference Data) (a) Power Control The power control is a logical sum of SHDNLB and SHDNRB. The negative power supply circuit starts when H level is inputted to either SHDNLB or SHDNRB, and power down when SHDNLB=SHDNRB=L level. SHDNLB Table.2 Charge Pump Control SHDNRB Control L L Power down L H Power ON H L Power ON H H Power ON Change Pump Frequency Charge PumpOscillator Ocsillator Frequency [kHz][kHz] Change Pump Frequency [kHz] Charge PumpOscillator Ocsillator Frequency [kHz] (b) Operating Frequency The operating frequency of the negative power supply charge pump is designed to minimize temperature and voltage dependency. Figure 26 shows the reference data (measurements). Please note the frequency interference in the application board. 400 380 360 VVDD=3.3V DD=3.3V Measure: Measure C1P : C1P CF=CH=2.2µF CF=CH=2.2uF 340 320 300 280 260 240 220 200 -50.0 0.0 50.0 100.0 Temperature : Ta [°C] Ta [℃] 400 380 360 Ta=25°C Ta=25℃ Measure: Measure :C1P C1P CF=CH=2.2µF CF=CH=2.2uF 340 320 300 280 260 240 220 200 2.0 3.0 4.0 5.0 6.0 Supply Voltage [V] Supply Voltage[V] Figure 26. Temperature Characteristic and Voltage Characteristic of Operating Frequency (Reference Data) (c) The Flying Capacitor and the Hold Capacitor The flying capacitor (CF) and the hold capacitor (CH) greatly influence the characteristic of the charge pump. Therefore, please connect 2.2µF capacitor with an excellent temperature characteristic and voltage characteristic as near as possible to the IC. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ (2) HEADPHONE AMP The headphone amplifier is driven by the internal positive voltage (+2.4V) and negative voltage (SVSS, -2.4V) based on ground (SGND). Therefore, the headphone can be connected without the output coupling capacitor. As a result, it brings improvement to low-frequency characteristic compared with the conventional coupling capacitor headphone type. (a) Power Control L channel and R channel of the headphone amplifier can be independently controlled by SHDNLB and SHDNRB logic. When the SVSS voltage is -1.1V@Typ or more, the headphone amplifier does not operate to protect from illegal operation. In addition, the over-current protection circuit is built in. The amplifier shutdowns when the over-current occurs because of the output short-circuit etc., thus IC is protected from being destroyed. Table.3 Control of the headphone amplifier SHDNRB L Channel SHDNLB R Channel L L Power down Power down L H Power down Power ON H L Power ON Power down H H Power ON Power ON [V] SHDNxB VDD 0 [time] [V] 0 [time] -1.1V SVSS Amprilier Disable Amplifier Enable Figure 27. Area of Headphone Amplifier can Operate SVSS does not have internal connection with PVSS. Please connect SVSS with PVSS on the application board. (b) Input Coupling Capacitor Input DC level of BD88400FJ is 0V (SGND). The input coupling capacitor is necessary for the connection with the signal source device. The signal degradation happens in the low frequency because of the high-pass filter composed by this input coupling capacitor and the input impedance of BD88400FJ. The input impedance of BD88400FJ is external resistance Ri. The cutoff frequency of this high-pass filter follows formula (2). fc = 1 2πR INCIN (2) Where: CIN is the input coupling capacitor. RIN=Ri 9.0 Rin=14kΩ R IN=14kΩ 6.0 3.0 CCin=10uF IN=10µF Gain Gain[dB] [dB] 0.0 -3.0 -6.0 Cin=4.7uF C IN=4.7µF -9.0 -12.0 C Cin=2.2uF IN=2.2µF -15.0 CCin=1uF IN=1µF -18.0 -21.0 1 10 100 Frequency[Hz] [Hz] Frequency Figure 28. Input Coupling Capacitor Frequency Response (Reference Data) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ The degradation of THD+N happens because of the input coupling capacitor. Therefore, please consider these when selecting components. 0 -10 -20 Cin=1.0uF CIN=1.0µF THD+N [dB] THD+N [dB] -30 -40 Cin=0.47uF CIN=0.47µ -50 -60 BD88415GUL BD88415GUL VVDD=3.3V DD=3.3V Po=10mW Po=10mW RRL=16Ω L=16Ω 20kHz LPF 20kHz LPF CIN=0.22µ Cin=0.22uF -70 -80 -90 CIN=2.2µF Cin=2.2uF -100 10 100 1k 10k 100k Frequency [Hz] Frequency [Hz] (Note) Capacitor size: 1608 Figure 29. THD+N by the Input Coupling Capacitor (Reference Data) Audio Source VS Vs IN Vin RIN=7.1kΩ Rin =7.1kΩ Cin C IN [V] VVs S [V] (c) Terminal State during Power Down The power control of the headphone amplifier changes the state of the terminal. When in shutdown, the input impedance of the input terminal becomes 7.1kΩ@Typ (In BD88400FJ, become RI + 7.1kΩ). The time constant can be reduced when the input coupling capacitor is charged. The input voltage changes while charging up the input coupling capacitor. Therefore, do not operate the headphone amplifier while charging. Vout OUT VDD Output Bias 0 time [s] [V] VVin IN [V] + Output Bias VSS 0 time [s] Figure 30. Input voltage transition with input coupling capacitor Charge time constant follows formula (3) by using the input coupling capacitor and the input impedance. The calculation of the convergence value to wait time is indicated in Figure 31. (3) τ = RINCIN Convergence [%][%] Convergence (Note) RIN=7.1kΩ@Typ In BD88400FJ, RIN=Ri+7.1kΩ 100 90 80 70 60 50 40 30 20 10 0 0τ 1τ 2τ 3τ 4τ 5τ Wait Time time [s][s] Wait 6τ 7τ 8τ Figure 31. Convergence vs Wait Time (Reference) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ (3) UVLO / SHUTDOWN CONTROL BD88400FJ has low voltage protection function (UVLO: Under Voltage Lock Out). This protects the IC from the illegal operation during a low power supply voltage. The detection voltage is 2.13V@Typ, so it does not influence recommended operation voltage of 2.4V. UVLO controls the whole IC, and also both the negative power supply charge pump and the headphone amplifier during power down. (4) TSD BD88400FJ has overheating protection function (TSD: Thermal Shutdown). The headphone amplifier shutdowns when overheating occurs due to headphone amplifier illegal operation. (The detection temp. 145°C@Typ) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ 2. Evaluation Board BD88400FJ evaluation Board loads and operates with the necessary parts only. It uses RCA Connector for input terminal and Headphone jack (φ=3.5mm) for output terminal. Therefore it can easily connect between Audio equipment. Also, it can operate using a single supply (2.4V to 5.5V). The switch on the board (SDB) can control shutdown. (Spec.) Item Limit Unit 2.4 to 5.5 V 1.0 A Operating Temperature Range -40 to +85 °C Input Voltage Range -2.5 to +2.5 V Output Voltage Range -2.5 to +2.5 V 15 Ω Supply Voltage Range (VDD) Maximum Supply Current Minimum Load Impedance (Schematic) Figure 32. Evaluation Board Schematic (BD88400FJ) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ (Parts List) Parts Name Type Value Size U1 SOP-J14pin BD88400FJ 8.65mm x 6.00mm C3, C5 Chip Ceramic capacitor 2.2µF 1608 C1,C2,C4,C6 Chip Ceramic capacitor 1.0µF 1608 C7 Tantalum capacitor 10µF 3216 R2,R3,R5,R6 Chip Resistor 10kΩ 1608 R7, R8 Chip Resistor Open - CN3 Headphone jack - φ=3.5mm (Operation procedure) ① ② ③ ④ ⑤ ⑥ Turn OFF the switch (SHNDLB/SHDNRB) on evaluation board. Connect the positive terminal of the power supply to the VDD pin and ground terminal to the GND pin. Connect the left output of the audio source to the INL and connect the right output to the INR. Turn ON the power supply. Turn ON the switch (SHDNLB/SHDNRB) on the evaluation board. (H) Input the audio source. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ (Board Layout) (TOP LAYER - TOP VIEW) (BOTTOM LAYER – TOP VIEW) Figure 33. ROHM Application Board Layout (BD88400FJ) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Power Dissipation Figure 34 shows the reference value of the thermal derating curve. (Conditions) This value is for mounted on the ROHM standard board Board size: 70mm x 70mm x 1.6mm (FR4, 1-Layer PCB) Power Dissipation Pd [W]: Pd [W] 1.2 1 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 Temperature : Ta [°C] Ta [℃] Figure 34. Thermal Derating Curve www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ I/O Equivalent Circuits PGND PGND PVDD PVDD SVDD - PAD PAD PAD + A B PGND PGND PIN6 C PVSS PVSS PIN8 SVDD SVSS PIN2,14 SVDD PGND PGND PAD PAD PAD + D SVSS PIN11,13 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 E SGND PIN1,4 22/27 F PIN9 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Except for pins the output of which were designed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned OFF completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 35. Example of Monolithic IC Structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over-Current Protection Circuit (OCP) This IC has a built-in overcurrent protection circuit that activates when the output is accidentally shorted. However, it is strongly advised not to subject the IC to prolonged shorting of the output. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Ordering Information B D 8 8 4 Part Number 0 0 F J - Package FJ: SOP-J14 GE 2 Packaging and forming specification GE2: Embossed tape and reel Marking Diagram SOP-J14 (TOP VIEW) Part Number Marking BD88400FJ LOT Number 1PIN MARK www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Physical Dimension, Tape and Reel Information Package Name SOP-J14 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 26/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet BD88400FJ Revision History Date Revision 26.May.2014 001 07.Aug.2014 002 Changes New Release. p.6 Electrical Characteristics Limit : Offset Voltage Max ±5.0mV -> ±6.0mV www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/27 TSZ02201-0C1C0EA00160-1-2 07.Aug.2014 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001