LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SINGLE DIGIT LED DISPLAY (1.0 Inch) Pb Lead-Free Parts LSD1005/66-XX-PF DATA SHEET DOC. NO REV. DATE : : QW0905- LSD1005/66-XX-PF A : 16 - May.- 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD1005/66-XX-PF Page 1/8 Package Dimensions 24.0(0.945") 10.5(0.413") 34.1 (1.343") 25.4 (1.0") 30.5 (1.201") ψ2.4(0.094") LSD1005/66-XX-PF LIGITEK Ø 0.51 TYP PIN NO.1 4.8±0.5 2.54X4= 10.16(0.4") Note : 1.All dimension are in millimeters and (lnch) tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD1005/66-XX-PF Page 2/8 Internal Circuit Diagram LSD10056-XX-PF 3,8 A B 6 7 C 4 D 2 E F 9 1 G 10 DP 5 LSD10066-XX-PF 3,8 A 7 B 6 C 4 D 2 E 1 F 9 G 10 DP 5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD1005/66-XX-PF Page 3/8 Electrical Connection PIN NO. LSD10056-XX-PF PIN NO. LSD10066-XX-PF 1 Anode E 1 Cathode E 2 Anode D 2 Cathode D 3 Common Cathode 3 Common Anode 4 Anode C 4 Cathode C 5 Anode DP 5 Cathode DP 6 Anode B 6 Cathode B 7 7 Cathode A 8 Anode A Common Cathode 8 Common Anode 9 Anode F 9 Cathode F 10 Anode G 10 Cathode G LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD1005/66-XX-PF Page 4/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT HR Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 100 mA Power Dissipation Per Chip PD 100 mW Ir 10 μA Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25℃) Electrical common λP △λ Vf(v) Iv(mcd) IV-M cathode (nm) (nm) Material Emitted or anode Min. Typ. Max. Min. Typ. CHIP PART NO Common Cathode LSD10056-XX-PF GaAlAs LSD10066-XX-PF Red 660 20 3.0 3.6 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 4.8 15.25 26.0 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/8 PART NO. LSD1005/66-XX-PF Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λP nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD1005/66-XX-PF Page6/8 Typical Electro-Optical Characteristics Curve HR CHIP Fig.1 Forward current vs. Forward Voltage 3.0 Relative Intensity@20mA 1000 Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current 100 10 1.0 0.1 1.0 2.0 3.0 4.0 2.5 2.0 1.5 1.0 0.5 0 5.0 1.0 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity@20mA Forward Voltage@20mA Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 -0 20 40 60 80 100 Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0 650 700 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) 600 1000 Forward Current(mA) Forward Voltage(V) -40 100 750 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD1005/66-XX-PF Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260° C Temp(°C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/8 PART NO. LSD1005/66-XX-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11