LINER LTC7130 20v 20a monolithic buck converter with ultralow dcr sensing Datasheet

LTC7130
20V 20A Monolithic Buck
Converter with Ultralow
DCR Sensing
DESCRIPTION
FEATURES
Wide VIN Range: 4.5V to 20V
Optimized for Low Duty Cycle Applications
nn High Efficiency: Up to 95%
nn LTC Proprietary Current Mode Architecture
nn High Current Parallel Operation
nn Ultralow DCR Current Sensing with
Temperature Compensation
nn Programmable Output Current Limit
nn High Speed Differential Remote Sense Amplifier
nn ±0.5% Output Voltage Regulation Accuracy
nn Output Short-Circuit Protection with Soft Recovery
nn Programmable Soft-Start, Tracking
nn Programmable Fixed Frequency: 250kHz to 770kHz
nn EXTV
CC for Reduced Power Dissipation
nn Fault Indicator for Output UV/OV Conditions
nn 6.25mm × 7.5mm × 2.22mm BGA Package
The LTC®7130 is a current mode synchronous step-down
monolithic converter that can deliver up to 20A continuous
load current. It employs a unique architecture which enhances
the signal-to-noise ratio of the current sense signal, allowing the use of a very low DC resistance power inductor to
maximize efficiency in high current applications. This feature
also reduces the switching jitter commonly found in low
DCR applications. The LTC7130 also includes a high speed
differential remote sense amplifier and a programmable current sense limit that can be selected from 10mV to 30mV to
set the output current limit up to 20A. In addition, the DCR
temperature compensation feature limits the maximum
output current precisely over temperature.
nn
nn
The LTC7130 also features a precise 0.6V reference with a
guaranteed limit of ±0.5% that provides an accurate output
voltage. A 5V to 20V input voltage range supports a wide
variety of bus voltages and various types of batteries.
APPLICATIONS
The LTC7130 is offered in a compact and low profile BGA package available with SnPb/RoHS compliant terminal finishes.
DSP, FPGA, ASIC Reference Designs
Telecom/Datacom Systems
nn Distributed High Power Density Systems
nn
L, LT, LTC, LTM, Burst Mode, OPTI-LOOP, μModule, Linear Technology and the Linear logo are
registered trademarks and No RSENSE is a trademark of Analog Devices, Inc. All other trademarks
are the property of their respective owners. Protected by U.S. Patents, including 5481178,
5705919, 5929620, 6177787, 6580258, 6498466, 6611131, patent pending.
nn
TYPICAL APPLICATION
High Efficiency, 1.5V/20A Step-Down Converter with Very Low DCR Sensing
2.2Ω
+
470µF
INTVCC
4.7µF
SVIN
INTVCC ITEMP
VIN
BOOST
ILIM
1k
SW
RUN
SNSD+
MODE/PLLIN
220pF
ITH
LTC7130
SNS–
TK/SS
1nF
0.1µF
20k
20k
30.1k
CMDSH2-3
SNSA+
EXTVCC
DIFFP
VFB
DIFFN
DIFFOUT
SGND
GND
FREQ
2.2Ω
0.1µF
3.09k
220nF
90
0.25µH
(0.37mΩ
DCR)
+
VOUT
1.5V
20A
470µF
×2
10
70
60
8
50
VIN = 12V
VOUT = 1.5V
L = 0.25μH (DCR = 0.37mΩ)
EXTVCC = 5V
CCM
40
30
220nF
20
619Ω
10
0
121k
12
EFFICIENCY
80
POWER LOSS
0
2
4
6 8 10 12 14 16 18 20
LOAD CURRENT (A)
6
4
POWER LOSS (W)
PINS NOT USED
IN THIS CIRCUIT:
PGOOD
CLKOUT
3.01k
14
100
1µF
EFFICIENCY (%)
VIN = 5V
TO 20V
Efficiency vs Load Current
2
0
7130 TA01b
7130 TA01a
7130fb
For more information www.linear.com/LTC7130
1
LTC7130
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Note 1)
Input Supply Voltage................................... –0.3V to 20V
EXTVCC, RUN, PGOOD.................................. –0.3V to 6V
SNSD+, SNSA+, SNS– Voltages.............. –0.3V to INTVCC
MODE/PLLIN, ILIM, TK/SS, FREQ.......... –0.3V to INTVCC
DIFFP, DIFFN.......................................... –0.3V to INTVCC
ITEMP, ITH, VFB Voltages....................... –0.3V to INTVCC
Operating Junction Temperature Range
(Note 2)................................................... –40°C to 125°C
Storage Temperature Range................... –65°C to 150°C
Peak Solder Reflow Body Temperature.................. 260°C
A
B
C
D
1
2
3
NC1
DIFFN
TOP VIEW
4
SNSD+ SNS–
SNSA+
5
DIFFP DIFFOUT ITH
TK/SS
7
NC2
RUN
FREQ
MODE/
PLLIN PGOOD
ILIM CLKOUT SGND
INTVCC
6
VFB
ITEMP EXTVCC
SVIN
GND
E
F
VIN
BOOST
G
GND
SW
H
J
BGA PACKAGE
63-PIN (6.25mm × 7.5mm × 2.22mm)
TJMAX = 125°C, θJA = 21°C/W, θJC = 10°C/W
θJA DERIVED FROM LTC7130 DEMO BOARD, Weight = 0.24g
ORDER INFORMATION
(http://www.linear.com/product/LTC7130#orderinfo)
PART MARKING*
PART NUMBER
PAD OR BALL FINISH
DEVICE
FINISH CODE
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(SEE NOTE 2)
LTC7130EY#PBF
SAC305 (RoHS)
LTC7130
e1
BGA
3
–40°C to 125°C
LTC7130IY#PBF
SAC305 (RoHS)
LTC7130
e1
BGA
3
–40°C to 125°C
• Device temperature grade is indicated by a label on the shipping container.
• Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Terminal Finish Part Marking: www.linear.com/leadfree
• This product is not recommended for second side reflow. For more
information, go to www.linear.com/BGA-assy
• Recommended BGA PCB Assembly and Manufacturing Procedures:
www.linear.com/BGA-assy
• BGA Package and Tray Drawings: www.linear.com/packaging
• This product is moisture sensitive. For more information, go to:
www.linear.com/BGA-assy
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 12V, VRUN = 5V unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
(Note 3)
4.5
20
V
with Diffamp Low DCR Sensing
0.6
0.6
3.5
5.5
V
V
0.603
0.6045
V
V
Main Control Loops
VIN
Input Voltage Range
VOUT
Output Voltage Range
without Diffamp and No Low DCR Sensing
VFB
2
Regulated Feedback Voltage
Current ITH Voltage = 1.2V (Note 4)
–40°C to 85°C
–40°C to 125°C
l
l
0.597
0.5955
0.6
0.6
7130fb
For more information www.linear.com/LTC7130
LTC7130
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 12V, VRUN = 5V unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN
IFB
Feedback Current
(Note 4)
VREFLNREG
Reference Voltage Line
Regulation
VIN = 4.5V to 20V (Note 4)
VLOADREG
Output Voltage Load
Regulation
(Note 4)
Measured in Servo Loop; ∆ITH Voltage = 1.2V to 0.7V
Measured in Servo Loop; ∆ITH Voltage = 1.2V to 1.6V
gm
Error Amplifier (EA)
Transconductance
ITH =1.2V, Sink/Source 5µA (Note 4)
IQ
Input DC Supply Current
Normal Mode
Shutdown
(Note 5)
VINTVCC Ramping Down
l
l
UVLO
Undervoltage Lockout
UVLO Hysteresis Voltage
VFBOVL
Feedback Overvoltage Lockout Measured at VFB
ISNSD+
SNSD+ Pin Bias Current
ISNSA+
SNSA+ Pin Bias Current
AVT_SNS
Total Sense Signal Gain to
Current Comparator
MAX
UNITS
–15
–50
nA
0.002
0.02
%
0.01
0.01
0.1
0.1
%
%
2
VRUN = 0V
UVLOHYS
TYP
3.4
mmho
3.8
30
50
mA
µA
3.75
4.1
V
0.5
0.66
0.68
V
VSNSD+ = 3.3V
30
100
nA
VSNSA+ = 3.3V
1
2
µA
l
0.64
V
5
VSENSE(MAX) Maximum Current Sense
Threshold
–40°C to 125°C
ITEMP
DCR Temperature
Compensation Current
ITK/SS
Soft-Start Charge Current
V/V
l
l
l
l
l
8.8
14
19
23.5
28.3
10
15
20
25
30
11.2
16
21
26.5
31.7
mV
mV
mV
mV
mV
VITEMP = 0.3V
l
9
10
11
µA
VTK/SS = 0V
l
1.0
1.25
1.5
µA
l
1.1
1.22
1.35
VRUN
RUN Pin on Threshold Voltage VRUN Rising
VRUN(HYS)
RUN Pin on Hysteresis
Voltage
tON(MIN)
Minimum On-Time
VSNS– = 1.8V, ILIM = 0V
ILIM = 1/4VINTVCC
ILIM = 1/2VINTVCC or Float
ILIM = 3/4VINTVCC
ILIM = VINTVCC
(Note 6)
V
80
mV
90
ns
INTVCC Linear Regulator
VINTVCC
VEXTVCC
Internal VCC Voltage
6V < VIN < 20V
Load Regulation
IINTVCC = 0mA to 20mA
External VCC Switchover
Voltage
EXTVCC Ramping Positive
EXTVCC Voltage Drop
IEXTVCC = 20mA, VEXTVCC = 5.5V
5.25
4.5
5.5
5.75
V
0.5
2
%
4.7
40
EXTVCC Hysteresis
V
100
250
mV
mV
Oscillator and Phase-Locked Loop
fNOM
Nominal Frequency
VFREQ = 1.2V
450
500
550
kHz
fLOW
Lowest Frequency
VFREQ = 0.4V
225
250
275
kHz
fHIGH
Highest Frequency
VFREQ > 2.4V
700
770
850
kHz
RMODE/PLLIN MODE/PLLIN Input Resistance
IFREQ
250
Frequency Setting Current
9
10
kΩ
11
µA
7130fb
For more information www.linear.com/LTC7130
3
LTC7130
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 12V, VRUN = 5V unless otherwise specified.
SYMBOL
PARAMETER
CLKOUT
Phase Relative to the
Oscillator Clock
CLKOUTHI
Clock Output High Voltage
CLKOUTLO
Clock Output Low Voltage
CONDITIONS
MIN
TYP
MAX
180
VINTVCC = 5.5V
4.5
UNITS
Deg
5.5
V
0
0.2
V
0.1
0.3
V
2
µA
PGOOD Output
VPGDLO
PGOOD Voltage Low
IPGOOD = 2mA
IPGD
PGOOD Leakage Current
VPGOOD = 5.5V
VPGD
PGOOD Trip
VFB with Respect to Set Output Voltage
VFB Going Negative
VFB Going Positive
–10
10
%
%
Differential Amplifier
AV
Gain
–40°C to 125°C
RIN
Input Resistance
Measured at DIFFP Input
VOS
Input Offset Voltage
VDIFFP = 1.5V, VDIFFOUT = 100µA
PSRR
Power Supply Rejection Ratio
5V < VIN < 20V (Note 7)
IOUT
Maximum Sourcing Output
Current
l
0.997
1
1.003
V/V
2
mV
80
1.5
kΩ
90
dB
2
mA
VOUT
Maximum Output Voltage
VINTVCC = 5.5V, IDIFFOUT = 300µA
GBW
Gain-Bandwidth Product
(Note 7)
VINTVCC – 1.4 VINTVCC – 1.1
3
MHz
V
SR
Slew Rate
(Note 7)
2
V/µs
RDS(ON)
RTOP
Top Power NMOS OnResistance
7.3
mΩ
RBOTTOM
Bottom Power NMOS OnResistance
2.1
mΩ
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC7130 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC7130E is guaranteed to meet performance specifications
from 0°C to 85°C operating junction temperature. Specifications over
the –40°C to 125°C operating junction temperature range are assured by
design, characterization and correlation with statistical process controls.
The LTC7130I is guaranteed to meet performance specifications over the
full –40°C to 125°C operating junction temperature range. The maximum
ambient temperature consistent with these specifications is determined
by specific operating conditions in conjunction with board layout, the
package thermal impedance and other environmental factors. The thermal
derating curves are based on the LTC7130 demo board.
4
Note 3: When 4.5V ≤ VIN ≤ 5.5V, INTVCC must be tied to VIN. Guaranteed
by design.
Note 4: The LTC7130 is tested in a feedback loop that servos VITH to a
specified voltage and measures the resultant VFB.
Note 5: Dynamic supply current is higher due to the gate charge being
delivered at the switching frequency. See Applications Information.
Note 6: The minimum on-time condition corresponds to the on inductor
peak-to-peak ripple current ≥40% of IMAX (see Minimum On-Time
Considerations in the Applications Information section).
Note 7: Guaranteed by design.
7130fb
For more information www.linear.com/LTC7130
LTC7130
TYPICAL PERFORMANCE CHARACTERISTICS
Efficiency vs Load Current
and Mode
100
100
90
100
VIN = 12V
fSW = 500kHz
90
80
70
70
60
50
VOUT = 1.5V
L = 0.25μH (DCR = 0.37mΩ)
FRONT PAGE CIRCUIT
40
30
10
0
0.1
1
10
LOAD CURRENT (A)
60
50
30
0
0.1
100
3681 G01
80
50
40
5
30
POWER LOSS (W)
10
60
6
9
11
14
LOAD CURRENT (A)
17
100
3681 G03
20
VOUT
AC–COUPLED
100mV/DIV
ILOAD
5A/DIV
1A to 15A
20µs/DIV
VIN = 12V
VOUT = 1.5V
FRONT PAGE CIRCUIT
POWER LOSS
3
1
10
LOAD CURRENT (A)
Load Step
(Continuous Conduction Mode)
ILOAD
5A/DIV
1A to 15A
20
0
CCM
Burst Mode OPERATION
PULSE–SKIPPING MODE
0
0.1
3681 G02
VOUT
AC–COUPLED
100mV/DIV
70
0
30
(Burst Mode Operation)
EFFICIENCY
10
VOUT = 1V
L = 0.25μH (DCR = 0.37mΩ)
FRONT PAGE CIRCUIT
40
15
VOUT = 1.5V
VIN = 20V
EXTVCC = 5V
50
10
100
VIN = 12V
60
Load Step
(Burst Mode® Operation)
vs Load Current
90
1
10
LOAD CURRENT (A)
fSW = 400kHz
20
CCM
Burst Mode OPERATION
PULSE–SKIPPING MODE
10
Efficiency and Power Loss
vs Load Current
100
VOUT = 1.5V
L = 0.25μH (DCR = 0.37mΩ)
FRONT PAGE CIRCUIT
40
20
CCM
Burst Mode OPERATION
PULSE–SKIPPING MODE
EFFICIENCY (%)
80
70
20
EFFICIENCY (%)
Efficiency vs Load Current
and Mode
80
EFFICIENCY (%)
EFFICIENCY (%)
90
Efficiency vs Load Current
and Mode
VIN = 5V
fSW = 500kHz
TA = 25°C, unless otherwise noted.
0
7130 G05
20µs/DIV
VIN = 12V
VOUT = 1.5V
FRONT PAGE CIRCUIT
7130 G06
7130 G04
Load Step
(Pulse-Skipping Mode)
Inductor Current at Light Load
Prebiased Output at 1V
CONTINUOUS
CONDUCTION
MODE 10A/DIV
VOUT
AC–COUPLED
100mV/DIV
VOUT
500mV/DIV
Burst Mode
OPERATION
10A/DIV
ILOAD
5A/DIV
1A TO 15A
TRACK/SS 500mV/DIV
VFB
500mV/DIV
PULSE–SKIP
MODE
10A/DIV
20µs/DIV
VIN = 12V
VOUT = 1.5V
FRONT PAGE CIRCUIT
7130 G07
VIN = 12V
VOUT = 1.5V
LOAD = 300mA
10µs/DIV
7130 G08
VIN = 12V
VOUT = 1.5V
20ms/DIV
7130 G09
7130fb
For more information www.linear.com/LTC7130
5
LTC7130
TYPICAL PERFORMANCE CHARACTERISTICS
Tracking Up and Down with
TK/SS External Ramp
CC
6
CURRENT SENSE THRESHOLD (mV)
40
5
INTVCC VOLTAGE (V)
VOUT
VOUT
0.5V/DIV
0V
VIN = 12V
VOUT = 1.5V
1Ω LOAD
Current Sense Threshold
vs ITH Voltage
INTVCC Line Regulation
VTK/SS
VTK/SS
0.2V/DIV
TA = 25°C, unless otherwise noted.
20ms/DIV
4
2
7130 G10
1
0
0
5
10
15
INPUT VOLTAGE (V)
30
25
20
15
10
5
0
–5
–10
20
ILIM = 0V
ILIM = 1/4 INTVCC
ILIM = 1/2 INTVCC
ILIM = 3/4 INTVCC
ILIM = INTVCC
35
0.25 0.5 0.75 1.0 1.25 1.5 1.75 2.0
VITH (V)
0
7130 G11
7130 G12
Maximum Current Sense
Threshold Voltage vs Feedback
Voltage (Current Foldback)
Maximum Current Sense Threshold
vs Common Mode Voltage
35
ILIM = INTVCC
30
ILIM = 3/4 INTVCC
25
ILIM = 1/2 INTVCC
20
ILIM = 1/4 INTVCC
15
ILIM = 0V
10
5
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5
VSENSE COMMON MODE VOLTAGE (V)
4.0
1.8
40
1.6
35
30
25
ILIM = INTVCC
1.4
ILIM = 3/4 INTVCC
1.2
ILIM = 1/2 INTVCC
20
ILIM = 1/4 INTVCC
15
0.2
0.1
0
0.2
0.4
0.5
0.3
FEEDBACK VOLTAGE (V)
ON
1.20
OFF
1.15
1.10
1.05
–25
0
25
50
75
TEMPERATURE (°C)
100
125
7130 G16
25
50
75
100
125
Oscillator Frequency
vs Temperature
600
VFREQ = 1.2V
575
601.0
550
FREQUENCY (kHz)
REGULATED FEEDBACK VOLTAGE (mV)
RUN THRESHOLD (V)
1.30
0
7130 G15
601.5
1.35
–25
TEMPERATURE (°C)
Regulated Feedback Voltage
vs Temperature
1.40
6
0
–50
0.6
7130 G14
Shutdown (RUN) Threshold
vs Temperature
1.25
0.8
0.4
5
0
1.0
0.6
ILIM = 0V
10
7130 G13
1.00
–50
TK/SS (µA)
MAXIMUM CURRENT SENSE THRESHOLD (mV)
CURRENT SENSE THRESHOLD (mV)
40
TK/SS Pull-Up Current
vs Temperature
600.5
600.0
599.5
525
500
475
450
599.0
598.5
–50
425
–25
0
25
50
75
TEMPERATURE (°C)
100
125
7130 G17
400
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
125
7130 G18
7130fb
For more information www.linear.com/LTC7130
LTC7130
TYPICAL PERFORMANCE CHARACTERISTICS
Oscillator Frequency
vs Input Voltage
Undervoltage Lockout Threshold
(INTVCC) vs Temperature
VFREQ = 2.5V
800
90
600
VFREQ = 1.2V
500
400
VFREQ = 0V
300
3.9
3.5
3.3
3.1
2.9
100
2.7
5
10
15
FALL
3.7
200
0
SHUTDOWN CURRENT (µA)
4.1
UVLO THRESHOLD (V)
20
–25
INPUT VOLTAGE (V)
0
25
50
75
TEMPERATURE (°C)
100
7130 G19
20
–25
0
25
50
75
TEMPERATURE (°C)
100
3.50
3.25
3.00
2.50
125
0
5
10
15
VOUT = 1.5V
fSW = 500kHz
DC2341A DEMO BOARD
0
25
50
75
100
AMBIENT TEMPERATURE (°C)
3.2
3.0
2.8
2.4
–50
20
125
7130 G25
–25
0
25
50
75
TEMPERATURE (°C)
100
NO HEAT SINK
20
Thermal Derating V
VIN
20V
IN == 20V
25
0LFM
200LFM
400LFM
15
10
5
0
VOUT = 1.5V
fSW = 500kHz
DC2341A DEMO BOARD
0
25
50
75
100
AMBIENT TEMPERATURE (°C)
125
7130 G24
Thermal
IN == 12V
Thermal Derating
Derating V
VIN
12V
10
5
3.4
2.6
25
15
20
7130 G23
MAXIMUM LOAD CURRENT (A)
MAXIMUM LOAD CURRENT (A)
20
10
15
INPUT VOLTAGE (V)
3.6
INPUT VOLTAGE (V)
0LFM
200LFM
400LFM
5
3.8
3.75
ThermalDerating
DeratingVIN
VIN==5V
5V
Thermal
NO HEAT SINK
0
4.0
7130 G22
25
20
Quiescent Current vs
Temperature without EXTVCC
2.75
15
10
–50
30
7130 G21
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
SHUTDOWN CURRENT (µA)
45
25
40
0
125
4.00
30
50
Input Quiescent Current
vs Input Voltage without EXTVCC
50
35
60
7130 G20
Shutdown Current vs Temperature
40
80
70
10
2.5
–50
MAXIMUM LOAD CURRENT (A)
FREQUENCY (kHz)
100
RISE
4.3
700
0
Shutdown Current
vs Input Voltage
4.5
900
0
TA = 25°C, unless otherwise noted.
125
7130 G26
NO HEAT SINK
20
0LFM
200LFM
400LFM
15
10
5
0
VOUT = 1.5V
fSW = 500kHz
DC2341A DEMO BOARD
0
25
50
75
100
AMBIENT TEMPERATURE (°C)
125
7130 G27
7130fb
For more information www.linear.com/LTC7130
7
LTC7130
PIN FUNCTIONS
FREQ (B7): Oscillator Frequency Control Input. A 10µA
current source flows out of this pin. Connecting a resistor
between this pin and ground sets a DC voltage which in
turn programs the oscillator frequency. Alternatively, this
pin can be driven with a DC voltage to vary the frequency
of the internal oscillator.
RUN (B6): Run Control Input. A voltage above 1.22V
turns on the IC. Pulling this pin below 1.1V causes the IC
to shut down. There is a 1μA pull-up current for the pin.
Once the RUN pin rises above 1.22V, an additional 4.5μA
pull-up current is added to the pin.
TK/SS (B5): Output Voltage Tracking and Soft-Start Input.
An internal soft-start current of 1.25μA charges the external
soft-start capacitor connected to this pin.
ITH (A5): Current Control Threshold and Error Amplifier Compensation Pin. The current comparator tripping
threshold is proportional with this voltage.
VFB (A6): Error Amplifier Feedback Input. This pin receives
the remotely sensed feedback voltage to set the output
voltage through an external resistive divider connected to
the DIFFOUT pin or the output.
DIFFOUT (A4): Output of Remote Sensing Differential
Amplifier. Connect this pin to VFB through a resistive
divider to set the desired output voltage.
DIFFN (A2): Negative Input of Remote Sensing Differential Amplifier. Connect this pin close to the ground of the
output load.
DIFFP (A3): Positive Input of Remote Sensing Differential
Amplifier. Connect this pin close to the output load.
SNSD+ (B1): DC Current Sense Comparator Input. The (+)
output to the DC current. Comparator is normally connected
to a DC current sensing network with a time constant that
matches the bandwidth, L/DCR, of the inductor.
8
SNS– (B2): Negative Current Sense Input. This negative
input of the current comparator is to be connected to the
output.
SNSA+ (C1): AC Current Sense Comparator Input. The (+)
output to the AC current comparator is normally connected
to a DCR sensing network. When combined with the SNSD+
pin, the DCR sensing network can be skewed to increase
the AC ripple voltage by a factor of 5.
ILIM (C2): Current Comparator Sense Voltage Limit. Apply
a DC voltage to set the maximum current sense threshold
for the current comparator.
CLKOUT (C3): Clock Output Pin. The CLKOUT signal is
180° out of phase to the rising edge of the IC internal clock.
GND (D2, D3, D4, E1, E2, E3, F2, F3, G4, G5, G6, H4,
H5, H6, H7, J4, J5, J6, J7): Power Ground. Connect
this pin closely to the (–) terminal of CVCC and the (–)
terminal of CIN.
SW (G1, G2, G3, H1, H2, H3, J1, J2, J3): Switch Node
Connection. Connect this pin to the output filter inductor, bottom N-channel MOSFET drain and top N-channel
MOSFET source. Voltage swing at these pins is from a
Schottky diode (external) voltage drop below ground to VIN.
BOOST (F1): Boosted Top Gate Driver Supply. The (+)
terminal of the bootstrap capacitor connects to this pin.
This pin swings from a diode voltage drop below INTVCC
up to VIN + INTVCC.
INTVCC (D1): Internal 5.5V Regulator Output. The internal
control circuits are powered from this voltage. Decouple
this pin to PGND with a 4.7μF low ESR tantalum or ceramic capacitor.
7130fb
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LTC7130
PIN FUNCTIONS
SVIN (D5): Main Input Supply. Decouple this pin to PGND
with a capacitor (0.1μF to 1μF). For applications where
the main input power is 5V, tie the SVIN and INTVCC pins
together.
PGOOD (C7): Power Good Indicator Output. Open-drain
logic out that is pulled to ground when the output exceeds
the 10% regulation window, after the internal 20μs power
bad mask timer expires.
VIN (E4, E5, E6, E7, F4, F5, F6, F7, G7): Main Input
Supply. These pins connect to the drain of the internal
power MOSFETs. Decouple this pin to GND with the input
capacitance CIN.
MODE/PLLIN (C6): Mode Operation or External Clock
Synchronization. Connect this pin to SGND to set the
continuous mode of operation. Connect to INTVCC to enable pulse-skipping mode of operation. Leaving the pin
floating will enable Burst Mode operation. A clock signal
applied to the pin will force the controller into continuous
mode of operation and synchronizes the internal oscillator.
EXTVCC (D7): External Supply Voltage Input. Whenever
an external voltage supply greater than 4.7V is connected
to this pin, an internal switch will close and bypass the
internal low dropout regulator, and the external supply will
power the IC. Do not exceed 6V on this pin and ensure
VIN > VEXTVCC at all times.
ITEMP (D6): Temperature DCR Compensation Input. Connect to a NTC (negative tempco) resistor placed near the
output inductor to compensate for its DCR change over
temperature. Floating this pin or tying it to INTVCC disables
the DCR temperature compensation function.
SGND (B3, B4, C4, C5): Signal Ground. This is the ground
of the controller. Connect compensation components and
output setting resistors to this ground.
NC (A1, A7): Do not connect. These pins are not connected
to anything internally.
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9
LTC7130
FUNCTIONAL BLOCK DIAGRAM
MODE/PLLIN
ITEMP
EXTVCC
FREQ
VIN
4.7V
+
+
–
TEMPSNS
F
MODE/SYNC
DETECT
0.6V
5.5V
REG
+
–
PLL-SYNC
CIN
SVIN
INTVCC
F
BOOST
CVCC
DB
BURST EN
CLKOUT
OSC
FCNT
S
R Q
ICOMP
IREV
+
–
CB
VOUT
SNSA+
SWITCH
LOGIC
AND
ANTISHOOTTHROUGH
–
+
SW
ON
SNS–
INTVCC
+
RUN
OV
COUT
GND
ILIM
PGOOD
SLOPE
COMPENSATION
+
INTVCC
UVLO
0.54V
UV
–
1
R
SNSD+
+
ACTIVE CLAMP
ITHB
AMP
–
–
+
–
– + +
0.5V
SS
RUN
+
EA
0.66V
+
1.25µA
DIFFAMP
40k
RUN
+
–
ITH
RC
CC1
TK/SS
CSS
40k DIFFP
40k
–
1µA/5.5µA
1.22V
0.55V
10
VSNS–
OV
VIN
0.6V
REF
–
+
SLEEP
VFB
SGND
RA
RB
40k
DIFFN
DIFFOUT
7130 BD
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LTC7130
OPERATION
Main Control Loop
The LTC7130 uses a LTC proprietary current sensing,
current mode step-down architecture. During normal
operation, the top MOSFET is turned on every cycle when
the oscillator sets the RS latch, and turned off when the
main current comparator, ICMP , resets the RS latch. The
peak inductor current at which ICMP resets the RS latch
is controlled by the voltage on the ITH pin, which is the
output of the error amplifier, EA. The remote sense amplifier (diffamp) produces a signal equal to the differential
voltage sensed across the output capacitor divided down
by the feedback divider and re-references it to the local
IC ground reference. The VFB pin receives this feedback
signal and compares it to the internal 0.6V reference. When
the load current increases, it causes a slight decrease in
the VFB pin voltage relative to the 0.6V reference, which in
turn causes the ITH voltage to increase until the inductor’s
average current equals the new load current. After the top
MOSFET has turned off, the bottom MOSFET is turned
on until either the inductor current starts to reverse, as
indicated by the reverse current comparator, IREV , or the
beginning of the next cycle.
The main control loop is shut down by pulling the RUN
pin low. Releasing RUN allows an internal 1.0µA current
source to pull up the RUN pin. When the RUN pin reaches
1.22V, the main control loop is enabled and the IC is
powered up. When the RUN pin is low, all functions are
kept in a controlled state.
Sensing Signal of Very Low DCR
The LTC7130 employs a unique architecture to enhance
the signal-to-noise ratio that enables it to operate with a
small sense signal of a very low value inductor DCR, 1mΩ
or less, to improve power efficiency, and reduce jitter due
to the switching noise which could corrupt the signal. The
LTC7130 comprises two positive sense pins, SNSD+ and
SNSA+, to acquire signals and processes them internally to
provide the response as with a DCR sense signal that has a
14dB signal-to-noise ratio improvement. In the meantime,
the current limit threshold is still a function of the inductor
peak current and its DCR value, and can be accurately set
from 10mV to 30mV in a 5mV steps with the ILIM pin. The
filter time constant, R1 • C1, of the SNSD+ should match
the L/DCR of the output inductor, while the filter at SNSA+
should have a bandwidth of five times larger than SNSD+,
R2 • C2 equals R1 • C1/5 (see Figure 3).
INTVCC/EXTVCC Power
Power for the top and bottom MOSFET drivers and most
other internal circuitry is derived from the INTVCC pin.
When the EXTVCC pin is tied to a voltage less than 4.7V,
an internal 5.5V linear regulator supplies INTVCC power
from VIN. Ground EXTVCC if it is not used. If EXTVCC is
taken above 4.7V, the 5.5V regulator is turned off and an
internal switch is turned on connecting EXTVCC to INTVCC.
Using the EXTVCC pin allows the INTVCC power to be derived
from a high efficiency external source such as a switching regulator output. The top MOSFET driver is biased
from the floating bootstrap capacitor, CB, which normally
recharges during the off cycle through an external diode
when the top MOSFET turns off. If the input voltage, VIN,
decreases to a voltage close to VOUT , the loop may enter
dropout and attempt to turn on the top MOSFET continuously. The dropout detector detects this and forces the top
MOSFET off for about one-twelfth of the clock period plus
100ns every third cycle to allow CB to recharge (note 7).
However, it is recommended that a load be present or the
IC operates at low frequency during the dropout transition
to ensure CB is recharged.
Internal Soft-Start
By default, the start-up of the output voltage is normally
controlled by an internal soft-start ramp. The internal
soft-start ramp connects to the noninverting input of the
error amplifier. The VFB pin is regulated to the lower of
the error amplifier’s three noninverting inputs (the internal soft-start ramp, the TK/SS pin or the internal 600mV
reference). As the ramp voltage rises from 0V to 0.6V over
approximately 600µs, the output voltage rises smoothly
from its prebiased value to its final set value.
Certain applications can result in the start-up of the converter into a non-zero load voltage, where residual charge
is stored on the output capacitor at the onset of converter
switching. In order to prevent the output from discharging
under these conditions, the bottom MOSFET is disabled
until soft-start is greater than VFB.
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11
LTC7130
OPERATION
Shutdown and Start-Up (RUN and TK/SS Pins)
The LTC7130 can be shut down using the RUN pin. Pulling
the RUN pin below 1.1V shuts down the main control loop
for the controller and most internal circuits, including the
INTVCC regulator. Releasing the RUN pin allows an internal
1.0µA current to pull up the pin and enable the controller.
Alternatively, the RUN pin may be externally pulled up
or driven directly by logic. Be careful not to exceed the
absolute maximum rating of 6V on this pin. The start-up
of the controller’s output voltage, VOUT , is controlled by
the voltage on the TK/SS pin, if the internal soft-start
has expired. When the voltage on the TK/SS pin is less
than the 0.6V internal reference, the LTC7130 regulates
the VFB voltage to the TK/SS pin voltage instead of the
0.6V reference. This allows the TK/SS pin to be used to
program a soft-start by connecting an external capacitor
from the TK/SS pin to SGND. An internal 1.25µA pull-up
current charges this capacitor, creating a voltage ramp on
the TK/SS pin. As the TK/SS voltage rises linearly from
0V to 0.6V (and beyond), the output voltage, VOUT , rises
smoothly from zero to its final value. Alternatively, the
TK/SS pin can be used to cause the start-up of VOUT to track
that of another supply. Typically, this requires connecting to the TK/SS pin an external resistor divider from the
other supply to ground (see the Applications Information
section). When the RUN pin is pulled low to disable the
controller, or when INTVCC drops below its undervoltage
lockout threshold of 3.75V, the TK/SS pin is pulled low
by an internal MOSFET. When in undervoltage lockout,
the controller is disabled and the MOSFETs are held off.
Light Load Current Operation (Burst Mode Operation,
Pulse-Skipping or Continuous Conduction)
The LTC7130 can be enabled to enter high efficiency Burst
Mode operation, constant-frequency pulse-skipping mode
or forced continuous conduction mode. To select forced
continuous operation, tie the MODE/PLLIN pin to SGND.
To select pulse-skipping mode of operation, tie the MODE/
PLLIN pin to INTVCC. To select Burst Mode operation, float
the MODE/PLLIN pin. When the controller is enabled for
Burst Mode operation, the peak current in the inductor
12
is set to approximately one-third of the maximum sense
voltage even though the voltage on the ITH pin indicates a
lower value. If the average inductor current is higher than
the load current, the error amplifier, EA, will decrease the
voltage on the ITH pin. When the ITH voltage drops below
0.5V, the internal sleep signal goes high (enabling “sleep”
mode) and both MOSFETs are turned off.
In sleep mode, the load current is supplied by the output
capacitor. As the output voltage decreases, the EA’s output
begins to rise. When the output voltage drops enough, the
sleep signal goes low, and the controller resumes normal
operation by turning on the top MOSFET on the next cycle
of the internal oscillator. When the controller is enabled for
Burst Mode operation, the inductor current is not allowed
to reverse. The reverse current comparator (IREV) turns
off the bottom MOSFET just before the inductor current
reaches zero, preventing it from reversing and going
negative. Thus, the controller operates in discontinuous
operation.
In forced continuous operation, the inductor current is
allowed to reverse at light loads or under large transient
conditions. The peak inductor current is determined by
the voltage on the ITH pin, just as in normal operation.
In this mode, the efficiency at light loads is lower than in
Burst Mode operation. However, continuous mode has the
advantages of lower output ripple and less interference
with audio circuitry.
When the MODE/PLLIN pin is connected to INTVCC, the
LTC7130 operates in PWM pulse skipping mode at light
loads. At very light loads, the current comparator, ICMP ,
may remain tripped for several cycles and force the top
MOSFET to stay off for the same number of cycles (i.e.,
skipping pulses). The inductor current is not allowed to
reverse (discontinuous operation). This mode, like forced
continuous operation, exhibits low output ripple as well as
low audio noise and reduced RF interference as compared
to Burst Mode operation. It provides higher low current
efficiency than forced continuous mode, but not nearly as
high as Burst Mode operation.
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LTC7130
OPERATION
Frequency Selection and Phase-Locked Loop
(FREQ and MODE/PLLIN Pins)
The selection of switching frequency is a trade-off between
efficiency and component size. Low frequency operation increases efficiency by reducing MOSFET switching
losses, but requires larger inductance and/or capacitance
to maintain low output ripple voltage.
If the MODE/PLLIN pin is not being driven by an external
clock source, the FREQ pin can be used to program the
controller’s operating frequency from 250kHz to 770kHz.
There is a precision 10µA current flowing out of the FREQ
pin so that the user can program the controller’s switching frequency with a single resistor to SGND. A curve
is provided later in the Applications Information section
showing the relationship between the voltage on the FREQ
pin and switching frequency.
A phase-locked loop (PLL) is available on the LTC7130
to synchronize the internal oscillator to an external clock
source that is connected to the MODE/PLLIN pin. The PLL
loop filter network is integrated inside the LTC7130. The
phase‑locked loop is capable of locking any frequency
within the range of 250kHz to 770kHz. The frequency setting
resistor should always be present to set the controller’s
initial switching frequency before locking to the external
clock. The controller operates in forced continuous mode
when it is synchronized.
Sensing the Output Voltage with a
Differential Amplifier
The LTC7130 includes a low offset, high input impedance,
unity-gain, high bandwidth differential amplifier for applications that require true remote sensing. Sensing the
load across the load capacitors directly greatly benefits
regulation in high current, low voltage applications, where
board interconnection losses can be a significant portion
of the total error budget. Connect DIFFP to the output load,
and DIFFN to the load ground. See Figure 1.
The LTC7130 differential amplifier has a typical output slew
rate of 2V/µs. The amplifier is configured for unity gain,
meaning that the difference between DIFFP and DIFFN is
translated to DIFFOUT, relative to SGND.
VOUT
LTC7130
DIFFP
COUT
DIFFN
+
DIFFAMP
–
DIFFOUT
VFB
7130 F01
Figure 1. Differential Amplifier Connection
Care should be taken to route the DIFFP and DIFFN PCB
traces parallel to each other all the way to the remote
sensing points on the board. In addition, avoid routing
these sensitive traces near any high speed switching
nodes in the circuit. Ideally, the DIFFP and DIFFN traces
should be shielded by a low impedance ground plane to
maintain signal integrity. The maximum output voltage is
limited to 3.5V when using the differential amplifier. If the
differential amplifier is not used, tie the feedback divider
directly across the output with its center point connected to
VFB and ground the SNSD+ pin. In this case the maximum
supported VOUT is 5V.
Power Good (PGOOD Pin)
The PGOOD pin is connected to the open drain of an
internal N-channel MOSFET. The MOSFET turns on and
pulls the PGOOD pin low when the VFB pin voltage is not
within ±10% of the 0.6V reference voltage. The PGOOD
pin is also pulled low when the RUN pin is below 1.1V or
when the LTC7130 is in the soft-start or tracking up phase.
When the VFB pin voltage is within the ±10% regulation
window, the MOSFET is turned off and the pin is allowed
to be pulled up by an external resistor to a source of up
to 6V. The PGOOD pin will flag power good immediately
when the VFB pin is within the regulation window. However,
there is an internal 20µs power-bad mask when the VFB
goes out of the window.
Inductor DCR Sensing Temperature Compensation
(ITEMP Pin)
Inductor DCR current sensing provides a lossless method
of sensing the instantaneous current. Therefore, it can
provide higher efficiency for applications with high output
currents. However, the DCR of a copper inductor typically
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13
LTC7130
OPERATION
has a positive temperature coefficient. As the temperature
of the inductor rises, its DCR value increases. The current
limit of the controller is therefore reduced.
The LTC7130 offers a method to counter this inaccuracy
by allowing the user to place an NTC temperature sensing
resistor near the inductor. A constant and precise 10μA
current flows out of the ITEMP pin. By connecting a linearized NTC resistor network from the ITEMP pin to SGND,
the maximum current sense threshold can be varied over
temperature according to the following equation:
VSENSEMAX( ADJ) = VSENSE(MAX) •
2.2 – VITEMP
1.5
Where:
VSENSEMAX(ADJ) is the maximum adjusted current sense
threshold.
VSENSE(MAX) is the maximum current sense threshold
specified in the Electrical Characteristics table. It is typically 10mV, 15mV, 20mV, 25mV or 30mV, depending on
the ILIM pin’s voltage.
VITEMP is the voltage of the ITEMP pin.
The valid voltage range for DCR temperature compensation
on the ITEMP pin is between 0.7V to SGND with 0.7V or
above being no DCR temperature correction.
An NTC resistor has a negative temperature coefficient,
meaning that its resistance decreases as its temperature
rises. The VITEMP voltage, therefore, decreases as the inductor’s temperature increases, and in turn the VSENSEMAX(ADJ)
14
will increase to compensate for the inductor’s DCR
temperature coefficient. The NTC resistor, however, is
non-linear and the user can linearize its value by building
a resistor network with regular resistors.
Output Overvoltage Protection
An overvoltage comparator, OV, guards against transient
overshoots (>10%) as well as other more serious conditions that may overvoltage the output. In such cases, the
top MOSFET is turned off and the bottom MOSFET is turned
on until the overvoltage condition is cleared.
Undervoltage Lockout
The LTC7130 has two functions that help protect the
controller in case of undervoltage conditions. A precision
UVLO comparator constantly monitors the INTVCC voltage
to ensure that an adequate gate-drive voltage is present.
It locks out the switching action when INTVCC is below
3.75V. To prevent oscillation when there is a disturbance
on the INTVCC, the UVLO comparator has 500mV of precision hysteresis.
Another way to detect an undervoltage condition is to
monitor the VIN supply. Because the RUN pin has a precision turn-on reference of 1.22V, one can use a resistor
divider to VIN to turn on the IC when VIN is high enough.
An extra 4.5µA of current flows out of the RUN pin once
the RUN pin voltage passes 1.22V. The RUN comparator
itself has about 80mV of hysteresis. One can program
additional hysteresis for the RUN comparator by adjusting the values of the resistive divider. For accurate VIN
undervoltage detection, VIN needs to be higher than 4.75V.
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LTC7130
APPLICATIONS INFORMATION
The Typical Application on the first page of this data sheet
is a basic LTC7130 application circuit. The LTC7130 is
designed and optimized for use with a very low DCR value
by utilizing a novel approach to reduce the noise sensitivity
of the sensing signal by a factor of 14dB. DCR sensing
is becoming popular because it saves expensive current
sensing resistors and is more power efficient, especially
in high current applications. However, as the DCR value
drops below 1mΩ, the signal-to-noise ratio is low and
current sensing is difficult. LTC7130 uses an LTC proprietary technique to solve this issue. In general, external
component selection is driven by the load requirement,
and begins with the DCR and inductor value. Next, input
and output capacitors are selected.
Current Limit Programming
The ILIM pin is a 5-level logic input which sets the maximum current limit of the controller. When ILIM is either
grounded, floated or tied to INTVCC, the typical value for
the maximum current sense threshold will be 10mV,
20mV or 30mV, respectively. Setting ILIM to one-fourth
INTVCC and three-fourths INTVCC for maximum current
sense thresholds of 15mV and 25mV.
Which setting should be used? For the best current limit
accuracy, use the highest setting that is applicable to the
output requirements.
SNSD+, SNSA+ and SNS– Pins
Compared to the conventional DCR sensing where there
are only 2 sense pins, SENSE+ and SENSE– to sense across
the DCR value of an inductor, the LTC7130 is designed
to sense very low DCR value inductors in the sub milliohms range by adding an extra current sensing loop with
SNSD+ pin. The SNSA+ and SNS– pins are the inputs to
the current comparators, while the SNSD+ pin is the input
of an internal amplifier.
input bias currents of less than 1μA, but there is also a
resistance of about 300k from the SNS– pin to ground. The
SNS– should be connected directly to VOUT. The SNSD+
pin connects to the filter that has a R1 • C1 time constant
matched to L/DCR of the inductor. The SNSA+ pin is connected to the second filter with the time constant one-fifth
that of R1 • C1. Care must be taken not to float these pins
during normal operation. Filter components, especially
capacitors, must be placed close to the LTC7130, and
the sense lines should run close together to a Kelvin connection underneath the current sense element (Figure 2).
Because the LTC7130 is designed to be used with a very
low DCR value to sense inductor current, without proper
care, the parasitic resistance, capacitance and inductance
will degrade the current sense signal integrity, making
the programmed current limit unpredictable. As shown
in Figure 3, resistors R1 and R2 are placed close to the
inductor and capacitors C1 and C2 are close to the IC pins
to prevent noise coupling to the sense signal.
When the SNSD+ pin is in use for low DCR sensing, the
maximum output voltage allowed is 3.5V due to the limitation of the internal amplifiers’ inputs operating range. If
low DCR sensing is not needed, the LTC7130 could also be
used like any typical current mode controller by disabling
the SNSD+ pin, shorting it to ground. RC filter can be used
to sense the output inductor signal and connects to the
SNSA+ pin. Its time constant, R • C, is equaled to L/DCR
of the output inductor. In these applications, the current
limit, VSENSE(MAX), will be five times larger for the specified
ILIM, and the operating voltage range of SNSA+ and SNS–
is from 0V to 5V. Without using the internal differential
amplifier, the output voltage of 5V can be generated as
shown in the Typical Application section.
TO SENSE FILTER,
NEXT TO THE CONTROLLER
All the positive sense pins that are connected to the current comparator or the amplifier are high impedance with
7130 F02
COUT
INDUCTOR
Figure 2. Sense Lines Placement with Inductor DCR
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15
LTC7130
APPLICATIONS INFORMATION
VIN
SVIN
VIN
INTVCC
BOOST
LTC7130
RITEMP
L
SW
DCR
VOUT
ITEMP
RS
20k
R1
SNSD+
SNS–
RNTC
100k
INDUCTOR
RP
100k
SGND
SNSA+
GND
R2
C1
C2
7130 F03
PLACE C1, C2 NEXT TO IC
PLACE R1, R2 NEXT TO INDUCTOR
R1C1 = 5 • R2C2
Figure 3. Inductor DCR Current Sensing
Inductor DCR Sensing
∆IL: Inductor ripple current
The LTC7130 is specifically designed for high load current
applications requiring the highest possible efficiency; it is
capable of sensing the signal of an inductor DCR in the
sub milliohm range (Figure 3). The DCR is the DC winding
resistance of the inductor’s copper, which is often less than
1mΩ for high current inductors. In high current and low
output voltage applications, a conduction loss of a high
DCR or a sense resistor will cause a significant reduction
in power efficiency. For a specific output requirement,
chose the inductor with the DCR that satisfies the maximum desirable sense voltage, and uses the relationship
of the sense pin filters to output inductor characteristics
as depicted below.
L, DCR: Output inductor characteristics
DCR =
VSENSE(MAX)
∆I
IMAX + L
2
L/DCR = R1 • C1 = 5 • R2 • C2
where:
VSENSE(MAX): Maximum sense voltage for a given ILIM
threshold
IMAX: Maximum load current
16
R1, C1: Filter time constant of the SNSD+ pin
R2, C2: Filter time constant of the SNSA+ pin
To ensure that the load current will be delivered over the full
operating temperature range, the temperature coefficient of
DCR resistance, approximately 0.4%/°C, should be taken
into account. The LTC7130 features a DCR temperature
compensation circuit that uses an NTC temperature sensing
resistor for this purpose. See the Inductor DCR Sensing
Temperature Compensation section for details.
Typically, C1 and C2 are selected in the range of 0.047µF
to 0.47µF. If C1 and C2 are chosen to be 220nF, and an
inductor of 0.25μH with 0.37mΩ DCR is selected, R1 and
R2 will be 3.09k and 619Ω respectively. The bias current at
SNSD+ and SNSA+ is about 30nA and 500nA respectively,
and it causes some small error to the sense signal.
There will be some power loss in R1 and R2 that relates to
the duty cycle, and will be the most in continuous mode
at the maximum input voltage:
PLOSS (R) =
( VIN(MAX) – VOUT ) • VOUT
R
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LTC7130
APPLICATIONS INFORMATION
Ensure that R1 and R2 have a power rating higher than this
value. However, DCR sensing eliminates the conduction
loss of a sense resistor; it will provide a better efficiency at
heavy loads. The actual ripple voltage will be determined
by the following equation:
∆VSENSE =
VOUT VIN – VOUT
•
VIN R1• C1• fOSC
Use the following equations:
VITEMP100C =
⎛
(100°C – 25°C) • 0.4 ⎞
⎟
⎜ IMAX •DCR (Max)•
100
0.7 – 1.5 ⎜
⎟
VSENSE(MAX)
⎟
⎜
⎠
⎝
= 0.25V
Inductor DCR Sensing Temperature Compensation
with NTC Thermistor
For DCR sensing applications, the temperature coefficient
of the inductor winding resistance should be taken into
account when the accuracy of the current limit is critical
over a wide range of temperature. The main element used
in inductors is Copper; that has a positive tempco of approximately 4000ppm/°C. The LTC7130 provides a feature
to correct for this variation through the use of the ITEMP
pin. There is a 10µA precision current source flowing out
of the ITEMP pin. A thermistor with a NTC (negative temperature coefficient) resistance can be used in a network,
RITEMP (Figure 3) connected to maintain the current limit
threshold constant over a wide operating temperature.
The ITEMP voltage range that activates the correction is
from 0.7V or less. If floating this pin, its voltage will be at
INTVCC potential, about 5.5V. When the ITEMP voltage is
higher than 0.7V, the temperature compensation is inactive.
The following guidelines will help to choose components
for temperature correction. The initial compensation is for
25°C ambient temperature:
1. Set the ITEMP pin resistance to 70k at 25°C. With
10µA flowing out of the ITEMP pin, the voltage on the
ITEMP pin will be 0.7V at room temperature. Current
limit correction will occur for inductor temperatures
greater than 25°C.
2. Calculate the ITEMP pin resistance at the maximum
inductor temperature, which is typically 100°C.
Since VSENSE(MAX) = IMAX • DCR (Max):
RITEMP100C =
where:
VITEMP100C
= 25k
10µA
RITEMP100C = ITEMP pin resistance at 100°C;
VITEMP100C = ITEMP pin voltage at 100°C;
VSENSE(MAX) = Maximum current sense threshold at
room temperature;
IMAX = Maximum load current; and
DCR (Max) = Maximum DCR value.
Calculate the values for the NTC network’s parallel and
series resistors, RP and RS. A simple method is to graph
the following RS versus RP equations with RS on the y-axis
and RP on the x-axis.
RS = RITEMP25C – RNTC25C||RP
RS = RITEMP100C – RNTC100C||RP
Next, find the value of RP that satisfies both equations,
which will be the point where the curves intersect. Once RP
is known, solve for RS. The resistance of the NTC thermistor
can be obtained from the vendor’s data sheet in the form
of graphs, tabulated data, or formulas. The approximate
value for the NTC thermistor for a given temperature can
be calculated from the following equation:
⎛ ⎛ 1
1 ⎞⎞
R = RO • exp ⎜ B • ⎜
–
⎟⎟
⎝ ⎝ T + 273 TO + 273 ⎠ ⎠
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17
LTC7130
APPLICATIONS INFORMATION
where:
VITEMP = 10µA • (RS + RP||RNTC);
R = Resistance at temperature T, which is in degrees C.
RO = Resistance at temperature TO, typically 25°C.
B = B-constant of the thermistor.
Figure 4 shows a typical resistance curve for a 100k
thermistor and the ITEMP pin network over temperature.
10k
THERMISTOR RESISTANCE
RO = 100k, TO = 25°C
B = 4334 FOR 25°C TO 100°C
100
TL is the inductor temperature.
The resulting current limit should be greater than or equal
to IMAX for inductor temperatures between 25°C and 100°C.
With the front page circuit where the current limit setting
is 15mV, and inductor DCR is 0.37mΩ, the LTC7130 can
deliver 20A of load current from 25°C to 125°C without the
need for temperature compensation, however, if another
inductor with a higher DCR is chosen, say 0.53mΩ, the
current limit can be compensated by using the temperature
compensation network. (Figure 5).
30
10
28
RITEMP
RS = 20k
RP = 100k
1
–50
–25
DCR = 0.53mΩ
L = 0.33μH
24
0
25
50
75
TEMPERATURE (°C)
100
125
7130 F04
Figure 4. Resistance Versus Temperature for the ITEMP Pin
Network and the 100k NTC
22
20
18
16
14
Starting values for the NTC compensation network are:
12
CORRECTED IMAX
NOMINAL IMAX
RITEMP:
RS = 20k
RP = 100k
THERMISTOR:
RO = 100k
TO = 25°C
B = 4334 FOR 25°C TO 125°C
10
–50 –25 0
25 50 75 100 125 150
INDUCTOR TEMPERATURE (°C)
• NTC RO = 100k
• RS = 20k
7130 F05
• RP =100k
But, the final values should be calculated using the above
equations and checked at 25°C and 100°C. After determining the components for the temperature compensation
network, check the results by plotting IMAX versus inductor
temperature using the following equations:
Figure 5. Worst-Case IMAX Versus Inductor Temperature Curve
with and without NTC Temperature Compensation
VOUT
IDC(MAX) =
ΔV
VSENSEMAX(ADJ) – SENSE
2
0.4 ⎞
⎛
DCR(MAX) at 25°C • ⎜ 1+ TL(MAX) – 25°C •
⎟
⎝
100 ⎠
(
)
where:
VSENSEMAX(ADJ) = VSENSE(MAX) •
18
UNCORRECTED IMAX
26
IMAX (A)
RESISTANCE (Ω)
1k
IDC(MAX) = Maximum average inductor current; and
2.2 – VITEMP
;
1.5
RNTC
L1
SW1
7130 F06
Figure 6. Thermistor Location. Place the Thermistor Next to
the Inductor for Accurate Sensing of the Inductor Temperature,
But Keep the ITEMP Pin Away from the Switch Nodes and Gate
Drive Traces
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For the most accurate temperature detection, place the
thermistor next to the output inductor as shown in Figure 6.
Care should be taken to keep the ITEMP sense line away
from switch nodes.
Pre-Biased Output Start-Up
There may be situations that require the power supply to
start up with a pre-bias on the output capacitors. In this
case, it is desirable to start up without discharging that
output pre-bias. The LTC7130 can safely power up into a
pre-biased output without discharging it.
The LTC7130 accomplishes this by turning off both top
and bottom MOSFETs until the TK/SS pin voltage and the
internal soft-start voltage are above the VFB pin voltage.
When VFB is higher than TK/SS or the internal soft-start
voltage, the error amp output is railed low. The control
loop would like to turn bottom MOSFET on, which would
discharge the output. Disabling both MOSFETs will prevent
the pre-biased output voltage from being discharged.
When TK/SS and the internal soft-start both cross 500mV
or VFB, whichever is lower, both MOSFETs are enabled. If
the pre-bias is higher than the OV threshold, the bottom
MOSFET is turned on immediately to pull the output back
into the regulation window.
Overcurrent Fault Recovery
Upon removal of the short, the output soft starts using
the internal soft-start, thus reducing output overshoot. In
the absence of this feature, the output capacitors would
have been charged at current limit, and in applications
with minimal output capacitance this may have resulted
in output overshoot. Current limit foldback is not disabled
during an overcurrent recovery. The load must step below
the folded back current limit threshold in order to restart
from a hard short.
Thermal Considerations
In some applications where the LTC7130 is operated at high
ambient temperature, high VIN, high switching frequency
and maximum output current load, the heat dissipated may
exceed the maximum junction temperature of the part.
To avoid the LTC7130 from exceeding the maximum
junction temperature, current rating shall be derated in
accordance to Ambient Temperature vs Maximum Load
Current in the Typical Performance Characteristics.
The junction to ambient thermal resistance will vary
depending on the size amount of heat sinking copper on
the PCB board where the part is mounted, as well as the
amount of air flow on the device. Figure 7, 8 and 9 show
temperature derating with both heatsink and airflow.
Thermal Derating VIN = 5V
MAXIMUM LOAD CURRENT (A)
When the output of the power supply is loaded beyond
its preset current limit, the regulated output voltage
will collapse depending on the load. The output may be
shorted to ground through a very low impedance path or
it may be a resistive short, in which case the output will
collapse partially, until the load current equals the preset
current limit. The controller will continue to source current
into the short. The amount of current sourced depends
on the ILIM pin setting and the VFB voltage as shown in
the Current Foldback graph in the Typical Performance
Characteristics section.
25
WITH HEAT SINK
20
0LFM
200LFM
400LFM
15
10
VIN = 5V
VOUT = 1.5V
fSW = 500kHz
DC2341A DEMO BOARD
5
0
0
25
50
75
100
AMBIENT TEMPERATURE (°C)
125
7130 G07
Figure 7. Temperature Derating Curve Based on the
DC2341A Demo Board
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19
LTC7130
APPLICATIONS INFORMATION
Thermal Derating VIN = 12V
MAXIMUM LOAD CURRENT (A)
25
WITH HEAT SINK
20
Inductor Value Calculation
0LFM
200LFM
400LFM
Given the desired input and output voltages, the inductor
value and operating frequency, fOSC, directly determine
the inductor’s peak-to-peak ripple current:
15
IRIPPLE =
10
VIN = 12V
VOUT = 1.5V
fSW = 500kHz
DC2341A DEMO BOARD
5
0
0
25
50
75
100
AMBIENT TEMPERATURE (°C)
125
7130 F08
Figure 8. Temperature Derating Curve Based on the
DC2341A Demo Board
Thermal Derating VIN = 20V
MAXIMUM LOAD CURRENT (A)
25
WITH HEAT SINK
20
0LFM
200LFM
400LFM
15
0
25
50
75
100
AMBIENT TEMPERATURE (°C)
125
7130 F09
Figure 9. Temperature Derating Curve Based on the
DC2341A Demo Board
Tables 1 and 2 provide heat sink and thermal conductive
adhesive tape information.
Table 1. Heat Sink Manufacturer (Thermally Conductive
Adhesive Tape Pre-Attached)
HEAT SINK
MANUFACTURER
PART NUMBER
WEBSITE
Cool Innovations
3-040404U
www.coolinnovations.com
Table 2. Thermally Conductive Adhesive Tape Vendor
THERMALLY CONDUCTIVE
ADHESIVE TAPE
MANUFACTURER
PART NUMBER WEBSITE
Chomerics
20
It is recommended to choose a ripple current that is about
50% of IOUT(MAX). Note that the largest ripple current occurs at the highest input voltage. To guarantee that ripple
current does not exceed a specified maximum, the inductor
should be chosen according to:
T411
VIN – VOUT VOUT
•
fOSC •IRIPPLE VIN
Inductor Core Selection
VIN = 20V
VOUT = 1.5V
fSW = 500kHz
DC2341A DEMO BOARD
5
0
Lower ripple current reduces core losses in the inductor,
ESR losses in the output capacitors, and output voltage
ripple. Thus, highest efficiency operation is obtained at
low frequency with a small ripple current. Achieving this,
however, requires a large inductor.
L≈
10
VOUT ⎛ VIN – VOUT ⎞
⎜
⎟
VIN ⎝ fOSC • L ⎠
www.chomerics.com
Once the inductance value is determined, the type of inductor must be selected. Core loss is independent of core
size for a fixed inductor value, but it is very dependent on
inductance selected. As inductance increases, core losses
go down. Unfortunately, increased inductance requires
more turns of wire and therefore copper losses will increase.
Ferrite designs have very low core loss and are preferred
at high switching frequencies, so design goals can concentrate on copper loss and preventing saturation. Ferrite
core material saturates “hard,” which means that inductance collapses abruptly when the peak design current is
exceeded. This results in an abrupt increase in inductor
ripple current and consequent output voltage ripple. Do
not allow the core to saturate!
CIN and COUT Selection
In continuous mode, the source current of the top MOSFET
is a square wave of duty cycle (VOUT)/(VIN). To prevent
large voltage transients, a low ESR capacitor sized for the
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maximum RMS current of one channel must be used. The
maximum RMS capacitor current is given by:
CIN Required IRMS
1/2
I
≈ MAX ⎡⎣( VOUT ) ( VIN – VOUT )⎤⎦
VIN
This formula has a maximum at VIN = 2VOUT, where
IRMS = IOUT/2. This simple worst-case condition is commonly used for design because even significant deviations
do not offer much relief. Note that capacitor manufacturers’
ripple current ratings are often based on only 2000 hours
of life. This makes it advisable to further derate the capacitor, or to choose a capacitor rated at a higher temperature
than required. Several capacitors may be paralleled to meet
size or height requirements in the design. Due to the high
operating frequency of the LTC7130, ceramic capacitors
can also be used for CIN. Always consult the manufacturer
if there is any question.
Ceramic capacitors are becoming very popular for small
designs but several cautions should be observed. X7R, X5R
and Y5V are examples of a few of the ceramic materials
used as the dielectric layer, and these different dielectrics
have very different effect on the capacitance value due to
the voltage and temperature conditions applied. Physically,
if the capacitance value changes due to applied voltage
change, there is a concomitant piezo effect which results
in radiating sound! A load that draws varying current at
an audible rate may cause an attendant varying input voltage on a ceramic capacitor, resulting in an audible signal.
A secondary issue relates to the energy flowing back into
a ceramic capacitor whose capacitance value is being
reduced by the increasing charge. The voltage can increase
at a considerably higher rate than the constant current being
supplied because the capacitance value is decreasing as
the voltage is increasing! Nevertheless, ceramic capacitors,
when properly selected and used, can provide the lowest
overall loss due to their extremely low ESR.
A small (0.1µF to 1µF) bypass capacitor, CIN, between the
chip VIN pin and ground, placed close to the LTC7130, is
also suggested. A 2.2Ω to 10Ω resistor placed between
CIN and VIN pin provides further isolation.
The selection of COUT is driven by the required effective
series resistance (ESR). Typically once the ESR requirement is satisfied the capacitance is adequate for filtering.
The steady-state output ripple (∆VOUT) is determined by:
⎛
1 ⎞
∆VOUT ≈ ∆IRIPPLE ⎜ESR +
⎟
8fCOUT ⎠
⎝
where f = operating frequency, COUT = output capacitance
and ∆IRIPPLE = ripple current in the inductor. The output
ripple is highest at maximum input voltage since ∆IRIPPLE
increases with input voltage. The output ripple will be less
than 50mV at maximum VIN with ∆IRIPPLE = 0.4IOUT(MAX)
assuming:
COUT required ESR < N • RSENSE
and
COUT >
1
(8f) (RSENSE )
The emergence of very low ESR capacitors in small, surface
mount packages makes very small physical implementations possible. The ability to externally compensate the
switching regulator loop using the ITH pin allows a much
wider selection of output capacitor types. The impedance
characteristic of each capacitor type is significantly different than an ideal capacitor and therefore requires accurate
modeling or bench evaluation during design. Manufacturers
such as Nichicon, Nippon Chemi-Con and Sanyo should be
considered for high performance through-hole capacitors.
The OS-CON semiconductor dielectric capacitors available
from Sanyo and the Panasonic SP surface mount types
have a good (ESR)(size) product.
Once the ESR requirement for COUT has been met, the RMS
current rating generally far exceeds the IRIPPLE(P-P) requirement. Ceramic capacitors from AVX, Taiyo Yuden, Murata
and TDK offer high capacitance value and very low ESR,
especially applicable for low output voltage applications.
In surface mount applications, multiple capacitors may
have to be paralleled to meet the ESR or RMS current
handling requirements of the application. Aluminum
electrolytic and dry tantalum capacitors are both available
in surface mount configurations. New special polymer
surface mount capacitors offer very low ESR also but
have much lower capacitive density per unit volume. In
the case of tantalum, it is critical that the capacitors are
surge tested for use in switching power supplies. Several
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21
LTC7130
APPLICATIONS INFORMATION
excellent choices are the AVX TPS, AVX TPSV, the KEMET
T510 series of surface mount tantalums or the Panasonic
SP series of surface mount special polymer capacitors
available in case heights ranging from 2mm to 4mm. Other
capacitor types include Sanyo POSCAP, Sanyo OS-CON,
Nichicon PL series and Sprague 595D series. Consult the
manufacturers for other specific recommendations.
Differential Amplifier
The LTC7130 has true remote voltage sense capability.
The sense connections should be returned from the load,
back to the differential amplifier’s inputs through a common, tightly coupled pair of PC traces. The differential
amplifier rejects common mode signals capacitively or
inductively radiated into the feedback PC traces as well
as ground loop disturbances. The LTC7130 diffamp has
80kΩ input impedance on DIFFP. It is designed to be connected directly to the output. The output of the diffamp
connects to the VFB pin through a voltage divider, setting
the output voltage.
External Soft-Start and Tracking
The LTC7130 has the ability to either soft-start by itself
or track the output of another channel or external supply.
When the controller is configured to soft-start by itself, a
capacitor may be connected to its TK/SS pin or the internal
soft-start may be used. The controller is in the shutdown
state if its RUN pin voltage is below 1.1V and its TK/SS
pin is actively pulled to ground in this shutdown state. If
the RUN pin voltage is above 1.22V, the controller powers
up. A soft-start current of 1.25µA then starts to charge the
TK/SS soft-start capacitor. Note that soft-start or tracking
is achieved not by limiting the maximum output current
of the controller but by controlling the output ramp voltage according to the ramp rate on the TK/SS pin. Current
foldback is disabled during this phase to ensure smooth
soft-start or tracking. The soft-start or tracking range is
defined to be the voltage range from 0V to 0.6V on the
TK/SS pin. The total soft-start time can be calculated as:
tSOFTSTART = 0.6 •
22
CSS
1.25µA
Regardless of the mode selected by the MODE/PLLIN pin,
the controller always starts in discontinuous mode up to
TK/SS = 0.5V. Between TK/SS = 0.5V and 0.54V, it will
operate in forced continuous mode and revert to the
selected mode once TK/SS > 0.54V. The output ripple
is minimized during the 40mV forced continuous mode
window, ensuring a clean PGOOD signal. When the channel is configured to track another supply, the feedback
voltage of the other supply is duplicated by a resistor
divider and applied to the TK/SS pin. Therefore, the voltage ramp rate on this pin is determined by the ramp rate
of the other supply’s voltage. It is only possible to track
another supply that is slower than the internal soft-start
ramp. Note that the small soft-start capacitor charging
current is always flowing, producing a small offset error.
To minimize this error, select the tracking resistive divider
value to be small enough to make this error negligible.
In order to track down another channel or supply after
the soft-start phase expires, the LTC7130 is forced into
continuous mode of operation as soon as VFB is below the
undervoltage threshold of 0.54V regardless of the setting
on the MODE/PLLIN pin. However, the LTC7130 should
always be set in forced continuous mode tracking down
when there is no load. After TK/SS drops below 0.1V, the
controller operates in discontinuous mode.
The LTC7130 allows the user to program how its output
ramps up and down by means of the TK/SS pin. Through
these pins, the output can be set up to either coincidentally or ratiometrically track another supply’s output, as
shown in Figure 10. In the following discussions, VOUT2
refers to the LTC7130’s output as a slave and VOUT1 refers
to another supply output as a master. To implement the
coincident tracking in Figure 10a, connect an additional
resistive divider to VOUT1 and connect its mid-point to the
TK/SS pin of the slave controller. The ratio of this divider
should be the same as that of the slave controller’s feedback divider shown in Figure 11a. In this tracking mode,
VOUT1 must be set higher than VOUT2. To implement the
ratiometric tracking in Figure 10b, the ratio of the VOUT2
divider should be exactly the same as the master controller’s feedback divider shown in Figure 11b . By selecting
different resistors, the LTC7130 can achieve different
modes of tracking including the two in Figure 10.
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VOUT1
OUTPUT VOLTAGE
OUTPUT VOLTAGE
VOUT1
VOUT2
VOUT2
TIME
TIME
(10a) Coincident Tracking
7130 F08
(10b) Ratiometric Tracking
Figure 10. Two Different Modes of Output Voltage Tracking
VOUT1
VOUT2
TO
TK/SS2
PIN
R3
R1
R4
R2
TO
VFB1
PIN
TO
VFB2
PIN
R3
R4
VOUT1
TO
TK/SS2
PIN
VOUT2
R1
R2
TO
VFB1
PIN
TO
VFB2
PIN
R3
R4
7130 F09
(11a) Coincident Tracking Setup
(11b) Ratiometric Tracking Setup
Figure 11. Setup and Coincident and Ratiometric Tracking
So which mode should be programmed? While either
mode in Figure 10 satisfies most practical applications,
some trade-offs exist. The ratiometric mode saves a pair
of resistors, but the coincident mode offers better output
regulation. Under ratiometric tracking, when the master
controller’s output experiences dynamic excursion (under
load transient, for example), the slave controller output
will be affected as well. For better output regulation, use
the coincident tracking mode instead of ratiometric.
INTVCC (LDO) and EXTVCC
The LTC7130 features a true PMOS LDO that supplies
power to INTVCC from the VIN supply. INTVCC powers the
gate drivers and much of the LTC7130’s internal circuitry.
The LDO regulates the voltage at the INTVCC pin to 5.5V
when VIN is greater than 6V. EXTVCC connects to INTVCC
through a P-channel MOSFET and can supply the needed
power when its voltage is higher than 4.7V. Either of these
can supply a peak current of 100mA and must be bypassed
to ground with a minimum of 4.7µF ceramic capacitor or
low ESR electrolytic capacitor. No matter what type of bulk
capacitor is used, an additional 0.1µF ceramic capacitor
placed directly adjacent to the INTVCC and PGND pins is
highly recommended. Good bypassing is needed to supply the high transient currents required by the MOSFET
gate drivers. High input voltage applications in which the
internal MOSFETs are being driven at high frequencies
may cause the maximum junction temperature rating for
the LTC7130 to be exceeded. The INTVCC current, which
is dominated by the gate charge current, also known as
the driver current, may be supplied by either the 5.5V LDO
or EXTVCC. When the voltage on the EXTVCC pin is less
than 4.5V, the LDO is enabled. The gate charge current
is dependent on operating frequency as discussed on Efficiency Considerations section. The power dissipation for
the IC in this case is equal to VIN • INTVCC. For example,
the LTC7130 INTVCC current is about 27.5mA from a 20V
supply in the BGA package not using the EXTVCC:
PD = 20V • 27.5mA = 0.55W
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23
LTC7130
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To reduce the total power loss and prevent the maximum
junction temperature from being exceeded due to the IC,
the EXTVCC pin can be used to provide MOSFET gate drive
and control power. When the voltage applied to EXTVCC
rises above 4.7V, the INTVCC LDO is turned off and the
EXTVCC is connected to the INTVCC. The EXTVCC remains
on as long as the voltage applied to EXTVCC remains above
4.5V. Using the EXTVCC allows the MOSFET driver and
control power to be derived from an efficient switching
regulator output during normal operation. If more current is required through the EXTVCC than is specified, an
external Schottky diode can be added between the EXTVCC
and INTVCC pins. Do not apply more than 6V to the EXTVCC
pin and make sure that EXTVCC < VIN.
in Figure 12 to minimize the voltage drop caused by the
gate charge current. This will override the INTVCC linear
regulator and will prevent INTVCC from dropping too low
due to the dropout voltage. Make sure the INTVCC voltage
is at or exceeds the RDS(ON) test voltage for the MOSFET
which is typically 4.5V for logic-level devices.
Significant efficiency and thermal gains can be realized
by powering INTVCC from EXTVCC, since the VIN current
resulting from the driver and control currents will be scaled
by a factor of (duty cycle)/(switcher efficiency). Tying the
EXTVCC pin to a 5V supply reduces power loss of the IC to:
Topside MOSFET Driver Supply (CB, DB)
PD = 5V • 24.5mA = 0.14W
However, for low voltage outputs, additional circuitry is
required to derive INTVCC power from the output.
The following list summarizes the three possible connections for EXTVCC:
1. EXTVCC grounded. This will cause INTVCC to be powered from the internal LDO resulting in an efficiency
penalty of up to 10% at high input voltages.
2. EXTVCC connected to an external supply. If a 5V external
supply is available, it may be used to power EXTVCC
providing it is compatible with the MOSFET gate drive
requirements.
3. EXTVCC connected to an output-derived boost network.
For 3.3V and other low voltage regulators, efficiency
gains can still be realized by connecting EXTVCC to an
output-derived voltage that has been boosted to greater
than 4.7V.
For applications where the main input power is 5V, tie
the VIN and INTVCC pins together and tie the combined
pins to the 5V input with a 1Ω or 2.2Ω resistor as shown
24
LTC7130
VIN
INTVCC
RVIN
1Ω
CINTVCC
4.7µF
+
5V
CIN
7130 F12
Figure 12. Setup for a 5V Input
External bootstrap capacitor, CB, connected to the BOOST
pin supplies the gate drive voltages for the topside MOSFET. Capacitor CB in the Functional Diagram is charged
through external diode DB from INTVCC when the SW pin
is low. When the topside MOSFET is to be turned on, the
driver places the CB voltage across the gate source of the
MOSFET. This enhances the MOSFET and turns on the
topside switch. The switch node voltage, SW, rises to VIN
and the BOOST pin follows. With the topside MOSFET on,
the boost voltage is above the input supply:
VBOOST = VIN + VINTVCC – VDB
The value of the boost capacitor, CB, needs to store
approximately 100 times the gate charge required by
the topside MOSFET(s). The reverse breakdown of the
external Schottky diode must be greater than VIN(MAX).
When adjusting the gate drive level, the final arbiter is the
total input current for the regulator. If a change is made
and the input current decreases, then the efficiency has
improved. If there is no change in input current, then there
is no change in efficiency.
For applications that require high VIN and high output
current, in order to minimize SW node ringing and EMI,
connect a 2Ω to 10Ω resistor RBOOST in series with the
BOOST pin. Make the CB and DB connections on the
other side of the resistor. This series resistor helps to
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slow down the SW node rise time, limiting the high dl/
dt current through the top MOSFET that causes SW node
ringing (see Figure 13).
LTC7130
INTVCC
BOOST
DB
RBOOST
CBB
SW
7130 F13
Figure 13. Using Boost Resistor
Setting Output Voltage
The LTC7130 output voltage is set by an external feedback
resistive divider carefully placed across the DIFFOUT pin,
as shown in Figure 14. The regulated output voltage is
determined by:
⎛ R ⎞
VOUT = 0.6V • ⎜1+ B ⎟
⎝ RA ⎠
RB
∆IL(SC) = tON(MIN) •
VIN
L
The resulting short-circuit current is:
⎛ 1/3 VSENSE(MAX) 1
⎞
ISC = ⎜
– ∆IL (SC) ⎟
2
RSENSE
⎝
⎠
After a short, or while starting with internal soft-start, make
sure that the load current takes the folded-back current
limit into account.
DIFFOUT
LTC7130
maximum sense voltage is progressively lowered from
its maximum programmed value to one-third of the maximum value. Foldback current limiting is disabled during
the soft-start or tracking up using the TK/SS pin. It is not
disabled for internal soft-start. Under short-circuit conditions with very low duty cycles, the LTC7130 will begin
cycle skipping in order to limit the short-circuit current.
In this situation the bottom MOSFET will be dissipating
most of the power but less than in normal operation. The
short circuit ripple current is determined by the minimum
on-time tON(MIN) of the LTC7130 (≈90ns), the input voltage
and inductor value:
CFF
VFB
Phase-Locked Loop and Frequency Synchronization
RA
7130 F14
Figure 14. Setting Output Voltage
To improve the frequency response, a feedforward capacitor, CFF , may be used. Great care should be taken to
route the VFB line away from noise sources, such as the
inductor or the SW line.
To minimize the effect of the voltage drop caused by high
current flowing through board conductance; connect DIFFN
and DIFFP sense lines close to the ground and the load
output respectively.
Fault Conditions: Current Limit and Current Foldback
The LTC7130 includes current foldback to help limit load
current when the output is shorted to ground. If the output falls below 50% of its nominal output level, then the
The LTC7130 has a phase-locked loop (PLL) comprised
of an internal voltage-controlled oscillator (VCO) and a
phase detector. This allows the turn-on of the top MOSFET
to be locked to the rising edge of an external clock signal
applied to the MODE/PLLIN pin. The phase detector is
an edge sensitive digital type that provides zero degrees
phase shift between the external and internal oscillators.
This type of phase detector does not exhibit false lock to
harmonics of the external clock.
The output of the phase detector is a pair of complementary current sources that charge or discharge the internal
filter network. There is a precision 10µA current flowing
out of the FREQ pin. This allows the user to use a single
resistor to SGND to set the switching frequency when
no external clock is applied to the MODE/PLLIN pin. The
internal switch between the FREQ pin and the integrated
PLL filter network is on, allowing the filter network to be
pre-charged to the same voltage as the FREQ pin. The
7130fb
For more information www.linear.com/LTC7130
25
LTC7130
APPLICATIONS INFORMATION
relationship between the voltage on the FREQ pin and
operating frequency is shown in Figure 15 and specified
in the Electrical Characteristics table. If an external clock
is detected on the MODE/PLLIN pin, the internal switch
mentioned above turns off and isolates the influence of the
FREQ pin. Note that the LTC7130 can only be synchronized
to an external clock whose frequency is within range of
the LTC7130’s internal VCO. This is guaranteed to be
between 250kHz and 770kHz. A simplified block diagram
is shown in Figure 16.
If the external clock frequency is greater than the internal oscillator’s frequency, fOSC, then current is sourced
continuously from the phase detector output, pulling up
the filter network. When the external clock frequency is
less than fOSC, current is sunk continuously, pulling down
900
800
the filter network. If the external and internal frequencies
are the same but exhibit a phase difference, the current
sources turn on for an amount of time corresponding to
the phase difference. The voltage on the filter network is
adjusted until the phase and frequency of the internal and
external oscillators are identical. At the stable operating
point, the phase detector output is high impedance and
the filter capacitor CLP holds the voltage.
Typically, the external clock (on the MODE/PLLIN pin) input
high threshold is 1.6V, while the input low threshold is 1V.
Minimum On-Time Considerations
Minimum on-time, tON(MIN), is the smallest time duration
that the LTC7130 is capable of turning on the top MOSFET.
It is determined by internal timing delays and the gate
charge required to turn on the top MOSFET. Low duty
cycle applications may approach this minimum on-time
limit and care should be taken to ensure that:
FREQUENCY (kHz)
700
tON(MIN) <
600
500
400
300
200
100
0
0
0.5
1
1.5
FREQ PIN VOLTAGE (V)
2
2.5
7130 F15
Figure 15. Relationship Between Oscillator Frequency
and Voltage at the FREQ Pin
2.4V 5.5V
10µA
RSET
FREQ
MODE/PLLIN
EXTERNAL
OSCILLATOR
DIGITAL
SYNC
PHASE/
FREQUENCY
DETECTOR
VCO
VOUT
VIN ( f)
If the duty cycle falls below what can be accommodated
by the minimum on-time, the controller will begin to skip
cycles. The output voltage will continue to be regulated,
but the voltage ripple and current ripple will increase. The
minimum on-time for the LTC7130 is approximately 90ns,
with good PCB layout, minimum 50% inductor current
ripple and at least 2mV ripple on the current sense signal.
The minimum on-time can be affected by PCB switching noise in the voltage and current loop. As the peak
sense voltage decreases the minimum on-time gradually
increases to about 110ns. This is of particular concern in
forced continuous applications with low ripple current at
light loads. If the duty cycle drops below the minimum
on-time limit in this situation, a significant amount of cycle
skipping can occur with correspondingly larger current
and voltage ripple.
Efficiency Considerations
7130 F16
Figure 16. Phase-Locked Loop Block Diagram
26
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
7130fb
For more information www.linear.com/LTC7130
LTC7130
APPLICATIONS INFORMATION
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can
be expressed as:
% Efficiency = 100%–(L1 + L2 + L3 +…)
where L1, L2, etc. are the individual losses as a percentage of input power.
Although all dissipative elements in the circuit produce
losses, three main sources usually account for most of
the losses in LTC7130 circuits: 1) I2R losses, 2) switching
and biasing losses, 3) other losses.
1. I2R losses are calculated from the DC resistances of
the internal switches, RSW, and external inductor, RL.
In continuous mode, the average output current flows
through inductor L but is “chopped” between the
internal top and bottom power MOSFETs. Thus, the
series resistance looking into the SW pin is a function
of both top and bottom MOSFET RDS(ON) and the duty
cycle (DC) as follows:
RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1-DC)
The RDS(ON) for both the top and bottom MOSFETs can be
obtained from the Typical Performance Characteristics
curves. Thus to obtain I2R losses:
I2R losses = IOUT2(RSW + RL)
2. The INTVCC current is the sum of the power MOSFET
driver and control currents. The power MOSFET driver
current results from switching the gate capacitance of
the power MOSFETs. Each time a power MOSFET gate is
switched from low to high to low again, a packet of charge
dQ moves from INTVCC to ground. The resulting dQ/dt
is a current out of INTVCC that is typically much larger
than the DC control bias current. In continuous mode,
IGATECHG = f(QT + QB), where QT and QB are the gate
charges of the internal top and bottom power MOSFETs
and f is the switching frequency. Since INTVCC is a low
dropout regulator output powered by VIN, its power
loss equals:
PLDO = VIN • IINTVCC
3. Other “hidden” losses such as transition loss and copper trace and internal load resistances can account
for additional efficiency degradations in the overall
power system. It is very important to include these
“system” level losses in the design of a system. Transition loss arises from the brief amount of time the top
power MOSFET spends in the saturated region during
switch node transitions. Other losses including diode
conduction losses during dead-time and inductor core
losses which generally account for less than 2% total
additional loss.
Checking Transient Response
The regulator loop response can be checked by looking at
the load current transient response. Switching regulators
take several cycles to respond to a step in DC (resistive)
load current. When a load step occurs, VOUT shifts by an
amount equal to ∆ILOAD • ESR, where ESR is the effective
series resistance of COUT . ∆ILOAD also begins to charge or
discharge COUT, generating the feedback error signal that
forces the regulator to adapt to the current change and
return VOUT to its steady-state value. During this recovery
time VOUT can be monitored for excessive overshoot or
ringing, which would indicate a stability problem. The
availability of the ITH pin not only allows optimization of
control loop behavior but also provides a DC-coupled and
AC-filtered closed-loop response test point. The DC step,
rise time and settling at this test point truly reflects the
closed-loop response. Assuming a predominantly second
order system, phase margin and/or damping factor can
be estimated using the percentage of overshoot seen at
this pin. The bandwidth can also be estimated by examining the rise time at the pin. The ITH external components
shown in the Typical Application circuit will provide an
adequate starting point for most applications. The ITH series
RC-CC filter sets the dominant pole-zero loop compensation.
The values can be modified slightly (from 0.5 to 2 times
their suggested values) to optimize transient response
once the final PC layout is done and the particular output
capacitor type and value have been determined. The output
capacitors need to be selected because the various types
and values determine the loop gain and phase. An output
current pulse of 20% to 80% of full-load current having a
7130fb
For more information www.linear.com/LTC7130
27
LTC7130
APPLICATIONS INFORMATION
rise time of 1µs to 10µs will produce output voltage and
ITH pin waveforms that will give a sense of the overall
loop stability without breaking the feedback loop. Placing
a power MOSFET directly across the output capacitor and
driving the gate with an appropriate signal generator is a
practical way to produce a realistic load step condition. The
initial output voltage step resulting from the step change
in output current may not be within the bandwidth of the
feedback loop, so this signal cannot be used to determine
phase margin. This is why it is better to look at the ITH
pin signal which is in the feedback loop and is the filtered
and compensated control loop response. The gain of the
loop will be increased by increasing RC and the bandwidth
of the loop will be increased by decreasing CC. If RC is
increased by the same factor that CC is decreased, the
zero frequency will be kept the same, thereby keeping the
phase shift the same in the most critical frequency range
of the feedback loop. The output voltage settling behavior
is related to the stability of the closed-loop system and
will demonstrate the actual overall supply performance.
A second, more severe transient is caused by switching
in loads with large (>1µF) supply bypass capacitors. The
discharged bypass capacitors are effectively put in parallel
with COUT , causing a rapid drop in VOUT . No regulator can
alter its delivery of current quickly enough to prevent this
sudden step change in output voltage if the load switch
resistance is low and it is driven quickly. If the ratio of
CLOAD to COUT is greater than 1:50, the switch rise time
should be controlled so that the load rise time is limited
to approximately 25 • CLOAD. Thus a 10µF capacitor would
require a 250µs rise time, limiting the charging current
to about 200mA.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the IC. These items are also illustrated graphically in the
layout diagram of Figure 17. Check the following in the
PC layout:
1. The INTVCC decoupling capacitor should be placed
immediately adjacent to the IC between the INTVCC pin
and PGND plane. A 1µF ceramic capacitor of the X7R
or X5R type is small enough to fit very close to the IC
to minimize the ill effects of the large current pulses
drawn to drive the bottom MOSFETs. An additional
4.7µF to 10µF of ceramic, tantalum or other very low
ESR capacitance is recommended in order to keep the
internal IC supply quiet.
2. Place the feedback divider between the + and – terminals of COUT. Route DIFFP and DIFFN with minimum
PC trace spacing from the IC to the feedback divider.
3. Are the SNSD+, SNSA+ and SNS– printed circuit traces
routed together with minimum PC trace spacing? The
filter capacitors between SNSD+, SNSA+ and SNS–
should be as close as possible to the pins of the IC.
Connect the SNSD+ and SNSA+ pins to the filter resistors
as illustrated in Figure 3.
L1
VIN
SW2
RIN
+
CIN
D1
VOUT
DCR
SW1
COUT
+
RL
7130 F17
BOLD LINES INDICATE HIGH, SWITCHING CURRENTS. KEEP LINES TO A MINIMUM LENGTH
Figure 17. Branch Current Waveforms
28
7130fb
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LTC7130
APPLICATIONS INFORMATION
4. Do the (+) plates of CIN connect to the drain of the
topside MOSFET as closely as possible? This capacitor
provides the pulsed current to the MOSFET.
5. Keep the switching nodes, SW, BOOST away from sensitive small-signal nodes (SNSD+, SNSA+, SNS–, DIFFP,
DIFFN, VFB). Ideally the SW, and BOOST printed circuit
traces should be routed away and separated from the
IC and especially the quiet side of the IC. Separate the
high dv/dt traces from sensitive small-signal nodes with
ground traces or ground planes.
6. Use a low impedance source such as a logic gate to
drive the MODE/PLLIN pin and keep the lead as short
as possible.
7. The 47pF to 330pF ceramic capacitor between the ITH
pin and signal ground should be placed as close as
possible to the IC. Figure 17 illustrates all branch currents in a switching regulator. It becomes very clear
after studying the current waveforms why it is critical to
keep the high switching current paths to a small physical
size. High electric and magnetic fields will radiate from
these loops just as radio stations transmit signals. The
output capacitor ground should return to the negative
terminal of the input capacitor and not share a common ground path with any switched current paths. The
left half of the circuit gives rise to the noise generated
by a switching regulator. The GND terminations and
Schottky diode should return to the bottom plate(s)
of the input capacitor(s) with a short isolated PC trace
since very high switched currents are present. External
OPTI-LOOP® compensation allows overcompensation
for PC layouts which are not optimized but this is not
the recommended design procedure.
8. Are the signal and power grounds kept separate? The
combined IC signal ground pin and the ground return of
CINTVCC must return to the combined COUT (–) terminals.
The VFB and ITH traces should be as short as possible.
The output capacitor (–) terminals should be connected
as close as possible to the (–) terminals of the input
capacitor by placing the capacitors next to each other
and away from the Schottky loop described above.
9. Use a modified “star ground” technique: a low impedance, large copper area central grounding point on
the same side of the PC board as the input and output
capacitors with tie-ins for the bottom of the INTVCC
decoupling capacitor, the bottom of the voltage feedback
resistive divider and the SGND pin of the IC.
Design Example
As a design example of the front page circuit for a single
channel high current regulator, assume VIN = 12V(nominal),
VIN = 20V(maximum), VOUT = 1.5V, IMAX = 20A, and
f = 500kHz (see front page schematic).
The regulated output voltage is determined by:
⎛ R ⎞
VOUT = 0.6V • ⎜1+ B ⎟
⎝ RA ⎠
Using a 20k 1% resistor from the VFB node to ground,
the top feedback resistor is (to the nearest 1% standard
value) 30.1k.
The frequency is set by biasing the FREQ pin to 1.2V (see
Figure 15).
The inductance value is based on a 50% maximum ripple
current assumption (10A). The highest value of ripple
current occurs at the maximum input voltage:
L=
VOUT
f • ∆IL(MAX)
⎛
⎞
⎜1− VOUT ⎟
⎜ V
⎟
IN(MAX) ⎠
⎝
This design will require 0.25µH. The Würth 744308025,
0.25µH inductor is chosen. At the nominal input voltage
(12V), the ripple current will be:
∆IL(NOM) =
⎞
VOUT ⎛
V
⎜1− OUT ⎟
f • L ⎜⎝ VIN(NOM) ⎟⎠
It will have 10.5A (52.5%) ripple. The peak inductor current will be the maximum DC value plus one-half the ripple
current, or around 25A.
7130fb
For more information www.linear.com/LTC7130
29
LTC7130
TYPICAL APPLICATIONS
The minimum on-time occurs at the maximum VIN, and
should not be less than 90ns:
tON(MIN) =
VOUT
VIN(MAX)f
=
1.5V
= 150ns
20V(500kHz)
DCR sensing is used in this circuit. If C1 and C2 are chosen
to be 220nF, based on the chosen 0.25µH inductor with
0.37mΩ DCR, R1 and R2 can be calculated as:
L
= 3.07k
DCR • C1
L
R2 =
= 614Ω
DCR • C2 • 5
R1=
For a 0.37mΩ DCR, a short-circuit to ground will result
in a folded back current of:
ISC =
(1/ 3) 15mV 1 ⎛⎜ 90ns(20V) ⎞⎟
– ⎜⎜
⎟⎟ ≈ 10A
0.37mΩ
2 ⎝ 0.25µH ⎠
COUT is chosen with an equivalent ESR of 4.5mΩ for low
output ripple. The output ripple in continuous mode will be
highest at the maximum input voltage. The output voltage
ripple due to ESR is approximately:
VORIPPLE = RESR (∆IL) ≈ 0.0045Ω • 10A = 45mVP-P
Further reductions in output voltage ripple can be made
by placing a 100µF ceramic capacitor across COUT.
Choose R1 = 3.09k and R2 = 619Ω.
Very Low Output Ripple Converter
The maximum DCR of the inductor is 0.4mΩ. The
VSENSE(MAX) is calculated as:
Although the LTC7130 recommends 50% inductor ripple
for most it’s applications, for applications that need very
small output ripple, the inductance can be increased to
achieve smaller output ripple.
VSENSE(MAX) = 25A • DCRMAX = 10mV
The current limit is chosen to be 15mV. If temperature
variation is considered, please refer to Inductor DCR
Sensing Temperature Compensation with NTC Thermistor.
30
The schematic as shown Figure 18 is similar to that of the
front page circuit, except that three times the inductance
and double the output capacitance are used. The compensation components are changed to maintain the same
crossover frequency and phase margin. Figure 19 shows
the transient response of 10A load step, and Figure 20
demonstrates that the output voltage ripple is a factor of
six smaller than that of typical current mode converters.
7130fb
For more information www.linear.com/LTC7130
LTC7130
TYPICAL APPLICATIONS
VIN
5V TO
20V
2.2Ω
1µF
10µF
x2
220µF
SVIN
INTVCC ILIM ITEMP
BOOST
0.22µF
RUN
SW
MODE/PLLIN
SNSD+
ITH
26.1k
CMDSH3
VIN
PINS NOT USED
IN THIS CIRCUIT:
EXTVCC
PGOOD
CLKOUT
3.3nF
4.7µF
220pF
LTC7130
220nF
SNSA+
VFB
20k
30.1k
COUT
470µF
×4
220nF
FREQ
121k
2.49k
VOUT
1.5V
20A
SNS–
TK/SS
0.1µF
0.72µH,
DCR = 1.3mΩ,
744325072
DIFFOUT
SGND GND
DIFFN
499Ω
DIFFP
7130 F18
Figure 18. High Efficiency, 1.5V/15A Step-Down Converter with Very Low Output Ripple
Very Low Output Voltage Ripple
VOUT
TYPICAL
FRONT PAGE
AC–COUPLED
10mV/DIV
VOUT
AC–COUPLED
100mV/DIV
VOUT
LOW RIPPLE
FIGURE 18
AC–COUPLED
10mV/DIV
ILOAD
5A/DIV
20µs/DIV
7130 F19
2µs/DIV
VIN = 12V
ILOAD = 1A to 10A
Figure 19. Load Step Transient Response
7130 F20
Figure 20. Very Low Output Voltage Ripple
7130fb
For more information www.linear.com/LTC7130
31
LTC7130
TYPICAL APPLICATIONS
High Efficiency, Dual Phase Very Low DCR Sensing 1.2V/40A Step-Down Supply
VIN
7V TO
14V
2.2Ω
180µF
×2
INTVCC
SW
MODE/PLLIN
RUN
RUN
TK/SS
120pF
U1
LTC7130
TK/SS
0.1µF
137k
1.8Ω
0.22µF
ILIM
ITH
2.49k
PGOOD
BOOST
VIN
1/4 VINTVCC
ITH
CMDSH3
120k
PGOOD
SVIN
U1 PINS NOT USED
IN THIS CIRCUIT:
EXTVCC
PGOOD
ITEMP
3.3nF
4.7µF
1µF
10µF
×2
220nF
20k
COUT
330µF
×2
VOUT
1.2V
40A
SNS–
220nF
619Ω
SNSA+
VFB
20k
100µF
×2
3.09k
SNSD+
FREQ
VFB
0.25µH,
DCR = 0.37mΩ,
WURTH
744308025
DIFFOUT CLKOUT SGND GND DIFFN DIFFP
2.2Ω
SVIN
U2 PINS NOT USED
IN THIS CIRCUIT:
EXTVCC
CLKOUT
DIFFOUT
ITEMP
4.7µF
1µF
10µF
×2
220µF
MODE/PLLIN
INTVCC PGOOD
BOOST
VIN
ITH
RUN
RUN
1/4 VINTVCC
ILIM
ITH
120pF
TK/SS
TK/SS
CMDSH3
PGOOD
1.8Ω
0.22µF
SW
SNSD+
U2
LTC7130
220nF
VFB
COUT
330µF
×2
220nF
SNSA+
VFB
SGND
100µF
×2
SNS–
FREQ
137k
3.09k
0.25µH,
DCR = 0.37mΩ,
WURTH
744308025
GND
DIFFN
619Ω
DIFFP
7130 TA03
32
7130fb
For more information www.linear.com/LTC7130
LTC7130
PACKAGE PHOTOGRAPHS
7130fb
For more information www.linear.com/LTC7130
33
For more information www.linear.com/LTC7130
aaa Z
0.4 ±0.025 Ø 63x
4
1.60
SUGGESTED PCB LAYOUT
TOP VIEW
0.80
PACKAGE TOP VIEW
E
0.000
PIN “A1”
CORNER
0.80
34
1.60
Y
3.20
2.40
1.60
0.80
0.000
0.80
1.60
2.40
3.20
X
D
aaa Z
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SYMBOL
A
A1
A2
b
b1
D
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H2
aaa
bbb
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SUBSTRATE
A1
NOM
2.22
0.40
1.82
0.50
0.40
7.50
6.25
0.80
6.40
4.80
0.32
1.50
A
A2
0.37
1.55
0.15
0.10
0.12
0.15
0.08
MAX
2.37
0.45
1.92
0.55
0.43
NOTES
DETAIL B
PACKAGE SIDE VIEW
TOTAL NUMBER OF BALLS: 63
0.27
1.45
MIN
2.07
0.35
1.72
0.45
0.37
b1
DIMENSIONS
ddd M Z X Y
eee M Z
DETAIL A
Øb (63 PLACES)
DETAIL B
H2
MOLD
CAP
ccc Z
Z
(Reference LTC DWG # 05-08-1988 Rev Ø)
BGA Package
63-Lead (7.5mm × 6.25mm × 2.22mm)
e
b
5
G
4
3
e
2
1
DETAIL A
PACKAGE BOTTOM VIEW
6
PIN 1
3
SEE NOTES
J
H
G
F
E
D
C
B
A
7
SEE NOTES
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
BALL DESIGNATION PER JESD MS-028 AND JEP95
TRAY PIN 1
BEVEL
COMPONENT
PIN “A1”
7
!
PACKAGE IN TRAY LOADING ORIENTATION
LTMXXXXXX
µModule
BGA 63 0914 REV Ø
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
5. PRIMARY DATUM -Z- IS SEATING PLANE
4
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
F
b
7
LTC7130
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/product/LTC7130#packaging for the most recent package drawings.
7130fb
2.40
2.40
LTC7130
REVISION HISTORY
REV
DATE
DESCRIPTION
A
07/16
Modified IQ conditions
PAGE NUMBER
Changed RUN threshold value
B
05/17
3
8, 12, 13, 22
Modified INTVCC/EXTVCC section, added Note 7
11
Corrected pin number of Boost pin
8
7130fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection
of its circuits
as described
herein will not infringe on existing patent rights.
For more
information
www.linear.com/LTC7130
35
LTC7130
TYPICAL APPLICATION
5V/5A Step-Down Converter
2.2Ω
VIN
12V
4.7µF
1µF
10µF
x2
180µF
x2
SVIN
PINS NOT USED
IN THIS CIRCUIT:
ITEMP
CLKOUT
DIFFOUT
INTVCC
28.7k
PGOOD
BOOST
VIN
ILIM
CMDSH3
2.2Ω
SW
MODE/PLLIN
SNSA+
ITH
2.2nF
120k
100pF
0.1µF
100k
LTC7130
VOUT
5V
5A
1.82k
100µF
×2
220nF
TK/SS
SNS–
FREQ
EXTVCC
COUT
470µF
×2
147k
VFB
RUN
SNSD+
1.8µH
DCR = 4.05mΩ,
COILCRAFT
0.22µF XAL7070-182ME
SGND
GND
DIFFN
DIFFP
20k
7130 TA02
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LTC3605/
LTC3605A
20V, 5A Synchronous Step-Down Regulator
4V < VIN < 20V, 0.6V < VOUT < 20V, 96% Max Efficiency, 4mm × 4mm
QFN-24 Package
LTC3633A
LTC3633A-1
Dual Channel 3A, 20V Monolithic Synchronous
Step‑Down Regulator
3.6V < VIN < 20V, 0.6V < VOUT < VIN, 95% Max Efficiency, 4mm × 5mm
QFN-28 and TSSOP-28 Package
LTC3622
17V, Dual 1A Synchronous Step-Down Regulator with
Ultralow Quiescent Current
2.7V < VIN < 17V, 0.6V < VOUT < VIN, 95% Max Efficiency, 3mm × 4mm
DFN-14 and MSOP-16 Package
LTC3613
24V, 15A Monolithic Step-Down Regulator with
Differential Output Sensing
4.5V < VIN < 24V, 0.6V < VOUT < 5.5V, 0.67% Output Voltage Accuracy,
Valley Current Mode, Programmable from 200kHz to 1MHz, Current
Sensing, 7mm × 9mm QFN-56 Package
LTC3624
17V, 2A Synchronous Step-Down Regulator with
3.5μA Quiescent Current
2.7V < VIN < 17V, 0.6V < VOUT < VIN, 95% Max Efficiency, 3.5μA IQ,
Zero‑Current Shutdown, 3mm × 3mm DFN-8 Package
LTM®4639
Low VIN 20A DC/DC μModule® Step-Down Regulator
Complete 20A Switch Mode Power Supply, 2.375V < VIN < 7V, 0.6V < VOUT
< 5.5V, 1.5% Max Total DC Output Voltage Error, Differential Remote
Sense Amp, 15mm × 15mm BGA Package
LTM4637
20A DC/DC μModule Step-Down Regulator
Complete 20A Switch Mode Power Supply, 4.5V < VIN < 20V, 0.6V < VOUT
< 5.5V, 1.5% Max Total DC Output Voltage Error, Differential Remote
Sense Amp, 15mm × 15mm BGA or LGA Package
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7130fb
LT 0517 REV B • PRINTED IN USA
For more information www.linear.com/LTC7130
www.linear.com/LTC7130
 LINEAR TECHNOLOGY CORPORATION 2016