TI ECJ3VB1C104K This document contains the following chapter Datasheet

DAC7573, DAC6573, and
DAC5573 Evaluation Module
User’s Guide
January 2004
Data Acquisition
SLAU125
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Amplifiers
Applications
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2004, Texas Instruments Incorporated
EVM IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION
PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided
may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective
considerations, including product safety measures typically found in the end product incorporating the goods.
As a prototype, this product does not fall within the scope of the European Union directive on electromagnetic
compatibility and therefore may not meet the technical requirements of the directive.
Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be returned
within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE
WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED,
IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY
PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user
indemnifies TI from all claims arising from the handling or use of the goods. Please be aware that the products
received may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). Due to the open construction
of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic
discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE
TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not
exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein.
Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM
User’s Guide prior to handling the product. This notice contains important safety information about temperatures
and voltages. For further safety concerns, please contact the TI application engineer.
Persons handling the product must have electronics training and observe good laboratory practice standards.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any
machine, process, or combination in which such TI products or services might be or are used.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright  2004, Texas Instruments Incorporated
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 0 V - VDD +0.3 V and the
output voltage range of ±4.5 V and ±18 V.
Exceeding the specified input range may cause unexpected operation and/or irreversible
damage to the EVM. If there are questions concerning the input range, please contact a TI
field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or
possible permanent damage to the EVM. Please consult the EVM User’s Guide prior to
connecting any load to the EVM output. If there is uncertainty as to the load specification,
please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than
100°C. The EVM is designed to operate properly with certain components above 100°C as
long as the input and output ranges are maintained. These components include but are not
limited to linear regulators, switching transistors, pass transistors, and current sense
resistors. These types of devices can be identified using the EVM schematic located in the
EVM User’s Guide. When placing measurement probes near these devices during operation,
please be aware that these devices may be very warm to the touch.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright  2004, Texas Instruments Incorporated
Information About Cautions and Warnings
Preface
Read This First
About This Manual
This user’s guide describes the characteristics, operation, and the use of the
DAC7573, DAC6573, DAC5573 Evaluation Module. It covers all pertinent
areas involved to properly use this EVM board along with the devices that it
supports. The physical PCB layout, schematic diagram and circuit
descriptions are included.
How to Use This Manual
This document contains the following chapters:
Chapter 1 – EVM Overview
Chapter 2 – PCB Design
Chapter 3 – EVM Operation
Information About Cautions and Warnings
This book may contain cautions and warnings.
This is an example of a caution statement.
A caution statement describes a situation that could potentially
damage your software or equipment.
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you.
iii
Trademarks
The information in a caution or a warning is provided for your protection.
Please read each caution and warning carefully.
Related Documentation From Texas Instruments
To obtain a copy of any of the following TI documents, call the Texas
Instruments Literature Response Center at (800) 477–8924 or the Product
Information Center (PIC) at (972) 644–5580. When ordering, identify this
manual by its title and literature number. Updated documents can also be
obtained through our Web site at www.ti.com.
Data Sheets:
Literature Number:
DAC7573
SLAS398
DAC6573
SLAS402
DAC5573
SLAS401
REF02
SBVS - 003A
OPA627
PDS - 998H
OPA2132
PDS - 1309B
Questions about this or other Data Converter EVMs?
If you have questions about this or other Texas Instruments Data Converter
evaluation modules, feel free to e-mail the Data Converter Application Team
at [email protected] Include in the subject heading the product you
have questions or concerns with.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested
for compliance with the limits of computing devices pursuant to subpart J of
part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case
the user at his own expense will be required to take whatever measures may
be required to correct this interference.
Trademarks
I2C is a trademark of Philips Corporation.
iv
Contents
Contents
1
EVM Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2
Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2.1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2.2 Reference Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3
EVM Basic Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
1-2
1-2
1-2
1-3
1-3
2
PCB Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1
PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.2
Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
3
EVM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1
Factory Default Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2
Host Processor Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3
EVM Stacking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4
Output Op Amp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.1 Unity Gain Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.2 Output Gain of Two . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.3 Capacitive Load Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.4 Optional Signal Conditioning Op Amp (U8B) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5
Jumper Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6
Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-1
3-2
3-2
3-3
3-3
3-4
3-4
3-5
3-5
3-6
3-7
v
Contents
Figures
1-1
2-1
2-2
2-3
2-4
2-5
2-6
2-7
EVM Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Top Silkscreen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Layer 1 (Top Signal Plane) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Layer 2 (Ground Plane) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Layer 3 (Power Plane) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Layer 4 (Bottom Signal Plane) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bottom Silkscreen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Drill Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-4
2-3
2-3
2-3
2-4
2-4
2-4
2-5
Tables
1-1
2-1
3-1
3-2
3-3
3-4
3-5
3-6
vi
Featured DAC Selections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DACx573EVM Factory-Default Jumper Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DACx573 Output Channel Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Unity Gain Output Jumper Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Gain of Two Output Jumper Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Capacitive-Load Drive Jumper Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Jumper Setting Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-2
2-6
3-2
3-3
3-4
3-4
3-5
3-6
Chapter 1
EVM Overview
This chapter gives a general overview of the DAC7573, DAC6573, and
DAC5573 evaluation module (EVM), and describes some of the factors that
must be considered in using this module.
Topic
Page
1.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.2
Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.3
EVM Basic Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
EVM Overview
1-1
Features
1.1 Features
This EVM features the DAC7573, DAC6573 and DAC5573 family of
digital - to - analog converters. In this user’s guide, the EVM is referred to as the
DACx573 EVM to cover all supported DAC parts. The DACx573 EVM provides
a quick and easy way to evaluate the functionality and performance of these
12 - bit, 10- bit, and 8- bit resolution, quad- channel, and serial I2C-input DACs.
The following table shows the three DAC types this EVM supports. The EVM
also provides an I2C serial interface to communicate with any host
microprocessor- or TI DSP-based system.
Table 1 - 1. Featured DAC Selections
EVM Version
Installed Device (DUT)
DAC Channels
Resolution
DAC7573 EVM
DAC7573IPW
4
12-Bit
DAC6573 EVM
DAC6573IPW
4
10-Bit
DAC5573 EVM
DAC5573IPW
4
8-Bit
1.2 Power Requirements
This section describes the power requirements of this EVM.
1.2.1
Supply Voltage
The power supply requirement for the digital section (VDD) of this EVM is
typically 5 V, connected via J5-1 or J6-10 when used with another EVM or
interface card. It is referenced to ground through the J5-2 and J6- 5 terminals.
The power supply requirements for the analog section of this EVM are as
follows:
VCC and VSS range from 15.75 V to - 15.75 V maximum, and connects
through J1-3 and J1-1 respectively, or through the J6-1 and J6-2 terminals.
The 5-VA supply connects through J5-3 or J6-3 and the 3.3-VA supply connects through J6-8.
All analog power supplies are referenced to analog ground through the
J1-2 and J6-6 terminals.
The analog power supply for the device under test (DUT), U1, can be supplied
by either 5 VA or 3.3 VA via jumper W1. This allows the DACx573 analog
section to operate from either supply while the I/O and digital section is
powered by 5 V, VDD.
The VCC supply is mainly used as the positive rail of the external output
operational amplifier (op amp), U2, the reference chip, U3, and the reference
buffer, U8. The negative rail of the output op amp, U2, can be selected between
VSS and AGND via jumper W5. The external op amp is installed as an option
to provide output signal conditioning, to boost capacitive load drive (via W15),
and for other output-mode requirements.
1-2
EVM Basic Functions
Caution
To avoid potential damage to the EVM board, make sure that the
correct cables are connected to their respective terminals as
labeled on the EVM board.
Stresses above the maximum listed voltage ratings may cause
permanent damage to the device.
1.2.2
Reference Voltage
The 5-V precision voltage reference is provided to supply the external voltage
reference for the DAC through REF02, U3, via jumper W4 by shorting pins 1
and 2. The reference voltage goes through 100-kΩ potentiometer R11 in
series with 20-kΩ R10 to allow the user to adjust the reference voltage to a
desired level. The voltage reference is then buffered through U8A to the DUT.
Test points TP1, TP2, and TP5 are also provided, as well as J4- 18 and J4- 20,
to allow the user to connect another external reference source if the onboard
reference circuit is not used. The external voltage reference must not exceed
5 Vdc.
The REF02 precision reference is powered by VCC (15 V) through the J1 - 3
or J6 - 1 terminal.
Caution
When applying an external voltage reference through TP1 or J4- 20,
make sure that it does not exceed 5 V maximum. Otherwise, this
can permanently damage the installed device under test (DUT).
1.3 EVM Basic Functions
The DACx573 EVM is a functional-evaluation platform to demonstrate the
operation of the DACx573 family of digital - to - analog converters. Functional
evaluation of the DAC device can be conducted with any microprocessor, TI
DSP, or a waveform generator.
Header connectors J2 and P2 allow control signals and data from a host
processor or waveform generator to interface with the DACx573 EVM using
a custom-built cable.
Specific adapter interface boards are also available for many TI DSP Starter
Kits (DSKs). Specify the correct adapter interface board for the TI DSP Starter
Kit to be used. In addition, an MSP430-based platform (HPA449) that uses the
MSP430F449 microprocessor is available that directly interfaces with this
EVM. For more information regarding the adapter - interface board or the
HPA449 platform, please call Texas Instruments or send email to
[email protected].
EVM Overview
1-3
EVM Basic Functions
The DAC outputs can be monitored through the J4 header connector. All the
outputs can be switched by their respective jumpers W2, W11, W12, and W13
for stacking. Stacking allows eight DAC channels to be used, provided that the
I2C address is unique for each EVM board stacked.
In addition, one DAC output can be fed to the noninverting side of output op
amp U2 by installing a jumper across the appropriate pins of J4. Output op amp
U2 must first be configured correctly for the desired waveform characteristic.
Refer to Chapter 3 of this user’s guide for more information.
A block diagram of the EVM is shown in Figure 1 - 1.
Figure 1 - 1. EVM Block Diagram
VCC
VCC
GND
VSS
GND
VDD
(J1)
(J5)
3.3 VA
(J6)
VDD
5 VA (P6)
VSS
External
Reference
Module
W4
TP1
DAC Out
TP3
Output
Buffer
Module
(J4)
(P4)
W3
8 CH
VREFH
W15
W5
VSS
1-4
W2
W11
W12
W13
(J2)
(P2)
VREFH
DAC Module
4 CH
TP2
A0
W7
A1
SDA
SCL
A2 A3 V REFL
W8 W9
A0
A1
A2
A3
LDAC
W10
W6
TP5
Chapter 2
PCB Design
This chapter describes the physical and mechanical characteristics of the
EVM. The bill of materials is also included in this chapter.
Topic
Page
2.1
PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.2
Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
PCB Design
2-1
PCB Layout
2.1 PCB Layout
The DACx573 EVM demonstrates the performance of the installed DAC
device under test, as specified in the data sheet. Careful analysis of the
physical restrictions and performance- degrading factors of the EVM is vital to
a successful design implementation. The obvious attributes that can cause
poor performance of the EVM can be avoided during schematic design by
proper component selection and correct circuit - design practices. The circuit
must include adequate bypassing, identifying, and managing the analog and
digital signals and understanding the mechanical attributes of the
components.
The less obvious part of the design lies in the PCB layout. The main concerns
are component placement and proper signal routing. The bypass capacitors
must be placed as close as possible to the pins and the analog and digital
signals must be properly separated from each other. The power and ground
planes are very important and require careful consideration. A solid plane is
preferred, but sometimes impractical. When solid planes are not possible, a
well - designed split plane can suffice. When considering a split- plane design,
analyze the component placement and carefully divide the board into its
analog and digital sections starting from the device under test. The ground
plane plays an important role in controlling noise and other effects that can
contribute to DAC output error. To ensure that return currents are handled
properly, route the appropriate signals only in their respective sections. Route
analog traces only directly above or below the analog section, and the digital
traces in the digital section. Minimize trace length, but use the widest possible
trace allowable in the design. These design practices are demonstrated in
subsequent figures in this section.
The DACx573 EVM board is constructed on a four- layer printed circuit board
using a copper - clad FR - 4 laminate material. The printed circuit board has a
dimension of 43,1800 mm (1.7000 inch) X 82,5500 mm (3.2500 inch), and the
board thickness is 1,5748 mm (0.0620 inch). Figure 2 - 1 through Figure 2 - 6
show the individual artwork layers.
2-2
PCB Layout
Figure 2 - 1. Top Silkscreen
DACx573
REV A
LAYER
SILKSCREEN
TOP
Figure 2 - 2. Layer 1 (Top Signal Plane)
DACx573
REV A
LAYER 1 TOP SIGNAL LAYER
Figure 2 - 3. Layer 2 (Ground Plane)
DACx573
REV A
LAYER 2
SPLIT GND PLANE
PCB Design
2-3
PCB Layout
Figure 2 - 4. Layer 3 (Power Plane)
DACx5/3
REV A
LAYER 3
SPLIT POWER PLANE
Figure 2 - 5. Layer 4 (Bottom Signal Plane)
DACx573
REV A
LAYER 4
BOTTOM SIGNAL
LAYER
Figure 2 - 6. Bottom Silkscreen
DACx573
2-4
REV A
LAYER
SILKSCREEN BOTTOM
PCB Layout
Figure 2 - 7. Drill Drawing
PCB Design
2-5
Bill of Materials
2.2 Bill of Materials
Table 2 - 1. Parts List
Item #
1
Qty
2
Designator
C9 C10
Mfr.
Panasonic
Part Number
ECUV1H105JCH
4
C1 C2 C3 C7
Panasonic
ECJ3VB1C104K
3
1
C12
Panasonic
ECUV1H102JCH
4
3
C5 C6 C11
Kemet
C1210C106K8PAC
5
17
Panasonic
ERJ - 8GEY0R00V
6
7
8
9
2
1
1
6
Panasonic
Panasonic
Panasonic
Panasonic
ERJ - 8GEYJ431V
ERJ - 8GEYJ101V
ERJ - 8ENF2002V
ERJ - 8GEYJ302V
430-Ω, 1/4-W 1206 chip resistor
100-Ω,1/4-W 1206 chip resistor
20-kΩ,1/4-W 1206 chip resistor
3-kΩ, 1/4-W 1206 chip resistor
10
11
3
1
R8 R17 R25
R26 R27 R28
R29 R30 R31
R32 R33 R34
R35 R36 R37
R38 R39
R15 R16
R13
R10
R1 R2 R3 R4
R5 R7
R6 R12 R14
R9
Description
1 - µF, 1206 multilayer - ceramic
capacitor
0.1- µF, 1206 multilayer - ceramic
capacitor
1-nF, 1206 multilayer ceramic
capacitor
10-µF, 1210 multilayer ceramic X5R
capacitor
0-Ω, 1/4-W 1206 chip resistor
2
Panasonic
Bourns
ERJ - 8ENF1002V
3214W- 203E
12
1
R11
Bourns
3214W- 104E
13
1
J6
Samtec
TSM - 105- 01- T - DV
14
2
J2 J4
Samtec
TSM - 110- 01- S - DV - M
15
2
J1 J5
On-Shore
Technology
ED555/3DS
10-kΩ,, 1/4-W 1206 chip resistor
20-kΩ, BOURNS_32X4W series 5T
pot
100-kΩ, BOURNS_32X4W series 5T
pot
5X2X0.1, 10-pin 3 A isolated power
socket
10X2X.1, 20 Pin 0.025” sq SMT
socket
3-pin terminal connector
12-bit, quad output, I2C DAC
10-bit, quad output, I2C DAC
8-bit, quad output, I2C DAC
8-SOP(D) precision op amp
5-V, 8-SOP(D) precision voltage
reference
8 - SOP(D) Dual Precision Op Amp
Turret terminal test point
16
1
U1
Texas Instruments
17
18
1
1
U2
U3
Texas Instruments
Texas Instruments
DAC7573IPW
DAC6573IPW
DAC5573IPW
OPA627AU
REF02AU
19
20
1
7
Texas Instruments
Mill-max
OPA2132UA
2348- 2 - 01- 00- 00- 07- 0
21
2
Samtec
SSW - 110- 22- S - D - VS - P
22
23
1
6
Samtec
Molex
SSW - 105- F - D - VS - K
22- 03- 2021
20-pin 0.025” square SMT
terminal strips
3-A isolated 10-pin power header
2 position jumper, 0.1” spacing
24
8
U8
TP1 TP2 TP3
TP4 TP5 TP6
TP7
P2 P4
(see Note)
P6 (see Note)
W3 W7 W8
W9 W10 W15
W1 W2 W4
W5 W6 W11
W12 W13
Molex
22- 03- 2031
3 position jumper, 0.1” spacing
Note:
2-6
P2, P4, and P6 parts are not shown in the schematic diagram. All the P-designated parts are installed on the bottom side
of the PC board opposite the J-designated counterpart. Example, J2 is installed on the top side while P2 is installed in the
bottom side opposite of J2. Not all parts listed in the BOM are installed in the EVM as they are specific to the DUT installed.
Chapter 3
EVM Operation
This chapter details the operation of the EVM to guide the user in evaluating
the onboard DAC and in interfacing the EVM to a host processor.
Refer to the specific DAC data sheet, as listed in the Related Documentation
From Texas Instruments section in the Preface of this user’s guide for more
information about the DAC serial interface and other related topics.
The EVM board is factory-configured to operate in the unipolar output mode.
Topic
Page
3.1
Factory Default Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.2
Host Processor Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.3
EVM Stacking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.4
The Output Op Amp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.5
Jumper Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.6
Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
EVM Operation
3-1
Factory Default Setting
3.1 Factory Default Setting
The EVM board is factory-configured to operate in unipolar 5-V output mode.
Table 3 - 1. DACx573EVM Factory-Default Jumper Configuration
DACx573 EVM CONFIGURATION
Jumper
Position
Reference
Function
W1
1-2
Analog supply for the DACx573 is 5 VA.
W2
1-2
DAC output A (VOUTA) is routed to J4 - 2.
W3
Open
VREFH is not routed to the inverting input of the op
amp.
W4
1-2
Onboard external buffered reference U3 is routed to
VREFH.
W5
1-2
Negative supply rail of U2 op amp is supplied by VSS.
W6
1-2
VREFL is tied to AGND.
W7
Closed
A0 pin is tied to DGND.
W8
Closed
A1 pin is tied to DGND.
W9
Closed
A3 pin is tied to DGND.
W10
Closed
A2 pin is tied to DGND.
W11
1-2
DAC output B (VOUTB) is routed to J4 - 4.
W12
1-2
DAC output C (VOUTC) is routed to J4 - 6.
W13
1-2
DAC output D (VOUTD) is routed to J4 - 8.
W15
Closed
Output op amp U2 is configured for a gain of 2.
J4
1-2
DAC output A (VOUTA) is connected to the noninverting input of output op amp U2.
3.2 Host Processor Interface
Because the host processor controls the DAC, proper operation depends on
the correct interface of the host processor and the EVM board. Properly written
code is also required to operate the DAC.
A host-platform-specific cable assembly can be made to connect the EVM to
the host processor through J2 for the I2C serial control and data signals. The
output is monitored through J4.
An interface adapter board is available for specific TI DSP starter kits as well
as for an MSP430-based microprocessor as mentioned in section 1.3. Using
the interface board alleviates the tedious task of building custom cables and
allows easy configuration of a simple evaluation system.
This DACx573 EVM interfaces with any host processor capable of I2C
protocols or the popular TI DSP. For more information regarding the serial
interface of the particular DAC installed, refer to the specific DAC data sheet,
as listed in the Related Documentation From Texas Instruments section in the
Preface of this user’s guide.
3-2
EVM Stacking
3.3 EVM Stacking
EVM stacking enables the designer to evaluate two DACx573s in tandem to
yield an eight-channel output. A maximum of two DACx573 EVMs are allowed
because the output terminal, J4, dictates the number of DAC channels that can
be connected without colliding. Table 3 - 2 shows how the DAC output
channels are mapped to the output terminal, J4, with respect to the jumper
positions of W2, W11, W12, and W13.
Table 3 - 2. DACx573 Output Channel Mapping
Reference
W2
W11
W12
W13
Jumper
Position
Function
1-2
DAC output A (VOUTA) is routed to J4 - 2.
2-3
DAC output A (VOUTA) is routed to J4 - 10.
1-2
DAC output B (VOUTB) is routed to J4 - 4.
2-3
DAC output B (VOUTB) is routed to J4 - 12.
1-2
DAC output C (VOUTC) is routed to J4 - 6.
2-3
DAC output C (VOUTC) is routed to J4 - 14.
1-2
DAC output D (VOUTD) is routed to J4 - 8.
2-3
DAC output D (VOUTD) is routed to J4 - 16.
Each DAC EVM in a stacked configuration must have a unique I2C address.
This is accomplished by configuring address jumpers W7 and W8 (refer to the
data sheet for I2C addressing).
The LDAC signal can be shared to have a synchronous DAC-output update
and can be hardware-driven by GPIO0. If software control of the LDAC is
desired, the GPIO0 signal must be set low through software or J2-pin 2 can
be strapped to DGND.
3.4 Output Op Amp
The EVM includes an optional signal conditioning circuit for the DAC output
through an external operational amplifier, U2. Only one DAC output channel
can be monitored at any given time because the odd numbered pins (J4 - 1 to
J4 - 7) are tied together. The output op amp gain is configured at two by default.
The unbuffered outputs of the DAC can be probed through the even pins of J4,
the output terminal, which also provides mechanical stability when stacking or
plugging into an interface board. J4 also provides easy access for monitoring
up to eight DAC channels when stacking two EVMs together, as described in
section 3.3.
The following sections describe various configurations of the output amplifier,
U2.
EVM Operation
3-3
Output Op Amp
3.4.1
Unity Gain Output
The buffered output configuration can be used to prevent loading the DAC.
However, it may present some slight distortion because of the feedback
resistor and capacitor. The user can tailor the feedback circuit to closely match
the desired wave shape by simply removing R7 and C11 and replacing them
with the desired values. R7 can be replaced with a zero-ohm resistor and C11
can be left open, if desired.
Table 3 - 3 shows the jumper settings for the unity gain configuration of the
output buffer in unipolar or bipolar supply mode.
Table 3 - 3. Unity Gain Output Jumper Settings
Jumper Setting
Reference
3.4.2
Function
Unipolar
Bipolar
W3
Open
Open
Disconnects TP2 input or AGND from the inverting input of the op amp
W5
2-3
1-2
Supplies VSS to the negative rail of the op amp
or ties it to AGND
W15
Open
Open
Disconnects negative input of the op amp
from AGND
Output Gain of Two
Table 3 - 4 shows the proper jumper settings of the EVM for the 2× gain output
of the DAC.
Table 3 - 4. Gain of Two Output Jumper Settings
Jumper Setting
Reference
Bipolar
Closed
Closed
Inverting input of output op amp U2 is connected to VREFH for use as its offset voltage
with a gain of 2. Jumper W15 must be open.
Open
Open
VREFH is disconnected from the inverting input of output op amp U2. Jumper W15 must
be closed.
2-3
1-2
Supplies power, VSS, to the negative rail of op
amp U2 for bipolar supply mode, or ties it to
AGND for unipolar supply mode
Closed
Closed
Configures op amp U2 for a gain of 2 output
without an offset voltage. Jumper W3 must be
open.
Open
Open
Inverting input of op amp U2 is disconnected
from AGND. Jumper W3 must be closed.
W3
W5
W15
3-4
Function
Unipolar
Output Op Amp
3.4.3
Capacitive Load Drive
Another output configuration option is to drive a wide range of capacitive loads.
All op amps under certain conditions may become unstable depending on
configuration, gain, and load value. In unity gain, the OPA627 op amp performs
well with large capacitive loads. Increasing the gain and adding a load resistor
further improves the capacitive load drive capability.
Table 3 - 5 shows the proper jumper settings of the EVM for the 2× gain output
of the DAC.
Table 3 - 5. Capacitive-Load Drive Jumper Settings
Jumper Setting
Reference
3.4.4
Function
Unipolar
Bipolar
W3
Open
Open
VREFH is disconnected from the inverting input of output op amp U2.
W5
2-3
1-2
Supplies power, VSS, to the negative rail of op
amp U2 for bipolar supply, or ties it to AGND
for unipolar supply.
W15
Open
Open
Capacitive load drive output of DAC is routed
to jumper-W15 pin 1, and this pin can be used
as the output terminal.
Optional Signal Conditioning Op Amp (U8B)
One device of the dual- op amp OPA2132 (U8) is used for reference buffering
(U8A), while the other is unused. This unused op amp (U8B) is available for
user - configured circuitry. The 1206- package resistor and capacitor footprints
associated with the U8B op amp are unpopulated and available for easy
configuration. TP6 and TP7 test points are not installed for maximum flexibility
of input - signal configuration. No test point is available for the output due to
space restrictions, but a wire can be simply soldered to the output of the op
amp via the unused component pads connected to it.
Once the op amp circuit design is determined, it is easily implemented by
simply populating the desired components and leaving unused component
footprints unpopulated.
EVM Operation
3-5
Jumper Setting
3.5 Jumper Setting
Table 3 - 6 shows the function of each specific jumper setting of the EVM.
Table 3 - 6. Jumper Setting Function
Reference
W1
W2
Jumper
Setting
1
3
1
3
1
3
1
3
Function
5 - V analog supply is selected for AVDD.
+3.3 - V analog supply is selected for AVDD.
Routes VOUTA to J4 - 2
Routes VOUTA to J4 - 10
Disconnects VREFH to the inverting input of output op amp U2.
W3
Connects VREFH to the inverting input of output op amp U2.
W4
W5
W6
1
3
Routes the adjustable, buffered, onboard 5-V reference to the VREFH input of the
DACx573.
1
3
Routes the user supplied reference from TP1 or J4 - 20 to the VREFH input of the
DACx573.
1
3
1
3
1
3
1
3
Negative supply rail of the output op amp U2 is powered by VSS for bipolar operation.
Negative supply rail of the output op amp U2 is tied to AGND for unipolar operation.
VREFL is tied to AGND.
Routes the user-supplied negative reference from TP2 or J4 - 18 to the VREFL input of
the DACx573. This voltage must be within the range of 0V to VREFH.
A0 is set high through pullup-resistor R4. A0 can be driven by GPIO5.
W7
A0 is set low.
A1 is set high through pullup-resistor R3. A1 can be driven by GPIO4.
W8
A1 is set low.
A3 is set high through pullup-resistor R2. A3 can be driven by GPIO1.
W9
LDAC pin is set low and DAC update is accomplished via software.
A2 is set high through pullup-resistor R1. A2 can be driven by GPIO3.
W10
A2 pin is set low.
W11
3-6
1
3
1
3
Routes VOUTB to J4 - 4
Routes VOUTB to J4 - 12
Schematic
Reference
W12
W13
Jumper
Setting
1
3
1
3
1
3
1
3
Function
Routes VOUTC to J4 - 6
Routes VOUTC to J4 - 14
Routes VOUTD to J4 - 8
Routes VOUTD to J4 - 16
Disconnects the inverting input of output op amp U2 from AGND.
W15
Connects the inverting input of output op amp U2 to AGND for gain of 2.
Legend:
Indicates the corresponding pins that are shorted or closed.
3.6 Schematic
The schematic is on the following page.
EVM Operation
3-7
1
2
3
+5VA
W1
VDD
4
(A3)
GPIO2
R27
GPIO3
R28
C1
0.1µF
C5
10µF
C6
10µF
C2
0.1µF
VCC
4
AVDD
IO_V/DVDD
12
16
(A2)
0
A3/LDAC
15
GPIO4
R38
(A1)
14
GPIO5
R39 0
(A0)
13
W9
W10
W8
W7
FSX
(SYNC)
SDI
11
SCLK
R16 440/0
10
R29
W2
5
W3
VrefL
W11
J4
OUT_B2
OUT_C1
VoutA
SCL/SCLK
VoutB
LDAC/SYNC
VoutC
GND
VoutD
1
2
OUT_C
7
W12
-REFin
+REFin
OUT_C2
8
6
U2_-IN
2
4
6
8
10
12
14
16
18
20
R14
10K
1
3
5
7
9
11
13
15
17
19
DAC6573 = 10-Bit
TP3
VOUT
100
W5
C10
1µF
R6
10K
C12
W13
OUT_D
R13
VSS
OUT_D1
DAC7573 = 12-Bit
U2_OUT
Op Amp
2
OUTPUT HEADER
DAC7573/6573/5573
C
U2
OUT_B1
OUT_B
SDA/Din
6
0
OUT_A
A0
9
R30
VrefL
A1
0
GPIO0 (LDAC)
VrefH
3
0
OUT_A2
A2/EN
0
R15 440/0
VrefH
3
R8
U2_+IN
OUT_A1
(EN)
0
D
1µF
U1
0
C9
7
GPIO1
R26 0
R7
3K
5
(LDAC)
R5
3K
1
R25
R4
10K
Approved
4
GPIO0
R3
10K
ECN Number
VDD
VrefH
D
R2
10K
6
Revision History
REV
AVDD
R1
10K
5
+3.3VA
C
1nF
OUT_D2
W15
1
DAC5573 = 8-Bit
VCC
R9
20K
2
R12
10K
U3
3
C7
0.1µF
C8
8
3
GND
TP4
REF02AU(8)
R11
2
3
100K
2
U8A
OPA2227UA
4
R10
20K
B
1
W4
0
-REFin
TP5
R21
EXTERNAL
REFERENCE
5
NI
7
6
NOTE: Voltage range of -REFin input should not exceed
0 - VrefH.
W6
R32
R24
R23
(A0)
NI
VrefL
DX
C13
GPIO3 (A2)
GPIO4 (A1)
SCL
B
SDA
R34
0
R37
0
VDD
3
1
VCC
2
3
2
GPIO1 (A3)
GPIO2 (EN)
R35
J5
1
-5VA +3.3VA VDD
GPIO0 (LDAC)
2
4
6
8
10
12
14
16
18
20
0
CLKX
VSS
R36
SCLK
J1
1
3
5
7
9
11
13
15
17
19
Serial Header
NI
TP2
VCC
GPIO5
0
SDI
+3.3VD+1.8VD +5VA
0
0
OPA2227UA
R19
NI
CLKX
CLKR
FSX
FSR
DX
DR
R33 0
NI
NI
TP7
-Vin
R31
U8B
R20
3
TP1
J2
NI
TP6
+Vin
VrefH
+REFin
R17
NI
R22
R18
NI
1
1
C3
0.1µF
6
3
1
TRIM OUT
V+ TEMP
NC
NC
NC
4
Tantalum
C11
10µF
5
2
8
7
VCC
J6
1
3
5
7
9
A
2
4
6
8
10
VSS
+5VA
ti
VCC = +15V Analog
VDD = +2.7V to +5.0V Digital
VSS = 0V to -15V Analog
12500 TI Boulevard. Dallas, Texas 75243
Title:
Engineer:
J. PARGUIAN
DACx573 EVM
DOCUMENTCONTROL #
Drawn By:
FILE:
1
2
3
4
5
DAC7573 RevA.Sch
A
DATE:
1-Dec-2003
6456605
SIZE:
6
REV:
SHEET:
OF:
A
1
Similar pages