ESD9C3.3ST5G SERIES ESD Protection Diodes In Ultra Small SOD−923 Package The ESD9C3.3ST5G Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications. http://onsemi.com 1 2 Specification Features: • Small Body Outline Dimensions: • • • • • • • PIN 1. CATHODE 2. ANODE 0.039″ x 0.024″ (1.0 mm x 0.60 mm) Low Body Height: 0.016″ (0.40 mm) Max Stand−off Voltage: 3.3 V, 5 V Low Leakage Response Time < 1 ns ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC61000−4−2 Level 4 ESD Protection These are Pb−Free Devices MARKING DIAGRAM X M Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C ⎪PD Lead Solder Temperature − Maximum (10 Second Duration) = Specific Device Code = Date Code ORDERING INFORMATION QUALIFIED MAX REFLOW TEMPERATURE: 260°C Junction and Storage Temperature Range XM SOD−923 CASE 514AB Value Unit Device Package Shipping † ESD9CxxST5G SOD−923 (Pb−Free) 8000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. mW 150 TJ, Tstg −55 to +150 TL 260 °C DEVICE MARKING INFORMATION See specific marking information in the device marking column of the table on page 2 of this data sheet. °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 = 1.0 x 0.75 x 0.62 in. © Semiconductor Components Industries, LLC, 2007 April, 2007 − Rev. 0 1 Publication Order Number: ESD9C3.3S/D ESD9C3.3ST5G SERIES ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted) IF Parameter Symbol IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR Working Peak Reverse Voltage Test Current IF Forward Current VF Forward Voltage @ IF Ppk Peak Power Dissipation V IR VF IT Breakdown Voltage @ IT IT C VC VBR VRWM Maximum Reverse Leakage Current @ VRWM IPP Max. Capacitance @VR = 0 and f = 1 MHz Uni−Directional TVS ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 1.1 V Max. @ IF = 10 mA) Device Marking VRWM (V) IR (mA) @ VRWM VBR (V) @ IT (Note 2) IT C (pF) (Note 3) C (pF) (Note 3) Max Max Min mA Typ Max ESD9C3.3ST5G R 3.3 1.0 5.0 1.0 12.8 13 ESD9C5.0ST5G P 5.0 0.5 11.0 1.0 6.0 6.2 Device 2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C. 3. Capacitance at f = 1 MHz, VR = 0 V, TA = 25°C. http://onsemi.com 2 ESD9C3.3ST5G SERIES PACKAGE DIMENSIONS SOD−923 CASE 514AB−01 ISSUE B D −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. −Y− E 1 b 2 2X 0.08 (0.0032) X Y DIM A b c D E HE L A c L HE MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.15 0.20 0.25 0.07 0.12 0.17 0.75 0.80 0.85 0.55 0.60 0.65 0.95 1.00 1.05 0.05 0.10 0.15 MIN 0.013 0.006 0.003 0.030 0.022 0.037 0.002 INCHES NOM 0.015 0.008 0.005 0.031 0.024 0.039 0.004 MAX 0.016 0.010 0.007 0.033 0.026 0.041 0.006 SOLDERING FOOTPRINT* 0.90 0.40 0.30 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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