ON ESD9C3.3ST5G Esd protection diodes in ultra small sod-923 package Datasheet

ESD9C3.3ST5G SERIES
ESD Protection Diodes
In Ultra Small SOD−923 Package
The ESD9C3.3ST5G Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage, and
fast response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its small size, it is suited
for use in cellular phones, portable devices, digital cameras, power
supplies and many other portable applications.
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Specification Features:
• Small Body Outline Dimensions:
•
•
•
•
•
•
•
PIN 1. CATHODE
2. ANODE
0.039″ x 0.024″ (1.0 mm x 0.60 mm)
Low Body Height: 0.016″ (0.40 mm) Max
Stand−off Voltage: 3.3 V, 5 V
Low Leakage
Response Time < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body Model
IEC61000−4−2 Level 4 ESD Protection
These are Pb−Free Devices
MARKING
DIAGRAM
X
M
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Symbol
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
⎪PD
Lead Solder Temperature − Maximum
(10 Second Duration)
= Specific Device Code
= Date Code
ORDERING INFORMATION
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Junction and Storage Temperature
Range
XM
SOD−923
CASE 514AB
Value
Unit
Device
Package
Shipping †
ESD9CxxST5G
SOD−923
(Pb−Free)
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
mW
150
TJ, Tstg
−55 to +150
TL
260
°C
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
© Semiconductor Components Industries, LLC, 2007
April, 2007 − Rev. 0
1
Publication Order Number:
ESD9C3.3S/D
ESD9C3.3ST5G SERIES
ELECTRICAL CHARACTERISTICS
I
(TA = 25°C unless otherwise noted)
IF
Parameter
Symbol
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
VBR
Working Peak Reverse Voltage
Test Current
IF
Forward Current
VF
Forward Voltage @ IF
Ppk
Peak Power Dissipation
V
IR VF
IT
Breakdown Voltage @ IT
IT
C
VC VBR VRWM
Maximum Reverse Leakage Current @ VRWM
IPP
Max. Capacitance @VR = 0 and f = 1 MHz
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 1.1 V Max. @ IF = 10 mA)
Device
Marking
VRWM (V)
IR (mA) @ VRWM
VBR (V) @ IT
(Note 2)
IT
C (pF)
(Note 3)
C (pF)
(Note 3)
Max
Max
Min
mA
Typ
Max
ESD9C3.3ST5G
R
3.3
1.0
5.0
1.0
12.8
13
ESD9C5.0ST5G
P
5.0
0.5
11.0
1.0
6.0
6.2
Device
2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C.
3. Capacitance at f = 1 MHz, VR = 0 V, TA = 25°C.
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ESD9C3.3ST5G SERIES
PACKAGE DIMENSIONS
SOD−923
CASE 514AB−01
ISSUE B
D
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
−Y−
E
1
b
2
2X
0.08 (0.0032) X Y
DIM
A
b
c
D
E
HE
L
A
c
L
HE
MILLIMETERS
MIN
NOM MAX
0.34
0.37
0.40
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.05
0.10
0.15
MIN
0.013
0.006
0.003
0.030
0.022
0.037
0.002
INCHES
NOM
0.015
0.008
0.005
0.031
0.024
0.039
0.004
MAX
0.016
0.010
0.007
0.033
0.026
0.041
0.006
SOLDERING FOOTPRINT*
0.90
0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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ESD9C3.3S/D
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