HY57V561620B(L)T-I 4 Banks x 4M x 16Bit Synchronous DRAM DESCRIPTION The HY57V561620B-I is a 268,435,456bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY57V561620B is organized as 4banks of 4,194,304x16. HY57V561620B-I is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input and output voltage levels are compatible with LVTTL. Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write cycles initiated by a single control command (Burst length of 1,2,4,8 or full page), and the burst count sequence(sequential or interleave). A burst of read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst read or write command on any cycle. (This pipelined design is not restricted by a `2N` rule.) FEATURES • Single 3.3±0.3V power supply • Auto refresh and self refresh • All device pins are compatible with LVTTL interface • 8192 refresh cycles / 64ms • JEDEC standard 400mil 54pin TSOP-II with 0.8mm of pin pitch • Programmable Burst Length and Burst Type • All inputs and outputs referenced to positive edge of system clock - 1, 2, 4, 8 or Full page for Sequential Burst - 1, 2, 4 or 8 for Interleave Burst • Data mask function by UDQM, LDQM • Programmable CAS Latency ; 2, 3 Clocks • Internal four banks operation • Ambient Temperature : - 40 ~ 85 °C ORDERING INFORMATION Part No. Clock Frequency HY57V561620BT-6I 166MHz HY57V561620BT-KI 133MHz HY57V561620BT-HI 133MHz HY57V561620BT-8I 125MHz HY57V561620BT-PI 100MHz HY57V561620BT-SI 100MHz HY57V561620BLT-6I 166MHz HY57V561620BLT-KI 133MHz HY57V561620BLT-HI 133MHz HY57V561620BLT-8I 125MHz HY57V561620BLT-PI 100MHz HY57V561620BLT-SI 100MHz Power Organization Interface Package 4Banks x 4Mbits x16 LVTTL 400mil 54pin TSOP II Normal Low power This document is a general product description and is subject to change without notice. Hynix Semiconductor Inc. does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev.1.3 / Apr. 2003 1 HY57V561620B(L)T-I PIN CONFIGURATION VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 VDD LDQM /WE /CAS /RAS /CS BA0 BA1 A10/AP A0 A1 A2 A3 VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 54pin TSOP II 400mil x 875mil 0.8mm pin pitch VSS DQ15 VSSQ DQ14 DQ13 VDDQ DQ12 DQ11 VSSQ DQ10 DQ9 VDDQ DQ8 VSS NC UDQM CLK CKE A12 A11 A9 A8 A7 A6 A5 A4 VSS 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 PIN DESCRIPTION PIN PIN NAME DESCRIPTION CLK Clock The system clock input. All other inputs are registered to the SDRAM on the rising edge of CLK CKE Clock Enable Controls internal clock signal and when deactivated, the SDRAM will be one of the states among power down, suspend or self refresh CS Chip Select Enables or disables all inputs except CLK, CKE, UDQM and LDQM BA0, BA1 Bank Address Selects bank to be activated during RAS activity Selects bank to be read/written during CAS activity A0 ~ A12 Address Row Address : RA0 ~ RA12, Column Address : CA0 ~ CA8 Auto-precharge flag : A10 RAS, CAS, WE Row Address Strobe, Column Address Strobe, Write Enable RAS, CAS and WE define the operation Refer function truth table for details UDQM, LDQM Data Input/Output Mask Controls output buffers in read mode and masks input data in write mode DQ0 ~ DQ15 Data Input/Output Multiplexed data input / output pin VDD/VSS Power Supply/Ground Power supply for internal circuits and input buffers VDDQ/VSSQ Data Output Power/Ground Power supply for output buffers NC No Connection No connection Rev.1.3 / Apr. 2003 2 HY57V561620B(L)T-I FUNCTIONAL BLOCK DIAGRAM 4Mbit x 4banks x 16 I/O Synchronous DRAM Self Refresh Logic & Timer Internal Row Counter 4Mx16 Bank 3 CLK Row Active Column Pre Decoders UDQM Y decoders LDQM Bank Select A0 A1 Rev.1.3 / Apr. 2003 DQ1 DQ14 DQ15 Column Add Counter Address Register Address buffers A12 BA0 BA1 DQ0 I/O Buffer & Logic Column Active Memory Cell Array Sense AMP & I/O Gate WE 4Mx16 Bank 0 X decoders CAS 4Mx16 Bank 1 X decoders RAS 4Mx16 Bank 2 State Machine CS Row Pre Decoders X decoders CKE Burst Counter Mode Registers CAS Latency Data Out Control Pipe Line Control 3 HY57V561620B(L)T-I ABSOLUTE MAXIMUM RATINGS Parameter Symbol Rating Unit Ambient Temperature TA -40~85 °C Storage Temperature TSTG -55 ~ 125 °C Voltage on Any Pin relative to VSS VIN, VOUT -1.0 ~ 4.6 V Voltage on VDD relative to VSS VDD, VDDQ -1.0 ~ 4.6 V Short Circuit Output Current IOS 50 mA Power Dissipation PD 1 W Soldering Temperature ⋅ Time TSOLDER 260 ⋅ 10 °C ⋅ Sec Note : Operation at above absolute maximum rating can adversely affect device reliability DC OPERATING CONDITION (TA=-40°C ~ 85°C) Parameter Symbol Min Typ. Max Unit Note Power Supply Voltage VDD, VDDQ 3.0 3.3 3.6 V 1 Input High Voltage VIH 2.0 3.0 VDD + 0.3 V 1,2 Input Low Voltage VIL - 0.3 0 0.8 V 1,3 Note : 1.All voltages are referenced to VSS = 0V 2.VIH (max) is acceptable 5.6V AC pulse width with ≤3ns of duration 3.VIL (min) is acceptable -2.0V AC pulse width with ≤3ns of duration AC OPERATING CONDITION (TA=-40°C ~ 85°C, VDD=3.3 ± 0.3V, VSS=0V) Parameter Symbol Value Unit AC Input High / Low Level Voltage VIH / VIL 2.4 / 0.4 V Vtrip 1.4 V Input Rise / Fall Time tR / tF 1 ns Output Timing Measurement Reference Level Voutref 1.4 V CL 50 pF Input Timing Measurement Reference Level Voltage Output Load Capacitance for Access Time Measurement Note 1 Note : 1. Output load to measure access time is equivalent to two TTL gates and one capacitor (50pF) For details, refer to AC/DC output circuit Rev.1.3 / Apr. 2003 4 HY57V561620B(L)T-I CAPACITANCE (TA=25°C, f=1MHz) -6I/KI/HI Parameter Pin Input capacitance Data input / output capacitance -8I/PI/SI Symbol Unit Min Max Min Max CLK CI1 2.5 3.5 2.5 4.0 pF A0 ~ A12, BA0, BA1, CKE, CS, RAS, CAS, WE, UDQM, LDQM CI2 2.5 3.8 2.5 5.0 pF DQ0 ~ DQ15 CI/O 4.0 6.5 4.0 6.5 pF OUTPUT LOAD CIRCUIT Vtt=1.4V RT=250 Ω Output Output 50pF 50pF DC Output Load Circuit AC Output Load Circuit DC CHARACTERISTICS I (TA=-40°C ~ 85°C, VDD=3.3±0.3V) Parameter Symbol Min. Max Unit Note Input Leakage Current ILI -1 1 uA 1 Output Leakage Current ILO -1 1 uA 2 Output High Voltage VOH 2.4 - V IOH = -4mA Output Low Voltage VOL - 0.4 V IOL = +4mA Note : 1.VIN = 0 to 3.6V, All other pins are not tested under VIN =0V 2.DOUT is disabled, VOUT=0 to 3.6V Rev.1.3 / Apr. 2003 5 HY57V561620B(L)T-I DC CHARACTERISTICS II (TA=-40°C ~ 85°C, VDD=3.3±0.3V, VSS=0V) Speed Parameter Symbol Test Condition -6I -KI -HI -8I -PI -SI 130 120 120 120 110 110 IDD1 Burst length=1, One bank active tRC ≥ tRC(min), IOL=0mA IDD2P CKE ≤ VIL(max), tCK = 15ns 2 IDD2PS CKE ≤ VIL(max), tCK = ∞ 1 IDD2N CKE ≥ VIH(min), CS ≥ VIH(min), tCK = 15ns Input signals are changed one time during 30ns. All other pins ≥ VDD-0.2V or ≤ 0.2V 30 IDD2NS CKE ≥ VIH(min), tCK = ∞ Input signals are stable. 15 IDD3P CKE ≤ VIL(max), tCK = 15ns 5 IDD3PS CKE ≤ VIL(max), tCK = ∞ 5 IDD3N CKE ≥ VIH(min), CS ≥ VIH(min), tCK = 15ns Input signals are changed one time during 30ns. All other pins ≥ VDD-0.2V or ≤ 0.2V 40 IDD3NS CKE ≥ VIH(min), tCK = ∞ Input signals are stable. 30 Burst Mode Operating Current IDD4 tCK ≥ tCK(min), IOL=0mA All banks active Auto Refresh Current IDD5 tRRC ≥ tRRC(min), All banks active Self Refresh Current IDD6 CKE ≤ 0.2V Operating Current Precharge Standby Current in Power Down Mode Precharge Standby Current in Non Power Down Mode Active Standby Current in Power Down Mode Active Standby Current in Non Power Down Mode Unit Note mA 1 mA mA mA mA CL=3 150 130 130 130 110 110 CL=2 140 140 140 140 120 120 240 220 220 200 200 200 mA 1 mA 2 3 mA 3 1.5 mA 4 Note : 1.IDD1 and IDD4 depend on output loading and cycle rates. Specified values are measured with the output open 2.Min. of tRRC (Refresh RAS cycle time) is shown at AC CHARACTERISTICS II 3.HY57V561620BT-6I/KI/HI/8I/PI/SI 4.HY57V561620BLT-6I/KI/HI/8I/PI/SI Rev.1.3 / Apr. 2003 6 HY57V561620B(L)T-I AC CHARACTERISTICS I (AC operating conditions unless otherwise noted) -6I Parameter CAS Latency = 3 tCK3 Max 6 Min Max 7.5 1000 -8I -PI -SI Min Max 7.5 1000 Max 8 1000 10 Min Max 10 1000 10 Min 10 1000 10 Note Max ns 1000 10 Clock High Pulse Width tCHW 2.5 - 2.5 - 2.5 - 3 - 3 - 3 - ns 1 Clock Low Pulse Width tCLW 2.5 - 2.5 - 2.5 - 3 - 3 - 3 - ns 1 CAS Latency = 3 tAC3 - 5.4 - 5.4 - 5.4 - 6 - 6 - 6 ns CAS Latency = 2 tAC2 - 6 - 5.4 - 6 - 6 - 6 - 6 ns Data-Out Hold Time tOH 2.0 - 2.5 - 2.5 - 2.5 - 2.5 - 2.5 - ns Data-Input Setup Time tDS 1.5 - 1.5 - 1.5 - 2 - 2 - 2 - ns 1 Data-Input Hold Time tDH 0.8 - 0.8 - 0.8 - 1 - 1 - 1 - ns 1 Address Setup Time tAS 1.5 - 1.5 - 1.5 - 2 - 2 - 2 - ns 1 Address Hold Time tAH 0.8 - 0.8 - 0.8 - 1 - 1 - 1 - ns 1 CKE Setup Time tCKS 1.5 - 1.5 - 1.5 - 2 - 2 - 2 - ns 1 CKE Hold Time tCKH 0.8 - 0.8 - 0.8 - 1 - 1 - 1 - ns 1 Command Setup Time tCS 1.5 - 1.5 - 1.5 - 2 - 2 - 2 - ns 1 Command Hold Time tCH 0.8 - 0.8 - 0.8 - 1 - 1 - 1 - ns 1 CLK to Data Output in Low-Z Time tOLZ 1 - 1 - 1 - 1 - 1 - 1 - ns CLK to Data Output in High-Z Time 7.5 Min tCK2 Access Time From Clock CAS Latency = 2 -HI Unit Min System Clock Cycle Time -KI Symbol 12 ns 2 CAS Latency = 3 tOHZ3 2.7 5.4 2.7 5.4 2.7 5.4 3 6 3 6 3 6 ns CAS Latency = 2 tOHZ2 2.7 5.4 2.7 5.4 3 6 3 6 3 6 3 6 ns Note : 1.Assume tR / tF (input rise and fall time ) is 1ns 2.Access times to be measured with input signals of 1v/ns edge rate Rev.1.3 / Apr. 2003 7 HY57V561620B(L)T-I AC CHARACTERISTICS II -6I Parameter -KI -HI -8I -PI -SI Symbol Unit Min Max Min Max Min Max Min Max Min Max Min Max Operation tRC 60 - 60 - 65 - 68 - 70 - 70 - ns Auto Refresh tRRC 60 - 60 - 65 - 68 - 70 - 70 - ns RAS to CAS Delay tRCD 18 - 15 - 20 - 20 - 20 - 20 - ns RAS Active Time tRAS 42 100K 45 100K 45 100K 48 100K 50 100K 50 100K ns RAS Precharge Time tRP 18 - 15 - 20 - 20 - 20 - 20 - ns RAS to RAS Bank Active Delay tRRD 12 - 15 - 15 - 16 - 20 - 20 - ns CAS to CAS Delay tCCD 1 - 1 - 1 - 1 - 1 - 1 - CLK Write Command to Data-In Delay tWTL 0 - 0 - 0 - 0 - 0 - 0 - CLK Data-In to Precharge Command tDPL 2 - 2 - 2 - 2 - 2 - 2 - CLK Data-In to Active Command tDAL 5 - 5 - 5 - 5 - 5 - 5 - CLK DQM to Data-Out Hi-Z tDQZ 2 - 2 - 2 - 2 - 2 - 2 - CLK DQM to Data-In Mask tDQM 0 - 0 - 0 - 0 - 0 - 0 - CLK MRS to New Command tMRD 2 - 2 - 2 - 2 - 2 - 2 - CLK CAS Latency = 3 tPROZ3 3 - 3 - 3 - 3 - 3 - 3 - CLK CAS Latency = 2 tPROZ2 2 - 2 - 2 - 2 - 2 - 2 - CLK Power Down Exit Time tPDE 1 - 1 - 1 - 1 - 1 - 1 - CLK Self Refresh Exit Time tSRE 1 - 1 - 1 - 1 - 1 - 1 - CLK Refresh Time tREF - 64 - 64 - 64 - 64 - 64 - 64 ms Note RAS Cycle Time Precharge to Data Output Hi-Z 1 Note : 1. A new command can be given tRRC after self refresh exit Rev.1.3 / Apr. 2003 8 HY57V561620B(L)T-I IBIS SPECIFICATION IOH Characteristics (Pull-up) Voltage 100MHz (Min) 100MHz (Max) 66MHz (Min) (V) I(mA) I(mA) I(mA) -2.4 3.3 -27.3 0 0.5 1 1.5 2 2.5 3 3.5 0 -100 3.0 0 -74.1 -0.7 2.6 -21.1 -129.2 -7.5 2.4 -34.1 -153.3 -13.3 2.0 -58.7 -197 -27.5 1.8 -67.3 -226.2 -35.5 1.65 -73 -248 -41.1 1.5 -77.9 -269.7 -47.9 1.4 -80.8 -284.3 -52.4 1.0 -88.6 -344.5 -72.5 0 -93 -502.4 -93 -200 I (mA) 3.45 66MHz and 100MHz Pull-up -300 -400 -500 -600 Voltage (V) IOH Min (100MHz) IOH Min (66MHz) IOH Max (66 /100MHz) IOL Characteristics (Pull-down) 66MHz and 100MHz Pull-down Voltage 100MHz (Min) 100MHz (Max) 66MHz (Min) (V) I(mA) I(mA) I(mA) 0 0 0 0 0.4 27.5 70.2 17.7 0.65 41.8 107.5 26.9 0.85 51.6 133.8 33.3 1.0 58.0 151.2 37.6 1.4 70.7 187.7 46.6 1.5 72.9 194.4 48.0 1.65 75.4 202.5 49.5 1.8 77.0 208.6 50.7 Voltage (V) 1.95 77.6 212.0 51.5 IOL Min (100MHz) 3.0 80.3 219.6 54.2 IOL Min (66MHz) 3.45 81.4 222.6 54.9 IOL Max (100MHz) Rev.1.3 / Apr. 2003 250 I (mA) 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 3.5 9 HY57V561620B(L)T-I DEVICE OPERATING OPTION TABLE HY57V561620B(L)T-6I 166MHz(6ns) 143MHz(7ns) 133MHz(7.5ns) CAS Latency tRCD tRAS tRC tRP tAC tOH 3CLKs 3CLKs 2CLKs 3CLKs 3CLKs 3CLKs 7CLKs 6CLKs 6CLKs 10CLKs 9CLKs 9CLKs 3CLKs 3CLKs 3CLKs 5.4ns 5.4ns 5.4ns 2.0ns 2.0ns 2.5ns HY57V561620B(L)T-KI 133MHz(7.5ns) 125MHz(8ns) 100MHz(10ns) CAS Latency tRCD tRAS tRC tRP tAC tOH 2CLKs 3CLKs 2CLKs 2CLKs 3CLKs 2CLKs 6CLKs 6CLKs 5CLKs 8CLKs 9CLKs 7CLKs 2CLKs 3CLKs 2CLKs 5.4ns 6ns 6ns 2.5ns 2.5ns 2.5ns CAS Latency tRCD tRAS tRC tRP tAC tOH 3CLKs 3CLKs 2CLKs 3CLKs 3CLKs 2CLKs 6CLKs 6CLKs 5CLKs 9CLKs 9CLKs 7CLKs 3CLKs 3CLKs 2CLKs 5.4ns 6ns 6ns 2.5ns 2.5ns 2.5ns CAS Latency tRCD tRAS tRC tRP tAC tOH 3CLKs 2CLKs 2CLKs 3CLKs 2CLKs 2CLKs 6CLKs 5CLKs 4CLKs 9CLKs 7CLKs 6CLKs 3CLKs 2CLKs 2CLKs 6ns 6ns 6ns 2.5ns 2.5ns 2.5ns HY57V561620B(L)T-HI 133MHz(7.5ns) 125MHz(8ns) 100MHz(10ns) HY57V561620B(L)T-8I 125MHz(8ns) 100MHz(10ns) 83MHz(12ns) HY57V561620B(L)T-PI 100MHz(10ns) 83MHz(12ns) 66MHz(15ns) CAS Latency tRCD tRAS tRC tRP tAC tOH 2CLKs 2CLKs 2CLKs 2CLKs 2CLKs 2CLKs 5CLKs 5CLKs 4CLKs 7CLKs 7CLKs 6CLKs 2CLKs 2CLKs 2CLKs 6ns 6ns 6ns 2.5ns 2.5ns 2.5ns HY57V561620B(L)T-SI 100MHz(10ns) 83MHz(12ns) 66MHz(15ns) Rev.1.3 / Apr. 2003 CAS Latency tRCD tRAS tRC tRP tAC tOH 3CLKs 2CLKs 2CLKs 2CLKs 2CLKs 2CLKs 5CLKs 5CLKs 4CLKs 7CLKs 7CLKs 6CLKs 2CLKs 2CLKs 2CLKs 6ns 6ns 6ns 2.5ns 2.5ns 2.5ns 10 HY57V561620B(L)T-I COMMAND TRUTH TABLE Command A10/ AP CKEn-1 CKEn CS RAS CAS WE DQM Mode Register Set H X L L L L X OP code H X X X No Operation H X X X L H H H Bank Active H X L L H H X H X L H L H X ADDR RA Read L V H Write L H X L H L L X CA Write with Autoprecharge H X L L H L X Burst Stop H DQM H Auto Refresh H H L L L Burst-Read-SingleWRITE H X L L Entry H L L H Exit L H H X L H H L X L V X X V X H X X L H X A9 Pin High (Other Pins OP code) L L H X X X X X X X L H H H H X X X L H H H H X X X L H H H H X X X L V V V L Precharge power down H X Precharge selected Bank Entry V H Precharge All Banks X X Exit Clock Suspend Note V CA Read with Autoprecharge Self Refresh1 BA Entry Exit L H L H X L H X X X X Note : 1. Exiting Self Refresh occurs by asynchronously bringing CKE from low to high 2. X = Don′t care, H = Logic High, L = Logic Low. BA =Bank Address, RA = Row Address, CA = Column Address, Opcode = Operand Code, NOP = No Operation Rev.1.3 / Apr. 2003 11 HY57V561620B(L)T-I PACKAGE INFORMATION 400mil 54pin Thin Small Outline Package UNIT : mm(inch) 11.938(0.4700) 11.735(0.4620) 22.327(0.8790) 22.149(0.8720) 10.262(0.4040) 10.058(0.3960) 0.150(0.0059) 0.050(0.0020) 0.80(0.0315)BSC Rev.1.3 / Apr. 2003 0.400(0.016) 0.300(0.012) 1.194(0.0470) 0.991(0.0390) 5deg 0deg 0.597(0.0235) 0.406(0.0160) 0.210(0.0083) 0.120(0.0047) 12