Features • Core • • • • • • – ARM® Cortex®-M3 revision 2.0 running at up to 96 MHz – Memory Protection Unit (MPU) – Thumb®-2 instruction set Memories – From 64 to 256 Kbytes embedded Flash, 128-bit wide access, memory accelerator, dual bank – From 16 to 48 Kbytes embedded SRAM with dual banks – 16 Kbytes ROM with embedded bootloader routines (UART, USB) and IAP routines – Static Memory Controller (SMC): SRAM, NOR, NAND support. NAND Flash controller with 4 Kbytes RAM buffer and ECC System – Embedded voltage regulator for single supply operation – POR, BOD and Watchdog for safe reset – Quartz or resonator oscillators: 3 to 20 MHz main and optional low power 32.768 kHz for RTC or device clock. – High precision 8/12 MHz factory trimmed internal RC oscillator with 4 MHz Default Frequency for fast device startup – Slow Clock Internal RC oscillator as permanent clock for device clock in low power mode – One PLL for device clock and one dedicated PLL for USB 2.0 High Speed Device – Up to 17 peripheral DMA (PDC) channels and 4-channel central DMA Low Power Modes – Sleep and Backup modes, down to 2.5 µA in Backup mode – Backup domain: VDDBU pin, RTC, 32 backup registers – Ultra low power RTC: 0.6 µA Peripherals – USB 2.0 Device: 480 Mbps, 4-kbyte FIFO, up to 7 bidirectional Endpoints, dedicated DMA – Up to 4 USARTs (ISO7816, IrDA®, Flow Control, SPI, Manchester support) and one UART – Up to 2 TWI (I2C compatible), 1 SPI, 1 SSC (I2S), 1 HSMCI (SDIO/SD/MMC) – 3-Channel 16-bit Timer/Counter (TC) for capture, compare and PWM – 4-channel 16-bit PWM (PWMC) – 32-bit Real Time Timer (RTT) and RTC with calendar and alarm features – 8-channel 12-bit 1MSPS ADC with differential input mode and programmable gain stage, 8-channel 10-bit ADC I/O – Up to 96 I/O lines with external interrupt capability (edge or level sensitivity), debouncing, glitch filtering and on-die Series Resistor Termination – Three 32-bit Parallel Input/Outputs (PIO) Packages – 100-lead LQFP, 14 x 14 mm, pitch 0.5 mm – 100-ball LFBGA, 9 x 9 mm, pitch 0.8 mm – 144-lead LQFP, 20 x 20 mm, pitch 0.5 mm – 144-ball LFBGA, 10 x 10 mm, pitch 0.8 mm AT91ARM Cortex M3-based Microcontrollers ATSAM3U Series Preliminary Summary NOTE: This is a summary document. The complete document is available on the Atmel website at www.atmel.com. 6430CS–ATARM–09-Apr-10 1. SAM3U Description Atmel's SAM3U series is a member of a family of Flash microcontrollers based on the high performance 32-bit ARM Cortex-M3 RISC processor. It operates at a maximum speed of 96 MHz and features up to 256 Kbytes of Flash and up to 52 Kbytes of SRAM. The peripheral set includes a High Speed USB Device port with embedded transceiver, a High Speed MCI for SDIO/SD/MMC, an External Bus Interface with NAND Flash controller, up to 4xUSARTs (SAM3U1C/2C/4C have 3), up to 2xTWIs (SAM3U1C/2C/4C have 1), up to 5xSPIs SAM3U1C/2C/4C have 4), as well as 4xPWM timers, 3xgeneral purpose 16-bit timers, an RTC, a 12-bit ADC and a 10-bit ADC. The SAM3U architecture is specifically designed to sustain high speed data transfers. It includes a multi-layer bus matrix as well as multiple SRAM banks, PDC and DMA channels that enable it to run tasks in parallel and maximize data throughput. It can operate from 1.62V to 3.6V and comes in 100-pin and 144-pin LQFP and BGA packages. The SAM3U device is particularly well suited for USB applications: data loggers, PC peripherals and any high speed bridge (USB to SDIO, USB to SPI, USB to External Bus Interface). 1.1 Configuration Summary The SAM3U series differ in memory sizes, package and features list. Table 1-1 summarizes the configurations of the six devices. Table 1-1. Configuration Summary Flash Organization SRAM Number of PIOs Number of USARTs Number of TWI FWUP, SHDN pins External Bus Interface HSMCI data size Device Flash SAM3U4E 2x128 Kbytes dual plane 52 Kbytes 96 4 2 Yes 8 or 16 bits, 4 chip selects, 24-bit address 8 bits SAM3U2E 128 Kbytes single plane 36 Kbytes 96 4 2 Yes 8 or 16 bits, 4 chip selects 24-bit address 8 bits SAM3U1E 64 Kbytes single plane 20 Kbytes 96 4 2 Yes 8 or 16 bits, 4 chip selects, 24-bit address 8 bits SAM3U4C 2 x 128 Kbytes dual plane 52 Kbytes 57 3 1 FWUP 8 bits, 2 chip selects, 8-bit address 4 bits SAM3U2C 128 Kbytes single plane 36 Kbytes 57 3 1 FWUP 8 bits, 2 chip selects, 8- 4 bits bit address SAM3U1C 64 Kbytes single plane 20 Kbytes 57 3 1 FWUP 8 bits 2 chip selects, 8-bit address Note: 2 4 bits Package ADC LQFP144 2 (8+ 8 channels) BGA144 LQFP144 BGA144 LQFP144 BGA144 LQFP100 BGA100 LQFP100 BGA100 LQFP100 BGA100 2 (8+ 8 channels) 2 (8+ 8 channels) 2 (4+ 4 channels) 2 (4+ 4 channels) 2 (4+ 4 channels) 1. The SRAM size takes into account the 4-Kbyte RAM buffer of the NAND Flash Controller (NFC) which can be used by the core if not used by the NFC. SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 2. SAM3U Block Diagram TST PCK0 -PCK2 SLAVE PLLA OSC 3-20 M PMC VDDUTMI SM BOD RC 32K FLASH 2x128 KBytes 1x128 KBytes 1x64 KBytes 8 GPBREG SHDN FWUP SUPC RTC VDDBU NRSTB ERASE NRST POR PDC 8-channel 12-bit ADC 10-bit ADC RSTC VD VD DI N DO UT D VB U T D G MII FS D DP F D SD H M D SD H P SD M L SE S Flash Unique Identifier RTT PIOA DMA I/D OSC 32K XIN32 XOUT32 NAND Flash Controller & ECC MPU WDT EBI Voltage Regulator USB Device HS SysTick Counter N V Cortex-M3 Processor I Fmax 96 MHz C RC Osc. 12/8/4 M VDDCORE JT AG In-Circuit Emulator UPLL XIN XOUT HS UTMI Transceiver JTAG & Serial Wire System Controller VD MASTER 144-pin SAM3U4/2/1E Block Diagram TD TDI TMO/T R TC S/S AC K/ WD ES SW IO W O CL K Figure 2-1. NAND Flash SRAM (4KBytes) 5-layer AHB Bus Matrix SRAM0 32 KBytes 16 KBytes 8 KBytes PDC TWI0 TWI1 SRAM1 16 KBytes 16 KBytes ROM 16 KBytes Peripheral DMA Controller Peripheral Bridge NCS0 NCS1 NRD NWR0/NWE NWR1/NBS1 4-Channel DMA Static Memory Controller APB PDC PDC UART USART0 USART1 USART2 USART3 PDC PWM TC0 TC1 TC2 NANDRDY D0-D15 A0/NBS0 A1 A2-A20 NWAIT A23 A21/ NANDALE A22/ NANDCLE NCS3 SPI SSC HSMCI PIOB NCS2 NANDOE, NANDWE G TR AD AD VR EF -A D1 2B V VD RE -A DA F D1 NA AD 2 12 A BT B0 D0 RG -A -A D T D1 7 TW WD 2B C 0- 7 K0 TW -T D W 1 C K U 1 R C U XD TS T X R 0-C D SCTSO TS R K0 -RT 3 D - S TXX0 SC 3 D -RDK3 0- X TX 3 D D3 C D 0 PW D RI0 SR M PW H D 0 0 T M -P R0 L0 W TC -P MH L WM 3 TI K0- L3 O T TI A0 CL O -T K2 N B0- IOA PC T 2 S0 IOB -N 2 PC SP S3 C M K O M SI IS O TK TF TD R D R F R DA K 0DA C 7 DA C K PIOC 3 6430CS–ATARM–09-Apr-10 TST PCK0 -PCK2 In-Circuit Emulator PLLA OSC 3-20 M SysTick Counter N V I C PMC SM BOD RC 32K FLASH 2x128 KBytes 1x128 KBytes 1x64 KBytes 8 GPBREG SHDN FWUP SUPC RTC VDDBU NRSTB ERASE NRST POR UT DO N DI VD VD S Flash Unique Identifier RTT PDC 4-channel 12-bit ADC 10-bit ADC RSTC NAND Flash SRAM (4KBytes) 5-layer AHB Bus Matrix SRAM0 32 KBytes 16 KBytes 8 KBytes SRAM1 16 KBytes 16 KBytes ROM 16 KBytes Peripheral DMA Controller Peripheral Bridge NCS0 NCS1 NRD NWE 4-Channel DMA Static Memory Controller APB PDC PDC PDC TWI UART USART0 USART1 USART2 NANDRDY D0-D7 A0 A1 A2-A7 NANDALE NANDCLE PDC PWM TC0 TC1 TC2 SPI SSC HSMCI NANDOE, NANDWE 2B V VD RE -A DA F D1 NA AD 2 12 A BT B0 D0 RG -A -A D T D1 3 TW WD 2B C 0- 3 K0 TW -T D W 1 C K U 1 R C U XD TS T X R 0-C D SCTSO TS R K0 -RT 2 D - S TXX0 SC 2 D -RDK2 0- X TX 2 D D2 C D 0 PW D RI0 SR M PW H D 0 0- T M P R0 L0 W TC -P MH LK WM 3 TI 0- L3 O T TI A0 CL O -T K2 N B0- IOA PC T 2 S0 IOB -N 2 PC SP S3 C M K O M SI IS O TK TF TD R D R F DA RK 0DA 3 C DA C K PIOB 4 G TR AD AD VR EF -A D1 PIOA DMA I/D OSC 32K XIN32 XOUT32 NAND Flash Controller & ECC MPU WDT VDDUTMI EBI Voltage Regulator USB Device HS Cortex-M3 Processor Fmax 96 MHz RC Osc. 12/8/4 M VDDCORE HS UTMI Transceiver JTAG & Serial Wire System Controller UPLL XIN XOUT D VB U T D G MII FS D DP FS D DM H D SD H P SD M SLAVE VD MASTER 100-pin SAM3U4/2/1C Block Diagram TD I TD O TM / T S RA TC / S C E K/ WD SW SW IO O CL K JT AG SE L Figure 2-2. SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 3. Signal Description Table 3-1 gives details on the signal names classified by peripheral. Table 3-1. Signal Description List Signal Name Function Type Active Level Voltage Reference Comments Power Supplies VDDIO Peripherals I/O Lines Power Supply Power 1.62V to 3.6V VDDIN Voltage Regulator Input Power 1.8V to 3.6V VDDOUT Voltage Regulator Output Power 1.8V VDDUTMII USB UTMI+ Interface Power Supply Power 3.0V to 3.6V GNDUTMII USB UTMI+ Interface Ground Ground VDDBU Backup I/O Lines Power Supply Power GNDBU Backup Ground Ground VDDPLL PLL A, UPLL and OSC 3-20 MHz Power Supply Power GNDPLL PLL A, UPLL and OSC 3-20 MHz Ground Ground VDDANA ADC Analog Power Supply Power GNDANA ADC Analog Ground Ground VDDCORE Core, Memories and Peripherals Chip Power Supply Power GND Ground Ground 1.62V to 3.6V 1.62 V to 1.95V 2.0V to 3.6V 1.62V to 1.95V Clocks, Oscillators and PLLs XIN Main Oscillator Input Input XOUT Main Oscillator Output XIN32 Slow Clock Oscillator Input XOUT32 Slow Clock Oscillator Output Output VBG Bias Voltage Reference Analog PCK0 - PCK2 Programmable Clock Output Output VDDPLL Output Input VDDBU VDDIO Shutdown, Wakeup Logic SHDN Shut-Down Control FWUP Force Wake-Up Input Output Input VDDBU Low push/pull 0: The device is in backup mode 1: The device is running (not in backup mode) Needs external pull-up Serial Wire/JTAG Debug Port (SWJ-DP) TCK/SWCLK Test Clock/Serial Wire Clock Input TDI Test Data In Input TDO/TRACESWO Test Data Out/Trace Asynchronous Data Out TMS/SWDIO Test Mode Select/Serial Wire Input/Output Input JTAGSEL JTAG Selection Input No pull-up resistor VDDIO Output No pull-up resistor No pull-up resistor High VDDBU Internal permanent pull-down 5 6430CS–ATARM–09-Apr-10 Table 3-1. Signal Name Signal Description List (Continued) Function Type Active Level Voltage Reference Comments Flash Memory ERASE Flash and NVM Configuration Bits Erase Command Input High VDDBU I/O Low VDDIO Input Low Internal permanent 15K pulldown Reset/Test NRST Microcontroller Reset NRSTB Asynchronous Microcontroller Reset VDDBU TST Test Select Input Internal permanent pullup Internal permanent pullup Internal permanent pulldown Universal Asynchronous Receiver Transceiver - UART URXD UART Receive Data Input UTXD UART Transmit Data Output PIO Controller - PIOA - PIOB - PIOC PA0 - PA31 PB0 - PB31 PC0 - PC31 Parallel IO Controller A Parallel IO Controller B Parallel IO Controller C I/O •Schmitt Trigger (1) Reset State: •PIO Input •Internal pullup enabled I/O •Schmitt Trigger (2) Reset State: •PIO Input •Internal pullup enabled VDDIO •Schmitt Trigger(3) Reset State: •PIO Input •Internal pullup enabled I/O External Bus Interface D0 - D15 Data Bus A0 - A23 Address Bus NWAIT External Wait Signal I/O Output Input Low Static Memory Controller - SMC NCS0 - NCS3 Chip Select Lines Output Low NWR0 - NWR1 Write Signal Output Low NRD Read Signal Output Low NWE Write Enable Output Low NBS0 - NBS1 Byte Mask Signal Output Low NAND Flash Controller - NFC NANDOE NAND Flash Output Enable Output Low NANDWE NAND Flash Write Enable Output Low NANDRDY NAND Ready 6 Input SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series Table 3-1. Signal Description List (Continued) Signal Name Function Type Active Level Voltage Reference Comments High Speed Multimedia Card Interface - HSMCI CK Multimedia Card Clock I/O CDA Multimedia Card Slot A Command I/O DA0 - DA7 Multimedia Card Slot A Data I/O Universal Synchronous Asynchronous Receiver Transmitter - USARTx SCKx USARTx Serial Clock I/O TXDx USARTx Transmit Data I/O RXDx USARTx Receive Data Input RTSx USARTx Request To Send CTSx USARTx Clear To Send DTR0 USART0 Data Terminal Ready DSR0 USART0 Data Set Ready Input DCD0 USART0 Data Carrier Detect Input RI0 USART0 Ring Indicator Input Output Input I/O Synchronous Serial Controller - SSC TD SSC Transmit Data Output RD SSC Receive Data Input TK SSC Transmit Clock I/O RK SSC Receive Clock I/O TF SSC Transmit Frame Sync I/O RF SSC Receive Frame Sync I/O Timer/Counter - TC TCLKx TC Channel x External Clock Input Input TIOAx TC Channel x I/O Line A I/O TIOBx TC Channel x I/O Line B I/O Pulse Width Modulation Controller- PWMC PWMHx PWM Waveform Output High for channel x Output only output in complementary mode when dead time insertion is enabled PWM Waveform Output Low for channel x PWMLx PWMFI0-2 Output PWM Fault Input Input Serial Peripheral Interface - SPI MISO Master In Slave Out I/O MOSI Master Out Slave In I/O SPCK SPI Serial Clock I/O NPCS0 SPI Peripheral Chip Select 0 I/O Low NPCS1 - NPCS3 SPI Peripheral Chip Select Output Low 7 6430CS–ATARM–09-Apr-10 Table 3-1. Signal Description List (Continued) Signal Name Function Type Active Level Voltage Reference Comments Two-Wire Interface - TWI TWDx TWIx Two-wire Serial Data I/O TWCKx TWIx Two-wire Serial Clock I/O 12-bit Analog-to-Digital Converter - ADC12B AD12Bx Analog Inputs AD12BTRG ADC Trigger AD12BVREF ADC Reference Analog Input Analog 10-bit Analog-to-Digital Converter - ADC ADx Analog Inputs ADTRG ADC Trigger ADVREF ADC Reference Analog Input Analog Fast Flash Programming Interface - FFPI PGMEN0-PGMEN2 Programming Enabling Input PGMM0-PGMM3 Programming Mode Input PGMD0-PGMD15 Programming Data I/O PGMRDY Programming Ready Output High PGMNVALID Data Direction Output Low PGMNOE Programming Read Input Low PGMCK Programming Clock Input PGMNCMD Programming Command Input VDDIO Low USB High Speed Device - UDPHS DFSDM USB Device Full Speed Data - Analog DFSDP USB Device Full Speed Data + Analog DHSDM USB Device High Speed Data - Analog DHSDP USB Device High Speed Data + Analog Notes: VDDUTMII 1. PIOA: Schmitt Trigger on all except PA14 on 100 and 144 packages. 2. PIOB: Schmitt Trigger on all except PB9 to PB16, PB25 to PB31 on 100 and 144 packages. 3. PIOC: Schmitt Trigger on all except PC20 to PC27 on 144 package. 3.1 Design Considerations In order to facilitate schematic capture when using a SAM3U design, Atmel provides a “Schematics Checklist” Application note. Please visit http://www.atmel.com/products/AT91/ for additional documentation. 8 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 4. Package and Pinout The SAM3U4/2/1E is available in 144-lead LQFP and 144-ball LFBGA packages. The SAM3U4/2/1C is available in 100-lead LQFP and 100-ball LFBGA packages. 4.1 4.1.1 SAM3U4/2/1E Package and Pinout 144-ball LFBGA Package Outline The 144-Ball LFBGA package has a 0.8 mm ball pitch and respects Green Standards. Its dimensions are 10 x 10 x 1.4 mm. Figure 4-1. Orientation of the 144-ball LFBGA Package TOP VIEW 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M BALL A1 4.1.2 144-lead LQFP Package Outline Figure 4-2. Orientation of the 144-lead LQFP Package 108 73 109 72 144 37 1 36 9 6430CS–ATARM–09-Apr-10 4.1.3 144-lead LQFP Pinout Table 4-1. 144-pin SAM3U4/2/1E Pinout 1 TDI 37 DHSDP 73 VDDANA 109 PA0/PGMNCMD 2 VDDOUT 38 DHSDM 74 ADVREF 110 PC0 3 VDDIN 39 VBG 75 GNDANA 111 PA1/PGMRDY 4 TDO/TRACESWO 40 VDDUTMI 76 AD12BVREF 112 PC1 5 PB31 41 DFSDM 77 PA22/PGMD14 113 PA2/PGMNOE 6 PB30 42 DFSDP 78 PA30 114 PC2 7 TMS/SWDIO 43 GNDUTMI 79 PB3 115 PA3/PGMNVALID 8 PB29 44 VDDCORE 80 PB4 116 PC3 9 TCK/SWCLK 45 PA28 81 PC15 117 PA4/PGMM0 10 PB28 46 PA29 82 PC16 118 PC4 11 NRST 47 PC22 83 PC17 119 PA5/PGMM1 12 PB27 48 PA31 84 PC18 120 PC5 13 PB26 49 PC23 85 VDDIO 121 PA6/PGMM2 14 PB25 50 VDDCORE 86 VDDCORE 122 PC6 15 PB24 51 VDDIO 87 PA13/PGMD5 123 PA7/PGMM3 16 VDDCORE 52 GND 88 PA14/PGMD6 124 PC7 17 VDDIO 53 PB0 89 PC10 125 VDDCORE 18 GND 54 PC24 90 GND 126 GND 19 PB23 55 PB1 91 PA15/PGMD7 127 VDDIO 20 PB22 56 PC25 92 PC11 128 PA8/PGMD0 21 PB21 57 PB2 93 PA16/PGMD8 129 PC8 22 PC21 58 PC26 94 PC12 130 PA9/PGMD1 23 PB20 59 PB11 95 PA17/PGMD9 131 PC9 24 PB19 60 GND 96 PB16 132 PA10/PGMD2 25 PB18 61 PB12 97 PB15 133 PA11/PGMD3 26 PB17 62 PB13 98 PC13 134 PA12/PGMD4 27 VDDCORE 63 PC27 99 PA18/PGMD10 135 FWUP 28 PC14 64 PA27 100 PA19/PGMD11 136 SHDN 29 PB14 65 PB5 101 PA20/PGMD12 137 ERASE 30 PB10 66 PB6 102 PA21/PGMD13 138 TST 31 PB9 67 PB7 103 PA23/PGMD15 139 VDDBU 32 PC19 68 PB8 104 VDDIO 140 GNDBU 33 GNDPLL 69 PC28 105 PA24 141 NRSTB 34 VDDPLL 70 PC29 106 PA25 142 JTAGSEL 35 XOUT 71 PC30 107 PA26 143 XOUT32 36 XIN 72 PC31 108 PC20 144 XIN32 10 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 4.1.4 144-ball LFBGA Pinout Table 4-2. 144-ball SAM3U4/2/1E Pinout A1 VBG D1 DFSDM G1 PB0 K1 PB7 A2 VDDUTMI D2 DHSDM G2 PC26 K2 PC31 A3 PB9 D3 GNDPLL G3 PB2 K3 PC29 A4 PB10 D4 PC14 G4 PC25 K4 PB3 A5 PB19 D5 PB21 G5 PB1 K5 PB4 A6 PC21 D6 PB23 G6 GND K6 PA14/PGMD6 A7 PB26 D7 PB24 G7 GND K7 PA16/PGMD8 A8 TCK/SWCLK D8 PB28 G8 VDDCORE K8 PA18/PGMD10 A9 PB30 D9 TDI G9 PC4 K9 PC20 A10 TDO/TRACESWO D10 VDDBU G10 PA6/PGMM2 K10 PA1/PGMRDY A11 XIN32 D11 PA10/PGMD2 G11 PA7/PGMM3 K11 PC1 A12 XOUT32 D12 PA11/PGMD3 G12 PC6 K12 PC2 B1 VDDCORE E1 PC22 H1 PC24 L1 PC30 B2 GNDUTMI E2 PA28 H2 PC27 L2 ADVREF B3 XOUT E3 PC19 H3 PA27 L3 AD12BVREF B4 PB14 E4 VDDCORE H4 PB12 L4 PA22/PGMD14 B5 PB17 E5 GND H5 PB11 L5 PC17 B6 PB22 E6 VDDIO H6 GND L6 PC10 B7 PB25 E7 GNDBU H7 VDDCORE L7 PC12 B8 PB29 E8 NRST H8 PB16 L8 PA19/PGMD11 B9 VDDIN E9 PB31 H9 PB15 L9 PA23/PGMD15 B10 JTAGSEL E10 PA12/PGMD4 H10 PC3 L10 PA0/PGMNCMD B11 ERASE E11 PA8/PGMD0 H11 PA5/PGMM1 L11 PA26 B12 SHDN E12 PC8 H12 PC5 L12 PC0 C1 DFSDP F1 PA31 J1 PB5 M1 VDDANA C2 DHSDP F2 PA29 J2 PB6 M2 GNDANA C3 XIN F3 PC23 J3 PC28 M3 PA30 C4 VDDPLL F4 VDDCORE J4 PB8 M4 PC15 C5 PB18 F5 VDDIO J5 PB13 M5 PC16 C6 PB20 F6 GND J6 VDDIO M6 PC18 C7 PB27 F7 GND J7 PA13/PGMD5 M7 PA15/PGMD7 C8 TMS/SWDIO F8 VDDIO J8 PA17/PGMD9 M8 PC11 C9 VDDOUT F9 PC9 J9 PC13 M9 PA20/PGMD12 C10 NRSTB F10 PA9/PGMD1 J10 PA2/PGMNOE M10 PA21/PGMD13 C11 TST F11 VDDCORE J11 PA3/PGMNVALID M11 PA24 C12 FWUP F12 PC7 J12 PA4/PGMM0 M12 PA25 11 6430CS–ATARM–09-Apr-10 4.2 4.2.1 SAM3U4/2/1C Package and Pinout 100-lead LQFP Package Outline Figure 4-3. Orientation of the 100-lead LQFP Package 75 76 50 100 26 1 4.2.2 51 25 100-ball LFBGA Package Outline Figure 4-4. Orientation of the 100-ball LFBGA Package TOP VIEW 1 2 3 4 5 6 7 8 9 10 A B C D E F G H J K 12 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 4.2.3 100-lead LQFP Pinout Table 4-3. 100-pin SAM3U4/2/1C1 Pinout 1 VDDANA 26 PA0/PGMNCMD 51 TDI 76 DHSDP 2 ADVREF 27 PA1/PGMRDY 52 VDDOUT 77 DHSDM 3 GNDANA 28 PA2/PGMNOE 53 VDDIN 78 VBG 4 AD12BVREF 29 PA3/PGMNVALID 54 TDO/TRACESWO 79 VDDUTMI 5 PA22/PGMD14 30 PA4/PGMM0 55 TMS/SWDIO 80 DFSDM 6 PA30 31 PA5/PGMM1 56 TCK/SWCLK 81 DFSDP 7 PB3 32 PA6/PGMM2 57 NRST 82 GNDUTMI 8 PB4 33 PA7/PGMM3 58 PB24 83 VDDCORE 9 VDDCORE 34 VDDCORE 59 VDDCORE 84 PA28 10 PA13/PGMD5 35 GND 60 VDDIO 85 PA29 11 PA14/PGMD6 36 VDDIO 61 GND 86 PA31 12 PA15/PGMD7 37 PA8/PGMD0 62 PB23 87 VDDCORE 13 PA16/PGMD8 38 PA9/PGMD1 63 PB22 88 VDDIO 14 PA17/PGMD9 39 PA10/PGMD2 64 PB21 89 GND 15 PB16 40 PA11/PGMD3 65 PB20 90 PB0 16 PB15 41 PA12/PGMD4 66 PB19 91 PB1 17 PA18/PGMD10 42 FWUP 67 PB18 92 PB2 18 PA19/PGMD11 43 ERASE 68 PB17 93 PB11 19 PA20/PGMD12 44 TST 69 PB14 94 PB12 20 PA21/PGMD13 45 VDDBU 70 PB10 95 PB13 21 PA23/PGMD15 46 GNDBU 71 PB9 96 PA27 22 VDDIO 47 NRSTB 72 GNDPLL 97 PB5 23 PA24 48 JTAGSEL 73 VDDPLL 98 PB6 24 PA25 49 XOUT32 74 XOUT 99 PB7 25 PA26 50 XIN32 75 XIN 100 PB8 13 6430CS–ATARM–09-Apr-10 4.2.4 100-ball LFBGA Pinout Table 4-4. 100-ball SAM3U4/2/1C Pinout A1 VBG C6 PB22 F1 PB1 H6 PA15/PGMD7 A2 XIN C7 TMS/SWDIO F2 PB12 H7 PA18/PGMD10 A3 XOUT C8 NRSTB F3 VDDIO H8 PA24 A4 PB17 C9 JTAGSEL F4 PA31 H9 PA1/PGMRDY A5 PB21 C10 VDDBU F5 VDDIO H10 PA2/PGMNOE A6 PB23 D1 DFSDM F6 GND J1 PB6 A7 TCK/SWCLK D2 DHSDM F7 PB16 J2 PB8 A8 VDDIN D3 VDDPLL F8 PA6/PGMM2 J3 ADVREF A9 VDDOUT D4 VDDCORE F9 VDDCORE J4 PA30 A10 XIN32 D5 PB20 F10 PA7/PGMM3 J5 PB3 B1 VDDCORE D6 ERASE G1 PB11 J6 PA16/PGMD8 B2 GNDUTMI D7 TST G2 PB2 J7 PA19/PGMD11 B3 VDDUTMI D8 FWUP G3 PB0 J8 PA21/PGMD13 B4 PB10 D9 PA11/PGMD3 G4 PB13 J9 PA26 B5 PB18 D10 PA12/PGMD4 G5 VDDCORE J10 PA0/PGMNCMD B6 PB24 E1 PA29 G6 GND K1 PB7 B7 NRST E2 GND G7 PB15 K2 VDDANA B8 TDO/TRACESWO E3 PA28 G8 PA3/PGMNVALID K3 GNDANA B9 TDI E4 PB9 G9 PA5/PGMM1 K4 AD12BVREF B10 XOUT32 E5 GNDBU G10 PA4/PGMM0 K5 PB4 C1 DFSDP E6 VDDIO H1 VDDCORE K6 PA14/PGMD6 C2 DHSDP E7 VDDCORE H2 PB5 K7 PA17/PGMD9 C3 GNDPLL E8 PA10/PGMD2 H3 PA27 K8 PA20/PGMD12 C4 PB14 E9 PA9/PGMD1 H4 PA22/PGMD14 K9 PA23/PGMD15 C5 PB19 E10 PA8/PGMD0 H5 PA13/PGMD5 K10 PA25 14 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 5. Power Considerations 5.1 Power Supplies The SAM3U product has several types of power supply pins: • VDDCORE pins: Power the core, the embedded memories and the peripherals; voltage ranges from 1.62V to 1.95V. • VDDIO pins: Power the Peripherals I/O lines; voltage ranges from 1.62V to 3.6V. • VDDIN pin: Powers the Voltage regulator • VDDOUT pin: It is the output of the voltage regulator. • VDDBU pin: Powers the Slow Clock oscillator and a part of the System Controller; voltage ranges from 1.62V to 3.6V. VDDBU must be supplied before or at the same time than VDDIO and VDDCORE. • VDDPLL pin: Powers the PLL A, UPLL and 3-20 MHz Oscillator; voltage ranges from 1.62V to 1.95V. • VDDUTMI pin: Powers the UTMI+ interface; voltage ranges from 3.0V to 3.6V, 3.3V nominal. • VDDANA pin: Powers the ADC cells; voltage ranges from 2.0V to 3.6V. Ground pins GND are common to VDDCORE and VDDIO pins power supplies. Separated ground pins are provided for VDDBU, VDDPLL, VDDUTMI and VDDANA. These ground pins are respectively GNDBU, GNDPLL, GNDUTMI and GNDANA. 5.2 Voltage Regulator The SAM3U embeds a voltage regulator that is managed by the Supply Controller. This internal regulator is intended to supply the internal core of SAM3U but can be used to supply other parts in the application. It features two different operating modes: • In Normal mode, the voltage regulator consumes less than 700 µA static current and draws 150 mA of output current. Internal adaptive biasing adjusts the regulator quiescent current depending on the required load current. In Wait Mode or when the output current is low, quiescent current is only 7µA. • In Shutdown mode, the voltage regulator consumes less than 1 µA while its output is driven internally to GND. The default output voltage is 1.80V and the start-up time to reach Normal mode is inferior to 400 µs. For adequate input and output power supply decoupling/bypassing, refer to “Voltage Regulator” in the “Electrical Characteristics” section of the product datasheet. 5.3 Typical Powering Schematics The SAM3U supports a 1.8V-3.6V single supply mode. The internal regulator input connected to the source and its output feed VDDCORE. Figure 5-1, Figure 5-2, Figure 5-3 show the power schematics. 15 6430CS–ATARM–09-Apr-10 Figure 5-1. Single Supply VDDBU VDDUTMI VDDANA VDDIO Main Supply (1.8V-3.6V) VDDIN Voltage Regulator VDDOUT VDDCORE VDDPLL Note: 16 Restrictions With Main Supply < 2.0 V, USB and ADC are not usable. With Main Supply ≥ 2.4V and < 3V, USB is not usable. With Main Supply ≥ 3V, all peripherals are usable. SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series Figure 5-2. Core Externally Supplied VDDBU VDDUTMI VDDANA Main Supply (1.62V-3.6V) VDDIO VDDIN Voltage Regulator VDDOUT VDDCORE Supply (1.62V-1.95V) VDDCORE VDDPLL Note: Restrictions With Main Supply < 2.0 V, USB and ADC are not usable. With Main Supply ≥ 2.4V and < 3V, USB is not usable. With Main Supply ≥ 3V, all peripherals are usable. 17 6430CS–ATARM–09-Apr-10 Figure 5-3. Backup Batteries Used FWUP SHDN Backup Batteries VDDBU VDDUTMI VDDANA VDDIO VDDIN Main Supply (1.62V-3.6V) Voltage Regulator VDDOUT VDDCORE VDDPLL Note: 18 Restrictions With Main Supply < 2.0 V, USB and ADC are not usable. With Main Supply ≥ 2.4V and < 3V, USB is not usable. With Main Supply ≥ 3V, all peripherals are usable. SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 5.4 Active Mode Active mode is the normal running mode with the core clock running from the fast RC oscillator, the main crystal oscillator or the PLLA. The power management controller can be used to adapt the frequency and to disable the peripheral clocks. 5.5 Low Power Modes The various low power modes of the SAM3U are described below: 5.5.1 Backup Mode The purpose of backup mode is to achieve the lowest power consumption possible in a system which is performing periodic wake-ups to perform tasks but not requiring fast startup time (<0.5ms). The Supply Controller, zero-power power-on reset, RTT, RTC, Backup registers and 32 kHz Oscillator (RC or crystal oscillator selected by software in the Supply Controller) are running. The regulator and the core supply are off. Backup Mode is based on the Cortex-M3 deep-sleep mode with the voltage regulator disabled. The SAM3U Series can be awakened from this mode through the Force Wake-Up pin (FWUP), and Wake-Up input pins WKUP0 to WKUP15, Supply Monitor, RTT or RTC wake-up event. Current Consumption is 2.5 µA typical on VDDBU. Backup mode is entered by using WFE instructions with the SLEEPDEEP bit in the System Control Register of the Cortex-M3 set to 1. (See the “Power Management” description in The “ARM Cortex M3 Processor” section of the product datasheet). Exit from Backup mode happens if one of the following enable wake up events occurs: • FWUP pin (low level, configurable debouncing) • WKUPEN0-15 pins (level transition, configurable debouncing) • SM alarm • RTC alarm • RTT alarm 5.5.2 Wait Mode The purpose of the wait mode is to achieve very low power consumption while maintaining the whole device in a powered state for a startup time of less than 10 µs. In this mode, the clocks of the core, peripherals and memories are stopped. However, the core, peripherals and memories power supplies are still powered. From this mode, a fast start up is available. This mode is entered via Wait for Event (WFE) instructions with LPM = 1 (Low Power Mode bit in PMC_FSMR). The Cortex-M3 is able to handle external events or internal events in order to wake-up the core (WFE). By configuring the external lines WKUP0-15 as fast startup wake-up pins (refer to Section 5.7 “Fast Start-Up”). RTC or RTT Alarm and USB wake-up events can be used to wake up the CPU (exit from WFE). Current Consumption in Wait mode is typically 15 µA on VDDIN if the internal voltage regulator is used or 8 µA on VDDCORE if an external regulator is used. 19 6430CS–ATARM–09-Apr-10 Entering Wait Mode: • Select the 4/8/12 MHz Fast RC Oscillator as Main Clock • Set the LPM bit in the PMC Fast Startup Mode Register (PMC_FSMR) • Execute the Wait-For-Event (WFE) instruction of the processor Note: 5.5.3 Internal Main clock resynchronization cycles are necessary between the writing of MOSCRCEN bit and the effective entry in Wait mode. Depending on the user application, Waiting for MOSCRCEN bit to be cleared is recommended to ensure that the core will not execute undesired instructions. Sleep Mode The purpose of sleep mode is to optimize power consumption of the device versus response time. In this mode, only the core clock is stopped. The peripheral clocks can be enabled. This mode is entered via Wait for Interrupt (WFI) or Wait for Event (WFE) instructions with LPM = 0 in PMC_FSMR. The processor can be awakened from an interrupt if WFI instruction of the Cortex M3 is used, or from an event if the WFE instruction is used to enter this mode. 20 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 5.5.4 Low Power Mode Summary Table The modes detailed above are the main low power modes. Each part can be set to on or off separately and wake up sources can be individually configured. Table 5-1 below shows a summary of the configurations of the low power modes. Table 5-1. Mode Backup Mode Low Power Mode Configuration Summary SUPC, 32 kHz Oscillator RTC RTT Backup Registers, Core POR Memory (VDDBU Region) Regulator Peripherals Mode Entry PIO State Potential Wake Up Core at while in Low PIO State Consumption Wake-up (2) (3) Sources Wake Up Power Mode at Wake Up Time(1) Previous state saved PIOA & PIOB & PIOC Inputs with pull ups ON Any Event from: Fast startup through ON Powered Clocked +SLEEPDEEP WKUP0-15 pins back RTC alarm bit = 0 SHDN =1 (Not clocked) +LPM bit = 1 RTT alarm USB wake-up Previous state saved Unchanged 8 µA/15 µA (5) < 10 µs ON Entry mode =WFI Interrupt Only; Entry mode =WFE Any WFE or WFI Enabled Interrupt ON Powered(7) +SLEEPDEEP and/or Any Event Clocked from: Fast start-up back bit = 0 SHDN =1 (Not clocked) through WKUP0-15 +LPM bit = 0 pins RTC alarm RTT alarm USB wake-up Previous state saved Unchanged ON FWUP pin WKUP0-15 pins OFF OFF +SLEEPDEEP BOD alarm SHDN =0 (Not powered) RTC alarm bit = 1 RTT alarm WFE Reset 2.5 µA typ(4) < 0.5 ms WFE Wait Mode Sleep Mode Notes: (6) (6) 1. When considering wake-up time, the time required to start the PLL is not taken into account. Once started, the device works with the 4/8/12 MHz Fast RC oscillator. The user has to add the PLL start-up time if it is needed in the system. The wake-up time is defined as the time taken for wake up until the first instruction is fetched. 2. The external loads on PIOs are not taken into account in the calculation. 3. BOD current consumption is not included. 4. Current consumption on VDDBU. 5. 8 µA total current consumption - without using internal voltage regulator. 15 µA total current consumption - using internal voltage regulator. 6. Depends on MCK frequency. 7. In this mode the core is supplied and not clocked but some peripherals can be clocked. 21 6430CS–ATARM–09-Apr-10 5.6 Wake-up Sources The wake-up events allow the device to exit backup mode. When a wake-up event is detected, the Supply Controller performs a sequence which automatically reenables the core power supply. Figure 5-4. Wake-up Source SMEN sm_int RTCEN rtc_alarm Core Supply Restart RTTEN rtt_alarm FWUPDBC SLCK FWUPEN FWUP WKUPT0 WKUP0 22 WKUPIS0 WKUPDBC WKUPEN1 WKUPIS1 WKUPS SLCK Debouncer Falling/Rising Edge Detector WKUPT15 WKUP15 WKUPEN0 Falling/Rising Edge Detector WKUPT1 WKUP1 FWUP Debouncer Falling Edge Detector WKUPEN15 WKUPIS15 Falling/Rising Edge Detector SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 5.7 Fast Start-Up The SAM3U allows the processor to restart in a few microseconds while the processor is in wait mode. A fast start up can occur upon detection of a low level on one of the 19 wake-up inputs. The fast restart circuitry, as shown in Figure 5-5, is fully asynchronous and provides a fast startup signal to the Power Management Controller. As soon as the fast start-up signal is asserted, the PMC automatically restarts the embedded 4/8/12 MHz fast RC oscillator, switches the master clock on this 4/8/12 MHz clock and reenables the processor clock. Figure 5-5. Fast Start-Up Sources USBEN usb_wakeup RTCEN rtc_alarm RTTEN rtt_alarm FSTT0 WKUP0 Falling/Rising Edge Detector fast_restart FSTT1 WKUP1 Falling/Rising Edge Detector FSTT15 WKUP15 Falling/Rising Edge Detector 23 6430CS–ATARM–09-Apr-10 6. Input/Output Lines The SAM3U has different kinds of input/output (I/O) lines, such as general purpose I/Os (GPIO) and system I/Os. GPIOs can have alternate functions thanks to multiplexing capabilities of the PIO controllers. The same GPIO line can be used whether it is in IO mode or used by the multiplexed peripheral. System I/Os are pins such as test pin, oscillators, erase pin, analog inputs or debug pins. With a few exceptions, the I/Os have input schmitt triggers. Refer to the footnotes associated with “PIO Controller - PIOA - PIOB - PIOC” on page 6 within Table 3-1, “Signal Description List”. 6.1 General Purpose I/O Lines (GPIO) GPIO Lines are managed by PIO Controllers. All I/Os have several input or output modes such as, pull-up, input schmitt triggers, multi-drive (open-drain), glitch filters, debouncing or input change interrupt. Programming of these modes is performed independently for each I/O line through the PIO controller user interface. For more details, refer to the “PIO Controller” section of the product datasheet. The input output buffers of the PIO lines are supplied through VDDIO power supply rail. The SAM3U embeds high speed pads able to handle up to 65 MHz for HSMCI and SPI clock lines and 35 MHz on other lines. See “AC Characteristics” of the product datasheet for more details. Typical pull-up value is 100 kΩ for all I/Os. Each I/O line also embeds an ODT (On-Die Termination), (see Figure 6-1 below). ODT consists of an internal series resistor termination scheme for impedance matching between the driver output (SAM3) and the PCB track impedance preventing signal reflection. The series resistor helps to reduce I/Os switching current (di/dt) thereby reducing in turn, EMI. It also decreases overshoot and undershoot (ringing) due to inductance of interconnect between devices or between boards. In conclusion, ODT helps reducing signal integrity issues. Figure 6-1. On-Die Termination schematic Z0 ~ Zout + Rodt ODT 36 Ohms Typ. Rodt Receiver SAM3 Driver with Zout ~ 10 Ohms 6.2 PCB Trace Z0 ~ 50 Ohms System I/O Lines System I/O lines are pins used by oscillators, test mode, reset, flash erase and JTAG to name but a few. 6.3 Serial Wire JTAG Debug Port (SWJ-DP) The SWJ-DP pins are TCK/SWCLK, TMS/SWDIO, TDO/SWO, TDI and commonly provided on a standard 20-pin JTAG connector defined by ARM. For more details about voltage reference and reset state, refer to Table 3-1, “Signal Description List” 24 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series The JTAGSEL pin is used to select the JTAG boundary scan when asserted at a high level. It integrates a permanent pull-down resistor of about 15 kΩ to GNDBU, so that it can be left unconnected for normal operations. By default, the JTAG Debug Port is active. If the debugger host wants to switch to the Serial Wire Debug Port, it must provide a dedicated JTAG sequence on TMS/SWDIO and TCK/SWCLK which disables the JTAG-DP and enables the SW-DP. When the Serial Wire Debug Port is active, TDO/TRACESWO can be used for trace. The asynchronous TRACE output (TRACESWO) is multiplexed with TDO. So the asynchronous trace can only be used with SW-DP, not JTAG-DP. All the JTAG signals are supplied with VDDIO except JTAGSEL, supplied by VDDBU. 6.4 Test Pin The TST pin is used for JTAG Boundary Scan Manufacturing Test or fast flash programming mode of the SAM3U series. The TST pin integrates a permanent pull-down resistor of about 15 kΩ to GND, so that it can be left unconnected for normal operations. To enter fast programming mode, see the “Fast Flash Programming Interface” section of the product datasheet. For more on the manufacturing and test mode, refer to the “Debug and Test” section of the product datasheet. 6.5 NRST Pin The NRST pin is bidirectional. It is handled by the on-chip reset controller and can be driven low to provide a reset signal to the external components or asserted low externally to reset the microcontroller. It will reset the Core and the peripherals, except the Backup region (RTC, RTT and Supply Controller). There is no constraint on the length of the reset pulse and the reset controller can guarantee a minimum pulse length. The NRST pin integrates a permanent pull-up resistor to VDDIO of about 100 kΩ. 6.6 NRSTB Pin The NRSTB pin is input only and enables asynchronous reset of the SAM3U when asserted low. The NRSTB pin integrates a permanent pull-up resistor of about 15 kΩ. This allows connection of a simple push button on the NRSTB pin as a system-user reset. In all modes, this pin will reset the chip including the Backup region (RTC, RTT and Supply Controller). It reacts as the Power-on reset. It can be used as an external system reset source. In harsh environments, it is recommended to add an external capacitor (10 nF) between NRSTB and VDDBU. (For filtering values refer to “I/O Characteristics” in the “Electrical Characteristics” section of the product datasheet.) It embeds an anti-glitch filter. 6.7 ERASE Pin The ERASE pin is used to reinitialize the Flash content and some of its NVM bits. It integrates a permanent pull-down resistor of about 15 kΩ to GND, so that it can be left unconnected for normal operations. This pin is debounced by SCLK to improve the glitch tolerance. When the ERASE pin is tied high during less than 100 ms, it is not taken into account. The pin must be tied high during more than 220 ms to perform the reinitialization of the Flash. 25 6430CS–ATARM–09-Apr-10 Even in all low power modes, asserting the pin will automatically start-up the chip and erase the Flash. 7. Processor and Architecture 7.1 ARM Cortex-M3 Processor • Version 2.0 • Thumb-2 (ISA) subset consisting of all base Thumb-2 instructions, 16-bit and 32-bit. • Harvard processor architecture enabling simultaneous instruction fetch with data load/store. • Three-stage pipeline. • Single cycle 32-bit multiply. • Hardware divide. • Thumb and Debug states. • Handler and Thread modes. • Low latency ISR entry and exit. 7.2 APB/AHB Bridges The SAM3U product embeds two separated APB/AHB bridges: • low speed bridge • high speed bridge This architecture enables to make concurrent accesses on both bridges. All the peripherals are on the low-speed bridge except SPI, SSC and HSMCI. The UART, 10-bit ADC (ADC), 12-bit ADC (ADC12B), TWI0-1, USART0-3, PWM have dedicated channels for the Peripheral DMA Channels (PDC). These peripherals can not use the DMA Controller. The high speed bridge regroups the SSC, SPI and HSMCI. These three peripherals do not have PDC channels but can use the DMA with the internal FIFO for Channel buffering. Note that the peripherals of the two bridges are clocked by the same source: MCK. 7.3 Matrix Masters The Bus Matrix of the SAM3U device manages 5 masters, which means that each master can perform an access concurrently with others to an available slave. Each master has its own decoder and specifically defined bus. In order to simplify the addressing, all the masters have the same decoding. Table 7-1. 26 List of Bus Matrix Masters Master 0 Cortex-M3 Instruction/Data Master 1 Cortex-M3 System Master 2 Peripheral DMA Controller (PDC) Master 3 USB Device High Speed DMA Master 4 DMA Controller SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 7.4 Matrix Slaves The Bus Matrix of the SAM3U manages 10 slaves. Each slave has its own arbiter, allowing a different arbitration per slave. Table 7-2. 7.5 List of Bus Matrix Slaves Slave 0 Internal SRAM0 Slave 1 Internal SRAM1 Slave 2 Internal ROM Slave 3 Internal Flash 0 Slave 4 Internal Flash 1 Slave 5 USB Device High Speed Dual Port RAM (DPR) Slave 6 NAND Flash Controller RAM Slave 7 External Bus Interface Slave 8 Low Speed Peripheral Bridge Slave 9 High Speed Peripheral Bridge Master to Slave Access All the Masters can normally access all the Slaves. However, some paths do not make sense, for example allowing access from the USB Device High speed DMA to the Internal Peripherals. Thus, these paths are forbidden or simply not wired, and shown as “–” in Table 7-3 below. Table 7-3. SAM3U Master to Slave Access Slaves Masters 0 1 2 3 4 Cortex-M3 I/D Bus Cortex-M3 S Bus PDC USB Device High Speed DMA DMA Controller 0 Internal SRAM0 – X X X X 1 Internal SRAM1 – X X X X 2 Internal ROM X – X X X 3 Internal Flash 0 X – – – – 4 Internal Flash 1 X – – – – 5 USB Device High Speed Dual Port RAM (DPR) – X – – – 6 NAND Flash Controller RAM – X X X X 7 External Bus Interface – X X X X 8 Low Speed Peripheral Bridge – X X – – 9 High Speed Peripheral Bridge – X X – – 27 6430CS–ATARM–09-Apr-10 7.6 DMA Controller • Acting as one Matrix Master • Embeds 4 channels: – 3 channels with 8 bytes/FIFO for Channel Buffering – 1 channel with 32 bytes/FIFO for Channel Buffering • Linked List support with Status Write Back operation at End of Transfer • Word, HalfWord, Byte transfer support. • Handles high speed transfer of SPI, SSC and HSMCI (peripheral to memory, memory to peripheral) • Memory to memory transfer • Can be triggered by PWM and T/C which enables to generate waveforms though the External Bus Interface The DMA controller can handle the transfer between peripherals and memory and so receives the triggers from the peripherals listed below. The hardware interface numbers are also given in Table 7-4 below. Table 7-4. 7.7 DMA Controller Instance name Channel T/R DMA Channel HW interface Number HSMCI Transmit/Receive 0 SPI Transmit 1 SPI Receive 2 SSC Transmit 3 SSC Receive 4 PWM Event Line 0 Trigger 5 PWM Event Line 1 Trigger 6 TIO Output of TImer Counter Channel 0 Trigger 7 Peripheral DMA Controller • Handles data transfer between peripherals and memories • Nineteen channels • – Two for each USART – Two for the UART – Two for each Two Wire Interface – One for the PWM – One for each Analog-to-digital Converter Low bus arbitration overhead – One Master Clock cycle needed for a transfer from memory to peripheral – Two Master Clock cycles needed for a transfer from peripheral to memory • 28 Next Pointer management for reducing interrupt latency requirement SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series The Peripheral DMA Controller handles transfer requests from the channel according to the following priorities (Low to High priorities): Table 7-5. 7.8 Peripheral DMA Controller Instance name Channel T/R TWI1 Transmit TWI0 Transmit PWM Transmit UART Transmit USART3 Transmit USART2 Transmit USART1 Transmit USART0 Transmit TWI0 Receive TWI1 Receive UART Receive USART3 Receive USART2 Receive USART1 Receive USART0 Receive ADC Receive ADC12B Receive Debug and Test Features • Debug access to all memory and registers in the system, including Cortex-M3 register bank when the core is running, halted, or held in reset. • Serial Wire Debug Port (SW-DP) and Serial Wire JTAG Debug Port (SWJ-DP) debug access • Flash Patch and Breakpoint (FPB) unit for implementing break points and code patches • Data Watchpoint and Trace (DWT) unit for implementing watch points, data tracing, and system profiling • Instrumentation Trace Macrocell (ITM) for support of printf style debugging • IEEE® 1149.1 JTAG Boundary-scan on all digital pins 29 6430CS–ATARM–09-Apr-10 8. Product Mapping Figure 8-1. SAM3U Memory Mapping 0x00000000 Code 0x00000000 Address memory space 0x40000000 Code 0x40004000 Peripherals MCI Boot Memory 0x00080000 SSC Internal Flash 0 0x00100000 0x40008000 0x20000000 SPI Internal Flash 1 0x00180000 0x4000C000 Internal SRAM 0x40080000 0x40000000 0x00200000 Reserved 0x1FFFFFFF 1 MByte bit band region +0x40 Peripherals Internal SRAM +0x80 0x60000000 SRAM0 0x20080000 TC1 TC2 TWI1 NFC (SRAM) 0x4008C000 Reserved PWM UDPHS (DMA) 0x20200000 0x40090000 0xE0000000 USART0 Undefined 0x22000000 0x40094000 System 32 MBytes bit band alias USART1 0x40098000 0xFFFFFFFF USART2 Undefined 0x40000000 0x400E0000 System Controller 0x4009C000 USART3 SMC 0x400A0000 0x400E0200 20 External SRAM PMC 0x400E0600 Chip Select 1 0x400E0740 0x61000000 UART 0x62000000 UDPHS 5 0x400A8000 8 0x400AC000 ADC12B ADC CHIPID Chip Select 2 0x400B0000 0x400E0800 0x63000000 EFC0 Chip Select 3 0x400E0A00 0x64000000 EFC1 reserved 0x400E0C00 0x68000000 PIOA NFC 0x400E0E00 reserved 0x400E1000 0x69000000 PIOB 0x9FFFFFFF PIOC 0x400E1200 RSTC ID +0x10 DMAC 6 24 18 19 25 13 14 1 MByte bit band region 15 16 7 0x400E0000 10 0x400E2600 RTT WDT +0x60 RTC SYSC 26 27 28 11 0x40100000 12 0x42000000 1 0x44000000 System Controller Reserved Reserved 32 MBytes bit band alias Reserved SUPC +0x50 0x400B3FFF 29 Reserved 0x60000000 +0x30 +0x90 23 0x400A4000 0x400E0400 Chip Select 0 22 Reserved MATRIX block peripheral TC0 TC0 0x40088000 0xA0000000 0x20180000 offset TC0 TWI0 0x20100000 0x60000000 TC0 0x40084000 External SRAM SRAM1 0x24000000 21 Reserved Internal ROM 0x20000000 17 3 4 2 GPBR 0x400E1400 reserved 0x4007FFFF 30 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 9. Memories The embedded and external memories are described below. 9.1 9.1.1 Embedded Memories Internal SRAM The SAM3U4 (256 KBytes internal Flash version) embeds a total of 48 Kbytes high-speed SRAM (32 Kbytes SRAM0 and 16 Kbytes SRAM1). The SAM3U2 (128 KBytes internal Flash version) embeds a total of 32 Kbytes high-speed SRAM (16 Kbytes SRAM0 and 16 Kbytes SRAM1). The SAM3U1 (64 KBytes internal Flash version) embeds a total of 16 Kbytes high-speed SRAM (8 Kbytes SRAM0 and 8 Kbytes SRAM1). The SRAM0 is accessible over System Cortex-M3 bus at address 0x2000 0000 and SRAM1 at address 0x2008 0000. The user can see the SRAM as contiguous. The SRAM0 and SRAM1 are in the bit band region. The bit band alias region is from 0x2200 0000 and 0x23FF FFFF. The NAND Flash Controller embeds 4224 bytes of internal SRAM. If the NAND Flash controller is not used, these 4224 Kbytes of SRAM can be used as general purpose. It can be seen at address 0x2010 0000. 9.1.2 Internal ROM The SAM3U product embeds an Internal ROM, which contains the SAM-BA Boot and FFPI program. At any time, the ROM is mapped at address 0x0018 0000. 9.1.3 9.1.3.1 Embedded Flash Flash Overview The Flash of the SAM3U4 (256 KBytes internal Flash version) is organized in two banks of 512 pages (dual plane) of 256 bytes. The Flash of the SAM3U2 (128 KBytes internal Flash version) is organized in one bank of 512 pages (single plane) of 256 bytes. The Flash of the is SAM3U1 (256 KBytes internal Flash version) organized in one bank of 256 pages (single plane) of 256 bytes. The Flash contains a 128-byte write buffer, accessible through a 32-bit interface. 9.1.3.2 Flash Power Supply The Flash is supplied by VDDCORE. 9.1.3.3 Enhanced Embedded Flash Controller The Enhanced Embedded Flash Controller (EEFC) manages accesses performed by the masters of the system. It enables reading the Flash and writing the write buffer. It also contains a User Interface, mapped within the Memory Controller on the APB. The Enhanced Embedded Flash Controller ensures the interface of the Flash block with the 32bit internal bus. Its 128-bit wide memory interface increases performance. 31 6430CS–ATARM–09-Apr-10 The user can choose between high performance or lower current consumption by selecting either 128-bit or 64-bit access. It also manages the programming, erasing, locking and unlocking sequences of the Flash using a full set of commands. One of the commands returns the embedded Flash descriptor definition that informs the system about the Flash organization, thus making the software generic. The SAM3U4 (256 KBytes internal Flash version) embeds two EEFC (EEFC0 for Flash0 and EEFC1 for Flash1) whereas the SAM3U2/1 embeds one EEFC. 9.1.3.4 Lock Regions In the SAM3U4 (256 KBytes internal Flash version) two Enhanced Embedded Flash Controllers each manage 16 lock bits to protect 32 regions of the flash against inadvertent flash erasing or programming commands. The SAM3U4 (256 KBytes internal Flash version) contains 32 lock regions and each lock region contains 32 pages of 256 bytes. Each lock region has a size of 8 Kbytes. The SAM3U2 (128 KBytes internal Flash version) Enhanced Embedded Flash Controller manages 16 lock bits to protect 32 regions of the flash against inadvertent flash erasing or programming commands. The SAM3U2 (128 KBytes internal Flash version) contains 16 lock regions and each lock region contains 32 pages of 256 bytes. Each lock region has a size of 8 Kbytes. The SAM3U1(64 KBytes internal Flash version) Embedded Flash Controller manages 8 lock bits to protect 8 regions of the flash against inadvertent flash erasing or programming commands. The SAM3U1(64 KBytes internal Flash version) contains 8 lock regions and each lock region contains 32 pages of 256 bytes. Each lock region has a size of 8 Kbytes. If a locked-region’s erase or program command occurs, the command is aborted and the EEFC triggers an interrupt. The lock bits are software programmable through the EEFC User Interface. The command “Set Lock Bit” enables the protection. The command “Clear Lock Bit” unlocks the lock region. Asserting the ERASE pin clears the lock bits, thus unlocking the entire Flash. 9.1.3.5 Security Bit Feature The SAM3U features a security bit, based on a specific General Purpose NVM bit (GPNVM bit 0). When the security is enabled, any access to the Flash, SRAM, Core Registers and Internal Peripherals either through the ICE interface or through the Fast Flash Programming Interface, is forbidden. This ensures the confidentiality of the code programmed in the Flash. This security bit can only be enabled, through the command “Set General Purpose NVM Bit 0” of the EEFC User Interface. Disabling the security bit can only be achieved by asserting the ERASE pin at 1, and after a full Flash erase is performed. When the security bit is deactivated, all accesses to the Flash, SRAM, Core Registers and Internal Peripherals either through the ICE interface or through the Fast Flash Programming Interface are permitted. It is important to note that the assertion of the ERASE pin should always be longer than 200 ms. As the ERASE pin integrates a permanent pull-down, it can be left unconnected during normal operation. However, it is safer to connect it directly to GND for the final application. 32 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 9.1.3.6 Calibration Bits NVM bits are used to calibrate the brownout detector and the voltage regulator. These bits are factory configured and cannot be changed by the user. The ERASE pin has no effect on the calibration bits. 9.1.3.7 Unique Identifier Each device integrates its own 128-bit unique identifier. These bits are factory configured and cannot be changed by the user. The ERASE pin has no effect on the unique identifier. 9.1.3.8 Fast Flash Programming Interface The Fast Flash Programming Interface allows programming the device through either a serial JTAG interface or through a multiplexed fully-handshaked parallel port. It allows gang programming with market-standard industrial programmers. The FFPI supports read, page program, page erase, full erase, lock, unlock and protect commands. The Fast Flash Programming Interface is enabled and the Fast Programming Mode is entered when TST, NRSTB and FWUP pins are tied high during power up sequence and if all supplies are provided externally (do not use internal regulator for VDDCORE). Please note that since the FFPI is a part of the SAM-BA Boot Application, the device must boot from the ROM. 9.1.3.9 SAM-BA® Boot The SAM-BA Boot is a default Boot Program which provides an easy way to program in-situ the on-chip Flash memory. The SAM-BA Boot Assistant supports serial communication via the UART and USB. The SAM-BA Boot provides an interface with SAM-BA Graphic User Interface (GUI). The SAM-BA Boot is in ROM and is mapped in Flash at address 0x0 when GPNVM bit 1 is set to 0. 9.1.3.10 GPNVM Bits The SAM3U features three GPNVM bits that can be cleared or set respectively through the commands “Clear GPNVM Bit” and “Set GPNVM Bit” of the EEFC User Interface. The SAM3U4 is equipped with two EEFC, EEFC0 and EEFC1. EEFC1 does not feature the GPNVM bits. The GPNVM embedded on EEFC0 applies to the two blocks in the SAM3U4. Table 9-1. 9.1.4 General-purpose Non-volatile Memory Bits GPNVMBit[#] Function 0 Security bit 1 Boot mode selection 2 Flash selection (Flash 0 or Flash 1) Only on SAM3U4 (256 Kbytes internal Flash version) Boot Strategies The system always boots at address 0x0. To ensure a maximum boot possibilities the memory layout can be changed via GPNVM. 33 6430CS–ATARM–09-Apr-10 A general purpose NVM (GPNVM1) bit is used to boot either on the ROM (default) or from the Flash. The GPNVM bit can be cleared or set respectively through the commands “Clear General-purpose NVM Bit” and “Set General-purpose NVM Bit” of the EEFC User Interface. Setting the GPNVM Bit 1 selects the boot from the Flash, clearing it selects the boot from the ROM. Asserting ERASE clears the GPNVM Bit 1 and thus selects the boot from the ROM by default. GPNVM2 enables to select if Flash 0 or Flash 1 is used for the boot. Setting the GPNVM2 bit selects the boot from Flash 1, clearing it selects the boot from Flash 0. 9.2 External Memories The SAM3U offers an interface to a wide range of external memories and to any parallel peripheral. 9.2.1 Static Memory Controller • 8- or 16- bit Data Bus • Up to 24-bit Address Bus (up to 16 MBytes linear per chip select) • Up to 4 chips selects, Configurable Assignment • Multiple Access Modes supported – Byte Write or Byte Select Lines • Multiple device adaptability – Control signals programmable setup, pulse and hold time for each Memory Bank • Multiple Wait State Management – Programmable Wait State Generation – External Wait Request – Programmable Data Float Time • Slow Clock mode supported 9.2.2 NAND Flash Controller • Handles automatic Read/Write transfer through 4224 bytes SRAM buffer • DMA support • Supports SLC NAND Flash technology • Programmable timing on a per chip select basis • Programmable Flash Data width 8-bit or 16-bit 9.2.3 NAND Flash Error Corrected Code Controller • Integrated in the NAND Flash Controller • Single bit error correction and 2-bit Random detection. • Automatic Hamming Code Calculation while writing – ECC value available in a register • Automatic Hamming Code Calculation while reading – Error Report, including error flag, correctable error flag and word address being detected erroneous 34 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series – Supports 8- or 16-bit NAND Flash devices with 512-, 1024-, 2048- or 4096-byte pages 35 6430CS–ATARM–09-Apr-10 10. System Controller The System Controller is a set of peripherals, which allow handling of key elements of the system, such as power, resets, clocks, time, interrupts, watchdog, etc... The System Controller User Interface also embeds the registers used to configure the Matrix. See the system controller block diagram in Figure 10-1 on page 37. 36 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series Figure 10-1. System Controller Block Diagram VDDBU VDDIN vr_standby Software Controlled Voltage Regulator FWUP VDDOUT SHDN WKUP0 - WKUP15 NRSTB Supply Controller VDDIO PIOA/B/C Input / Output Buffers Zero-Power Power-on Reset PIOx VDDANA General Purpose Backup Registers ADVREF ADC (front-end) ADx SLCK RTC rtc_alarm bodbup_in SLCK RTT VDDUTMI Supply Monitor bodbup_on rtt_alarm USBx USB osc32k_xtal_en VDDCORE vddcore_nreset XIN32 XTALSEL Xtal 32 kHz Oscillator XOUT32 Embedded 32 kHz RC Oscillator Slow Clock SLCK bodcore_on Brownout Detector bodcore_in supc_interrupt osc32k_rc_en SRAM Backup Power Supply Peripherals vddcore_nreset proc_nreset periph_nreset ice_nreset Reset Controller NRST Cortex-M3 Matrix Peripheral Bridge FSTT0 - FSTT15(1) Embedded 12 / 8 / 4 MHz RC Oscillator XIN Main Clock MAINCK 3 - 20 MHz XTAL Oscillator XOUT MAINCK PLLACK PLLA MAINCK Flash SLCK Power Management Controller Master Clock MCK SLCK Watchdog Timer UPLLCK UPLL Core Power Supply FSTT0 - FSTT15 are possible Fast Startup Sources, generated by WKUP0-WKUP15 Pins, but are not physical pins. 37 6430CS–ATARM–09-Apr-10 10.1 System Controller and Peripheral Mapping Please refer to Figure 8-1“SAM3U Memory Mapping” on page 30 . All the peripherals are in the bit band region and are mapped in the bit band alias region. 10.2 Power-on-Reset, Brownout and Supply Monitor The SAM3U embeds three features to monitor, warn and/or reset the chip: • Power-on-Reset on VDDBU • Brownout Detector on VDDCORE • Supply Monitor on VDDUTMI 10.2.1 Power-on-Reset on VDDBU The Power-on-Reset monitors VDDBU. It is always activated and monitors voltage at start up but also during power down. If VDDBU goes below the threshold voltage, the entire chip is reset. For more information, refer to the “Electrical Characteristics” section of the datasheet. 10.2.2 Brownout Detector on VDDCORE The Brownout Detector monitors VDDCORE. It is active by default. It can be deactivated by software through the Supply Controller (SUPC_MR). It is especially recommended to disable it during low-power modes such as wait or sleep modes. If VDDCORE goes below the threshold voltage, the reset of the core is asserted. For more information, refer to the “Supply Controller” and “Electrical Characteristics” sections of the product datasheet. 10.2.3 10.3 Supply Monitor on VDDUTMI The Supply Monitor monitors VDDUTMI. It is not active by default. It can be activated by software and is fully programmable with 16 steps for the threshold (between 1.9V to 3.4V). It is controlled by the Supply Controller. A sample mode is possible. It allows to divide the supply monitor power consumption by a factor of up to 2048. For more information, refer to the “Supply Controller” and “Electrical Characteristics” sections of the product datasheet. Reset Controller The Reset Controller is capable to return to the software the source of the last reset, either a general reset, a wake-up reset, a software reset, a user reset or a watchdog reset. The Reset Controller controls the internal resets of the system and the NRST pin output. It is capable to shape a reset signal for the external devices, simplifying to a minimum connection of a push-button on the NRST pin to implement a manual reset. 10.4 Supply Controller The Supply Controller controls the power supplies of each section of the processor and the peripherals (via Voltage regulator control). The Supply Controller has its own reset circuitry and is clocked by the 32 kHz Slow clock generator. The reset circuitry is based on a zero-power power-on reset cell. The zero-power power-on reset allows the Supply Controller to start properly. 38 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series The Slow Clock generator is based on a 32 kHz crystal oscillator and an embedded 32 kHz RC oscillator. The Slow Clock defaults to the RC oscillator, but the software can enable the crystal oscillator and select it as the Slow Clock source. The Supply Controller starts up the device by enabling the Voltage Regulator, then it generates the proper reset signals to the core power supply. It also enables to set the system in different low power modes and to wake it up from a wide range of events. 10.5 Clock Generator The Clock Generator is made up of: • One Low Power 32768 Hz Slow Clock Oscillator with bypass mode • One Low Power RC Oscillator • One 3 to 20 MHz Crystal Oscillator, which can be bypassed • One Fast RC Oscillator factory programmed, 3 output frequencies can be selected: 4, 8 or 12 MHz. By default 4 MHz is selected. 8 MHz and 12 MHz output are factory calibrated. • One 480 MHz UPLL providing a clock for the USB High Speed Device Controller. Input frequency is 12 MHz (only). • One 96 to 192 MHz programmable PLL (PLL A), capable to provide the clock MCK to the processor and to the peripherals. The input frequency of the PLL A is between 8 and 16 MHz. Figure 10-2. Clock Generator Block Diagram Clock Generator XTALSEL On Chip 32k RC OSC XIN32 XOUT32 XIN Slow Clock SLCK Slow Clock Oscillator 12M Main Oscillator Main Clock MAINCK XOUT On Chip 12/8/4 MHz RC OSC MAINSEL PLL B HSCK Divider /6 /8 UPLL Clock UPLLCK PLL and Divider A PLLA Clock PLLACK Status Control Power Management Controller 39 6430CS–ATARM–09-Apr-10 10.6 Power Management Controller The Power Management Controller provides all the clock signals to the system. It provides: • the Processor Clock HCLK • the Free running processor clock FCLK • the Cortex SysTick external clock • the Master Clock MCK, in particular to the Matrix and the memory interfaces • the USB Device HS Clock UDPCK • independent peripheral clocks, typically at the frequency of MCK • three programmable clock outputs: PCK0, PCK1 and PCK2 The Supply Controller selects between the 32 kHz RC oscillator or the crystal oscillator. The unused oscillator is disabled automatically so that power consumption is optimized. By default, at startup the chip runs out of the Master Clock using the Fast RC Oscillator running at 4 MHz. Figure 10-3. Power Management Controller Block Diagram Processor Clock Controller HCK int Sleep Mode Divider /8 SystTick FCLK Master Clock Controller SLCK MAINCK PLLACK PLLBCK Prescaler /1,/2,/4,...,/64 MCK Peripherals Clock Controller periph_clk[..] ON/OFF Programmable Clock Controller SLCK MAINCK PLLACK PLLBCK ON/OFF Prescaler /1,/2,/4,...,/64 pck[..] USB Clock Controller ON/OFF HSCK UDPCK The SysTick calibration value is fixed at 10500, which allows the generation of a time base of 1 ms with SystTick clock to 10.5 MHz (max HCLK/8). 40 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 10.7 Watchdog Timer • 16-bit key-protected once-only Programmable Counter • Windowed, prevents the processor to be in a dead-lock on the watchdog access 10.8 SysTick Timer • 24-bit down counter • Self-reload capability • Flexible system timer 10.9 Real-time Timer • Real-time Timer, allowing backup of time with different accuracies – 32-bit Free-running back-up Counter – Integrates a 16-bit programmable prescaler running on slow clock – Alarm Register capable to generate a wake-up of the system 10.10 Real-time Clock • Low power consumption • Full asynchronous design • Two hundred year calendar • Programmable Periodic Interrupt • Alarm and update parallel load • Control of alarm and update Time/Calendar Data In 10.11 General-Purpose Back-up Registers • Eight 32-bit general-purpose backup registers 10.12 Nested Vectored Interrupt Controller • Thirty maskable interrupts • Sixteen priority levels • Dynamic reprioritization of interrupts • Priority grouping – selection of preempting interrupt levels and non preempting interrupt levels. • Support for tail-chaining and late arrival of interrupts. – back-to-back interrupt processing without the overhead of state saving and restoration between interrupts. • Processor state automatically saved on interrupt entry, and restored on – interrupt exit, with no instruction overhead. 41 6430CS–ATARM–09-Apr-10 10.13 Chip Identification • Chip Identifier (CHIPID) registers permit recognition of the device and its revision. Table 10-1. SAM3U Chip IDs Register - Engineering Samples Chip Name Flash Size KByte Pin Count CHIPID_CIDR CHIPID_EXID SAM3U4C (Rev A) 256 100 0x28000960 0x0 SAM3U2C (Rev A) 128 100 0x280A0760 0x0 SAM3U1C (Rev A) 64 100 0x28090560 0x0 SAM3U4E (Rev A) 256 144 0x28100960 0x0 SAM3U2E (Rev A) 128 144 0x281A0760 0x0 SAM3U1E (Rev A) 64 144 0x28190560 0x0 • JTAG ID: 0x0582A03F Table 10-2. SAM3U Chip IDs Register - Revision A Parts Chip Name Flash Size KByte Pin Count CHIPID_CIDR CHIPID_EXID SAM3U4C (Rev A) 256 100 0x28000961 0x0 SAM3U2C (Rev A) 128 100 0x280A0761 0x0 SAM3U1C (Rev A) 64 100 0x28090561 0x0 SAM3U4E (Rev A) 256 144 0x28100961 0x0 SAM3U2E (Rev A) 128 144 0x281A0761 0x0 SAM3U1E (Rev A) 64 144 0x28190561 0x0 • JTAG ID: 0x0582A03F 42 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 10.14 PIO Controllers • 3 PIO Controllers, PIOA, PIOB, and PIOC, controlling a maximum of 96 I/O Lines • Each PIO Controller controls up to 32 programmable I/O Lines – PIOA has 32 I/O Lines – PIOB has 32 I/O Lines – PIOC has 32 I/O Lines • Fully programmable through Set/Clear Registers • Multiplexing of two peripheral functions per I/O Line • For each I/O Line (whether assigned to a peripheral or used as general purpose I/O) – Input change, rising edge, falling edge, low level and level interrupt – Debouncing and Glitch filter – Multi-drive option enables driving in open drain – Programmable pull up on each I/O line – Pin data status register, supplies visibility of the level on the pin at any time • Synchronous output, provides Set and Clear of several I/O lines in a single write 43 6430CS–ATARM–09-Apr-10 11. Peripherals 11.1 Peripheral Identifiers Table 11-1 defines the Peripheral Identifiers of the SAM3U. A peripheral identifier is required for the control of the peripheral interrupt with the Nested Vectored Interrupt Controller and for the control of the peripheral clock with the Power Management Controller. Note that some Peripherals are always clocked. Please refer to the table below. Table 11-1. 44 Peripheral Identifiers PMC Clock Control Instance ID Instance Name NVIC Interrupt 0 SUPC X Supply Controller 1 RSTC X Reset Controller 2 RTC X Real Time Clock 3 RTT X Real Time Timer 4 WDT X Watchdog Timer 5 PMC X Power Management Controller 6 EEFC0 X Enhanced Embedded Flash Controller 0 7 EEFC1 X Enhanced Embedded Flash Controller 1 8 UART X X Universal Asynchronous Receiver Transmitter 9 SMC X X Static Memory Controller 10 PIOA X X Parallel I/O Controller A, 11 PIOB X X Parallel I/O Controller B 12 PIOC X X Parallel I/O Controller C 13 USART0 X X USART 0 14 USART1 X X USART 1 15 USART2 X X USART 2 16 USART3 X X USART 3 17 HSMCI X X High Speed Multimedia Card Interface 18 TWI0 X X Two-Wire Interface 0 19 TWI1 X X Two-Wire Interface 1 20 SPI X X Serial Peripheral Interface 21 SSC X X Synchronous Serial Controller 22 TC0 X X Timer Counter 0 23 TC1 X X Timer Counter 1 24 TC2 X X Timer Counter 2 25 PWM X X Pulse Width Modulation Controller 26 ADC12B X X 12-bit ADC Controller 27 ADC X X 10-bit ADC Controller 28 DMAC X X DMA Controller 29 UDPHS X X USB Device High Speed Instance Description SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 11.2 Peripheral Signal Multiplexing on I/O Lines The SAM3U features 3 PIO controllers, PIOA, PIOB and PIOC that multiplex the I/O lines of the peripheral set. Each PIO Controller controls up to 32 lines. Each line can be assigned to one of two peripheral functions, A or B. The multiplexing tables in the following pages define how the I/O lines of peripherals A and B are multiplexed on the PIO Controllers. The two columns “Extra Function” and “Comments” have been inserted in this table for the user’s own comments, they may be used to track how pins are defined in an application. Note that some peripheral functions which are output only, might be duplicated within the tables. 45 6430CS–ATARM–09-Apr-10 11.2.1 PIO Controller A Multiplexing Table 11-2. I/O Line Multiplexing on PIO Controller A (PIOA) Peripheral A Peripheral B Extra Function Comments (1)(2) PA0 TIOB0 NPCS1 WKUP0 PA1 TIOA0 NPCS2 WKUP1(1)(2) PA2 TCLK0 AD12BTRG WKUP2(1)(2) PA3 MCCK PCK1 PA4 MCCDA PWMH0 PA5 MCDA0 PWMH1 PA6 MCDA1 PWMH2 PA7 MCDA2 PWML0 PA8 MCDA3 PWML1 PA9 TWD0 PWML2 WKUP3(1)(2) PA10 TWCK0 PWML3 WKUP4(1)(2) PA11 URXD PWMFI0 PA12 UTXD PWMFI1 PA13 MISO PA14 MOSI PA15 SPCK PWMH2 PA16 NPCS0 NCS1 WKUP5(1)(2) PA17 SCK0 ADTRG WKUP6(1)(2) PA18 TXD0 PWMFI2 WKUP7(1)(2) PA19 RXD0 NPCS3 WKUP8(1)(2) PA20 TXD1 PWMH3 WKUP9(1)(2) PA21 RXD1 PCK0 WKUP10(1)(2) PA22 TXD2 RTS1 AD12B0 PA23 RXD2 CTS1 PA24 TWD1 SCK1 WKUP11(1)(2) Only on 144-pin version PA25 TWCK1 SCK2 WKUP12(1)(2) Only on 144-pin version PA26 TD TCLK2 PA27 RD PCK0 PA28 TK PWMH0 PA29 RK PWMH1 PA30 TF TIOA2 PA31 RF TIOB2 Notes: AD12B1 1. Wake-Up source in Backup mode (managed by the SUPC). 2. Fast Start-Up source in Wait mode (managed by the PMC). 46 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 11.2.2 PIO Controller B Multiplexing Table 11-3. Multiplexing on PIO Controller B (PIOB) I/O Line Peripheral A Peripheral B Extra Function Comments (1)(2) PB0 PWMH0 A2 WKUP13 PB1 PWMH1 A3 WKUP14(1)(2) PB2 PWMH2 A4 WKUP15(1)(2) PB3 PWMH3 A5 AD12B2 PB4 TCLK1 A6 AD12B3 PB5 TIOA1 A7 AD0 PB6 TIOB1 D15 AD1 PB7 RTS0 A0/NBS0 AD2 PB8 CTS0 A1 AD3 PB9 D0 DTR0 PB10 D1 DSR0 PB11 D2 DCD0 PB12 D3 RI0 PB13 D4 PWMH0 PB14 D5 PWMH1 PB15 D6 PWMH2 PB16 D7 PWMH3 PB17 NANDOE PWML0 PB18 NANDWE PWML1 PB19 NRD PWML2 PB20 NCS0 PWML3 PB21 A21/NANDALE RTS2 PB22 A22/NANDCLE CTS2 PB23 NWR0/NWE PCK2 PB24 NANDRDY PCK1 PB25 D8 PWML0 Only on 144-pin version PB26 D9 PWML1 Only on 144-pin version PB27 D10 PWML2 Only on 144-pin version PB28 D11 PWML3 Only on 144-pin version PB29 D12 Only on 144-pin version PB30 D13 Only on 144-pin version PB31 D14 Only on 144-pin version Notes: 1. Wake-Up source in Backup mode (managed by the SUPC). 2. Fast Start-Up source in Wait mode (managed by the PMC). 47 6430CS–ATARM–09-Apr-10 11.2.3 PIO Controller C Multiplexing Table 11-4. Multiplexing on PIO Controller C (PIOC) I/O Line Peripheral A Peripheral B Extra function Comments PC0 A2 Only on 144-pin version PC1 A3 Only on 144-pin version PC2 A4 Only on 144-pin version PC3 A5 NPCS1 Only on 144-pin version PC4 A6 NPCS2 Only on 144-pin version PC5 A7 NPCS3 Only on 144-pin version PC6 A8 PWML0 Only on 144-pin version PC7 A9 PWML1 Only on 144-pin version PC8 A10 PWML2 Only on 144-pin version PC9 A11 PWML3 Only on 144-pin version PC10 A12 CTS3 Only on 144-pin version PC11 A13 RTS3 Only on 144-pin version PC12 NCS1 TXD3 Only on 144-pin version PC13 A2 RXD3 Only on 144-pin version PC14 A3 NPCS2 Only on 144-pin version PC15 NWR1/NBS1 PC16 NCS2 PC17 AD12B4 Only on 144-pin version AD12B5 Only on 144-pin version NCS3 AD12B6 Only on 144-pin version PC18 NWAIT AD12B7 Only on 144-pin version PC19 SCK3 PC20 A14 Only on 144-pin version PC21 A15 Only on 144-pin version PC22 A16 Only on 144-pin version PC23 A17 Only on 144-pin version PC24 A18 PWMH0 Only on 144-pin version PC25 A19 PWMH1 Only on 144-pin version PC26 A20 PWMH2 Only on 144-pin version PC27 A23 PWMH3 Only on 144-pin version PC28 PWML3 NPCS1 Only on 144-pin version MCDA4 AD4 Only on 144-pin version PC29 PWML0 MCDA5 AD5 Only on 144-pin version PC30 PWML1 MCDA6 AD6 Only on 144-pin version PC31 PWML2 MCDA7 AD7 Only on 144-pin version Notes: 1. Wake-Up source in Backup mode (managed by the SUPC). 2. Fast Start-Up source in Wait mode (managed by the PMC). 48 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series 12. Embedded Peripherals Overview 12.1 Serial Peripheral Interface (SPI) • Supports communication with serial external devices – Four chip selects with external decoder support allow communication with up to 15 peripherals – Serial memories, such as DataFlash and 3-wire EEPROMs – Serial peripherals, such as ADCs, DACs, LCD Controllers, CAN Controllers and Sensors – External co-processors • Master or slave serial peripheral bus interface – 8- to 16-bit programmable data length per chip select – Programmable phase and polarity per chip select – Programmable transfer delays between consecutive transfers and between clock and data per chip select – Programmable delay between consecutive transfers – Selectable mode fault detection • Very fast transfers supported – Transfers with baud rates up to MCK – The chip select line may be left active to speed up transfers on the same device 12.2 Two Wire Interface (TWI) • Master, Multi-Master and Slave Mode Operation • Compatibility with Atmel two-wire interface, serial memory and I2C compatible devices • One, two or three bytes for slave address • Sequential read/write operations • Bit Rate: Up to 400 kbit/s • General Call Supported in Slave Mode • Connecting to PDC channel capabilities optimizes data transfers in Master Mode only – One channel for the receiver, one channel for the transmitter – Next buffer support 12.3 Universal Asynchronous Receiver Transceiver (UART) • Two-pin UART – Implemented features are 100% compatible with the standard Atmel USART – Independent receiver and transmitter with a common programmable Baud Rate Generator – Even, Odd, Mark or Space Parity Generation – Parity, Framing and Overrun Error Detection – Automatic Echo, Local Loopback and Remote Loopback Channel Modes – Support for two PDC channels with connection to receiver and transmitter 49 6430CS–ATARM–09-Apr-10 12.4 Universal Synchronous Asynchronous Receiver Transmitter (USART) • Programmable Baud Rate Generator • 5- to 9-bit full-duplex synchronous or asynchronous serial communications – 1, 1.5 or 2 stop bits in Asynchronous Mode or 1 or 2 stop bits in Synchronous Mode – Parity generation and error detection – Framing error detection, overrun error detection – MSB- or LSB-first – Optional break generation and detection – By 8 or by-16 over-sampling receiver frequency – Hardware handshaking RTS-CTS – Receiver time-out and transmitter timeguard – Optional Multi-drop Mode with address generation and detection – Optional Manchester Encoding • RS485 with driver control signal • ISO7816, T = 0 or T = 1 Protocols for interfacing with smart cards – NACK handling, error counter with repetition and iteration limit • SPI Mode – Master or Slave – Serial Clock programmable Phase and Polarity – SPI Serial Clock (SCK) Frequency up to MCK/6 • IrDA modulation and demodulation – Communication at up to 115.2 Kbps • Test Modes – Remote Loopback, Local Loopback, Automatic Echo 12.5 Serial Synchronous Controller (SSC) • Provides serial synchronous communication links used in audio and telecom applications (with CODECs in Master or Slave Modes, I2S, TDM Buses, Magnetic Card Reader, ...) • Contains an independent receiver and transmitter and a common clock divider • Offers a configurable frame sync and data length • Receiver and transmitter can be programmed to start automatically or on detection of different event on the frame sync signal • Receiver and transmitter include a data signal, a clock signal and a frame synchronization signal 12.6 Timer Counter (TC) • Three 16-bit Timer Counter Channels • Wide range of functions including: – Frequency Measurement – Event Counting – Interval Measurement 50 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series – Pulse Generation – Delay Timing – Pulse Width Modulation – Up/Down Capabilities – Quadrature Decoder Logic • Each channel is user-configurable and contains: – Three external clock inputs – Five internal clock inputs – Two multi-purpose input/output signals • Two global registers that act on all three TC Channels 12.7 Pulse Width Modulation Controller (PWM) • 4 channels, one 16-bit counter per channel • Common clock generator, providing Thirteen Different Clocks – A Modulo n counter providing eleven clocks – Two independent Linear Dividers working on modulo n counter outputs – High Frequency Asynchronous clocking mode • Independent channel programming – Independent Enable Disable Commands – Independent Clock Selection – Independent Period and Duty Cycle, with Double Buffering – Programmable selection of the output waveform polarity – Programmable center or left aligned output waveform – Independent Output Override for each channel – Independent complementary Outputs with 12-bit dead time generator for each channel – Independent Enable Disable Commands – Independent Clock Selection – Independent Period and Duty Cycle, with Double Buffering • Synchronous Channel mode – Synchronous Channels share the same counter – Mode to update the synchronous channels registers after a programmable number of periods • Connection to one PDC channel – Offers Buffer transfer without Processor Intervention, to update duty cycle of synchronous channels • Two independent event lines which can send up to 8 triggers on ADC within a period • Four programmable Fault Inputs providing asynchronous protection of outputs 51 6430CS–ATARM–09-Apr-10 12.8 High Speed Multimedia Card Interface (HSMCI) • Compatibility with MultiMedia Card Specification Version 4.3 • Compatibility with SD Memory Card Specification Version 2.0 • Compatibility with SDIO Specification Version V2.0. • Compatibility with CE-ATA Specification 1.1 • Cards clock rate up to Master Clock divided by 2 • Boot Operation Mode support • High Speed mode support • Embedded power management to slow down clock rate when not used • HSMCI has one slot supporting – One MultiMediaCard bus (up to 30 cards) or – One SD Memory Card – One SDIO Card • Support for stream, block and multi-block data read and write • Supports Connection to DMA controller – Minimizes Processor intervention for large buffer transfers • Built in FIFO (32 bytes) with large Memory Aperture Supporting Incremental access • Support for CE-ATA Completion Signal Disable Command 12.9 USB High Speed Device Port (UDPHS) • USB V2.0 high-speed compliant, 480 MBits per second • Embedded USB V2.0 UTMI+ high-speed transceiver • Embedded 4-Kbyte dual-port RAM for endpoints • Embedded 6 channels DMA controller • Suspend/Resume logic • Up to 2 or 3 banks for isochronous and bulk endpoints • Seven endpoints, configurable by software • Maximum configuration: seven endpoints: – Endpoint 0: 64 bytes, 1 bank mode – Endpoint 1 & 2: 512 bytes, 2 banks mode, HS isochronous capable – Endpoint 3 & 4:64 bytes, 3 banks mode – Endpoint 5 & 6: 1024 bytes, 3 banks mode, HS isochronous capable 12.10 Analog-to-Digital Converter (ADC) Two ADCs are embedded in the product. 12.10.1 12-bit High Speed ADC • 8-channel ADC • 12-bit 1 Msamples/sec. Cyclic Pipeline ADC • Integrated 8-to-1 multiplexer • 12-bit resolution 52 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series • Selectable single ended or differential input voltage • Programmable gain for maximum full scale input range • External voltage reference for better accuracy on low voltage inputs • Individual enable and disable of each channel • Multiple trigger sources – Hardware or software trigger – External trigger pin – Timer Counter 0 to 2 outputs TIOA0 to TIOA2 trigger – PWM trigger • Sleep Mode and conversion sequencer – Automatic wakeup on trigger and back to sleep mode after conversions of all enabled channels 12.10.2 10-bit Low Power ADC • 8-channel ADC • 10-bit 384 Ksamples/sec. or 8-bit 533 Ksamples/sec. Successive Approximation Register ADC • -2/+2 LSB Integral Non Linearity, -1/+1 LSB Differential Non Linearity • Integrated 8-to-1 multiplexer • External voltage reference for better accuracy on low voltage inputs • Individual enable and disable of each channel • Multiple trigger sources – Hardware or software trigger – External trigger pin – Timer Counter 0 to 2 outputs TIOA0 to TIOA2 trigger – PWM trigger • Sleep Mode and conversion sequencer – Automatic wakeup on trigger and back to sleep mode after conversions of all enabled channels 53 6430CS–ATARM–09-Apr-10 13. Package Drawings Figure 13-1. 100-ball LQFP Package Drawing 54 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series Figure 13-2. 100-ball LFBGA Package Drawing 55 6430CS–ATARM–09-Apr-10 Figure 13-3. 144-lead LQFP Package Drawing Notes: 1. This drawing is for general information only; refer to JEDEe Drawing MS-026 for additional information. 2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm. 3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum plastic body size dimensions including mold mismatch. 4. b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages. 5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip. 6. A1 is defined as the distance from the seating place to the lowest point on the package body. 56 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series Figure 13-4. 144-ball LFBGA Package Drawing All dimensions are in mm. 57 6430CS–ATARM–09-Apr-10 14. Ordering Information Table 14-1. ATSAM3U4/2/1 Ordering Information Ordering Code MRL Flash (Kbytes) Package Package Type ATSAM3U4EA-AU A 256 LQFP144 Green Industrial -40°C to 85°C ATSAM3U4EA-CU A 256 LFBGA 144 Green Industrial -40°C to 85°C ATSAM3U4CA-AU A 256 LQFP 100 Green Industrial -40°C to 85°C ATSAM3U4CA-CU A 256 TFBGA100 Green Industrial -40°C to 85°C ATSAM3U2EA-AU A 128 LQFP144 Green Industrial -40°C to 85°C ATSAM3U2EA-CU A 128 LFBGA144 Green Industrial -40°C to 85°C ATSAM3U2CA-AU A 128 LQFP100 Green Industrial -40°C to 85°C ATSAM3U2CA-CU A 128 TFBGA100 Green Industrial -40°C to 85°C ATSAM3U1EA-AU A 64 LQFP144 Green Industrial -40°C to 85°C ATSAM3U1EA-CU A 64 LFBGA144 Green Industrial -40°C to 85°C ATSAM3U1CA-AU A 64 LQFP100 Green Industrial -40°C to 85°C ATSAM3U1CA-CU A 64 TFBGA100 Green Industrial -40°C to 85°C 58 Temperature Operating Range SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series Revision History In the tables that follow, the most recent version of the document appears first. “rfo” indicates changes requested during the review and approval loop. Doc. Rev 6430CS Comments Change Request Ref. Section 2. ”SAM3U Block Diagram”, changed orientation of block diagrams. Section 5. ”Power Considerations”, fixed grammar in Voltage ranges. Section 3. ”Signal Description”, USART signal DCD0 is an Input rfo Figure 5-1 ”Single Supply”, Main supply range is 1.8V-3.6V. Figure 5-1, Figure 5-2, Figure 5-3, updated “Note” below figures, “With Main Supply <2.0V USB and ADC are not usable. 6698 Section 5.5 ”Low Power Modes”, stray references to WUPx pins, renamed WKUPx 6711 Table 5-1, “Low Power Mode Configuration Summary”, updated footnote “5”. 6964 Table 11-2, “Multiplexing on PIO Controller A (PIOA)”, TWD1 and TWCK1 only available on 144-pin version. 6686 Section 10.13 ”Chip Identification” Table 10-2, “SAM3U Chip IDs Register - Revision A Parts”, added to datasheet. Section 12.4 ”Universal Synchronous Asynchronous Receiver Transmitter (USART)”...“SCK up to MCK/6” 6951 6681 rfo→7097 59 6430CS–ATARM–09-Apr-10 Doc Rev 6430BS Change Request Ref. Comments Introduction: Section 1. ”SAM3U Description”, Updated: 52 Kbytes of SRAM. 4x USARTs (SAM3U1C/2C/4C have 3), up to 6400 2x TWIs (SAM3U1C/2C/4C have 1), up to 5x SPIs SAM3U1C/2C/4C have 4), Table 1-1, “Configuration Summary”,EBI column updated, 8 bits for SAM3U1C/2C/4C SAM3U4/3/2C rows FWUP replaces NO in FWUP,SHDN pins column 6642 60 Figure 2-1 ”144-pin SAM3U4/2/1E Block Diagram” and Figure 2-2 ”100-pin SAM3U4/2/1C Block Diagram” updated, SM cell removed; UART moved to peripheral area, added Flash Unique block, removed 12B from ADC block, added SysTick counter and Fmax 96 MHz to M3 block. FWUP replaces WKUP in fig 2-1, FWUP added to fig 2-2 Figure 2-2 ”100-pin SAM3U4/2/1C Block Diagram”, NWR1/NBS1, NXRP0, A0 removed from block diagram. 6482/6642 Table 3-1, “Signal Description List”, Schmitt Trigger added ”PIO Controller - PIOA - PIOB - PIOC”. exception details given in footnote. VDDIN, VDDOUT added to table. ”Serial Wire/JTAG Debug Port (SWJ-DP)” replaced ICE and JTAG. This section of the table updated status of pulldowns and pullups specified. 6480 Section 4. ”Package and Pinout”, reorganized according to product. Section 4.1 ”SAM3U4/2/1E Package and Pinout” and Section 4.2 ”SAM3U4/2/1C Package and Pinout”, pinouts finalized in datasheet. 6471/rfo 6607 Section 5.5.1 ”Backup Mode”, BOD replaced by Supply Monitor/SM. FWUP →Falling Edge Detector. Figure 5-4 ”Wake-up Source”, BODEN replaced by SMEN. Table 5-1, “Low Power Mode Configuration Summary”, PIO state in Low Power Modes, backup mode is; “Previous state saved. rfo Section 6.6 ”NRSTB Pin”, VDDIO changed to VDDBU Section 6. ”Input/Output Lines”, replaces Section 5.8 “Programmable I/O Lines”. Section 6.1 ”General Purpose I/O Lines (GPIO)” and Section 6.2 ”System I/O Lines”, replace Section 6. “I/O Line Considerations”. Figure 6-1 ”On-Die Termination schematic”, added. Section 6.8 “PIO Controllers”, removed. Section 8. ”Product Mapping”, title changed from “Memories”. Section 9. ”Memories”, now comprises Section 9.1 ”Embedded Memories” and Section 9.2 ”External Memories”. Section 9.1.3.5 ”Security Bit Feature”, updated 6646 6481/rfo Table 7-3, “SAM3U Master to Slave Access”, Slave 9, High Speed Peripheral Bridge line added. Section 7.2 ”APB/AHB Bridges”, reference to ADC updated “10-bit ADC, 12-bit ADC (ADC12B)”. Table 11-3, “Multiplexing on PIO Controller B (PIOB)”, ADC12B2, ADC12B3 properly listed. Section 12.10.1 ”12-bit High Speed ADC”, Section 12.10.2 ”10-bit Low Power ADC”, titles changed. “Quadrature Decoder Logic” on page 51, properly stated in list of TC functions. 6663 6397 Section 12.10.1 ”12-bit High Speed ADC”, 2nd item on list updated. Section 12.10.2 ”10-bit Low Power ADC”, Ksample values updated on 2nd item of list. rfo rfo rfo 6645 SAM3U Series 6430CS–ATARM–09-Apr-10 SAM3U Series Doc. Rev Comments 6430AS First issue Change Request Ref. 61 6430CS–ATARM–09-Apr-10 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support AT91SAM Support Atmel techincal support Sales Contacts www.atmel.com/contacts/ Product Contact Web Site www.atmel.com www.atmel.com/AT91SAM Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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