bq24314 bq24316 www.ti.com SLUS763 – JULY 2007 OVERVOLTAGE AND OVERCURRENT PROTECTION IC AND Li+ CHARGER FRONT-END PROTECTION IC • • • • • • • • Provides Protection for Three Variables: – Input Overvoltage – Input Overcurrent (User-Programmable) – Battery Overvoltage 30V Maximum Input Voltage Supports up to 1.5A Input Current High Immunity Against False Triggering Due to Voltage Spikes Robust Against False Triggering Due to Current Transients Thermal Shutdown Status Indication – Fault Condition Available in Space-Saving Small 8 Lead 2×2 SON and 12 Lead 4x3 SON Packages APPLICATIONS • • • • • Smart Phones PDAs MP3 Players Low-Power Handheld Devices Bluetooth Headsets DESCRIPTION The bq24314 and bq24316 are highly integrated circuits designed to provide protection to Li-ion batteries from failures of the charging circuit. The IC continuously monitors the input voltage, the input current, and the battery voltage. In case of an input overvoltage condition, the IC immediately removes power from the charging circuit by turning off an internal switch. In the case of an overcurrent condition, it limits the system current at the threshold value, and if the overcurrent persists, switches the pass element OFF after a blanking period. Additionally, the IC also monitors its own die temperature and switches off if it becomes too hot. The input overcurrent threshold is user-programmable. The IC can be controlled by a processor and also provides status information about fault conditions to the host. APPLICATION SCHEMATIC AC Adapter 1 IN VDC OUT 8 1 mF 1 mF GND Charging Circuit bq24316DSG SYSTEM VBAT 6 ILIM VSS FAULT 4 7 2 CE 5 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2007, Texas Instruments Incorporated PRODUCT PREVIEW FEATURES 1 bq24314 bq24316 www.ti.com SLUS763 – JULY 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. SIMPLIFIED BLOCK DIAGRAM IN OUT Charge Pump, Bandgap, Bias Generator ISNS ILIM ILIMREF OFF PRODUCT PREVIEW ILIMREF - D tBLANK(OCP) ISNS FAULT 5.85 V (bq24314) 6.80 V (bq24316) COUNTER, CONTROL, AND STATUS VIN CE VUVLO tDGL(PGOOD) VIN THERMAL SHUTDOWN tGDL(BOVP) 4.35 V VBAT VSS TERMINAL FUNCTIONS TERMINAL NAME I/O DESCRIPTION 1 I Input power, connect to external DC supply. Connect external 1μF capacitor (minimum) to VSS. For the 12 pin (DSJ-suffix) device, ensure that pins 1 and 2 are connected together on the PCB at the device. 10, 11 8 O Output terminal to the charging system. Connect external 1μF capacitor (minimum) to VSS. 8 6 I Battery voltage sense input. Connect to pack positive terminal through a resistor. DSJ DSG 1, 2 OUT VBAT IN 2 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq24314 bq24316 bq24314 bq24316 www.ti.com SLUS763 – JULY 2007 TERMINAL I/O DESCRIPTION DSJ DSG 9 7 I/O Input overcurrent threshold programming. Connect a resistor to VSS to set the overcurrent threshold. CE 7 5 I Chip enable input. Active low. When CE = High, the input FET is off. Internally pulled down. FAULT 4 4 O Open-drain output, device status. FAULT = Low indicates that the input FET has been turned off due to input overvoltage or input overcurrent conditions, or because the battery voltage is outside safe limits. VSS 3 2 – Ground terminal NC 5, 6, 12 3 ILIM Thermal PAD These pins may have internal circuits used for test purposes. Do not make any external connections at these pins for normal operation. – There is an internal electrical connection between the exposed thermal pad and the VSS pin of the device. The thermal pad must be connected to the same potential as the VSS pin on the printed circuit board. Do not use the thermal pad as the primary ground input for the device. The VSS pin must be connected to ground at all times. IN 1 8 7 VSS 2 NC 3 IN 1 12 NC IN 2 11 OUT 10 OUT OUT ILIM VSS 3 bq24314DSG bq24316DSG 6 bq24314DSJ bq24316DSJ VBAT FAULT 4 FAULT 4 5 PRODUCT PREVIEW NAME CE 9 ILIM NC 5 8 VBAT NC 6 7 CE ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER Input voltage PIN VALUE IN (with respect to VSS) –0.3 to 30 OUT (with respect to VSS) –0.3 to 12 ILIM, FAULT, CE, VBAT (with respect to VSS) –0.3 to 7 UNIT V Input current IN 2.0 A Output current OUT 2.0 A Output sink current FAULT 15 mA Junction temperature, TJ –40 to 150 °C Storage temperature, TSTG –65 to 150 °C 300 °C Lead temperature (soldering, 10 seconds) (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal unless otherwise noted. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq24314 bq24316 3 bq24314 bq24316 www.ti.com SLUS763 – JULY 2007 PACKAGE DISSIPATION RATINGS PART NO. PACKAGE BQ24314DSG BQ24316DSG 2×2 SON BQ24314DSJ BQ24316DSJ 4×3 SON RθJC RθJA TA ≤ 25°C POWER RATING DERATING FACTOR TA > 25°C RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) VIN Input voltage range IIN Input current, IN pin IOUT Output current, OUT pin RILIM OCP Programming resistor TJ Junction temperature MIN MAX 3.3 26 V 1.5 A 1.5 UNIT A 16.67 83.33 kΩ 0 125 °C ELECTRICAL CHARACTERISTICS PRODUCT PREVIEW over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IN VUVLO Under-voltage lock-out, input power detected threshold CE = Low or High, VIN: 2V → 3V 2.5 2.8 V VHYS-UVLO Hysteresis on UVLO CE = Low or High, VIN: 3V → 2V 200 300 mV TDGL(PGOOD) Deglitch time, input power detected CE = Low or High. Time measured from VIN status 0V → 5V 1μs rise-time, to output turning ON IDD Operating current CE = Low, No load on OUT pin, VIN < 6V ISTDBY Standby current CE = High, VIN < 6V 8 ms 600 μA 55 μA INPUT TO OUTPUT CHARACTERISTICS VDO Drop-out voltage IN to OUT CE = Low, VIN = 5V, IOUT = 1A 300 mV INPUT OVERVOLTAGE PROTECTION VOVP Input overvoltage protection threshold (bq24314) 5.67 5.85 6.00 V Input overvoltage protection threshold (bq24316) 6.60 6.80 7.00 V tPD(OVP) Input OV propagation delay CE = Low VHYS-OVP Hysteresis on OVP CE = Low or High, VIN: 7.5V → 5V tON(OVP) Recovery time from input overvoltage condition CE = Low, Time measured from VIN 7.5V → 5V, 1μs fall-time 1 μs 60 mV 8 ms INPUT OVERCURRENT PROTECTION IOCP Input overcurrent protection threshold range CE = Low, RILIM = 16.67kΩ to 83.33kΩ ΔIOCP OCP threshold accuracy CE = Low, RILIM = 16.67kΩ to 83.33kΩ IOCP Input overcurrent protection threshold CE = Low, RILIM = 25kΩ KILIM Current limit programming: IOCP = KILIM ÷ RILIM tBLANK(OCP) Blanking time, input overcurrent detected tON(OCP) Recovery time from input overcurrent condition CE = Low CE = Low 300 1500 mA 1070 mA ±10 % 930 1000 25000 AΩ 176 μs 64 ms BATTERY OVERVOLTAGE PROTECTION 4 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq24314 bq24316 bq24314 bq24316 www.ti.com SLUS763 – JULY 2007 ELECTRICAL CHARACTERISTICS (continued) over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted) PARAMETER TEST CONDITIONS BVOVP Battery overvoltage protection threshold CE = Low, VIN > 4.3V VHYS-BOVP Hysteresis on BVOVP CE = Low, VIN > 4.3V IVBAT Input bias current on VBAT pin TDGL(BOVP) Deglitch time, battery overvoltage detected MIN TYP MAX 4.30 4.35 4.4 270 V mV 20 CE = Low, VIN > 4.3V UNIT nA μs 176 THERMAL PROTECTION TJ(OFF) Thermal shutdown temperature TJ(OFF-HYS) Thermal shutdown hysteresis 140 150 °C °C 20 LOGIC LEVELS ON CE VIL Low-level input voltage 0 VIH High-level input voltage 1.4 0.4 V IIL Low-level input current VCE = 0V 1 μA IIH High-level input current VCE = 1.8V 10 μA ISINK = 5mA 0.4 V V VOL Output low voltage TYPICAL OPERATING PERFORMANCE For Figure 1 through Figure 4, VIN = 5 V to 12 V, COUT = 0.47 μF, ROUT = 33 Ω, RILIM = 25 kΩ, Channel 1 = VIN, Channel 2 = VOUT, Channel 4 = FAULT VIN = 5 V to 12 V, COUT = 0.47 mF, ROUT = 33 W, Ch 1 = VIN RILIM = 25 kW Ch 1 = VIN VIN = 5 V to 12 V, COUT = 0.47 mF, ROUT = 33 W, RILIM = 25 kW Ch 2 = VOUT Ch 4 = FAULT Figure 1. bq24314 OVP Response for Input Step, tR = 1 μs Ch 2 = VOUT Ch 4 = FAULT Figure 2. bq24314 OVP Response for Input Step, tR = 20 μs Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq24314 bq24316 5 PRODUCT PREVIEW LOGIC LEVELS ON FAULT bq24314 bq24316 www.ti.com SLUS763 – JULY 2007 TYPICAL OPERATING PERFORMANCE (continued) VIN = 5 V to 12 V, COUT = 0.47 mF, ROUT = 33 W, Ch 1 = VIN Ch 1 = VIN RILIM = 25 kW VIN = 5 V to 12 V, COUT = 0.47 mF, ROUT = 33 W, RILIM = 25 kW Ch 2 = VOUT Ch 2 = VOUT Ch 4 = FAULT Ch 4 = FAULT PRODUCT PREVIEW Figure 3. bq24316 OVP Response for Input Step, tR = 1 μs Figure 4. bq24316 OVP Response for Input Step, tR = 20 μs VIN = 0 V to 9 V in 40 ms V IN = 10 V to 5 V in 400 m s Ch 2 = VOUT Ch 1 = VIN Ch 1 = VIN Ch 2 = VOUT Ch 4 = FAULT Ch 4 = FAULT Figure 5. bq24316 Response for Slow Input Ramp Channel 1 = VIN, Channel 2 = VOUT, Channel 4 = FAULT, VIN = 0V to 9V in 40ms 6 Figure 6. bq24316 Recovery From OVP Channel 2 = VIN, Channel 1 = VOUT, Channel 4 = FAULT, VIN = 10V to 5V in 400μs Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq24314 bq24316 bq24314 bq24316 www.ti.com SLUS763 – JULY 2007 TYPICAL OPERATING PERFORMANCE (continued) Ch 1 = Load Switch VIN = 4.75 V, ROUT = 11 W to 8 W, RILIM = 50 kW Ch 3 = IIN PRODUCT PREVIEW Figure 7. bq24316 OCP Response Channel 1 = Load Switch, Channel 3 = IIN, VIN = 4.75V, RILIM = 50kΩ, ROUT = 11Ω to 8Ω TYPICAL APPLICATION CIRCUIT (Terminal numbers shown are for the 2×2 DSG package) AC Adapter VDC 1 IN OUT 8 CIN COUT GND Charging Circuit bq24316DSG SYSTEM VBAT 6 VPU RBAT RPU FAULT 4 ILIM VSS RFAULT 7 2 Host Controller CE 5 RCE Figure 8. Simple Protection DETAILED FUNCTIONAL DESCRIPTION POWER DOWN The device remains in power down mode when the input voltage at the IN pin is below the undervoltage threshold VUVLO. The FET Q1 connected between IN and OUT pins is off, and the status output, FAULT, is set to Hi-Z. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq24314 bq24316 7 bq24314 bq24316 www.ti.com SLUS763 – JULY 2007 POWER-ON RESET The device resets when the input voltage at the IN pin exceeds the UVLO threshold. All internal counters and other circuit blocks are reset. OPERATION The device continuously monitors the input voltage, the input current, and the battery voltage. Input Overvoltage Protection If the input voltage rises above VOVP, the internal FET is turned off, removing power from the circuit. The FAULT pin is driven low. When the input voltage returns below VOVP – VHYS-OVP (but is still above VUVLO), the FET is turned on again after a deglitch time of tON(OVP) to ensure that the input supply has stabilized. Input Overcurrent Protection The overcurrent threshold is programmed by a resistor RILIM connected from the ILIM pin to VSS. The overcurrent threshold is given by IOCP = KILIM ÷ RILIM. PRODUCT PREVIEW If the load current tries to exceed the IOCP threshold, the device limits the current for a blanking duration of tBLANK(OCP). If the load current returns to less than IOCP before tBLANK(OCP) times out, the device continues to operate. However, if the overcurrent situation persists for tBLANK(OCP), the FET is turned off for a duration of tON(OCP), and the FAULT pin is driven low. The FET is then turned on again after tON(OCP) and the current is monitored all over again. Each time an OCP fault occurs, an internal counter is incremented. If 15 OCP faults occur in one charge cycle, the FET is turned off permanently. The counter is cleared either by removing and re-applying input power, or by disabling and re-enabling the device with the CE pin. Battery Overvoltage Protection The battery overvoltage threshold BVOVP is internally set to 4.35V. If the battery voltage exceeds the BVOVP threshold, the FET is turned off, and the FAULT pin is driven low. The FET is turned back on once the battery voltage drops to BVOVP – VHYS-BOVP. Each time a battery overvoltage fault occurs, an internal counter is incremented. If 15 such faults occur in one charge cycle, the FET is turned off permanently. The counter is cleared either by removing and re-applying input power, or by disabling and re-enabling the device with the CE pin. THERMAL PROTECTION If the junction temperature of the device exceeds TJ(OFF), the FET is turned off, and the FAULT pin is driven low. The FET is turned back on when the junction temperature falls below TJ(OFF) – TJ(OFF-HYS). 8 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq24314 bq24316 bq24314 bq24316 www.ti.com SLUS763 – JULY 2007 Power Down All IC functions OFF FAULT = HiZ Any State if V(IN) < V (UVLO), go to Power Down No V(IN) > V(UVLO) ? Any State if CE = Hi, go to Reset Yes Reset Timers reset Counters reset FAULT = HiZ FET off No V(IN) < V(OVP) ? No PRODUCT PREVIEW CE = Low ? Turn off FET FAULT = Low No CE = Hi ? Yes Go to Reset Yes No I < IOCP ? No Turn off FET FAULT = Low Incr OCP counter Wait tON(OCP) count <15 ? Yes No CE = Hi ? Yes Go to Reset No Turn off FET FAULT = Low VBAT < BATOVP ? No Incr BAT counter count <15 ? Yes TJ < TJ(OFF) ? No Turn off FET FAULT = Low Yes Turn on FET FAULT = HiZ Figure 9. Flow Diagram CE Pin The IC has an enable pin which can be used to enable or disable the device. When the CE pin is driven high, the internal FET is turned off. When the CE pin is low, the FET is turned on if other conditions are safe. The CE pin has an internal pulldown resistor and can be left floating. Note that the FAULT pin functionality is also disabled when the CE pin is high. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq24314 bq24316 9 bq24314 bq24316 www.ti.com SLUS763 – JULY 2007 APPLICATION INFORMATION (WITH REFERENCE TO FIGURE 8) Selection of RBAT It is strongly recommended that the battery not be tied directly to the VBAT pin of the device, as under some failure modes of the IC, the voltage at the IN pin may appear on the VBAT pin. This voltage can be as high as 30V, and applying 30V to the battery in case of the failure of the bq2431x can be hazardous. Connecting the VBAT pin through RBAT prevents a large current from flowing into the battery in case of a failure of the IC. In the interests of safety, RBAT should have a very high value. The problem with a large RBAT is that the voltage drop across this resistor because of the VBAT bias current IVBAT causes an error in the BVOVP threshold. This error is over and above the tolerance on the nominal 4.35V BVOVP threshold. Choosing RBAT equal to 220kΩ is a good compromise. In the case of an IC failure, the maximum current flowing into the battery would be (30V – 3V) ÷ 220kΩ = 123μA, which is low enough to be absorbed by the bias currents of the system components. RBAT equal to 220kΩ would result in a worst-case voltage drop of RBAT × IVBAT = 4.4mV. This added to the internal tolerance of 50mV results in a total BVOVP threshold error of less than 55mV, which should be acceptable in most applications. Selection of RCE The CE pin can be used to enable and disable the IC. If host control is not required, the CE pin can be tied to ground or left un-connected, permanently enabling the device. PRODUCT PREVIEW In applications where external control is required, the CE pin can be controlled by a host processor. As in the case of the VBAT pin (see above), the CE pin should be connected to the host GPIO pin through as large a resistor as possible. The limitation on the resistor value is that the minimum VOH of the host GPIO pin less the drop across the resistor should be greater than VIH of the bq2431× CE pin. The drop across the resistor is given by RCE × IIH. FAULT Pin The FAULT pin is an open-drain output that goes low during OV, OC, and battery-OV events. If the application does not require monitoring of the FAULT pin, it can be left unconnected. But if the FAULT pin has to be monitored, it should be pulled high externally through RPU, and connected to the host through RFAULT. RFAULT prevents damage to the host controller if the bq2431x fails (see above). The resistors should be of high value, in practice values between 22kΩ and 100kΩ should be sufficient. 10 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq24314 bq24316 PACKAGE OPTION ADDENDUM www.ti.com 26-Jul-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty BQ24314DSGR PREVIEW SON DSG 8 3000 TBD Call TI Call TI BQ24316DSGR PREVIEW SON DSG 8 3000 TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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